CN108048889A - A kind of process of surface treatment of Cu-Al bimetal material - Google Patents

A kind of process of surface treatment of Cu-Al bimetal material Download PDF

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Publication number
CN108048889A
CN108048889A CN201711292350.XA CN201711292350A CN108048889A CN 108048889 A CN108048889 A CN 108048889A CN 201711292350 A CN201711292350 A CN 201711292350A CN 108048889 A CN108048889 A CN 108048889A
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China
Prior art keywords
time
washing
temperature
cleaned
copper
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CN201711292350.XA
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CN108048889B (en
Inventor
董晓文
王连忠
沙均洋
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YANTAI FISEND BIMETAL CO Ltd
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YANTAI FISEND BIMETAL CO Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/06Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/08Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas

Abstract

The present invention provides a kind of process of surface treatment of Cu-Al bimetal material, comprise the following steps:(1)Hot dipping oil removing;(2)Washing;(3)Alkali cleaning;(4)Washing;(5)Anodic oxidation;(6)High temperature water seal;(7)Washing;(8)It is tin plating:Using 30~50g/L of stannous sulfate, 120~150g/L of sulfuric acid, bright dose of 10~20g/L of X-ray, DS 15~25g/L of open cylinder agent, current control is in 0.8~1.2A/dm2, temperature control is at 15~25 DEG C;(9)Washing;(10)It is dry.Copper-Aluminum compound is first discharged into row anodic oxidation by the present invention, forms one layer of fine and close insulating oxide aluminium in aluminium surface, aluminium element is protected, aluminium element is prevented to participate in subsequent electroplating process, and is activated copper surface in anode;Copper-Aluminum compound is arranged into direct electrotinning, has not only reduced intermediate leaching zinc, the process of copper pre-plating, but also has achieved the effect that plating protection.

