CN108061944B - A kind of method and apparatus of light module package - Google Patents
A kind of method and apparatus of light module package Download PDFInfo
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- CN108061944B CN108061944B CN201610981740.7A CN201610981740A CN108061944B CN 108061944 B CN108061944 B CN 108061944B CN 201610981740 A CN201610981740 A CN 201610981740A CN 108061944 B CN108061944 B CN 108061944B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
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Abstract
The present invention relates to the airtight technical fields of optical module, provide a kind of method and apparatus of light module package.Wherein, which comprises the assembling and glue envelope for carrying out OSA component obtain optical module to be coated；Using cover material, the external connection interface of optical module to be coated is covered；The optical module to be coated finished will be covered to be put into coating chamber, plated film is carried out to the optical module to be coated；Wherein, Coating Materials is Parylene；Remove cover material.The embodiment of the present invention completes assembling in optical assembly and glue is honored as a queen; using the method for chemical deposition to progress plated film outside optical assembly; so that there are one layer of densification, uniform protective film in the outside of assembling backlight assembly, to greatly improve the technique constructive method of optical assembly reliability.
Description
[technical field]
The present invention relates to the airtight technical fields of optical module, more particularly to a kind of method and apparatus of light module package.
[background technique]
Big data era, the rapidly development of stimulus data communication especially data center, greatly pulling data communication are used
The demand of optical module (Optical Module).However, the cost of optical module is a weight for rapid proliferation optical communication network
Want factor.A large amount of and inexpensive data communication optical modules is needed in the market.
The core of optical module is optical assembly (Optical Sub Assembly, write a Chinese character in simplified form are as follows: OSA), including sends optical assembly
(Transmitter Optical Sub Assembly, write a Chinese character in simplified form are as follows: TOSA), optical assembly (Receiver Optical is received
Sub Assembly, writes a Chinese character in simplified form are as follows: ROSA), (Bi-directional Optical Sub Assembly, writes a Chinese character in simplified form two-way optical assembly
Are as follows: BOSA) or light engine (optical engine) etc..Optical assembly accounts for 60% or more of optical mode block cost.In general,
Laser, for detector etc optical chip after volume production, the leeway of cost improvement is little, so the encapsulation technology of improvement optical assembly
It is the necessary condition that optical module is evolved.
Level Hermetic Package mode is usually used in traditional optical assembly encapsulation.This is because former such as laser, detector etc.
Optical chip be all that cannot be placed directly in non-controlling environment (Uncontrolled environment, writes a Chinese character in simplified form are as follows: UNC)
Bare die.Typical optical assembly level Hermetic Package form is the same axle envelope of TO-can (Transistor Outline, writes a Chinese character in simplified form are as follows: TO)
Dress.There is also such as butterflies to encapsulate (Butterfly), the non-TO-can level Hermetic Package of Minidill etc..The spy of level Hermetic Package
Point is using the encapsulating material (metal, ceramics and glass) and technique for being fully able to prevent liquid or solid from corroding.Level Hermetic Package
The problem of be that packaging technology is longer, component is more, higher cost etc..In addition, traditional level Hermetic Package makes integreted phontonics, (light is mixed
Intersection at or silicon light etc.) it is extremely difficult, be not able to satisfy the requirement in current data communication market.
Solve method of problems in above-mentioned level Hermetic Package first is that the non-hermetically sealed envelope of exploitation data communication optical assembly
Dress technology.The precondition of non-hermetically sealed encapsulation is that optical chip must satisfy reliability requirement condition under non-controlling environment (here
It refers mainly to specified in Telcordia GR-486-CORE for applying the condition that must satisfy under UNC environment).In IC industry
In non-hermetically sealed encapsulation technology be generally divided into: the non-hermetically sealed method in part, note type method Casting and trickle irrigation method (Chip On Board, letter
It is written as: COB).Wherein, although the non-hermetically sealed method in part and note type method can play good electromagnetic compatibility by metal shell structure
Property (Electro Magnetic Compatibility, writes a Chinese character in simplified form are as follows: EMC)/electromagnetic interference (Electro Magnetic
Interference writes a Chinese character in simplified form are as follows: EMI) performance, still, but to leaving non-hermetically sealed hidden danger at package interface；Although and trickle irrigation method
The airtight problem of interface can be improved, still, there are problems that Electro Magnetic Compatibility, and harsh for what is faced needed for optical device
For working environment, still have much room for improvement.According to the data of IC industry, under conditions of 121 degree Celsius, 202kPa pressure, respectively
The average data of method reliability (sealing surface gap) is as follows: the non-hermetically sealed method: greater than 200h in part；Note type method: 200h or so；Drop
Filling method: 20h or so；Therefore, the non-hermetically sealed encapsulation technology of IC industry is used in optical device, it is necessary to improve various encapsulation sides
The reliability of method.
