CN108052934A - A kind of intelligent Sensorsystem framework and its implementation, device - Google Patents
A kind of intelligent Sensorsystem framework and its implementation, device Download PDFInfo
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- G06F15/76—Architectures of general purpose stored program computers
- G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
- G06F15/7807—System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package
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- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
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Abstract
The embodiment of the invention discloses a kind of intelligent Sensorsystem framework and its implementation, device, which includes：Sensor assembly and artificial intelligence process module, wherein：The sensor assembly is connected with the artificial intelligence process module in a manner that single-chip integration or module integrate；The measuring signal for obtaining measuring signal, and is converted to electric signal by the sensor assembly；The artificial intelligence process module, the electric signal for being generated according to the sensor assembly perform corresponding artificial intelligence process operation.The embodiment of the present invention can break through the conventional coupling arrangement between sensor assembly and artificial intelligence process module, reduce the transmission range between sensor assembly and artificial intelligence process module, and then effectively improve message transmission rate, reduce the time delay of data transmission, artificial intelligence operation is performed quickly in the signal that can be obtained to sensor assembly, manual intelligent degree is improved, can be had a wide range of application.
Description
Technical field
The present embodiments relate to sensor and field of artificial intelligence more particularly to a kind of intelligent Sensorsystem framves
Structure and its implementation, device.
Background technology
With advances in technology, the subject that artificial intelligence is being rapidly developed as one, has been widely used in figure
The Digital Signal Processing such as picture or sound.Artificial intelligence is combined with sensor technology, it will the level of intelligence of sensor is improved,
To be an important directions of Artificial Intelligence Development.
In the prior art, artificial intelligence is mainly found expression in the mode that sensor technology is combined：The system of smart machine
Framework includes sensor and is used to implement the system level chip (System on Chip, abbreviation SoC) of artificial intelligence function, sensing
It is connected between device and SoC by data cable, transducing signal is carried out virtualization intelligence by sensor by data line transfer into SoC
Judgement or parsing, such as the recognition of face of Apple Inc., the scene Recognition of Huawei Company and semantics recognition etc..
However, with the extension of artificial intelligence application scope, it is further that current system architecture will become artificial intelligence
The bottleneck of development is mainly manifested in following three aspects：
(1) as the data volume in the unit interval from sensor transmissions to SoC is continuously increased, passed by existing data cable
Defeated mode will cause the problem of transmission bandwidth is limited, transmission rate is low, although those skilled in the art are promoted using sensor bridge
Transmission rate, but room for promotion is limited, can further increase time delay instead.
(2) it is larger that the process time delay of artificial intelligence process is carried out to the transducing signal of sensor, is not suitable for automatic/auxiliary
Drive etc. to time delay than more sensitive application field, can application range it is small.
(3) transducing signal digitlization can generate distorted signals, and the information of loss may cause subsequent artefacts' intelligent operation
Harmful effect.
The content of the invention
The embodiment of the present invention provides a kind of intelligent Sensorsystem framework and its implementation, device, solves the prior art
The problem of middle transmission rate is low, propagation delay time is big.
In a first aspect, an embodiment of the present invention provides a kind of intelligent Sensorsystem framework, including：Sensor assembly and people
Work intelligent processing module, wherein：
The sensor assembly and the artificial intelligence process module phase in a manner that single-chip integration or module integrate
Even；
The measuring signal for obtaining measuring signal, and is converted to electric signal by the sensor assembly；
The artificial intelligence process module, the electric signal for being generated according to the sensor assembly perform corresponding
Artificial intelligence process operates.
Second aspect, the embodiment of the present invention additionally provide a kind of implementation method of intelligent Sensorsystem framework, including：
Obtain the electric signal for the sensor assembly generation being connected in a manner that single-chip integration or module integrate；
Corresponding artificial intelligence process operation is performed according to the electric signal.
The third aspect, the embodiment of the present invention additionally provide a kind of realization device of intelligent Sensorsystem framework, including：
Acquiring unit, for obtaining the sensor assembly being connected in a manner that single-chip integration or module integrate generation
Electric signal；
Artificial intelligence process unit operates for performing corresponding artificial intelligence process according to the electric signal.
The embodiment of the present invention is by the way that sensor assembly and artificial intelligence process module are integrated with single-chip integration or module
Mode be connected, breach between sensor assembly and artificial intelligence process module by data cable connect traditional connection side
Formula can reduce the transmission range between sensor assembly and artificial intelligence process module, and then effectively improve data biography
Defeated rate reduces the time delay of data transmission, and artificial intelligence operation is performed quickly in the signal that can be generated to sensor assembly,
Manual intelligent degree is improved, optimizes the design of system architecture, can be had a wide range of application.
Description of the drawings
Fig. 1 is a kind of structure diagram of the system architecture of intelligence sensor in the embodiment of the present invention one；
Fig. 2 a are a kind of structure diagram of intelligence sensor single-chip integration mode in the embodiment of the present invention two；
Fig. 2 b are a kind of structure diagram of intelligence sensor module integration mode in the embodiment of the present invention two；
Fig. 2 c are a kind of structure diagram of intelligence sensor module integration mode in the embodiment of the present invention two；
Fig. 3 is a kind of structure diagram of sensor assembly in the embodiment of the present invention three；
Fig. 4 is a kind of structure diagram of artificial intelligence process module in the embodiment of the present invention four；
Fig. 5 a are a kind of structure diagram of intelligent Sensorsystem framework in the embodiment of the present invention five；
Fig. 5 b are a kind of structure diagram of intelligent Sensorsystem framework in the embodiment of the present invention five；
Fig. 6 a are a kind of structure diagram of intelligent Sensorsystem framework in the embodiment of the present invention six；
Fig. 6 b are a kind of structure diagram of intelligent Sensorsystem framework in the embodiment of the present invention six；
Fig. 7 is a kind of structure diagram of intelligent Sensorsystem framework in the embodiment of the present invention seven；
Fig. 8 is a kind of structure diagram of intelligent Sensorsystem framework in the embodiment of the present invention eight；
Fig. 9 is a kind of flow chart of the implementation method of intelligent Sensorsystem framework in the embodiment of the present invention nine；
Figure 10 is a kind of structure diagram of the realization device of intelligent Sensorsystem framework in the embodiment of the present invention ten.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limitation of the invention.It also should be noted that in order to just
Part related to the present invention rather than entire infrastructure are illustrated only in description, attached drawing.
Embodiment one
A kind of structure diagram of the system architecture for intelligence sensor that Fig. 1 provides for the embodiment of the present invention one, this implementation
Example is applicable to realize acquisition transducing signal by the system architecture of intelligence sensor and perform the situation of artificial intelligent operation,
Software may be employed in the system and/or the mode of hardware is realized, is generally integrated in intelligent terminal, for example, mobile phone or
Tablet computer etc..
The system of the embodiment of the present invention one specifically includes：Sensor assembly 110 and artificial intelligence process module 120, wherein：
What the sensor assembly 110 and the artificial intelligence process module 120 were integrated by single-chip integration or module
Mode is connected.
