CN108074842B - Substrate wet processing device - Google Patents

Substrate wet processing device Download PDF

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Publication number
CN108074842B
CN108074842B CN201711089961.4A CN201711089961A CN108074842B CN 108074842 B CN108074842 B CN 108074842B CN 201711089961 A CN201711089961 A CN 201711089961A CN 108074842 B CN108074842 B CN 108074842B
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substrate
processing
tank
spray
immersion
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CN108074842A (en
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冯傳彰
吴庭宇
蔡文平
刘茂林
李威震
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Scientech Corp
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Scientech Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Level Indicators Using A Float (AREA)
  • Weting (AREA)

Abstract

The invention discloses a substrate wet processing device, which is used for carrying out a wet processing procedure on a substrate. The substrate wet processing apparatus includes: a dipping treatment tank for performing the dipping treatment process on the substrate; the spray rinsing processing tank comprises a substrate inversion carrying platform, a substrate is placed on the substrate inversion carrying platform and used for carrying out spray rinsing processing procedures on the substrate, a cleaning and drying tank is used for carrying out cleaning and drying procedures on the substrate, and a processing procedure control unit is electrically connected with the dipping processing tank, the spray rinsing processing tank and the cleaning and drying tank and used for controlling the wet processing procedures of the substrate in the substrate wet processing device. The substrate is inverted in the groove for spray-washing treatment in the spray-washing treatment process of the substrate, so that compared with the traditional non-inverted state of the substrate, the substrate is easier to remove removed objects or stripped objects in the spray-washing process, and the problems of sticking back and the like are prevented.

Description

Substrate wet processing device
Technical Field
The invention relates to a substrate wet processing device, which is used for carrying out a wet processing procedure on a substrate, wherein the wet processing procedure comprises a soaking processing procedure, a spray rinsing processing procedure and a cleaning and drying procedure, and the substrate wet processing device is used for carrying out the spray rinsing processing procedure on the substrate to enable the substrate to be in an inverted state.
Background
In a semiconductor process, a substrate (e.g., a wafer) is cleaned to remove impurities from the surface of the substrate. After patterning a substrate by photolithography, a Photoresist (PR) or a Metal Film (Metal Film) must be removed by a plurality of cleaning processes. One conventional process is to process substrates in batches, and to process the substrates simultaneously in a batch, which has the problem of inaccurate processing effect. In another conventional process, a single substrate is used for horizontal processing, but in the cleaning step, when the substrate is cleaned by normal rotation, the substrate is contaminated by the removed or peeled substrate generated by the substrate and the cleaning solution during the cleaning process. In view of the above problems of inaccurate effect of the conventional process or contamination of the substrate, the prior art needs to be improved.
Disclosure of Invention
The invention relates to a substrate wet processing device, which is used for carrying out a wet processing procedure on a substrate, wherein the wet processing procedure comprises a dipping processing procedure, a spray rinsing processing procedure and a cleaning and drying procedure, and the substrate is in an inverted state in the spray rinsing processing procedure of the substrate.
The substrate wet processing device is used for carrying out a wet processing procedure on a substrate, wherein the wet processing procedure comprises a dipping processing procedure, a spray rinsing processing procedure and a cleaning and drying procedure. The substrate wet processing device comprises a dipping processing tank, a spray washing processing tank and a cleaning and drying tank, wherein the dipping processing tank is used for carrying out a dipping processing procedure on the substrate; the spray rinsing processing tank is used for carrying out spray rinsing processing procedures on the substrate and comprises a substrate inversion carrying platform, wherein the substrate is placed on the substrate inversion carrying platform; a cleaning and drying tank for cleaning and drying the substrate; and a process control unit electrically connected to the immersion treatment tank, the spray treatment tank and the cleaning and drying tank, the process control unit controlling a wet treatment process of the substrate in the substrate wet treatment apparatus.
In one embodiment of the substrate wet processing apparatus of the present invention, the immersion processing tank can accommodate a plurality of substrates, wherein when the immersion processing tank performs the immersion processing procedure, the processing procedure control unit controls an immersion timing of placing each substrate into the immersion processing tank.