[summary of the invention]
Technical problems to be solved of the embodiment of the present invention first is that how to improve non-hermetically sealed employed in existing IC industry
It is encapsulated in reliability, non-hermetically sealed encapsulation employed in IC industry is made to can satisfy the air-tightness requirement of fields of light devices.
The embodiment of the present invention adopts the following technical scheme that
In a first aspect, the embodiment of the invention provides a kind of method of light module package, the packaging method includes:
The assembling and glue envelope for carrying out OSA component, obtain optical module to be coated；
Using cover material, the external connection interface of optical module to be coated is covered；
The optical module to be coated finished will be covered to be put into coating chamber, plated film is carried out to the optical module to be coated；Wherein,
Coating Materials is Parylene；
Remove cover material.
Optionally, the assembling for carrying out OSA component, specifically includes:
OSA component is installed on substrate, wherein the installation includes: gluing, to light, device layout, bonding and surface
One or more process in patch weldering.
Optionally, when the assembling mode of OSA component meets the non-hermetically sealed method in part, the glue envelope is specifically included:
Resin glue is inserted in gap between cap, pin, substrate and shell；
When the assembling mode of OSA component meets note type method, the glue envelope is specifically included:
Resin glue is inserted in gap between substrate and resin enclosure；
When the assembling mode of OSA component meets trickle irrigation method, the glue envelope is specifically included:
OSA component optical path and its around point on match glue, the OSA device region point resin glue on substrate.
Second aspect, the embodiment of the invention provides a kind of method of light module package, the packaging method includes:
The assembling and glue envelope for carrying out OSA component, obtain optical module to be coated；
Optical module to be coated is put into coating chamber, in such a way that electromagnetism sputters or is vapor-deposited, to described to be plated
Film optical module carries out nanoscale plasma coating.
Optionally, the assembling for carrying out OSA component and glue envelope, specifically include:
OSA component is installed on substrate, wherein the installation includes: gluing, to light, device layout, bonding and surface
One or more process in patch weldering；
Optionally, when the assembling mode of OSA component meets the non-hermetically sealed method in part, the glue envelope is specifically included:
Resin glue is inserted in gap between cap, pin, adagio and shell；
When the assembling mode of OSA component meets note type method, the glue envelope is specifically included:
Resin glue is inserted in gap between substrate and resin enclosure；
When the assembling mode of OSA component meets trickle irrigation method, the glue envelope is specifically included:
OSA component optical path and its around point on match glue, the OSA device region point resin glue on substrate.
The third aspect, the embodiment of the invention provides a kind of structure of light module package, the structure include OSA component,
Substrate, shell, resin glue and Parylene plated film:
The OSA component is fixed on the substrate, and is located in the shell；Electrical interface is additionally provided on the shell
And optical interface；Resin glue is provided at the electrical interface and optical interface；The Parylene plated film be covered in the shell with
And on resin glue.
Optionally, the Parylene plated film with a thickness of 10-14um.
Fourth aspect, the embodiment of the invention provides a kind of structures of light module package, which is characterized in that the structure packet
Include OSA component, substrate, optical fiber interface, resin glue and Parylene plated film:
The OSA component is fixed on the substrate, and the optical fiber is fixed on the optical fiber interface of OSA component；Described
It is located at OSA assembly surface on substrate and optical fiber interface is covered with resin glue；The Parylene plated film is covered in the tree
On rouge glue.
Optionally, the Parylene plated film with a thickness of 10-14um.
The embodiment of the present invention optical assembly complete assembling and glue be honored as a queen, using chemical deposition method to outside optical assembly into
Row plated film, so that there are one layer of densification, uniform protective film in the outside of assembling backlight assembly, so that it is reliable to greatly improve optical assembly
The technique constructive method of property.