Specifically, sensor assembly can be integrated in a chip with artificial intelligence process module or sensor die
Chip where block carries out module with the chip where artificial intelligence process module and integrates.It is optional in the embodiment of the present invention one
In embodiment, when sensor assembly and artificial intelligence process module single-chip integration, sensor assembly and artificial intelligence process
Module can transmit data by the metal routing on chip, when sensor assembly and artificial intelligence process module module integrate
When, the chip where sensor assembly can pass through the metal routing on connecting plate with the chip where artificial intelligence process module
Transmit data.Inventor passes through the study found that the sensor assembly being integrated on same chip leads to artificial intelligence process module
It crosses metal routing transmission data or the sensor assembly on different chips passes through connecting plate with artificial intelligence process module
On metal routing transmission data, transmission rate is big by way of data line transfer data compared to traditional, propagation delay time
It is small.
The measuring signal for obtaining measuring signal, and is converted to electric signal by the sensor assembly 110.
Specifically, sensor assembly can include at least one sensing unit, can further include at signal
Reason or the functional circuitry of signal control.Sensor die at least one sensing unit in the block can be used for gathering different types of
Measuring signal, for example, optical signal, voice signal, temperature signal, pressure signal etc., correspondingly, sensor assembly can be used specifically
In image sensing, sound sensor, temperature sensing, pressure sensing etc..Based on different application scenarios, sensor assembly can basis
The demand of practical application, obtains the measuring signal of corresponding species, and sensor assembly can also obtain one or more measurements simultaneously
Signal, the embodiment of the present invention are not limited for the quantity of specific species and species that sensor assembly obtains measuring signal.
The artificial intelligence process module 120, the electric signal for being generated according to the sensor assembly 110 perform
Corresponding artificial intelligence process operation.
Specifically, artificial intelligence process module can be divided at least one functional unit, each functional unit can be held
The corresponding artificial intelligence operation of row.Artificial intelligence operation can include recognition of face, iris recognition, natural language processing and
Language identification etc., the electric signal that artificial intelligence process module can be generated or exported according to sensor assembly, performs a kind of or several
Kind artificial intelligence operation.In one optional embodiment of the embodiment of the present invention, artificial intelligence process module can include people
Work intelligent processor can also further comprise digital signal processor.It can be according to prestoring in artificial intelligence process device
Artificial intelligence process instruction perform the operation of corresponding artificial intelligence process, can also be according to central processing unit or application processor
The artificial intelligence process instruction of transmission performs corresponding artificial intelligence process operation.Artificial intelligence process module and sensor assembly
The mode being combined can specifically be set according to the condition of practical application, illustratively, if be in time delay than more sensitive
Under application conditions, for example, identifying self-actuating brake after vehicle front someone in automatic Pilot environment, then in artificial intelligence process module
Artificial intelligence process device can be integrally formed circuit with sensor die part of functions circuit in the block, realize sensor
While functions of modules, artificial intelligence process operation is performed, to save time delay.If being in does not have other Digital Signal Processing
It is required that application conditions under, then artificial intelligence process mould artificial intelligence process device in the block can with modulus in sensor assembly turn
It changes circuit and is integrally formed circuit, perform artificial intelligence process operation, and realize analog-digital conversion function, to reduce Digital Signal Processing
The extra latency that circuit is brought.If under the application conditions insensitive to time delay or application condition, artificial intelligence process mould
Artificial intelligence process device in the block can be connected by digital signal processor with sensor assembly, perform relevant number letter
Artificial intelligence process operation is performed after number processing operation again.
It, can be in vehicle by taking sensor assembly is applied in automobile auxiliary security driving technology field as an example in the present embodiment
Upper installation is for obtaining the sensor assembly of variety classes measuring signal, and illustratively, sensor assembly can include infrared biography
Unit, photoelectric sensing unit, microwave radar range sensing unit and laser radar range sensing unit etc. are felt, to obtain vehicle
, the information such as road and peripheral situation of vehicle, with reference to artificial intelligence process module, auxiliary driver increases environment sensing energy
Power, and pre-warning signal is provided.
A kind of intelligent Sensorsystem framework that the embodiment of the present invention one provides, can break through sensor assembly and artificial intelligence
The conventional coupling arrangement connected between energy processing module by data cable, passes through the design of optimization system framework, reduces sensor
Transmission range between module and artificial intelligence process module, and then message transmission rate is effectively improved, reduce data
The time delay of transmission, the signal that can be obtained to sensor assembly are performed quickly artificial intelligence operation, improve manual intelligent
Degree can have a wide range of application.
Embodiment two
The embodiment of the present invention two is optimized based on embodiment one, specifically to intelligent Sensorsystem framework
Further optimization, Fig. 2 a are a kind of structure diagram of intelligence sensor single-chip integration mode provided by Embodiment 2 of the present invention,
Referring to Fig. 2 a, the embodiment of the present invention two specifically includes：
Sensor assembly 210 and artificial intelligence process module 220；
The sensor assembly 210 is connected with the artificial intelligence process module 220 by single-chip integration mode.
Optionally, the single-chip integration includes：The sensor assembly is integrated in together with the artificial intelligence process module
In one chip, and the sensor assembly is connected with the artificial intelligence process module by the metal routing in the chip,
The metal routing is located at least one metal layer.
Specifically, sensor assembly is integrated in artificial intelligence process module in same chip, and pass through the gold in chip
Belong to cabling to be connected, metal routing can be located on same metal layer, can also be located on different metal layers, the embodiment of the present invention
This is not intended to limit.
The sensor assembly 210 is connected with the artificial intelligence process module 220 by module integration mode.
Optionally, the module integrate including：The sensor assembly is set respectively with the artificial intelligence process module
In different individual chips, each individual chips are connected by the metal routing on connecting plate, and the metal routing is located at extremely
On a few metal layer.
Specifically, the chip where sensor assembly carries out module with the chip where artificial intelligence process module and integrates,
Chip where can be understood as sensor assembly is integrated with the chip where artificial intelligence process module according to default distance
Into same module, and the metal routing for passing through two chip chamber connecting plates is connected, and metal routing can be located on same metal layer,
It can also be located on different metal layers, the embodiment of the present invention is not intended to limit this.It can be according to the first predetermined process parameter system
Chip where standby sensor assembly, can be according to the core where the second predetermined process parameter preparation artificial intelligence process module
Piece, the first predetermined process parameter and the second predetermined process parameter can specifically be set according to actual conditions, for example, the first default work
Skill parameter could be provided as 110nm, and the second predetermined process parameter could be provided as 28nm, and the second predetermined process parameter can also be set
It is set to below 10nm.The chip where sensor assembly and artificial intelligence process module institute are prepared by different technological parameters
Chip, the cost performance of entire module can be promoted, moreover, can be reduced in a manner that module integrates sensor assembly with
Noise jamming between artificial intelligence process module.