Description

A kind of process of surface treatment of Cu-Al bimetal material
Technical field
The invention belongs to technical field of copper aluminum composite material, relate in particular at a kind of surface of Cu-Al bimetal material Science and engineering skill.
Background technology
Copper-Aluminum compound row is used as a kind of novel conductor material, has the advantages that the electrical and thermal conductivity of copper material is good, has simultaneously The light weight of aluminium and it is economical the advantages that.With the continuous development of science and technology, China's Copper-Aluminum compound technique has reached international and has first intake It is flat, it has successively issued and implemented national standard and has been dominated by China and participated and draw ASTM standard, gradually approved by domestic and international client, Product is widely used in multiple industries.But there are difference in Electrode Potential, surface between copper aluminium not to protect, and makes under normal atmospheric environment Use no problem;If under corrosive medium, copper aluminium interface can generate galvanic interaction, and interface can be corroded between copper aluminium, and then can shadow Ring the use of product.Therefore in order to ensure the stabilization during use, it usually needs electrotinning protective treatment is done in product surface, To achieve the effect that the contact area of anti-corrosion and increase between row and row.
For single metal, aluminium element belongs to double property metals, can react with acid reaction and with alkali, not fit The electroplate liquid directly electroplated closed;And having very strong affinity to oxygen, surface easily forms layer oxide film;The electrode potential of aluminium It is very negative, easily with being replaced with the metal ion compared with positive potential when immersing electroplate liquid, influence binding force of cladding material;It is generally necessary to It could be electroplated after covering one layer of bottom or interlayer in aluminium base.Now more mature to the surface protection of aluminium base is Anode oxidation process is exactly to form one layer of fine and close oxide layer in aluminium surface, has good corrosion stability and electrical insulating property and height Thermal insulation.Copper electroplating process relative simplicity, after surface is activated can direct electroplating other metals, and copper Fine and close alloy is easily formed between tin element.
Due to Copper-Aluminum compound, row is bimetallic, needs to take into full account the characteristic of two kinds of metals in electroplating process, to reach The effect of protection avoids anticaustic caused by electroplating process.Present electroplating schemes are the electroplating technology bases based on aluminium On plinth, after method is surface degreasing, zinc, then one layer of copper of preplating are soaked twice(Using the alloy formed between copper and tin, protect Combination power after card plating), last tin plating, although technical maturity, production process is longer.
The content of the invention
The present invention provides a kind of process of surface treatment of Cu-Al bimetal material, solve the processing side in background technology The shortcomings that method production process is long.
The technical proposal of the invention is realized in this way:A kind of process of surface treatment of Cu-Al bimetal material, including with Lower step:
(1)Hot dipping oil removing:By copper aluminum composite material SF degreasing powder oil removings, 40~60g/L of dosage, 50 ± 10 DEG C of solution temperature, 5~8min of time;
(2)Washing:It is cleaned using deionized water, room temperature, 20~40S of time;
(3)Alkali cleaning:Alkali cleaning, 50 ± 10 DEG C of temperature, 40~80S of time are carried out using the NaOH solution of 40g/L;
(4)Washing:It is cleaned, cleaned twice, room temperature, 20~40S of time using deionized water;
(5)Anodic oxidation:Using the H of 200~300g/L2SO4Solution sun plate aoxidizes, and voltage keeps 15~18V, temperature 10~20 DEG C, 5 ± 2min of time;
(6)High temperature water seal:Using deionized water, 80~95 DEG C of temperature carries out copper aluminum composite material high temperature closure processing, processing 15~30S of time;
(7)Washing:It is cleaned with deionized water, room temperature, 5~15S of time;
(8)It is tin plating:Using 30~50g/L of stannous sulfate, 120~150g/L of sulfuric acid, bright dose of 10~20g/L of X-ray, DS open cylinder agents 15 ~25g/L carries out tin plating, 0.8~1.2A/dm of electric current to copper aluminum composite material2, 15~25 DEG C of temperature, the time is true according to thickness It is fixed;
(9)Washing:It is cleaned using deionized water, room temperature, then 5~15S of time is cleaned once with 50~60 DEG C of water again;
(10)It is dry:By the water stain removal in surface, and enter oven cooking cycle.
The beneficial effects of the invention are as follows:Copper-Aluminum compound is first discharged into row anodic oxidation by the present invention, and one layer is formed in aluminium surface Fine and close insulating oxide aluminium, protects aluminium element, while aluminium element is prevented to participate in subsequent electroplating process, Er Qie Anode is activated copper surface;Then Copper-Aluminum compound is arranged into direct electrotinning, so both reduces intermediate leaching zinc, preplating The process of copper, and achieved the effect that plating protection, electroplating technology flow is substantially reduced, resource consumption is reduced, production is provided Efficiency reduces electroplated layer, improves binding force of cladding material, further reduces the hidden danger of plating damage layer.
Specific embodiment
For a better understanding and implementation, the following detailed description of a kind of process of surface treatment of Cu-Al bimetal material:Choosing The horizontal casting Copper-Aluminum compound row of width 60mm, thickness 6mm, length 40mm are taken, is followed the steps below:
(1)Hot dipping oil removing:Horizontal casting Copper-Aluminum compound is arranged and uses SF degreasing powder oil removings, dosage 48g/L, 50 DEG C of solution temperature, when Between 6min;
(2)Washing:It is cleaned using deionized water, room temperature, time 30S;
(3)Alkali cleaning:Using the NaOH solution alkali cleaning of 40g/L, temperature 50 C, time 60S;
(4)Washing:It is cleaned, cleaned twice, room temperature, time 30S using deionized water;
(5)Anodic oxidation:Using the H of 220g/L2SO4Solution, voltage keep 15.5V, 20 DEG C of temperature, time 5min;
(6)High temperature water seal:Using deionized water, 90 DEG C of temperature discharges into Copper-Aluminum compound row Seal treatment, time 25S;
(7)Washing:It is cleaned with deionized water, room temperature, time 10S;
(8)It is tin plating:Using bright dose of stannous sulfate 40g/L, sulfuric acid 130g/L, X-ray 15g/L, DS open cylinder agent 20g/L, current control In 1.0A/dm2, temperature control is at 22 DEG C, tin plating layer thickness 6um;
(9)Washing:It is cleaned using deionized water, room temperature, then time 10S is cleaned once with 55 DEG C of water again;
(10)It is dry:By the water stain removal in surface, and into oven cooking cycle to get to finished product.