[Detailed description of the invention]
Fig. 1 is optical module structure schematic diagram made from the non-hermetically sealed method in a kind of part provided in an embodiment of the present invention；
Fig. 2 is optical module structure schematic diagram made from a kind of note type method provided in an embodiment of the present invention；
Fig. 3 is optical module structure schematic diagram made from a kind of trickle irrigation method provided in an embodiment of the present invention；
Fig. 4 is a kind of method flow schematic diagram of light module package provided in an embodiment of the present invention；
Fig. 5 is a kind of method flow schematic diagram of light module package provided in an embodiment of the present invention；
Fig. 6 is a kind of method of optical module level Hermetic Package realized based on the non-hermetically sealed method in part provided in an embodiment of the present invention
Flow diagram；
Fig. 7 is a kind of apparatus structure schematic diagram of optical module level Hermetic Package provided in an embodiment of the present invention；
Fig. 8 is that a kind of method flow of optical module level Hermetic Package realized based on note type method provided in an embodiment of the present invention is shown
It is intended to；
Fig. 9 is a kind of apparatus structure schematic diagram of optical module level Hermetic Package provided in an embodiment of the present invention；
Figure 10 is a kind of method flow of optical module level Hermetic Package realized based on trickle irrigation method provided in an embodiment of the present invention
Schematic diagram；
Figure 11 is a kind of apparatus structure schematic diagram of optical module level Hermetic Package provided in an embodiment of the present invention；
Figure 12 is the result schematic diagram of existing optical module optical power test provided in an embodiment of the present invention；
Figure 13 is the result schematic diagram of the optical power test of the device of optical module level Hermetic Package provided in an embodiment of the present invention；
Figure 14 is the light function between existing optical module and the device of optical module level Hermetic Package provided in an embodiment of the present invention
Rate test and comparison figure.
[specific embodiment]
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the present invention, term "inner", "outside", " longitudinal direction ", " transverse direction ", "upper", "lower", "top", "bottom" etc. refer to
The orientation or positional relationship shown be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention rather than
It is required that the present invention must be constructed and operated in a specific orientation, therefore it is not construed as limitation of the present invention.
In addition, as long as technical characteristic involved in the various embodiments of the present invention described below is each other not
Constituting conflict can be combined with each other.
The precondition of non-hermetically sealed encapsulation is that optical chip must satisfy reliability requirement condition under non-controlling environment (here
It refers mainly to specified in Telcordia GR-486-CORE for applying the condition that must satisfy under UNC environment).In optical device
Non-hermetically sealed encapsulation technology is generally divided into field: the non-hermetically sealed method in part, note type method and trickle irrigation method, however, it is found by the inventors that above-mentioned
There is respective deficiency in three kinds of methods.
The non-hermetically sealed method in part: as shown in Figure 1, the carrier of the optical assemblies such as optical chip is shell, but shell and pin, adagio
(Flex) material of the resin one kind of the gap between cover board, and encapsulation is completed after being heating and curing.
This method is from level Hermetic Package to the transition of non-hermetically sealed encapsulation, and shell is metal material, wherein metal material
Shell has good Electro Magnetic Compatibility/electromagnetic interference performance.But in order to simplify technique and guarantee RF performance, wherein lead, soft
Band etc. is only fixed with resin.Obviously, the place of resin is non-hermetically sealed.
Note type method: as shown in Fig. 2, the size according to optical assembly designs mold, the plastic shell as made of resin is made.
For optical assembly, general OSA is fixed on the substrate of electrical connection, is then covered resin enclosure on OSA, gap location
The liquid resins such as epoxy resin are injected, encapsulation is completed after heated solidification.
The material of note type method can be metal, be also possible to resin (plastics), require to accept or reject according to cost and performance.If
It is plastics, then other methods must be taken into consideration to solve the problems, such as EMC/EMI.Filler and silicon tree can be added as needed on OSA
Rouge protects OSA, is encapsulated using the glue of epoxy resin in the interface of shell and bottom plate.
Trickle irrigation method: as shown in figure 3, the carrier of the optical assemblies such as optical chip is placed directly against printed circuit board (Printed
Circuit Board, writes a Chinese character in simplified form are as follows: PCB) on, with syringe and the liquid distributor epoxy resin that viscosity is relatively low, the liquid such as silicone resin
State drop of resin is filled on optical assembly, completes to encapsulate by heat cure.
Trickle irrigation method is the mature technology of IC, it has proved that can help to protect chip.When used in package of optical device, due to having
Optical interface generally requires the filler of first point matching glue etc Backup lightpath, then puts the resin glues such as silicone resin again.Traditional is non-
For level Hermetic Package method in the application of optical module, reliability seems insufficient.Therefore, the embodiment of the present invention will be directed to traditional non-gas
Close packaging method proposes the implementation for improving its air-tightness.