In one embodiment of the substrate wet processing apparatus of the present invention, the processing process control unit controls a timing of moving each substrate into and out of the immersion processing bath.
In one embodiment of the substrate wet processing apparatus of the present invention, the processing procedure control unit controls the immersion processing time to be the same for each substrate, and schedules each substrate to be placed in the immersion processing tank for the immersion processing procedure.
In one embodiment of the substrate wet processing apparatus of the present invention, the processing procedure control unit controls the time for performing the immersion processing procedure on each substrate to be different, and schedules each substrate to be placed in the immersion processing tank for performing the immersion processing procedure.
In one embodiment of the substrate wet processing apparatus of the present invention, the time required for the immersion processing of the substrate is longer than the time required for the spray processing, and the processing procedure control unit schedules the immersion timing of each substrate in the immersion processing tank according to a time difference between the time required for the immersion processing and the time required for the spray processing.
In one embodiment of the substrate wet processing apparatus of the present invention, the immersion processing tank and the spray processing tank are the same tank body, and the immersion processing tank is located below the spray processing tank, wherein the processing process control unit raises the substrate that has completed the immersion processing procedure and places the substrate into the spray processing tank.
In one embodiment, the substrate wet processing apparatus of the present invention performs the spray processing on the substrate using a spray processing liquid, and the spray processing liquid is collected from the immersion processing tank located below the spray processing tank.
In one embodiment of the substrate wet processing apparatus of the present invention, the spray treatment tank includes a recycling unit, wherein the spray treatment is performed on the substrate by using a spray treatment solution, and the spray treatment solution is recycled by the recycling unit, wherein the spray treatment solution not sprayed to the recycling unit falls into the immersion treatment tank located below the spray treatment tank for recycling.
In an embodiment of the substrate wet processing apparatus according to the present invention, the substrate is placed on the substrate inverting stage, wherein the substrate wet processing apparatus further includes a stage driving module that lowers the substrate inverting stage into the immersion processing tank to perform the immersion processing procedure on the substrate, and after the immersion processing procedure is completed, the stage driving module raises the substrate inverting stage into the spray processing tank to perform the spray processing procedure on the substrate.
In an embodiment of the substrate wet processing apparatus according to the present invention, the wet processing program further includes a before-dipping spray rinsing processing program, and after the processing procedure control unit places the substrate on the substrate inversion stage to perform the before-dipping spray rinsing processing program, the stage driving module lowers the substrate inversion stage into the dipping processing tank to perform the dipping processing program on the substrate.
In one embodiment of the substrate wet processing apparatus of the present invention, the spray rinsing bath includes a plurality of processing liquid nozzles for supplying different spray rinsing processing liquids.
In one embodiment of the substrate wet processing apparatus of the present invention, the spray rinsing bath includes a plurality of recovery units for recovering different spray rinsing solutions.
In one embodiment of the substrate wet processing apparatus of the present invention, the immersion processing tank, the spray processing tank and the cleaning and drying tank are the same tank body, and the spray processing tank and the cleaning and drying tank are different recovery units of the same tank body.
In one embodiment of the substrate wet processing apparatus of the present invention, the tank is a closed tank.
In one embodiment of the substrate wet processing apparatus of the present invention, the cleaning and drying tank is located above the spray processing tank, wherein the substrate wet processing apparatus further includes a stage driving module for lifting the substrate and the inverted stage of the substrate after the spray processing into the cleaning and drying tank to perform the cleaning and drying process.
In one embodiment of the substrate wet processing apparatus of the present invention, the stage driving module turns the substrate upside down stage located in the spray processing tank to be upright, and places the substrate in the cleaning and drying tank in the upright position to perform the cleaning and drying process.
In one embodiment, the substrate wet processing apparatus of the present invention includes a tank body control unit, wherein the tank body control unit controls the cleaning and drying tank and the spray processing tank to be separated from each other up and down to form a substrate input/output port, and the substrate passes through the substrate input/output port to input/output the substrate wet processing apparatus.