Fig. 2 b are a kind of structure diagram of intelligence sensor module integration mode provided by Embodiment 2 of the present invention, referring to
Fig. 2 b, the sensor assembly are respectively arranged at from the artificial intelligence process module in different individual chips, each independence
Chip is connected by the metal routing on connecting plate, including：
The connecting plate includes support plate；
The sensor assembly and the artificial intelligence process module are packaged on support plate side by side, the sensor assembly
It is connected with the artificial intelligence process module by the metal wire on the support plate.
Specifically, support plate can include glass plate, silicon plate, organic material plate, ceramic material plate or plastic plate etc., sensing
During device module is integrated with artificial intelligence process module progress module, the module of intelligent Sensorsystem framework can be included
Change design, the modularization of preparation process can also be included.
Fig. 2 c are a kind of structure diagram of intelligence sensor module integration mode provided by Embodiment 2 of the present invention, referring to
Fig. 2 c, the sensor assembly are respectively arranged at from the artificial intelligence process module in different individual chips, each independence
Chip is connected by the metal routing on connecting plate, is further included：
The connecting plate includes pinboard；
Chip where chip where the sensor assembly and the artificial intelligence process module is passed through into pinboard
Laminated type three-dimension packaging is carried out, the sensor assembly passes through the metal on the pinboard with the artificial intelligence process module
Line connects.
Optionally, the pinboard includes silicon hole (Through Silicon Via, abbreviation TSV), glass through hole
(Through Glass Via, abbreviation TGV) or substrate through vias (Through Substrate Via, abbreviation TSV) etc..
Specifically, by carrying out lamination to the chip where the chip where sensor assembly and artificial intelligence process module
Formula three-dimension packaging, realizes being connected directly for chip and the chip where artificial intelligence process module where sensor assembly, two
It is connected between chip by way of metal throuth hole, connection length reduces, and to promote electric signal transmission speed, can reduce work(
Consumption, can also reduce module area, so as to save motherboard space.
It should be noted that the realization method that module integrates is not limited to encapsulate side by side and laminated type three-dimension packaging, Ke Yigen
According to the demand of actual conditions, for example, the demand of transmission bandwidth, delay requirement, demand and cost performance of equipment volume etc. need
It asks, chooses the realization method that specific module integrates, the embodiment of the present invention is not intended to limit this.
A kind of intelligent Sensorsystem framework provided by Embodiment 2 of the present invention, can reduce sensor assembly and artificial intelligence
Transmission range between energy processing module, shortens the time delay of transmission, improves transmission rate, and improve sensor assembly
With the integration degree between artificial intelligence process module, contribute to the micromation of smart machine, help to promote the experience of user
Sense.
Embodiment three
Fig. 3 is the structure diagram of a kind of sensor assembly that the embodiment of the present invention three provides, the embodiment of the present invention three with
Improvement is optimized based on the various embodiments described above, sensor assembly is further illustrated, as shown in figure 3, this hair
Sensor assembly in bright embodiment three specifically includes：At least one sensing unit 310, analog signal processing circuit 320 and
Analog to digital conversion circuit 330；
At least one sensing unit 310, is connected with the analog signal processing circuit, for receiving measuring signal,
The measuring signal is converted into electric signal, and by the electric signal transmission to the analog signal processing circuit.
Specifically, at least one sensing unit can obtain one or more of measuring signals, and measuring signal is converted to
Electric signal.
The analog signal processing circuit 320, is connected with analog-digital conversion circuit as described, for carrying out mould to the electric signal
Intend signal processing, and simulation process result is transmitted to analog to digital conversion circuit.
Specifically, the electric signal that analog signal processing circuit can be generated and exported at least one sensing unit carries out mould
Intend signal processing, for example, analog signal processing can include signal modulation, signal filtering, signal amplification and signal is carried out
Calculus, power, evolution, division arithmetic etc..
Analog-digital conversion circuit as described 330, under the control of clock circuit, the simulation process result to be converted to number
Word signal simultaneously exports.
Specifically, analog to digital conversion circuit can be converted analog signals by being sampled and being quantified to analog signal
Digital signal.
Specifically, clock circuit, control circuit and interface circuit etc., the present embodiment can also be included in sensor assembly
In, exemplified by image taking sensor (CMOS Image Sensor, abbreviation CIS), imaging sensor can include pixel unit battle array
Row, analog signal processing circuit, analog to digital conversion circuit, sequential logical circuit, control circuit, interface circuit etc., ambient light irradiation
Pixel unit array occurs photoelectric effect, corresponding charge is generated in pixel unit array, i.e. imaging sensor obtains light
Signal, and electric signal is converted optical signals to, analog signal processing is carried out to electric signal, under the control of clock circuit, by institute
State simulation process result and be converted to digital signal, control circuit control digital signal by interface circuit by digital data transmission extremely
Artificial intelligence process module.
The embodiment of the present invention three provides a kind of sensor assembly, can experience measured information, and will experience
Information be for conversion into electric signal or it is other needed for form information output, disclosure satisfy that acquisition of information, transmission, processing, storage,
And the demands such as control, contribute to detection automatically and the realization of automatic control function.
Example IV
Fig. 4 is a kind of structure diagram for artificial intelligence process module that the embodiment of the present invention four provides, and the present invention is implemented
Improvement is optimized in example four based on the various embodiments described above, artificial intelligence process module is further illustrated, such as
Shown in Fig. 4, the artificial intelligence process module in the embodiment of the present invention four specifically includes：Digital signal processor 410 and at least
One artificial intelligent processor 420；
The digital signal processor 410, for carrying out Digital Signal Processing, and output digit signals to the electric signal
Handling result.
Specifically, by digital signal processor can to electric signal carry out Digital Signal Processing, for example, to electric signal into
Row digital filtering, discrete transform and spectrum analysis etc..Exemplified by image taking sensor, digital signal processor can be to sensor die
The electric signal of block generation carries out the operations such as the control of automatic exposure amount, nonuniform compensation, white balance processing, Gamma correction.
At least one artificial intelligence process device 420 operates for performing corresponding artificial intelligence process to electric signal.
The embodiment of the present invention four provides a kind of artificial intelligence process module, can realize a variety of artificial intelligence process behaviour
Make, improve system performance, improve the operational capability of system, and then improve the manual intelligent degree of smart machine.
Embodiment five
Fig. 5 a are a kind of structure diagram for intelligent Sensorsystem framework that the embodiment of the present invention five provides, and the present invention is real
Apply example five and be optimized improvement based on the various embodiments described above, specifically to each functional unit of sensor assembly with manually
The connection mode of each functional unit of intelligent processing module is further described, and referring to Fig. 5 a, the embodiment of the present invention is specifically wrapped
It includes：
According to different application scenarios and actual demand, for example, delay requirement, error requirement etc., it can be by sensor
Each functional unit of module connection mode different from each functional unit progress of artificial intelligence process module.
In one optional embodiment of the embodiment of the present invention, sensor assembly specifically includes：At least one sensing is single
Member 510, analog signal processing circuit 520 and analog to digital conversion circuit 530, artificial intelligence process module specifically include：Number letter
Number processor 540 and at least one artificial intelligence process device 550.