Embodiment 1:
The embodiment of the present invention 1 provides a kind of method of light module package, the method be suitable for the non-hermetically sealed method in part,
The optical module that note type method and trickle irrigation method complete the process carries out subsequent processing, so that the gas for the optical module that various methods are processed
Close property further can satisfy the demand of optical device application environment, as shown in figure 4, the method includes steps performed below:
In step 201, the assembling and glue envelope for carrying out OSA component, obtain optical module to be coated.
It is set according to different product demands and producing line, the assembling and glue envelope in the step 201 include but is not limited to
Any one in the non-hermetically sealed method in part, note type method and trickle irrigation method.Wherein, used material includes: epoxy during glue envelope
Resin, silica gel etc., the curing mode of different glue have slightly different, wherein being heating and curing is mode more commonly used at present
One of.
In step 202, using cover material, the external connection interface of optical module to be coated is covered.
Wherein, cover material can be specific gummed paper or liquid.And the external connection interface is often referred to electrical interface,
Such as: golden finger, metal pin or PCB pad etc.；The external connection interface can be with optical interface, such as gigabit second
Too network interface converter (Gigabit Interface Converter, write a Chinese character in simplified form are as follows: GIC) and small pluggable interface
The optical interface of the external connection of (Small Form Factor Plugable, write a Chinese character in simplified form are as follows: SFP).
In step 203, the optical module to be coated that finishes will be covered to be put into coating chamber, to the optical module to be coated into
Row plated film；Wherein, Coating Materials is Parylene.
During specific implementation, the coating process is typically implemented as: Parylene material being put into chamber, in vacuum
Under the conditions of high temperature be sublimed into gaseous state；Then sublimation gases enter cracking room, and under cracking temperature, gaseous starting materials are cracked into list
Body；Last gaseous monomer enters settling chamber (coating chamber is also referred to as in the present embodiment), is dispersed near optical module surface to be coated,
Start polymerizable crystallizable on optical module surface to be coated, is formed solid-state (i.e. parylene film).
Parylene film has mechanical strength good, coefficient of friction is low, water vapor transmittance due to that can plate thicker
Low, dielectric strength is high, and insulation resistance is high, and dielectric loss and dielectric constant are also relatively low, and as protective coating, it can be covered from work
Frequency arrives the use of 10GHZ frequencies above section circuit.
In step 204, cover material is removed.
The method for removing cover material, the method that removing can be used for gummed paper can make for liquid
The purpose of removal cover material is realized with cleaning solution.
The embodiment of the present invention optical assembly complete assembling and glue be honored as a queen, using chemical deposition method to outside optical assembly into
Row plated film, coating film thickness is more flexible, can be from nanometer to some tens of pm.So that there be one layer of cause in the outside of assembling backlight assembly
Close, uniform protective film, to greatly improve the technique constructive method of optical assembly reliability.The method of the embodiment of the present invention
Can be applied to integrated etc. the non-hermetically sealed encapsulation optical assembly of planar optical waveguide PLC hybrid integrated or silicon light, be applied to including but
It is not limited to SFP, the construction of the high rate optical module of CFP, QSFP etc..
In embodiments of the present invention, the assembling for carrying out OSA component, specifically includes: OSA component is mounted on substrate
On, wherein it is described installation include: gluing, to light, device layout, bonding and surface patch weldering in one or more it is processed
Journey.
When the assembling mode of OSA component meets the non-hermetically sealed method in part, as shown in Figure 1, glue envelope specifically includes:
Resin glue is inserted in gap between cap, pin, substrate and shell.
When the assembling mode of OSA component meets note type method, as shown in Fig. 2, glue envelope specifically includes:
Resin glue is inserted in gap between substrate and resin enclosure.
When the assembling mode of OSA component meets trickle irrigation method, as shown in figure 3, glue envelope specifically includes:
OSA component optical path and its around point on match glue, the OSA device region point resin glue on substrate.
Wherein, matching glue can guarantee the normal transmitting of the optical signal at optical-path interface position；It can prevent resin glue from entering
Optical-path interface, so that causing signal to decay light propagation.
What coating process used by the embodiment of the present invention, the coating process of low-temp low-pressure influence workpiece without；Have
Very strong permeability, can penetrate into the various minute sites of device, the bottom of COB patch workpiece and the loose capillary of working surface
Kong Zhong；Since film is very thin, facilitate the heat dissipation of electronic device, the destruction of the film as caused by expanding with heat and contract with cold will not be generated；Due to
It is in working surface direct polymerization into solid coated film, without convergent force caused by solidification process, also not because of surface
It is uneven caused by power.