In one embodiment, the substrate wet processing apparatus further includes a gas spraying unit disposed above at least one of the spraying treatment tank and the dipping treatment tank, and performing gas spraying when the substrate is moved out of the tank body.
In an embodiment of the substrate wet processing apparatus of the present invention, the substrate is placed on the substrate inverting stage, and the wet processing program is performed on the substrate, wherein the substrate wet processing apparatus further includes a stage driving module for driving the substrate inverting stage to flip between an inverted position and a forward position, wherein when the substrate wet processing apparatus performs the immersion processing program and the spray cleaning processing program on the substrate, the substrate inverting stage is in the inverted position, and when the substrate wet processing apparatus performs the cleaning and drying program on the substrate, the substrate inverting stage is in the forward position.
The substrate is inverted in the groove for spray-washing treatment in the spray-washing treatment process of the substrate, so that compared with the traditional non-inverted state of the substrate, the substrate is easier to remove removed objects or stripped objects in the spray-washing process, and the problems of sticking back and the like are prevented.
The invention also discloses a substrate wet treatment device with the immersion treatment tank and the spray treatment tank arranged in the same tank body, so as to reduce the transmission time and avoid the generation of liquid medicine mutual pollution.
The invention also discloses a substrate wet processing device which arranges the dipping processing tank, the spray processing tank and the cleaning and drying tank in the same tank body, a closed space can be formed in the wet processing procedure, the transmission time of the whole processing procedure is reduced, the generation of liquid medicine interactive pollution is avoided, and the problem of chemical gas dissipation can be prevented.
The invention also discloses a cleaning and drying procedure for turning the substrate to be upright for cleaning and drying, so as to prevent the deionized water after cleaning and drying from dropping into the liquid medicine for pollution.
Drawings
Fig. 1A is a schematic view of a substrate wet processing apparatus according to a first embodiment of the present invention.
FIG. 1B is a schematic view of a immersion processing bath according to the first embodiment of the present invention in which a plurality of substrates are vertically immersed.
FIG. 1C is a schematic view of a immersion processing bath according to the first embodiment of the present invention, in which a plurality of substrates are immersed horizontally.
FIG. 1D is a schematic view of a spray rinsing bath according to a first embodiment of the present invention.
FIG. 1E is a schematic view of the vertical processing of the substrate in the cleaning and drying tank according to the first embodiment of the present invention.
Fig. 1F is a schematic view of the horizontal processing of the substrate in the cleaning and drying tank according to the first embodiment of the present invention.
Fig. 2 is a schematic diagram of a substrate immersion process according to a second embodiment of the present invention.
FIG. 3 is a schematic diagram illustrating a substrate undergoing a spray rinsing process according to a second embodiment of the present invention.
Fig. 4 is a schematic diagram of a third embodiment of the present invention.
FIG. 5 is a schematic view of a third embodiment of the present invention, in which a cleaning and drying tank and a spray treatment tank are separated from each other vertically to form a substrate inlet/outlet.
Fig. 6 is another schematic diagram of a third embodiment of the present invention.
Fig. 7 is another schematic diagram of a substrate cleaning and drying process according to a third embodiment of the invention.
FIG. 8 is a schematic operation diagram of a substrate wet processing apparatus according to a third embodiment of the present invention.
FIG. 9 is a schematic operation diagram of a substrate wet processing apparatus according to a third embodiment of the present invention.
Wherein, the reference numbers:
substrate wet processing apparatus 1,1a,1b,1c
Immersion treatment bath 10,10a,10c
Inner trough area 11
Outer trough area 12
Spray rinsing treatment tank 20
Substrate inverting stage 21
Cleaning and drying tank 30,30a
Process control unit 40
Transport carrier 41
Stage drive module 60
Recovery units 22,22a,22b,31
Treatment liquid nozzle 80
Spray rinsing unit 801
Substrate 90
Tank body control unit 901
Substrate input/output port 902
Inverted position P1
Positive position P2
Soaking liquid medicine 200
Ionized water 300
Spray rinsing treatment solution 100
Detailed Description
In order to explain the technical contents of the present invention in more detail, preferred embodiments are specifically illustrated as follows. Referring to fig. 1A to 1F, a substrate wet processing apparatus according to a first embodiment of the invention is shown.
As shown in fig. 1A, the present invention discloses a substrate wet processing apparatus 1 for performing a wet processing procedure on a substrate 90, wherein the wet processing procedure includes a dipping procedure, a spraying procedure and a cleaning and drying procedure. According to an embodiment of the present invention, the substrate wet processing apparatus 1 includes an immersion processing tank 10, a spray processing tank 20, a cleaning and drying tank 30, and a processing control unit 40, wherein the processing control unit 40 is electrically connected to the immersion processing tank 10, the spray processing tank 20, and the cleaning and drying tank 30, and the processing control unit 40 controls a wet processing procedure of the substrate 90 in the substrate wet processing apparatus 1.
As shown in fig. 1A,1B and 1C, in the first embodiment, the immersion processing tank 10, the spray processing tank 20 and the cleaning and drying tank 30 are independent tanks, and the processing control unit 40 further includes a transport carrier 41, the wet processing of the substrate 90 is performed in the immersion processing tank 10, the spray processing tank 20 and the cleaning and drying tank 30, respectively, and the transport carrier 41 holds the substrate 90 and puts the substrate into the immersion processing tank 10 to perform the immersion processing of the chemical solution. It should be noted that, in the embodiment, the process control unit 40 is a control program executed by a controller or a computer, and the transport carrier 41 is a robot, but the invention is not limited thereto.
According to an embodiment of the present invention, the immersion process further includes at least one of controlling a temperature of the process liquid, controlling a flow field of the process liquid, and shaking the substrate 90.
In the present embodiment, the dipping process is performed in such a way that the dipping treatment tank 10 shown in fig. 1B can accommodate a plurality of vertically arranged substrates 90, and the dipping treatment tank 10a shown in fig. 1C can accommodate a plurality of horizontally arranged substrates 90, so as to perform a plurality of substrate dipping treatments.
When the immersion treatment tank 10 performs the immersion treatment of the plurality of substrates, the process control unit 40 may control the immersion timing of each substrate 90 into the immersion treatment tank 10 to be the same or different. The process control unit 40 controls the immersion processing procedure of each substrate 90 in the immersion processing tank 10 through the transport carrier 41. Wherein, each substrate 90 under the same process condition is sequentially transferred to the spray rinsing processing tank 20 after the same immersion processing time. Since the dipping time of each substrate 90 is the same, the difference of the cleaning degree caused by different dipping time can be avoided, and the yield can be improved. In addition, the process control unit 40 may process a plurality of substrates 90 under different process conditions according to process requirements. The immersion time required for different process conditions may vary, and the specific immersion time required for each substrate 90 may be individually controlled by the process control unit 40.
In addition, the time required for the immersion treatment of each substrate 90 can be controlled to be longer than the time required for the spray treatment, so that the object to be treated on each substrate 90 can be effectively removed (for example, the photoresist and the metal film can be effectively peeled off). The process control unit 40 may schedule an immersion timing of each substrate 90 into the immersion tank 10 according to a time difference between a time required for the immersion process and a time required for the spray process. Taking the sequence of processing each substrate 90, taking the first substrate and the second substrate as an example, the first substrate and the second substrate are arranged to be placed into the dipping processing tank 10 to perform the dipping processing procedure, respectively, and when the first substrate is dipped, the first substrate is transferred to the spray processing tank 20, and when the second substrate is dipped, the first substrate is also sprayed and transferred to the next procedure (for example, the cleaning and drying tank 30). Therefore, the process control unit 40 can directly hold the second substrate from the immersion processing bath 10 and transfer the second substrate to the spray processing bath 20 without any hindrance, and can effectively control the immersion processing time of each substrate 90.