Claims (1)

1. a kind of process of surface treatment of Cu-Al bimetal material, it is characterised in that comprise the following steps:
(1)Hot dipping oil removing:By copper aluminum composite material SF degreasing powder oil removings, 40~60g/L of dosage, 50 ± 10 DEG C of solution temperature, 5~8min of time;
(2)Washing:It is cleaned using deionized water, room temperature, 20~40S of time;
(3)Alkali cleaning:Alkali cleaning, 50 ± 10 DEG C of temperature, 40~80S of time are carried out using the NaOH solution of 40g/L;
(4)Washing:It is cleaned, cleaned twice, room temperature, 20~40S of time using deionized water;
(5)Anodic oxidation:Using the H of 200~300g/L2SO4Solution sun plate aoxidizes, and voltage keeps 15~18V, temperature 10~20 DEG C, 5 ± 2min of time;
(6)High temperature water seal:Using deionized water, 80~95 DEG C of temperature carries out copper aluminum composite material high temperature closure processing, processing 15~30S of time;
(7)Washing:It is cleaned with deionized water, room temperature, 5~15S of time;
(8)It is tin plating:Using 30~50g/L of stannous sulfate, 120~150g/L of sulfuric acid, bright dose of 10~20g/L of X-ray, DS open cylinder agents 15 ~25g/L carries out tin plating, 0.8~1.2A/dm of electric current to copper aluminum composite material2, 15~25 DEG C of temperature, the time is true according to thickness It is fixed;
(9)Washing:It is cleaned using deionized water, room temperature, then 5~15S of time is cleaned once with 50~60 DEG C of water again;
(10)It is dry:By the water stain removal in surface, and enter oven cooking cycle.
CN201711292350.XA 2017-12-08 2017-12-08 Surface treatment process of copper-aluminum bimetallic material Active CN108048889B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110184633A (en) * 2019-05-21 2019-08-30 上海锦町实业有限公司 A kind of preparation method of copper aluminum composite material metal film on surface

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60112894A (en) * 1983-11-22 1985-06-19 Pilot Precision Co Ltd Lubricant coating film and its production
JPS6137997A (en) * 1984-07-30 1986-02-22 Pilot Precision Co Ltd Surface treatment of aluminum or aluminum alloy
CN101418450A (en) * 2008-10-27 2009-04-29 江苏佳成机械有限公司 Copper plating process of aluminum wire material
CN102354575A (en) * 2011-08-23 2012-02-15 浙江省浦江县百川产业有限公司 Tinning copper clad aluminum wire production technology
CN106637313A (en) * 2016-12-22 2017-05-10 陕西航空电气有限责任公司 Technological method for plating silver on aluminum alloy part
CN107268049A (en) * 2017-08-07 2017-10-20 尼尔金属(苏州)有限公司 A kind of tin plating method on aluminium and aluminum alloy coiled materials

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60112894A (en) * 1983-11-22 1985-06-19 Pilot Precision Co Ltd Lubricant coating film and its production
JPS6137997A (en) * 1984-07-30 1986-02-22 Pilot Precision Co Ltd Surface treatment of aluminum or aluminum alloy
CN101418450A (en) * 2008-10-27 2009-04-29 江苏佳成机械有限公司 Copper plating process of aluminum wire material
CN102354575A (en) * 2011-08-23 2012-02-15 浙江省浦江县百川产业有限公司 Tinning copper clad aluminum wire production technology
CN106637313A (en) * 2016-12-22 2017-05-10 陕西航空电气有限责任公司 Technological method for plating silver on aluminum alloy part
CN107268049A (en) * 2017-08-07 2017-10-20 尼尔金属(苏州)有限公司 A kind of tin plating method on aluminium and aluminum alloy coiled materials

Non-Patent Citations (2)

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Title
李 军 等: "铝及铝合金的电镀工艺综述", 《表面技术》 *
钟建武: "铝及铝合金电镀高可焊性锡基合金工艺", 《材料保护》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110184633A (en) * 2019-05-21 2019-08-30 上海锦町实业有限公司 A kind of preparation method of copper aluminum composite material metal film on surface

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Denomination of invention: A surface treatment process of copper aluminum bimetallic material

Effective date of registration: 20211210

Granted publication date: 20200320

Pledgee: Yantai Zhonglian Industry Co.,Ltd.

Pledgor: YANTAI FISEND BIMETAL Co.,Ltd.

Registration number: Y2021980014584

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Date of cancellation: 20220725

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Pledgor: YANTAI FISEND BIMETAL Co.,Ltd.

Registration number: Y2021980014584