Embodiment 2:
The embodiment of the invention also provides a kind of methods of light module package, common both for embodiment 1
Point be exactly be all made of to be completed, and carried out the envelope of glue in the prior art optical module (be known as in embodiment to
Plated film optical module).However, the distinctive points of the two are then presented as that the mode of operation that plated film is completed in coating chamber is different, embodiment 1
In be accomplished that plating parylene film, and what the embodiment of the present invention was realized is then plasma membrane, as shown in figure 5, the envelope
Dress method includes:
In step 301, the assembling and glue envelope for carrying out OSA component, obtain optical module to be coated.
In step 302, optical module to be coated is put into coating chamber, the side for being sputtered or being vapor-deposited using electromagnetism
Formula carries out nanoscale plasma coating to the optical module to be coated.
The embodiment of the present invention optical assembly complete assembling and glue be honored as a queen, by electromagnetism sputter or be vapor-deposited in the way of pair
Plated film is carried out outside optical assembly, so that there are one layer of densification, uniform protective film in the outside of assembling backlight assembly, to greatly mention
The technique constructive method of bloom assembly reliability.The embodiment that compares 1, plasma coating used by the present embodiment, due to
The characteristics of plasma membrane, is that film is very thin (nanoscale), so even if on optic module PCB such as electrical interface of " golden finger " class
Place, does not need generally to cover, and does not influence to weld and be in electrical contact.The embodiment that compares 1 simplifies manufacturing procedure, when having saved processing
Between.The method of the embodiment of the present invention can be applied to including but not limited to SFP, the structure of the high rate optical module of CFP, QSFP etc.
It makes.
In embodiments of the present invention, the assembling for carrying out OSA component, specifically includes: OSA component is mounted on substrate
On, wherein it is described installation include: gluing, to light, device layout, bonding and surface patch weldering in one or more it is processed
Journey.
When the assembling mode of OSA component meets the non-hermetically sealed method in part, as shown in Figure 1, glue envelope specifically includes:
Resin glue is inserted in gap between cap, pin, substrate and shell.
When the assembling mode of OSA component meets note type method, as shown in Fig. 2, glue envelope specifically includes:
Resin glue is inserted in gap between substrate and resin enclosure.
When the assembling mode of OSA component meets trickle irrigation method, as shown in figure 3, glue envelope specifically includes:
OSA component optical path and its around point on match glue, the OSA device region point resin glue on substrate.
What coating process used by the embodiment of the present invention, the coating process of low-temp low-pressure influence workpiece without；Have
Very strong permeability, can penetrate into the various minute sites of device, the bottom of COB patch workpiece and the loose capillary of working surface
Kong Zhong；Since film is very thin, facilitate the heat dissipation of electronic device, the destruction of the film as caused by expanding with heat and contract with cold will not be generated；Due to
It is in working surface direct polymerization into solid coated film, without convergent force caused by solidification process, also not because of surface
It is uneven caused by power.
Embodiment 3:
The embodiment of the present invention is for a kind of method of light module package proposed in embodiment 1, and how bound fraction is non-
Airtight method specific implementation gives detailed steps flow chart and illustrates.As shown in Figure 6, which comprises
In step 401, the assembling of OSA component.Inside the shell according to assembling OSA is required, including uses and meet institute's light requirement
The various techniques of function, comprising: adhesion process (epoxy bonding), to light (alignment), device layout
(placement), it is bonded (wire bonding) etc..
In step 402, glue envelope is carried out to the OSA component being completed.Between cap, pin, adagio and shell
Resin glue is inserted in gap.
In step 403, the resin glue of heat cure filling.After being heating and curing, OSA is completed.It is completed at this time
Optical assembly optical module to be coated is also known as in various embodiments of the present invention.
In step 404, it covers and does not need the place of plated film, (electrical interface, optical interface etc.) is with specific gummed paper or liquid
Body is covered.
In step 405, the plated film of optical assembly is carried out.Specifically, putting optical assembly to jig frame, light then will be placed
The jig frame of component is put into gaseous phase deposition stove, plates parylene film.Optionally, the parylene film thickness are as follows: 10-
14um。
In a step 406, optical assembly is removed from jig frame, removes the overcover of optical assembly.External film coated type is non-hermetically sealed
It encapsulates optical assembly to complete, completes the effect diagram of the non-hermetically sealed encapsulation optical assembly of film coated type as shown in fig. 7, other components in Fig. 7
Explanation can refer to Fig. 1 related content, will not repeat them here.
Embodiment 4:
How the embodiment of the present invention combines note type method for a kind of method of light module package proposed in embodiment 1
Specific implementation gives detailed steps flow chart and illustrates.As shown in Figure 8, which comprises
In step 501, mold is designed according to the size of optical assembly, makes resin enclosure.
In step 502, in substrate over-assemble OSA, the various techniques of institute's light requirement function are met including using, such as: glue
Adhering process, to light, device layout, bonding etc..Wherein, the plate structure with electrical connection such as substrate PCB, adagio, ceramic wafer.
In step 503, molding resin enclosure is covered on OSA.
In step 504, resin glue is inserted in the gap between substrate and resin enclosure, carries out glue envelope.
The resin glue specifically can be the liquid resins such as epoxy resin.
In step 505, heat cure.After being heating and curing, OSA is completed.The optical assembly being completed at this time is in this hair
Optical module to be coated is also known as in bright each embodiment.
In step 506, the place for not needing plated film is covered, such as: electrical interface, optical interface etc..It is specifically used specific
Gummed paper or liquid are covered.
In step 507, the plated film of optical assembly is carried out, optical assembly is put to jig frame, and controlling for optical assembly then will be placed
Tool frame, which is put into gaseous phase deposition stove, plates parylene film.Wherein, Parylene film thickness: 10-14um.
In step 508, optical assembly is removed from jig frame, and removes covering, then the non-hermetically sealed encapsulation light of external film coated type
Component is completed.Complete film coated type it is non-hermetically sealed encapsulation optical assembly effect diagram as shown in figure 9, in Fig. 9 other components explanation
Can refer to Fig. 2 related content, will not repeat them here.
Embodiment 5:
How the embodiment of the present invention combines trickle irrigation method for a kind of method of light module package proposed in embodiment 1
Specific implementation gives detailed steps flow chart and illustrates.As shown in Figure 10, which comprises
In step 601, the assembling of OSA component is carried out.Specifically, in substrate, (PCB, adagio, ceramic wafer etc. have and are electrically connected
Connect the substrate even with other IC) over-assemble OSA, the various techniques of institute's light requirement function are met including using, such as: gluing work
Skill, to light, device layout, bonding etc..
If the size of OSA is suitable, can using surface mounting technology, (Sureface Mount Technology, is write a Chinese character in simplified form
Are as follows: SMT) technique assembled.
In step 602, OSA component and its around the filler of glue etc Backup lightpath is first matched on point, then point
The resin glues such as silicone resin.
In step 603, after being heating and curing, OSA component is completed.
In step 604, the place (electrical interface, optical interface etc.) for not needing plated film, specifically used specific gummed paper are covered
Or liquid is covered
In step 605, optical assembly is put to jig frame, and the jig frame for placing optical assembly is then put into gaseous phase deposition stove
It is interior, plate parylene film.Wherein, the film thickness of parylene film are as follows: 10-14um.
In step 606, optical assembly is removed from jig frame, and removes covering, then the non-hermetically sealed encapsulation light of external film coated type
Component is completed.The effect diagram for completing the non-hermetically sealed encapsulation optical assembly of film coated type is as shown in figure 11, and other components says in Figure 11
It is bright can refer to Fig. 3 related content, will not repeat them here.
Embodiment 6:
Based on the method for optical module level Hermetic Package described in the embodiment of the present invention 1, propose in embodiments of the present invention by
The structure for the optical module level Hermetic Package that the method for the optical module level Hermetic Package is processed, as shown in Fig. 7 or 9, the structure packet
Include OSA component 1, substrate 2, resin glue 4, Parylene plated film 5 and shell 6:
The OSA component 1 is fixed on the substrate 2, and is located in the shell 6；Wherein, the shell 6 is fixed on
On substrate 2；Electrical interface and optical interface 3 are additionally provided on the shell 6；The connector and electricity of the shell 6 and substrate 2 connect
Resin glue 4 is provided at mouth and/or optical interface 3；The Parylene plated film 5 is covered in the shell 6 and resin glue 4
On.
Wherein, shell 6 can be resinae shell, be also possible to metal class shell, and the two belongs to the embodiment of the present invention
In protection scope.