After the immersion processing is completed, as shown in fig. 1A, the transport carrier 41 holds the substrate 90 and places the substrate 90 in the spray processing tank 20 to perform the spray processing, and at this time, the substrate 90 is placed on the substrate inversion stage 21 of the spray processing tank 20, as shown in fig. 1D. According to one embodiment of the present invention, the substrate inversion stage 21 is provided with a substrate holding device (not shown) for holding the substrate 90 inverted for the spray process. The spray processing tank 20 is provided with at least one recovery unit 22,22a, wherein the processing liquid nozzle 80 supplies the spray processing liquid 100, and the spray processing liquid 100 is recovered by the recovery unit 22,22a while the substrate 90 is rotated by being held by the substrate inverting stage 21.
As shown in fig. 1D, a plurality of recovery units 22,22a may be provided, wherein the treatment solution nozzle 80 may supply different spray treatment solutions 100, and the recovery units 22 or 22a corresponding to the respective spray treatment solutions may recover the different spray treatment solutions.
According to an embodiment of the present invention, a gas spraying unit (not shown) is disposed above at least one of the spraying treatment tank 20 and the dipping treatment tank 10, and the gas spraying is performed when the substrate 90 is moved out of the tank body, so as to spray the residual liquid on the substrate 90 and further reduce the residual liquid. The gas spraying unit is disposed above the tank body or above the tank wall, and the invention is not limited thereto.
After the substrate 90 is treated by the chemical solution spraying, the transportation carrier 41 holds the substrate 90 and places the substrate 90 into the cleaning and drying tank 30, and performs a cleaning and drying process with a treatment solution (e.g., deionized water) to complete the wet treatment process of the substrate 90, as shown in fig. 1E, the substrate 90 is placed vertically in the cleaning and drying tank 30 for the cleaning and drying process. According to an embodiment of the present invention, as shown in fig. 1F, the substrate 90 is horizontally placed in the cleaning and drying tank 30a, cleaned and spin-dried to perform the cleaning and drying process.
Fig. 2 to 3 are schematic diagrams showing a second embodiment of the present invention, in which the immersion treatment tank 10c of the substrate wet processing apparatus 1a and the spray treatment tank 20 are the same tank, the immersion treatment tank 10c is located below the spray treatment tank 20, and the treatment process control unit 40 controls to lift the substrate 90, which has completed the immersion treatment process, from the immersion treatment tank 10c into the spray treatment tank 20, and then the spray treatment process is performed.
According to an embodiment of the present invention, as shown in fig. 2, the substrate wet processing apparatus 1a is provided with a stage driving module 60, the stage driving module 60 is electrically connected to the substrate inversion stage 21, the substrate inversion stage 21 is lowered into the immersion processing tank 10c to perform the immersion processing on the substrate 90, and after the immersion processing is completed, the stage driving module 60 raises the substrate inversion stage 21 into the spray processing tank 20 to perform the spray processing on the substrate 90. In the present embodiment, the stage driving module 60 is a driving motor, but the present invention is not limited thereto, and other devices that can drive the substrate inverting stage 21 are applicable.
As shown in fig. 2, when the immersion processing program is performed, the stage driving module 60 lowers the substrate inversion stage 21 into the immersion processing tank 10c to perform the immersion processing program on the substrate 90, the immersion processing tank 10c of the present embodiment may be divided into an inner tank area 11 and an outer tank area 12, and when the stage driving module 60 drives the substrate inversion stage 21 to invert the substrate 90 into the immersion liquid 200 in the inner tank area 11, the immersion liquid 200 overflows from the inner tank area 11 to the outer tank area 12 to perform liquid circulation, wherein the temperature may also be controlled cyclically. According to one embodiment, the substrate inversion stage 21 holds the substrate 90 in a rotated state, in which the substrate 90 is rotated and uniformly subjected to the immersion liquid 200 and the temperature, and after the immersion process is completed, the stage driving module 60 drives the substrate inversion stage 21 to be lifted away from the immersion liquid 200.
According to an embodiment of the present invention, the immersion process includes at least one of controlling the temperature of the processing solution (immersion solution 200), controlling the flow field of the processing solution (immersion solution 200), and shaking the substrate 90, and after the immersion process is completed, as shown in fig. 3, the stage driving module 60 raises the substrate inverting stage 21 into the spray processing tank 20 to perform the spray processing on the substrate 90.
Referring to FIG. 3, the spray treatment tank 20 is provided with at least one recovery unit 22,22a for recovering the spray treatment liquid 100, and the spray treatment liquid 100 not sprayed to the recovery unit 22,22a falls into the immersion treatment tank 10c located at the lower side of the spray treatment tank 20. Wherein the spin speed of the substrate is increased to allow the spin-rinsing treatment solution 100 to spin into the recovery units 22,22a by centrifugal force after being spin-rinsed.
According to an embodiment of the present invention, referring to fig. 3, since the spray treatment solution 100 and the soak solution 200 are the same composition treatment solution (e.g., a batch of the same treatment solution, or a new or old same treatment solution), the spray treatment solution 100 that is not sprayed to the recovery units 22 and 22a will fall into the immersion treatment tank 10c located below the spray treatment tank 20, and the spray treatment solution 100 is mixed into the soak solution 200 for continuous use, so that there is no cross contamination problem of the treatment solutions.
According to an embodiment of the present invention, the wet processing program further includes a before-dip spray processing program, and when the before-dip spray processing program is performed, the process control unit 40 places the substrate 90 on the substrate inversion stage 21 to perform the before-dip spray processing program, and then the stage driving module 60 lowers the substrate 90 into the dip processing tank 10 c.
After the spray-rinsing process is completed, the stage driving module 60 raises the substrate 90 and the inverted substrate stage 21 after the spray-rinsing process is completed, and places the substrate into the cleaning and drying tank 30 to perform the cleaning and drying process, the substrate 90 is spray-rinsed in the cleaning and drying tank 30 with a processing liquid (e.g., deionized water 300), and after the cleaned deionized water 300 is discharged from the cleaning and drying tank, the substrate can be further spray-dried with nitrogen at a high speed. According to an embodiment of the present invention, the cleaning and drying tank 30 supplies a volatile liquid for dry cleaning in the tank, for example, when the substrate 90 is a surface-structured substrate, a better cleaning effect can be obtained.
Fig. 4 to 9 are schematic views showing a third embodiment of the present invention, in which the immersion processing tank 10c, the spray processing tank 20, and the cleaning and drying tank 30 of the substrate wet processing apparatus are all in the same tank, and the spray processing tank 20 and the cleaning and drying tank 30 are different recovery units of the same tank, so that a closed space can be formed during the wet processing process.
As shown in fig. 4, after the spray processing routine is completed, stage drive module 60 raises substrate 90 and substrate inversion stage 21 on which the spray processing routine is completed, and sets them in cleaning and drying tank 30, sprays deionized water 300 onto substrate 90, and recovers them by recovery unit 22 b. According to an embodiment of the present invention, the substrate 90 is turned to the right position for performing the cleaning and drying process, so as to prevent the deionized water 300 after cleaning and drying from dropping into the spray rinsing processing tank 20 and causing contamination. In this step, the timing at which the substrate inverting stage 21 is turned to be upright may be before or after the substrate inverting stage is placed in the cleaning and drying tank 30.
As shown in fig. 5, the cleaning and drying tank 30 is vertically separated from the spray treatment tank 20 to form a schematic view of the inlet and outlet of the substrate 90. For example, after the cleaning and drying process is completed, the cleaning and drying bath 30 is raised to complete the substrate wet processing process.
According to an embodiment of the present invention, in the substrate wet processing apparatus 1b shown in fig. 6, the recovery unit 31 of the cleaning and drying tank 30 is disposed adjacent to the recovery units 22 and 22a of the spray processing tank 20, and when the spray processing is performed, the processing liquid nozzle 80 sprays the substrate 90 with the spray processing liquid 100 and recovers the spray processing liquid 100 through at least one of the recovery units 22 and 22 a. After the spray rinsing process is completed, as shown in fig. 7, the stage driving module 60 raises the substrate 90 and the substrate inversion stage 21, on which the spray rinsing process is completed, to a position where the deionized water 300 can be recovered by the recovery unit 31 of the cleaning and drying tank 30, performs the cleaning and drying process of the next stage, and recovers the deionized water 300 after the cleaning and drying process by the recovery unit 31. In the description and illustration of the present embodiment, the substrate inverting stage 21 is moved up and down to perform the spray processing program and the cleaning and drying program, but the present embodiment is not limited thereto, and the spray processing program and the cleaning and drying program may be performed in the same tank by moving up and down the recovery units 22,22a, 31, and the like, for example. Since the form and driving method of the recovery unit are not the focus of the improvement of the present invention, the details thereof will not be described herein.
According to an embodiment of the present invention, as shown in fig. 8 and 9, the immersion processing tank 10, the spray processing tank 20 and the cleaning and drying tank 30 of the substrate wet processing apparatus 1c are all in the same tank body, the spray processing tank 20 and the cleaning and drying tank 30 are different recovery units of the same tank body (the schematic of each recovery unit can refer to fig. 4 and 5 as examples), a closed space can be formed during the wet processing procedure, the substrate wet processing apparatus 1c includes a tank body control unit 901, the tank body control unit 901 can control the cleaning and drying tank 30 and the spray processing tank 20 to be closed (fig. 9) or separated (fig. 8), when the cleaning and drying tank 30 and the spray processing tank 20 are closed, the substrate 90 can be cleaned and dried in the cleaning and drying tank 30, so as to prevent the cleaning liquid from splashing outside the apparatus, and prevent the chemical gas from escaping; when the cleaning/drying tank 30 is separated from the spray treatment tank 20, a substrate transfer port 902 may be formed, and the substrate 90 may be transferred to and from the substrate wet treatment apparatus 1c through the substrate transfer port 902. According to an embodiment of the present invention, the tank body control unit 901 may be a driving motor or a robot, but the present invention is not limited to these embodiments.
As shown in fig. 8 and 9, the substrate inversion stage 21 includes an inversion position P1 and a forward position P2, wherein the substrate inversion stage 21 drives the substrate inversion stage 21 to flip between the inversion position P1 and the forward position P2 through the stage driving module 60. When the substrate wet processing apparatus 1c performs the dip processing program and the spray processing program on the substrate 90, the substrate inversion stage 21 assumes the inversion position P1, and when the substrate wet processing apparatus 1c performs the cleaning and drying program on the substrate 90, the substrate inversion stage 21 assumes the forward position P2. In the embodiment, the substrate wet processing procedure is integrated in the same tank, which not only shortens the processing time of the wet processing procedure, reduces the leakage of the spray 100 or the soak 200 when the substrate 90 is switched among several tanks, but also solves the problems of the mutual contamination of the processing solutions and the chemical gas dissipation when the wet processing procedure is switched.
The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (19)

1. A substrate wet processing device for performing a wet processing procedure on a substrate, the wet processing procedure comprising a dipping processing procedure, a chemical liquid spraying processing procedure and a cleaning and drying procedure in sequence, the substrate wet processing device comprising:
a dipping treatment tank for performing the dipping treatment process on the substrate;
a spray rinsing treatment tank, wherein the dipping treatment tank is positioned below the spray rinsing treatment tank, the spray rinsing treatment tank comprises a substrate inversion carrying platform, and the substrate is placed on the substrate inversion carrying platform and is used for carrying out the liquid medicine spray rinsing treatment program on the substrate;
a stage driving module for driving the substrate inverting stage to flip between an inverted position and a forward position, wherein when the substrate wet processing apparatus performs the immersion processing procedure and the liquid medicine spray processing procedure on the substrate, the stage driving module drives the substrate inverting stage to assume the inverted position;
a cleaning and drying tank for performing the cleaning and drying process on the substrate, wherein the immersion processing tank, the spray processing tank and the cleaning and drying tank are all the same tank body, and when the substrate wet processing device performs the cleaning and drying process on the substrate, the stage driving module drives the substrate inverted stage to assume the forward position; and
a processing process control unit electrically connected to the immersion processing tank, the spray processing tank and the cleaning and drying tank, wherein the processing process control unit controls the wet processing procedure of the substrate in the substrate wet processing device.
