CN1080670A - Non-metal electroplating process - Google Patents
Non-metal electroplating process Download PDFInfo
- Publication number
- CN1080670A CN1080670A CN92105061.5A CN92105061A CN1080670A CN 1080670 A CN1080670 A CN 1080670A CN 92105061 A CN92105061 A CN 92105061A CN 1080670 A CN1080670 A CN 1080670A
- Authority
- CN
- China
- Prior art keywords
- metal
- electroplating
- square decimeter
- electroplate
- process according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052755 nonmetal Inorganic materials 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000009713 electroplating Methods 0.000 title abstract description 9
- 150000002843 nonmetals Chemical class 0.000 title 1
- 239000007769 metal material Substances 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004568 cement Substances 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000002969 artificial stone Substances 0.000 abstract 1
- 239000011449 brick Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000004927 clay Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 239000010440 gypsum Substances 0.000 abstract 1
- 229910052602 gypsum Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000004575 stone Substances 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003791 organic solvent mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The present invention is one new electroplating technology capable of electroplating copper, silver, gold and other metals on various non-metal material products. The method is that a layer of anticorrosive glue is coated on the non-metal product, then a conductive coating is coated on the non-metal product to form a conductive layer on the surface of the non-metal product, and then electroplating is directly carried out. It can be used for electroplating on various non-metal products of plastics, ceramics, gypsum, clay pottery, cement, brick and tile, stone and artificial stone, etc., so that it can greatly broaden the field of electroplating application.
Description
The present invention relates to a kind of novel on non-metallic material the technology of plated metal.
Because the various in style and low price of non-metallic material, thereby people have done big quantity research to its electroplating technology.But at present only can be on limited several non-metallic material such as ABS plastic, acetal plastic, glass reinforced plastic plated metal, and complex process generally need be carried out steps such as degreasing, alligatoring, sensitization, activation, dispergation, electroless plating, preplating, plating.Japan has introduced in the clear 55-79871 patent with carbon particulate or silver, copper, nickel powder organic binder bond, ORGANIC SOLVENT MIXTURES and has formed mobile suspension; be coated in and form conductive layer on the non-metallic material; carry out electric plating method then; in addition; introduce a kind of waterproof paint and electrically conducting coating of on non-metallic material, applying in the flat 1-301882 patent of Japan, carried out electric plating method after the drying again.Existing problem is in the above-described processing method, electrically conducting coating is difficult to all have good sticking power with various non-metallic material, thereby can not guarantee to plate out good metal coating various nonmetal powering on, the anti-plating bath erosion of its water-proof coating is not strong in addition, requirement just increases an electrode when electroplating area above the 3-5 square decimeter.
The objective of the invention is to provides a kind of can powering at most non-metal material surfaces to plate the processing method of good metal at the deficiency in the above technology, and method is simple, and cost is lower.
The objective of the invention is to reach by following measure, its non metal electroplate process step is: precoating waterproof glue against corrosion on non-metallic material, at this coated with conductive coating again above glue-line, use the diluted acid activation treatment after dry, and carry out Metal plating again.
The present invention is described in further detail below with reference to embodiment.
Example 1, copper facing, gold-plated on rostone (mixtures of a spot of resin and finely powdered non-metallic material such as a large amount of talcum powder or cement) goods.
Earlier product surface is sprayed last layer waterproof glue against corrosion.Resist and cover the mixture that waterproof glue is a kind of styrenic polymer and solvent, at its conductive coating spray during complete drying not, this coating is the mixture of styrenic polymer, solvent and fine copper powder, under 50 ℃ of conditions dry 20 minutes afterwards, the mixing solutions activation treatment that 3% sulfuric acid and a small amount of washing composition are arranged after the cooling again, the copper facing of washing back is to electroplate 30 minutes under 3 square decimeters the condition in current density, and is gold-plated then.
Example 2, in the stronger non-metallic material of water-absorbent, as carrying out acid bright copper plating on the plastering, imitative old.
Earlier with three times waterproof glues against corrosion of its goods dip-coating, its prescription is the same with example 1, conductive coating spray then, and its prescription is consistent with example 1.Oven dry is 40 minutes under 60 ℃ of conditions, directly carries out acid bright copper plating after the cooling, and its electroplating technology is all consistent with example 1.