In implementation of the embodiment of the present invention, optionally, the Parylene plated film with a thickness of 10-14um.
Embodiment 7:
Based on the method for optical module level Hermetic Package described in the embodiment of the present invention 1, propose in embodiments of the present invention by
The structure for the optical module level Hermetic Package that the method for the optical module level Hermetic Package is processed, as shown in figure 11, the structure includes
OSA component 1, substrate 2, optical fiber interface 3, resin glue 4 and Parylene plated film 5:
The OSA component 1 is fixed on the substrate 2, and the optical fiber 3 is fixed on the optical fiber interface 3 of OSA component 1；?
It is located at 1 surface of OSA component on the substrate 2 and optical fiber interface 3 is covered with resin glue 4；The Parylene plated film covering
In on the resin glue 4.
In implementation of the embodiment of the present invention, optionally, the Parylene plated film with a thickness of 10-14um.
Embodiment 8:
The embodiment of the present invention is for the optical module hermetic seal proposed by the embodiment of the present invention that uses in above-described embodiment 3
The optical module and the existing optical module obtained using the non-hermetically sealed method of regular section that dress method obtains, carry out realize comparison obtain as
Respective experimental result picture shown in Figure 12 and Figure 13.The comparative experiments specifically: non-to sample progress to power on, double 85 (refer
GR-468,3.3.2.3, Non-powered Damp Heat) experimental result, wherein the plated film sample power of the method for the present invention
Final variation is less than 2.58dB.Non- plated film sample power finally changes close to 6dB.And pass through the variation of mean power shown in Figure 14
Compare figure, it can be seen that plating membrane sample variation of mean power in experimental situation, which compares, does not plate membrane sample and effectively changed
It is kind, wherein the mean power for plating membrane sample changes within 0.69dB, relative to the absolute of first time measurement point (168 hours)
Value difference is 0.23dB；The mean power for not plating membrane sample changes then within 2.47dB, and relative to first time measurement point, (168 is small
When) absolute difference be 1.29dB, therefore, it was demonstrated that practicability and validity of the invention.It specifically will be in Figure 12 and Figure 13
Figure is compared in plating membrane sample that each empirical curve obtains after averaging and the mean power variation for not plating membrane sample.
In addition to this, the optical module level Hermetic Package method that 1-5 of the embodiment of the present invention is proposed does not need expensive hermetic seal
Casing (metal, ceramics, glass etc.) and technique (laser welding etc.), the cost of shell and technique compare level Hermetic Package method
1/2 or more decline.
Compared with needing pin passing through the level Hermetic Package extracted after glass insulation, in non-hermetically sealed encapsulation technology, by
Simple in " shell ", optical device can be directly with corresponding IC line, and the impedance matching for greatly having mitigated high-speed wire-layout is asked
Topic, so that optical module has better performance.
The three kinds of non-hermetically sealed packaging methods of optical assembly proposed in 3-5 of the embodiment of the present invention, can be used not only for plane light wave
Lead (Planar Lightwave Circuit, write a Chinese character in simplified form are as follows: PLC) hybrid integrated, the highly integrated optical assembly such as silicon light is integrated,
It can be directly used for through prism, the optical assembly of the Free-space couplings such as filter.
Those of ordinary skill in the art will appreciate that all or part of the steps in the various methods of embodiment is can to lead to
Program is crossed to instruct relevant hardware and complete, which can be stored in a computer readable storage medium, storage medium
It may include: read-only memory (ROM, Read Only Memory), random access memory (RAM, Random Access
Memory), disk or CD etc..
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of method of light module package, which is characterized in that the packaging method includes:
The assembling and glue envelope for carrying out OSA component, obtain optical module to be coated；
Using cover material, the external connection interface of optical module to be coated is covered；
The optical module to be coated finished will be covered to be put into coating chamber, plated film is carried out to the optical module to be coated；Wherein, plated film
Material is Parylene；
Remove cover material.
2. light module package method according to claim 1, which is characterized in that the assembling for carrying out OSA component, specifically
Include:
OSA component is installed on substrate, wherein the installation includes: gluing, pastes and weld to light, device layout, bonding and surface
In one or more process.