The digital signal processor 540 analog-digital conversion circuit as described 530 in the block with the sensor die respectively it is defeated
The input terminal of outlet and the artificial intelligence process device 550 is connected, wherein：
The digital signal processor 540, the electric signal for being generated according to the sensor assembly carry out number
Signal processing, and output digit signals handling result；
The artificial intelligence process device 550, for according to the Digital Signal Processing as a result, performing corresponding artificial intelligence
Processing operation.
Specifically, the electric signal that analog to digital conversion circuit exports in digital signal processor receiving sensor module, and to electricity
Signal carries out Digital Signal Processing, and at least one artificial intelligence process device receives the electric signal of digital signal processor generation, and
Artificial intelligent operation is performed to the electric signal.
Fig. 5 b are a kind of structure diagram for intelligent Sensorsystem framework that the embodiment of the present invention five provides, referring to figure
5b, in one optional embodiment of the embodiment of the present invention, sensor assembly specifically includes：At least one sensing unit 510,
Analog signal processing circuit 520 and analog to digital conversion circuit 530, artificial intelligence process module specifically include：Digital Signal Processing
Device 540 and at least one artificial intelligence process device 550.
At least one artificial intelligence process device 550, the digital signal processor 540 and the analog-to-digital conversion
Circuit 530, which is connected directly, forms digital processing and artificial intelligence operation integral circuitry 560；
The digital processing is used to be exported according to the analog signal processing circuit with artificial intelligence operation integral circuitry 560
The simulation process result carry out analog-to-digital conversion, Digital Signal Processing and perform the operation of corresponding artificial intelligence process.
Specifically, digital processing and artificial intelligence operation integral circuitry receiving sensor mould analog signal processing electricity in the block
The electric signal of road generation, and analog-to-digital conversion, Digital Signal Processing are carried out to electric signal and performs corresponding artificial intelligence process
Operation.Digital processing operates integral circuitry for analog-to-digital conversion, Digital Signal Processing and the corresponding people of execution with artificial intelligence
The execution sequence of work Intelligent treatment operation is not limited, illustratively, can for the electric signal of analog signal processing circuit generation
While artificial intelligence process operation is carried out, to perform the operation of analog-to-digital conversion and Digital Signal Processing.For example, with automobile certainly
Exemplified by dynamic driving application scenarios, if detecting infrared signal in vehicle front pre-determined distance, alarm and self-actuating brake are sent.
Skilled person will appreciate that analog-to-digital conversion operation can inevitably generate error.But in automatic driving applied field
Jing Zhong, error can generate harmful effect for sending alarm or self-actuating brake, therefore, when signal reaches artificial intelligence process
During condition, then artificial intelligence process operation is performed, and analog-to-digital conversion and Digital Signal Processing can be carried out at the same time, turned according to modulus
Change or Digital Signal Processing as a result, artificial intelligence process device can continue to execute corresponding manual handling operations, passed with reducing
Defeated time delay and error.
The embodiment of the present invention five provides a kind of intelligent Sensorsystem framework, can either realize strong artificial intelligence, also can
The advantage of data processing is enough given full play to, improves the intelligence degree of intelligent Sensorsystem, and propagation delay time can be reduced,
Promoting transmission rate and transmission bandwidth disclosure satisfy that the demand of specific application scene.
Embodiment six
Fig. 6 a are a kind of structure diagram for intelligent Sensorsystem framework that the embodiment of the present invention six provides, and the present invention is real
Apply example six and be optimized improvement based on the various embodiments described above, specifically to each functional unit of sensor assembly with manually
The connection mode of each functional unit of intelligent processing module is further described, and referring to Fig. 6 a, the embodiment of the present invention is specifically wrapped
It includes：
In one optional embodiment of the embodiment of the present invention, sensor assembly specifically includes：At least one sensing is single
Member 610, analog signal processing circuit 620 and analog to digital conversion circuit 630, artificial intelligence process module specifically include：At least one
A artificial intelligent processor 640.
The input terminal of the artificial intelligence process device 640 and sensor die analog-digital conversion circuit as described 630 in the block
Output terminal be connected；
Wherein, the artificial intelligence process device 640, specifically for according to sensor die analog to digital conversion circuit in the block
The digital signal of output performs corresponding artificial intelligence process operation.
Specifically, obtain what sensor die analog to digital conversion circuit in the block generated by least one artificial intelligence process device
Electric signal, and corresponding artificial intelligence process is performed to electric signal and is operated.
Fig. 6 b are a kind of structure diagram for intelligent Sensorsystem framework that the embodiment of the present invention six provides, referring to figure
6b, in one optional embodiment of the embodiment of the present invention, sensor assembly specifically includes：At least one sensing unit 610,
Analog signal processing circuit 620 and analog to digital conversion circuit 630, artificial intelligence process module specifically include：It is at least one artificial
Intelligent processor 640.
At least one artificial intelligence process device 640 and sensor die analog-digital conversion circuit as described 630 in the block
It is connected directly, forms analog-to-digital conversion and operate integral circuitry 650 with artificial intelligence；
The analog-to-digital conversion operates integral circuitry 650 with artificial intelligence, for defeated according to the analog signal processing circuit
The simulation process result gone out carries out analog-to-digital conversion and performs corresponding artificial intelligence process operation.
Specifically, analog-to-digital conversion and artificial intelligence operation integral circuitry receiving sensor mould analog signal processing electricity in the block
The electric signal of road generation, and analog-to-digital conversion is carried out to electric signal and performs corresponding artificial intelligence process operation.Digital processing
Execution sequence that integral circuitry operated for analog-to-digital conversion and the corresponding artificial intelligence process of executions is operated with artificial intelligence not
It is limited.Artificial intelligence process device can also possess the ability for performing Digital Signal Processing, carry out the mistake of artificial intelligence operation
Analog-to-digital conversion operation is carried out in journey, it can be understood as, artificial intelligence process device can be obtained before performing analog-to-digital conversion operation
Electric signal or perform analog-to-digital conversion operating process in M signal, can also obtain perform analog-to-digital conversion operation after
Electric signal.
The embodiment of the present invention six provides a kind of intelligent Sensorsystem framework, can either realize strong artificial intelligence, also can
Enough give full play to the advantage of data processing, there is higher level of intelligence, and propagation delay time can be reduced, promoting transmission rate and
Transmission bandwidth disclosure satisfy that the demand of specific application scene, meet the use demand of user.
Embodiment seven
Fig. 7 is a kind of structure diagram for intelligent Sensorsystem framework that the embodiment of the present invention seven provides, and the present invention is real
Apply example seven and be optimized improvement based on the various embodiments described above, specifically to each functional unit of sensor assembly with manually
The connection mode of each functional unit of intelligent processing module is further described, and referring to Fig. 7, the embodiment of the present invention is specifically wrapped
It includes：
In one optional embodiment of the embodiment of the present invention, sensor assembly specifically includes：At least one sensing is single
Member 710 and analog signal processing circuit 720；
At least one sensing unit 710, is connected with the analog signal processing circuit, for receiving measuring signal,
The measuring signal is converted into electric signal, and by the electric signal transmission to the analog signal processing circuit；
The analog signal processing circuit 720, for the electric signal exported according at least one sensing unit
Carry out analog signal processing.