2. The apparatus of claim 1, wherein the process control unit controls timing of the substrate entering and exiting the immersion processing bath, respectively.
3. The apparatus of claim 2, wherein the process control unit controls the immersion processing time to be the same for each of the substrates, and schedules each of the substrates to be placed in the immersion processing bath to perform the immersion processing process.
4. The apparatus of claim 2, wherein the process control unit controls the immersion processing process to be performed on each of the substrates for different time periods, respectively, and schedules the immersion processing to be performed on each of the substrates in the immersion processing tank.
5. The apparatus of claim 1, wherein the time required for the immersion process is longer than the time required for the chemical solution spray process, and the process control unit schedules the immersion timing for each substrate to be placed in the immersion tank according to a time difference between the time required for the immersion process and the time required for the chemical solution spray process.
6. The apparatus of claim 1, wherein the process control unit raises the substrate subjected to the immersion processing into the spray treatment tank.
7. A wet processing apparatus for a substrate according to claim 6, wherein said chemical solution is sprayed to said substrate using a chemical solution which is recovered by falling into said immersion processing bath located below said spraying processing bath.
8. The apparatus of claim 6, wherein the spray treatment tank comprises a recycling unit, wherein the chemical solution spray treatment process is performed on the substrate using a chemical solution, and the chemical solution is recycled by the recycling unit, wherein the chemical solution not sprayed to the recycling unit is recycled by falling into the immersion treatment tank located below the spray treatment tank.
9. The apparatus of claim 6, wherein the substrate is placed on the substrate inversion stage, wherein the apparatus further comprises a stage driving module for lowering the substrate inversion stage into the immersion processing tank to perform the immersion processing on the substrate, and after the immersion processing is completed, the stage driving module raises the substrate inversion stage into the spray processing tank to perform the chemical spray processing on the substrate.
10. The apparatus of claim 9, wherein the wet processing program further comprises a pre-dip shower processing program, and wherein the stage driving module lowers the substrate inversion stage into the dip processing tank to perform the dip processing program on the substrate after the process control unit places the substrate into the substrate inversion stage to perform the pre-dip shower processing program.
11. The apparatus of claim 6, wherein the spray rinsing bath includes a plurality of treating solution nozzles to supply different treating solutions.
12. The apparatus of claim 11, wherein the spray rinsing bath includes a plurality of recovery units to recover different chemical solutions correspondingly.
13. The apparatus of claim 6, wherein the spray treatment tank and the cleaning and drying tank are different recovery units of the same tank body.
14. The apparatus of claim 13, wherein the tank is a closed tank.
15. The apparatus of claim 13, wherein the cleaning and drying tank is located above the spray processing tank, and wherein the apparatus further comprises a stage driving module for raising the substrate and the inverted stage of the substrate that have completed the chemical spray processing into the cleaning and drying tank to perform the cleaning and drying process.
16. The apparatus of claim 15, wherein the stage driving module turns the substrate upside down stage positioned in the spray processing tank to be upright, and places the substrate in the cleaning and drying tank in the upright position to perform the cleaning and drying process.
17. The substrate wet processing apparatus according to claim 13, comprising a tank body control unit, wherein the tank body control unit controls the cleaning and drying tank and the spray treatment tank to be separated from each other in a vertical direction to form a substrate inlet/outlet, wherein the substrate passes through the substrate inlet/outlet to input/output the substrate wet processing apparatus.
18. The apparatus of claim 1, further comprising a gas spraying unit disposed above at least one of the spray treatment tank and the immersion treatment tank, for performing gas spraying when the substrate is moved out of the tank body.
19. The apparatus of claim 1, wherein the immersion processing bath is capable of accommodating a plurality of substrates, and wherein the process control unit controls an immersion timing of each substrate into the immersion processing bath when the immersion processing bath performs the immersion processing.
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