3. light module package method according to claim 2, which is characterized in that when the assembling mode of OSA component meets portion
When dividing non-hermetically sealed method, the glue envelope is specifically included:
In cap, pin and substrate three, resin glue respectively is inserted in the gap between shell；
When the assembling mode of OSA component meets note type method, the glue envelope is specifically included:
Resin glue is inserted in gap between substrate and resin enclosure；
When the assembling mode of OSA component meets trickle irrigation method, the glue envelope is specifically included:
OSA component optical path and its around point on match glue, the OSA device region point resin glue on substrate.
4. a kind of method of light module package, which is characterized in that the packaging method includes:
The assembling and glue envelope for carrying out OSA component, obtain optical module to be coated；
Optical module to be coated is put into coating chamber, in such a way that electromagnetism sputters or is vapor-deposited, to the light to be coated
Module carries out nanoscale plasma coating.
5. light module package method according to claim 4, which is characterized in that the assembling for carrying out OSA component and glue
Envelope, specifically includes:
OSA component is installed on substrate, wherein the installation includes: gluing, pastes and weld to light, device layout, bonding and surface
In one or more process.
6. light module package method according to claim 5, which is characterized in that when the assembling mode of OSA component meets portion
When dividing non-hermetically sealed method, the glue envelope is specifically included:
In cap, pin and adagio three, resin glue respectively is inserted in the gap between shell；
When the assembling mode of OSA component meets note type method, the glue envelope is specifically included:
Resin glue is inserted in gap between substrate and resin enclosure；
When the assembling mode of OSA component meets trickle irrigation method, the glue envelope is specifically included:
OSA component optical path and its around point on match glue, the OSA device region point resin glue on substrate.
7. a kind of structure of light module package, which is characterized in that the structure include OSA component, substrate, shell, resin glue and
Parylene plated film:
The OSA component is fixed on the substrate, and is located in the shell；Wherein, the shell is fixed on substrate；Institute
It states and is additionally provided with electrical interface and optical interface on shell；At the connector and electrical interface and/or optical interface of the shell and substrate
It is provided with resin glue；The Parylene plated film is covered on the shell and resin glue.
8. encapsulation device for optical module according to claim 7, which is characterized in that the Parylene plated film with a thickness of
10-14um。
9. a kind of structure of light module package, which is characterized in that the structure includes OSA component, substrate, optical fiber interface, resin
Glue and Parylene plated film:
The OSA component is fixed on the substrate, and the optical fiber is fixed on the optical fiber interface of OSA component；In the substrate
Upper two bands of position of OSA assembly surface and optical fiber interface that are located at are covered with resin glue；The Parylene plated film covering
In on the resin glue.
10. encapsulation device for optical module according to claim 9, which is characterized in that the thickness of the Parylene plated film
For 10-14um.
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| CN111142197B (en) * | 2018-11-05 | 2022-12-27 | 华为机器有限公司 | Optical device, optical module and optical communication equipment |
| JP7379854B2 (en) * | 2019-04-19 | 2023-11-15 | 住友電気工業株式会社 | optical transceiver |
| CN111610608A (en) * | 2020-06-29 | 2020-09-01 | 亨通洛克利科技有限公司 | Optical module encapsulating structure and method |
| CN114296191B (en) * | 2021-12-31 | 2023-11-17 | 中天宽带技术有限公司 | Silicon optical component and packaging method thereof |
| CN114806328B (en) * | 2022-03-28 | 2023-03-10 | 武汉华工正源光子技术有限公司 | Protective coating for optical module and preparation method thereof |
| CN117134827A (en) * | 2022-05-20 | 2023-11-28 | 华为技术有限公司 | Optical communication device |
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| CN1393709A (en) * | 2001-06-22 | 2003-01-29 | 陈祖培 | Moisture-proof sealing method for optical fibre device |
| JP2010109173A (en) * | 2008-10-30 | 2010-05-13 | Mitsubishi Electric Corp | Optical transmitter-receiver, optical transmitter and optical receiver |
| US8766284B1 (en) * | 2004-02-27 | 2014-07-01 | Banpil Photonics Inc. | Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
| EP2833183A2 (en) * | 2013-07-31 | 2015-02-04 | JDS Uniphase Corporation | Flexible hermetic package for optical device |
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| CN1393709A (en) * | 2001-06-22 | 2003-01-29 | 陈祖培 | Moisture-proof sealing method for optical fibre device |
| US8766284B1 (en) * | 2004-02-27 | 2014-07-01 | Banpil Photonics Inc. | Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
| JP2010109173A (en) * | 2008-10-30 | 2010-05-13 | Mitsubishi Electric Corp | Optical transmitter-receiver, optical transmitter and optical receiver |
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