The artificial intelligence process module specifically includes：At least one artificial intelligence process device 730, at least one people
Work intelligent processor 730 is connected directly with the sensor die analog signal processing circuit 720 in the block, forms simulation letter
Number processing with artificial intelligence operate integral circuitry 740；
The analog signal processing operates integral circuitry 740 with artificial intelligence, for single according at least one sensing
The electric signal of member output carries out analog signal processing and performs corresponding artificial intelligence process operation.
Specifically, analog signal processing operates integral circuitry receiving sensor mould at least one biography in the block with artificial intelligence
Feel the electric signal of unit generation, and analog signal processing is carried out to electric signal and performs corresponding artificial intelligence process operation.
Analog signal processing operates integral circuitry for analog signal processing and the corresponding artificial intelligence process of execution with artificial intelligence
The execution sequence of operation is not limited.Artificial intelligence process device, which can also possess, performs analog-to-digital conversion, the energy of Digital Signal Processing
Power carries out analog signal processing operation during artificial intelligence operation is carried out, it can be understood as, artificial intelligence process device can
To intervene sensor die analog signal processing circuit in the block, artificial intelligence process device, which can obtain, performs analog signal processing behaviour
The M signal in electric signal or analog signal processing operating process before work can also be obtained and performed at analog signal
Electric signal after reason operation, so that the response delay of artificial intelligence operation is low.
The embodiment of the present invention seven provides a kind of intelligent Sensorsystem framework, can shift to an earlier date artificial intelligence computing, into
And the time of artificial intelligence response is improved, it can either realize strong artificial intelligence, can also give full play to the advantage of data processing,
With higher level of intelligence, and propagation delay time, promoting transmission rate and transmission bandwidth can be reduced, can had a wide range of application.
Embodiment eight
Fig. 8 is a kind of structure diagram for intelligent Sensorsystem framework that the embodiment of the present invention eight provides, and the present invention is real
Apply example eight and be optimized improvement based on the various embodiments described above, specifically to each functional unit of sensor assembly with manually
The connection mode of each functional unit of intelligent processing module is further described, and referring to Fig. 8, the embodiment of the present invention is specifically wrapped
It includes：
In one optional embodiment of the embodiment of the present invention, sensor assembly specifically includes：At least one sensing is single
Member 810；
The measuring signal for receiving measuring signal, is converted to electric signal by least one sensing unit 810.
The artificial intelligence process module specifically includes：At least one artificial intelligence process device 820；
At least one artificial intelligence process device 820 and the sensor die at least one sensing unit in the block
810 are connected directly, and form sensing and operate integral circuitry 830 with artificial intelligence；
It is described sensing with artificial intelligence operation integral circuitry 830 be used for by the measuring signal be converted to the electric signal with
And perform corresponding artificial intelligence process operation.
Specifically, sensing can obtain measuring signal with artificial intelligence operation integral circuitry, electricity is converted in measuring signal
During signal, corresponding artificial intelligence operation is carried out, it can be understood as, artificial intelligence process device can intervene sensor die
At least one sensing unit in the block can directly carry out artificial intelligence process operation, artificial intelligence for the transducing signal of acquisition
Energy processor, which can also possess, performs analog signal processing, analog-to-digital conversion, the ability of Digital Signal Processing.
The embodiment of the present invention seven provides a kind of intelligent Sensorsystem framework, by being converted to electric signal in measuring signal
During, corresponding artificial intelligence operation is carried out, the time delay for performing artificial intelligent operation can be reduced, improve smart machine
Intelligence degree, improve the security reliability of system.
Embodiment nine
Fig. 9 is a kind of flow chart of the implementation method for intelligent Sensorsystem framework that the embodiment of the present invention nine provides, this
The electric signal that embodiment is applicable to be generated according to sensor assembly performs the situation of artificial intelligent operation, and this method can be by one
The realization device of intelligent Sensorsystem framework is planted to perform, which may be employed software and/or the mode of hardware is realized, and one
As be integrated in artificial intelligence process module, for example, artificial intelligence process device etc..The method of the embodiment of the present invention nine is specifically wrapped
It includes：
The electric signal for the sensor assembly generation that S910, acquisition are connected in a manner that single-chip integration or module integrate.
Optionally, obtaining the electric signal for the sensor assembly generation being connected by single chip integrated mode includes：
Obtain the electricity that the sensor assembly being integrated in same chip is transmitted by the metal routing in the chip
Signal.
Specifically, when artificial intelligence process module and sensor assembly single-chip integration, artificial intelligence process module passes through
The electric signal that part functional unit generates in metal routing receiving sensor module or sensor assembly in chip.
Optionally, obtaining the electric signal for the sensor assembly generation being connected in a manner that module integrates includes：
Obtain the electric signal that the sensor assembly in different chips is transmitted by the metal routing on connecting plate.
Specifically, when artificial intelligence process module and integrated sensor assembly module, artificial intelligence process module passes through
Part functional unit generates in the metal routing receiving sensor module or sensor assembly of connecting plate between two chips
Electric signal.
S920, corresponding artificial intelligence process operation is performed according to the electric signal.
Specifically, it can include in artificial intelligence process module at least one artificial intelligence process device and digital signal
Device is managed, one or more artificial intelligence process operations can be performed, at least one artificial intelligence process device can be used to implement language
Sound identification, machine vision, recognition of face and cognitive behavior etc..
In the present embodiment, according to different application scenarios and actual demand, for example, delay requirement, error requirement etc., it can
With by each functional unit of sensor assembly connection mode different from each functional unit progress of artificial intelligence process module.
In one optional embodiment of the embodiment of the present invention, it is single that the sensor assembly includes at least one sensing
Member, analog signal processing circuit and analog to digital conversion circuit；
When artificial intelligence process module include at least one artificial intelligence process device, at least one artificial intelligence process device
When input terminal is connected with the output terminal of analog-digital conversion circuit as described, then the phase in a manner that single-chip integration or module integrate is obtained
The electric signal of sensor assembly generation even includes：
Sensor die analog-digital conversion circuit as described in the block is obtained by least one artificial intelligence process device to generate
Electric signal.
In one optional embodiment of the embodiment of the present invention, it is single that the sensor assembly includes at least one sensing
Member, analog signal processing circuit and analog to digital conversion circuit；
When the artificial intelligence process module includes at least one artificial intelligence process device and digital signal processor, institute
The input terminal of digital signal processor is stated with the output terminal of analog-digital conversion circuit as described to be connected, the digital signal processor it is defeated
When outlet is connected at least one artificial intelligence process device, then the phase in a manner that single-chip integration or module integrate is obtained
The electric signal of sensor assembly generation even includes：
The electric signal of the digital signal processor generation is received by least one artificial intelligence process device.
In one optional embodiment of the embodiment of the present invention, it is single that the sensor assembly includes at least one sensing
Member, analog signal processing circuit and analog to digital conversion circuit；
When the artificial intelligence process module includes at least one artificial intelligence process device, at least one artificial intelligence
When processor is connected directly composition analog-to-digital conversion with artificial intelligence operation integral circuitry with analog-digital conversion circuit as described, then obtain logical
Crossing the electric signal for the sensor assembly generation that the mode that single-chip integration or module integrate is connected includes：
Integral circuitry is operated by the analog-to-digital conversion and artificial intelligence, obtains the analog signal processing circuit generation
Electric signal；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
According to the electric signal that the analog signal processing circuit generates, carry out analog-to-digital conversion and perform corresponding artificial intelligence
It can processing operation.
In one optional embodiment of the embodiment of the present invention, it is single that the sensor assembly includes at least one sensing
Member, analog signal processing circuit and analog to digital conversion circuit；
When the artificial intelligence process module includes at least one artificial intelligence process device and digital signal processor, institute
It states at least one artificial intelligence process device, the digital signal processor and analog-digital conversion circuit as described and is connected directly composition
When digital processing is with artificial intelligence operation integral circuitry, then the biography being connected in a manner that single-chip integration or module integrate is obtained
The electric signal of sensor module generation includes：
Integral circuitry is operated by the digital processing and artificial intelligence, obtains the analog signal processing circuit generation
Electric signal；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
According to the electric signal that the analog signal processing circuit generates, carry out analog-to-digital conversion, Digital Signal Processing and hold
The corresponding artificial intelligence process operation of row.
In one optional embodiment of the embodiment of the present invention, the sensor assembly includes at least one sensing unit
And analog signal processing circuit；
When artificial intelligence process module includes at least one artificial intelligence process device, at least one artificial intelligence process
When device is connected directly composition analog signal processing with artificial intelligence operation integral circuitry with the analog signal processing circuit, then obtain
Taking the electric signal that the sensor assembly being connected in a manner that single-chip integration or module integrate generates includes：
Integral circuitry is operated by the analog signal processing and artificial intelligence, obtains at least one sensing unit life
Into electric signal；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
According to the electric signal that at least one sensing unit generates, carry out analog signal processing and perform corresponding people
Work Intelligent treatment operates.
In one optional embodiment of the embodiment of the present invention, it is single that the sensor assembly includes at least one sensing
Member；
When artificial intelligence process module includes at least one artificial intelligence process device, at least one artificial intelligence process
When device is connected directly composition sensing with artificial intelligence operation integral circuitry at least one sensing unit, then obtains and pass through list
The electric signal for the sensor assembly generation that the mode that piece integrates or module integrates is connected includes：
Integral circuitry is operated with artificial intelligence by the sensing, measuring signal is obtained, and the measuring signal is converted
For electric signal；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
During the measuring signal is converted to electric signal, corresponding artificial intelligence process operation is performed.
The embodiment of the present invention provides for a kind of implementation method of intelligent Sensorsystem framework, can reduce sensor die
Transmission range between block and artificial intelligence process module, and then message transmission rate is effectively improved, reduce data biography
Defeated time delay, the signal that can be generated to sensor assembly are performed quickly artificial intelligence operation, improve manual intelligent journey
Degree, can have a wide range of application, and reliability is high.
Embodiment ten
Figure 10 is a kind of structure diagram of the realization device of intelligent Sensorsystem framework in the embodiment of the present invention ten,
The electric signal that the device is applicable to be generated according to sensor assembly performs the situation of artificial intelligent operation, which may be employed
The mode of software and/or hardware is realized, is generally integrated in artificial intelligence process module, for example, artificial intelligence process device etc..Such as
Shown in Figure 10, device includes：Acquiring unit 1010 and artificial intelligence process unit 1020, wherein：
Acquiring unit 1010, for obtaining the sensor assembly being connected in a manner that single-chip integration or module integrate life
Into electric signal；
Artificial intelligence process unit 1020 operates for performing corresponding artificial intelligence process according to the electric signal.
The embodiment of the present invention is by the way that sensor assembly and artificial intelligence process module are integrated with single-chip integration or module
Mode be connected, breach between sensor assembly and artificial intelligence process module by data cable connect traditional connection side
Formula can reduce the transmission range between sensor assembly and artificial intelligence process module, and then effectively improve data biography
Defeated rate reduces the time delay of data transmission, and artificial intelligence operation is performed quickly in the signal that can be obtained to sensor assembly,
Manual intelligent degree is improved, optimizes the design of system architecture, can be had a wide range of application.
On the basis of the various embodiments described above, the acquiring unit can include：
First obtains subelement, includes at least one sensing unit, analog signal processing for working as the sensor assembly
Circuit and analog to digital conversion circuit, artificial intelligence process module includes at least one artificial intelligence process device, at least one artificial
When the input terminal of intelligent processor is connected with the output terminal of analog-digital conversion circuit as described, pass through at least one artificial intelligence process device
Obtain the electric signal of sensor die analog-digital conversion circuit as described generation in the block；
The artificial intelligence process unit can include：
First artificial intelligence process subelement for the electric signal generated according to analog-digital conversion circuit as described, performs corresponding
Artificial intelligence process operation.
On the basis of the various embodiments described above, the acquiring unit can also include：
Second obtains subelement, includes at least one sensing unit, analog signal processing for working as the sensor assembly
Circuit and analog to digital conversion circuit, the artificial intelligence process module include at least one artificial intelligence process device and number
Signal processor, the input terminal of the digital signal processor are connected with the output terminal of analog-digital conversion circuit as described, the number
When the output terminal of signal processor is connected at least one artificial intelligence process device, pass through at least one artificial intelligence process
Device receives the electric signal of the digital signal processor generation；
The artificial intelligence process unit can also include：
Second artificial intelligence process subelement for the electric signal generated according to the digital signal processor, performs phase
The artificial intelligence process operation answered.
On the basis of the various embodiments described above, the acquiring unit can also include：
3rd obtains subelement, includes at least one sensing unit, analog signal processing for working as the sensor assembly
Circuit and analog to digital conversion circuit, the artificial intelligence process module include at least one artificial intelligence process device, it is described at least
One artificial intelligent processor is connected directly with analog-digital conversion circuit as described forms analog-to-digital conversion and artificial intelligence operation one electricity
Lu Shi operates integral circuitry by the analog-to-digital conversion and artificial intelligence, obtains the electricity of the analog signal processing circuit generation
Signal；
The artificial intelligence process unit can also include：
Third party's work Intelligent treatment subelement for the electric signal generated according to the analog signal processing circuit, carries out
Analog-to-digital conversion and the corresponding artificial intelligence process operation of execution.
On the basis of the various embodiments described above, the acquiring unit can also include：
4th obtains subelement, includes at least one sensing unit, analog signal processing for working as the sensor assembly
Circuit and analog to digital conversion circuit, the artificial intelligence process module include at least one artificial intelligence process device and number
Signal processor, at least one artificial intelligence process device, the digital signal processor and analog-digital conversion circuit as described
When being connected directly composition digital processing with artificial intelligence operation integral circuitry, pass through the digital processing and artificial intelligence operates one
Body circuit obtains the electric signal of the analog signal processing circuit generation；
The artificial intelligence process unit can also include：
4th artificial intelligence process subelement for the electric signal generated according to the analog signal processing circuit, carries out
Analog-to-digital conversion, Digital Signal Processing and the corresponding artificial intelligence process operation of execution.
On the basis of the various embodiments described above, the acquiring unit can also include：
5th obtains subelement, includes at least one sensing unit and analog signal processing for working as the sensor assembly
Circuit, artificial intelligence process module include at least one artificial intelligence process device, at least one artificial intelligence process device with
When the analog signal processing circuit is connected directly composition analog signal processing with artificial intelligence operation integral circuitry, by described
Analog signal processing operates integral circuitry with artificial intelligence, obtains the electric signal of at least one sensing unit generation；
The artificial intelligence process unit can also include：
5th artificial intelligence process subelement for the electric signal generated according at least one sensing unit, carries out
Analog signal processing and the corresponding artificial intelligence process operation of execution.
On the basis of the various embodiments described above, the acquiring unit can also include：
6th obtains subelement, includes at least one sensing unit, artificial intelligence process for working as the sensor assembly
Module includes at least one artificial intelligence process device, and at least one artificial intelligence process device and at least one sensing are single
When member is connected directly composition sensing with artificial intelligence operation integral circuitry, pass through the sensing and artificial intelligence operation one electricity
Road obtains measuring signal, and the measuring signal is converted to electric signal；
The artificial intelligence process unit can also include：
Sixth Man work Intelligent treatment subelement during being converted to electric signal in the measuring signal, performs phase
The artificial intelligence process operation answered.
The realization device of intelligent Sensorsystem framework provided in an embodiment of the present invention can perform any embodiment of the present invention
The implementation method of the intelligent Sensorsystem framework of offer, the implementation method for possessing execution intelligent Sensorsystem framework are corresponding
Function module and advantageous effect.
Note that it above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various apparent variations,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above example to the present invention
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
It can include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (22)
1. a kind of intelligent Sensorsystem framework, which is characterized in that including：Sensor assembly and artificial intelligence process module,
In：
The sensor assembly is connected with the artificial intelligence process module in a manner that single-chip integration or module integrate；
The measuring signal for obtaining measuring signal, and is converted to electric signal by the sensor assembly；
The artificial intelligence process module, the electric signal for being generated according to the sensor assembly perform corresponding artificial
Intelligent treatment operates.
2. system according to claim 1 framework, which is characterized in that the single-chip integration includes：The sensor assembly
It is integrated in the artificial intelligence process module in same chip, and the sensor assembly and the artificial intelligence process module
It is connected by the metal routing in the chip, the metal routing is located at least one metal layer.
3. system according to claim 1 framework, which is characterized in that the module integrate including：The sensor assembly
It is respectively arranged at from the artificial intelligence process module in different individual chips, each individual chips pass through the gold on connecting plate
Belong to cabling connection, the metal routing is located at least one metal layer.
4. system architecture according to claim 3, which is characterized in that at the sensor assembly and the artificial intelligence
When reason module is respectively arranged in different individual chips, then according to where the first predetermined process parameter prepares the sensor assembly
Chip, the chip according to where the second predetermined process parameter prepares the artificial intelligence process module.
5. system architecture according to claim 4, which is characterized in that the sensor assembly and the artificial intelligence process
Module is respectively arranged in different individual chips, and each individual chips are connected by the metal routing on connecting plate, including：
The connecting plate includes support plate；
The sensor assembly and the artificial intelligence process module are packaged on support plate side by side, the sensor assembly and institute
Artificial intelligence process module is stated to connect by the metal wire on the support plate.
6. system architecture according to claim 4, which is characterized in that the sensor assembly and the artificial intelligence process
Module is respectively arranged in different individual chips, and each individual chips are connected by the metal routing on connecting plate, are further included：
The connecting plate includes pinboard；
Chip where the sensor assembly and the chip where the artificial intelligence process module are carried out by pinboard
Laminated type three-dimension packaging, the sensor assembly are connected with the artificial intelligence process module by the metal wire on the pinboard
It connects.
7. system architecture according to claim 6, which is characterized in that the pinboard include silicon hole, glass through hole or
Substrate through vias.
8. according to claim 1-7 any one of them system architectures, which is characterized in that the sensor assembly specifically includes：
At least one sensing unit, analog signal processing circuit and analog to digital conversion circuit；
At least one sensing unit, is connected with the analog signal processing circuit, for receiving measuring signal, by the survey
Amount signal is converted to electric signal, and by the electric signal transmission to the analog signal processing circuit；
The analog signal processing circuit, is connected with analog-digital conversion circuit as described, for carrying out analog signal to the electric signal
Processing, and simulation process result is transmitted to analog to digital conversion circuit；
Analog-digital conversion circuit as described, under the control of clock circuit, the simulation process result to be converted to digital signal
And it exports.
9. system architecture according to claim 8, which is characterized in that the artificial intelligence process module specifically includes：Extremely
A few artificial intelligent processor, input terminal and the sensor die modulus in the block of the artificial intelligence process device turn
The output terminal for changing circuit is connected；
Wherein, the artificial intelligence process device, specifically for what is exported according to sensor die analog to digital conversion circuit in the block
Digital signal performs corresponding artificial intelligence process operation.
10. system architecture according to claim 8, which is characterized in that the artificial intelligence process module specifically includes：Number
Word signal processor and at least one artificial intelligence process device, the digital signal processor respectively with the sensor assembly
In the output terminal of analog-digital conversion circuit as described and the input terminal of the artificial intelligence process device be connected, wherein：
The digital signal processor, the electric signal for being generated according to the sensor assembly are carried out at digital signal
Reason, and output digit signals handling result；
The artificial intelligence process device, for being grasped according to the Digital Signal Processing as a result, performing corresponding artificial intelligence process
Make.
11. system architecture according to claim 8, which is characterized in that the artificial intelligence process module specifically includes：Extremely
A few artificial intelligent processor, at least one artificial intelligence process device turn with the sensor die modulus in the block
It changes circuit to be connected directly, forms analog-to-digital conversion and operate integral circuitry with artificial intelligence, the integral circuitry is used for according to the mould
The simulation process result for intending signal processing circuit output carries out analog-to-digital conversion and performs corresponding artificial intelligence process behaviour
Make.
12. system architecture according to claim 8, which is characterized in that the artificial intelligence process module specifically includes：Number
Word signal processor and at least one artificial intelligence process device, at least one artificial intelligence process device, the number letter
Number processor and analog-digital conversion circuit as described, which are connected directly, to be formed digital processing and operates integral circuitry with artificial intelligence, described
The simulation process result that integral circuitry is used to be exported according to the analog signal processing circuit carries out analog-to-digital conversion, number is believed
Number processing and perform the operation of corresponding artificial intelligence process.
13. according to claim 1-7 any one of them system architectures, which is characterized in that the sensor assembly specifically includes：
At least one sensing unit and analog signal processing circuit；
At least one sensing unit, is connected with the analog signal processing circuit, for receiving measuring signal, by the survey
Amount signal is converted to electric signal, and by the electric signal transmission to the analog signal processing circuit；
The analog signal processing circuit, the electric signal for being exported according at least one sensing unit are simulated
Signal processing.
14. system architecture according to claim 13, which is characterized in that the artificial intelligence process module specifically includes：
At least one artificial intelligence process device, at least one artificial intelligence process device and the sensor die simulation in the block
Signal processing circuit is connected directly, and is formed analog signal processing and is operated integral circuitry with artificial intelligence, the integral circuitry is used for
The electric signal exported according at least one sensing unit carries out analog signal processing and performs corresponding artificial intelligence
It can processing operation.
15. according to claim 1-7 any one of them system architectures, which is characterized in that the sensor assembly specifically includes：
At least one sensing unit；
The measuring signal for receiving measuring signal, is converted to electric signal by least one sensing unit.
16. system architecture according to claim 15, which is characterized in that the artificial intelligence process module specifically includes：
At least one artificial intelligence process device, at least one artificial intelligence process device and the sensor die it is in the block it is described at least
One sensing unit is connected directly, and is formed sensing and is operated integral circuitry with artificial intelligence, the integral circuitry is used for the survey
Amount signal is converted to the electric signal and performs corresponding artificial intelligence process operation.
17. a kind of implementation method of intelligent Sensorsystem framework, which is characterized in that including：
Obtain the electric signal for the sensor assembly generation being connected in a manner that single-chip integration or module integrate；
Corresponding artificial intelligence process operation is performed according to the electric signal.
18. according to the method for claim 17, it is characterised in that：
Obtaining the electric signal for the sensor assembly generation being connected by single chip integrated mode includes：
Obtain the electric signal that the sensor assembly being integrated in same chip is transmitted by the metal routing in the chip；
Obtaining the electric signal for the sensor assembly generation being connected in a manner that module integrates includes：
Obtain the electric signal that the sensor assembly in different chips is transmitted by the metal routing on connecting plate.
19. according to the method for claim 18, it is characterised in that：
The sensor assembly includes at least one sensing unit, analog signal processing circuit and analog to digital conversion circuit；
When artificial intelligence process module includes at least one artificial intelligence process device, the input of at least one artificial intelligence process device
When end is connected with the output terminal of analog-digital conversion circuit as described, then obtain what is be connected in a manner that single-chip integration or module integrate
The electric signal of sensor assembly generation includes：
The electricity of sensor die analog-digital conversion circuit as described generation in the block is obtained by least one artificial intelligence process device
Signal；
When the artificial intelligence process module includes at least one artificial intelligence process device and digital signal processor, the number
The input terminal of word signal processor is connected with the output terminal of analog-digital conversion circuit as described, the output terminal of the digital signal processor
When being connected at least one artificial intelligence process device, then obtain what is be connected in a manner that single-chip integration or module integrate
The electric signal of sensor assembly generation includes：
The electric signal of the digital signal processor generation is received by least one artificial intelligence process device；
When the artificial intelligence process module includes at least one artificial intelligence process device, at least one artificial intelligence process
When device is connected directly composition analog-to-digital conversion with artificial intelligence operation integral circuitry with analog-digital conversion circuit as described, then obtains and pass through list
The electric signal for the sensor assembly generation that the mode that piece integrates or module integrates is connected includes：
Integral circuitry is operated by the analog-to-digital conversion and artificial intelligence, obtains the telecommunications of the analog signal processing circuit generation
Number；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
According to the electric signal that the analog signal processing circuit generates, carry out analog-to-digital conversion and perform at corresponding artificial intelligence
Reason operation；
When the artificial intelligence process module include at least one artificial intelligence process device and digital signal processor, it is described extremely
A few artificial intelligent processor, the digital signal processor and analog-digital conversion circuit as described are connected directly composition number
When processing is with artificial intelligence operation integral circuitry, then the sensor being connected in a manner that single-chip integration or module integrate is obtained
The electric signal of module generation includes：
Integral circuitry is operated by the digital processing and artificial intelligence, obtains the telecommunications of the analog signal processing circuit generation
Number；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
According to the electric signal that the analog signal processing circuit generates, carry out analog-to-digital conversion, Digital Signal Processing and perform phase
The artificial intelligence process operation answered.
20. according to the method for claim 18, it is characterised in that：
The sensor assembly includes at least one sensing unit and analog signal processing circuit；
When artificial intelligence process module include at least one artificial intelligence process device, at least one artificial intelligence process device with
When the analog signal processing circuit is connected directly composition analog signal processing with artificial intelligence operation integral circuitry, then obtain logical
Crossing the electric signal for the sensor assembly generation that the mode that single-chip integration or module integrate is connected includes：
Integral circuitry is operated by the analog signal processing and artificial intelligence, obtains at least one sensing unit generation
Electric signal；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
According to the electric signal that at least one sensing unit generates, carry out analog signal processing and perform corresponding artificial intelligence
It can processing operation.
21. according to the method for claim 18, it is characterised in that：
The sensor assembly includes at least one sensing unit；
When artificial intelligence process module include at least one artificial intelligence process device, at least one artificial intelligence process device with
When at least one sensing unit is connected directly composition sensing with artificial intelligence operation integral circuitry, then obtain through monolithic collection
Into or the electric signal of sensor assembly generation that is connected of the mode that integrates of module include：
Integral circuitry is operated with artificial intelligence by the sensing, measuring signal is obtained, and the measuring signal is converted into electricity
Signal；
Performing corresponding artificial intelligence process operation according to the electric signal includes：
During the measuring signal is converted to electric signal, corresponding artificial intelligence process operation is performed.
22. a kind of realization device of intelligent Sensorsystem framework, which is characterized in that including：
Acquiring unit, for obtaining the telecommunications of the sensor assembly being connected in a manner that single-chip integration or module integrate generation
Number；
Artificial intelligence process unit operates for performing corresponding artificial intelligence process according to the electric signal.
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| CN201810082922.XA CN108052934A (en) | 2018-01-29 | 2018-01-29 | A kind of intelligent Sensorsystem framework and its implementation, device |
| PCT/CN2018/087887 WO2019144540A1 (en) | 2018-01-29 | 2018-05-22 | Intelligent sensor system architecture and realization method and apparatus therefor |
| US16/965,779 US20210027200A1 (en) | 2018-01-29 | 2018-05-22 | Intelligent sensor system architecture and realization method and apparatus therefor |
| JP2020541542A JP2021513772A (en) | 2018-01-29 | 2018-05-22 | Smart sensor system architecture, its implementation method and equipment |
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