More than goods among two embodiment when Metal plating, electroplate area below the 10-15 square decimeter, can adopt an electrode, greater than the 10-15 square decimeter, every increases 10-15 square decimeter needs anode contact of increase.
Claims (4)
1, a kind of non metal electroplate process is characterized in that; Precoating waterproof glue against corrosion on non-metallic material at this coated with conductive coating again above glue-line, is used the diluted acid activation treatment after dry, carries out Metal plating again.
2, non metal electroplate process according to claim 1 is characterized in that: waterproof glue against corrosion is the mixture of styrenic polymer, solvent.
3, non metal electroplate process according to claim 1 is characterized in that: electrically conducting coating is a styrenic polymer, the mixture of solvent and fine copper powder.
4, non metal electroplate process according to claim 1 is characterized in that: during Metal plating, electroplate area below the 10-15 square decimeter, can adopt an electrode, greater than the 10-15 square decimeter, every increase 10-15 square decimeter needs to increase an anode contact.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN92105061.5A CN1029413C (en) | 1992-06-26 | 1992-06-26 | Non-metal electroplating process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN92105061.5A CN1029413C (en) | 1992-06-26 | 1992-06-26 | Non-metal electroplating process |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1080670A true CN1080670A (en) | 1994-01-12 |
CN1029413C CN1029413C (en) | 1995-08-02 |
Family
ID=4941161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN92105061.5A Expired - Fee Related CN1029413C (en) | 1992-06-26 | 1992-06-26 | Non-metal electroplating process |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1029413C (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1860258B (en) * | 2003-08-21 | 2010-06-16 | 株式会社秀峰 | Method of preparing printed or daubed image and printed or daubed image element by it |
CN102127764A (en) * | 2011-01-28 | 2011-07-20 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
CN103029373A (en) * | 2011-09-30 | 2013-04-10 | 孙宝春 | Stone with functional thin film layer and manufacturing method thereof |
CN103952736A (en) * | 2014-05-14 | 2014-07-30 | 石家庄东方紫铜浮雕工艺品有限公司 | Electroplating process for redwood screen base |
CN105219202A (en) * | 2015-09-15 | 2016-01-06 | 熊平伟 | For the conductive resin of non-metal electroplating and the mould made thereof and electro-plating method thereof |
CN108221017A (en) * | 2018-03-02 | 2018-06-29 | 张磊 | A kind of non-metallic process product and electroplating manufacturing process |
CN113645825A (en) * | 2021-08-11 | 2021-11-12 | 中国电子科技集团公司第十四研究所 | Preparation method of electromagnetic shielding composite film based on non-metallic material |
-
1992
- 1992-06-26 CN CN92105061.5A patent/CN1029413C/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1860258B (en) * | 2003-08-21 | 2010-06-16 | 株式会社秀峰 | Method of preparing printed or daubed image and printed or daubed image element by it |
CN102127764A (en) * | 2011-01-28 | 2011-07-20 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
CN102127764B (en) * | 2011-01-28 | 2013-03-27 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
CN103029373A (en) * | 2011-09-30 | 2013-04-10 | 孙宝春 | Stone with functional thin film layer and manufacturing method thereof |
CN103952736A (en) * | 2014-05-14 | 2014-07-30 | 石家庄东方紫铜浮雕工艺品有限公司 | Electroplating process for redwood screen base |
CN105219202A (en) * | 2015-09-15 | 2016-01-06 | 熊平伟 | For the conductive resin of non-metal electroplating and the mould made thereof and electro-plating method thereof |
CN108221017A (en) * | 2018-03-02 | 2018-06-29 | 张磊 | A kind of non-metallic process product and electroplating manufacturing process |
CN113645825A (en) * | 2021-08-11 | 2021-11-12 | 中国电子科技集团公司第十四研究所 | Preparation method of electromagnetic shielding composite film based on non-metallic material |
Also Published As
Publication number | Publication date |
---|---|
CN1029413C (en) | 1995-08-02 |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
OR01 | Other related matters | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |