CN108048842A - A kind of etching liquid and its application method of nano silver wire conductive film - Google Patents
A kind of etching liquid and its application method of nano silver wire conductive film Download PDFInfo
- Publication number
- CN108048842A CN108048842A CN201711330168.9A CN201711330168A CN108048842A CN 108048842 A CN108048842 A CN 108048842A CN 201711330168 A CN201711330168 A CN 201711330168A CN 108048842 A CN108048842 A CN 108048842A
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- CN
- China
- Prior art keywords
- conductive film
- nano silver
- etching liquid
- silver wire
- wire conductive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
Abstract
The present invention is a kind of etching liquid and its application method of nano silver wire conductive film, and the etching liquid component and mass percent are as follows:Acetic acid:10~30%;Ammonium hydroxide:5~10%;Inorganic metal salt:10~20%;Hydrogen peroxide:6~16%;Water-soluble polymer:3~15%;Silica:4%;Carboxymethyl cellulose:3%;Ethylene glycol:2~17%;Deionized water:10~30%.Using the nano silver wire conductive film for preparing of the present invention there is film formation surface electric conductivity to stablize, the characteristics of resistivity is low, light transmittance height, strong adhesive force, preparation process of the invention is simply ripe, and equipment is simple, easy to operate, of low cost, easy to utilize.In addition, the nano silver wire conductive film prepared using the present invention is had, chemical stability is good, and the excellent characteristic of antiseptic property, without strong acid or highly basic, environmental pollution is small, available for fields such as electromagnetic shielding and electronic circuits, has extensively using value.
Description
Technical field
The present invention relates to a kind of etching liquid technical field more particularly to a kind of nano silver wire conductive film etching liquid and its make
Use method.
Background technology
The transparent conductive film of industry manufacture at present is based on oxide, and oxidic transparent conductive film is since it is with relatively low
Resistivity, high visible light transmissivity the advantages that and as transparent electrode be widely used in plane show, solar cell, touch
Screen, can heated glass window it is medium.ITO (Indium Tin Oxide) is current most widely used transparent material, and ITO is a kind of
N-type oxide semiconductor-tin indium oxide, two indexs of evaluation ito thin film quality most critical are light transmittance and conductivity, in oxygen
In compound conductive film, to mix the In of Sn2O3(ITO) transmitance highest and electric conductivity is best, and light transmittance is led up to more than 90%
Electrically while light transmittance 90%, reach 10-100ohm/sq.But the material have it is more crisp, preparation temperature is higher, and
And the shortcomings of expensive.A kind of relatively cheap method for preparing transparent electrode material is developed at present, and with excellent
Electricity, optics and mechanical property become the direction of industry effort always.
The content of the invention
Present invention seek to address that the deficiencies in the prior art, and etching liquid and its use of a kind of nano silver wire conductive film are provided
Method.
The present invention to achieve the above object, using following technical scheme:
A kind of etching liquid of nano silver wire conductive film, which is characterized in that the etching liquid component and mass percent are as follows:
Acetic acid:10~30%;
Ammonium hydroxide:5~10%;
Inorganic metal salt:10~20%;
Hydrogen peroxide:6~16%;
Water-soluble polymer:3~15%;
Silica:4%;
Carboxymethyl cellulose:3%;
Ethylene glycol:2~17%;
Deionized water:10~30%.
Further, the mass fraction of the acetic acid is 65%, and the mass fraction of the ammonium hydroxide is 25%~28%.
Further, the inorganic metal salt includes one or more of ferric acetate, iron chloride, potassium acetate.
Further, the water-soluble polymer includes modified cellulose, polyvinyl alcohol, one kind or several of polyethylene glycol
Kind.
The present invention also provides a kind of application methods of the etching liquid of above-mentioned nano silver wire conductive film, which is characterized in that by silver
Nano wire conductive film is immersed in etching liquid, then room temperature 5-15 minutes cleans nano silver wire conductive film with pure water, will
Nano silver wire conductive film is air-dried or dried.
The beneficial effects of the invention are as follows:The nano silver wire conductive film prepared using the present invention has film formation surface electric conductivity
The characteristics of stable, resistivity is low, and light transmittance is high, strong adhesive force, preparation process of the invention is simply ripe, and equipment is simple,
It is easy to operate, it is of low cost, it is easy to utilize.In addition, the nano silver wire conductive film prepared using the present invention has chemistry surely
Qualitative good, the excellent characteristic of antiseptic property, without strong acid or highly basic, environmental pollution is small, available for electromagnetic shielding and electronics electricity
The fields such as road have extensively using value.
Specific embodiment
With reference to embodiment, the invention will be further described:
The etching liquid of 1 a kind of nano silver wire conductive film of embodiment, which is characterized in that the etching liquid component and quality percentage
Than as follows:
Acetic acid:30%;
Ammonium hydroxide:10%;
Ferric acetate:20%;
Hydrogen peroxide:16%;
Modified cellulose:3%;
Silica:4%;
Carboxymethyl cellulose:3%;
Ethylene glycol:2%;
Deionized water:12%.
A kind of application method of the etching liquid of above-mentioned nano silver wire conductive film, which is characterized in that by nano silver wire conductive film
It is immersed in above-mentioned etching liquid, then room temperature 15 minutes cleans nano silver wire conductive film with pure water, nano silver wire is led
Electrolemma is air-dried or dried.
The etching liquid of 2 a kind of nano silver wire conductive film of embodiment, which is characterized in that the etching liquid component and quality percentage
Than as follows:
Acetic acid:10%;
Ammonium hydroxide:5%;
Ferric acetate:10%;
Hydrogen peroxide:6%;
Modified cellulose:15%;
Silica:4%;
Carboxymethyl cellulose:3%;
Ethylene glycol:17%;
Deionized water:30%.
A kind of application method of the etching liquid of above-mentioned nano silver wire conductive film, which is characterized in that by nano silver wire conductive film
It is immersed in above-mentioned etching liquid, then room temperature 10 minutes cleans nano silver wire conductive film with pure water, nano silver wire is led
Electrolemma is air-dried or dried.
The etching liquid of 3 a kind of nano silver wire conductive film of embodiment, which is characterized in that the etching liquid component and quality percentage
Than as follows:
Acetic acid:20%;
Ammonium hydroxide:8%;
Ferric acetate:10%;
Hydrogen peroxide:8%;
Modified cellulose:12%;
Silica:4%;
Carboxymethyl cellulose:3%;
Ethylene glycol:5%;
Deionized water:30%.
A kind of application method of the etching liquid of above-mentioned nano silver wire conductive film, which is characterized in that by nano silver wire conductive film
It is immersed in above-mentioned etching liquid, then room temperature 5 minutes cleans nano silver wire conductive film with pure water, nano silver wire is led
Electrolemma is air-dried or dried.
The etching liquid of 4 a kind of nano silver wire conductive film of embodiment, which is characterized in that the etching liquid component and quality percentage
Than as follows:
Acetic acid:30%;
Ammonium hydroxide:10%;
Ferric acetate:15%;
Hydrogen peroxide:6%;
Modified cellulose:12%;
Silica:4%;
Carboxymethyl cellulose:3%;
Ethylene glycol:10%;
Deionized water:10%.
A kind of application method of the etching liquid of above-mentioned nano silver wire conductive film, which is characterized in that by nano silver wire conductive film
It is immersed in above-mentioned etching liquid, then room temperature 12 minutes cleans nano silver wire conductive film with pure water, nano silver wire is led
Electrolemma is air-dried or dried.
The present invention is exemplarily described above, it is clear that present invention specific implementation is not subject to the restrictions described above,
As long as it employs the various improvement of inventive concept and technical scheme of the present invention progress or not improved directly applies to other fields
It closes, within protection scope of the present invention.
Claims (5)
1. a kind of etching liquid of nano silver wire conductive film, which is characterized in that the etching liquid component and mass percent are as follows:
Acetic acid:10~30%;
Ammonium hydroxide:5~10%;
Inorganic metal salt:10~20%;
Hydrogen peroxide:6~16%;
Water-soluble polymer:3~15%;
Silica:4%;
Carboxymethyl cellulose:3%;
Ethylene glycol:2~17%;
Deionized water:10~30%.
A kind of 2. etching liquid of nano silver wire conductive film according to claim 1, which is characterized in that the quality of the acetic acid
Fraction is 65%, and the mass fraction of the ammonium hydroxide is 25%~28%.
A kind of 3. etching liquid of nano silver wire conductive film according to claim 1, which is characterized in that the inorganic metal salt
Including one or more of ferric acetate, iron chloride, potassium acetate.
A kind of 4. etching liquid of nano silver wire conductive film according to claim 1, which is characterized in that the water-soluble polymeric
Object includes modified cellulose, polyvinyl alcohol, the one or more of polyethylene glycol.
5. a kind of application method of the etching liquid of nano silver wire conductive film as described in claim 1, which is characterized in that receive silver
Rice noodles conductive film is immersed in etching liquid, then room temperature 5-15 minutes cleans nano silver wire conductive film, by silver with pure water
Nano wire conductive film is air-dried or dried.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711330168.9A CN108048842A (en) | 2017-12-13 | 2017-12-13 | A kind of etching liquid and its application method of nano silver wire conductive film |
Applications Claiming Priority (1)
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CN201711330168.9A CN108048842A (en) | 2017-12-13 | 2017-12-13 | A kind of etching liquid and its application method of nano silver wire conductive film |
Publications (1)
Publication Number | Publication Date |
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CN108048842A true CN108048842A (en) | 2018-05-18 |
Family
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CN201711330168.9A Pending CN108048842A (en) | 2017-12-13 | 2017-12-13 | A kind of etching liquid and its application method of nano silver wire conductive film |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020171051A1 (en) * | 2019-02-19 | 2020-08-27 | Dic株式会社 | Etching liquid for silver, and method for producing printed wiring board using same |
EP3817523A4 (en) * | 2018-06-26 | 2022-03-16 | DIC Corporation | Method of manufacturing printed wiring board |
EP3817524A4 (en) * | 2018-06-26 | 2022-03-16 | DIC Corporation | Method of manufacturing printed wiring board |
US11639470B2 (en) | 2020-12-28 | 2023-05-02 | Samsung Display Co., Ltd. | Etching composition for thin film containing silver, method for forming pattern and method for manufacturing a display device using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103215592A (en) * | 2013-04-27 | 2013-07-24 | 苏州诺菲纳米科技有限公司 | Etching cream, applications of etching cream, and method for etching nano silver conductive material by utilizing etching cream |
CN104962919A (en) * | 2015-07-31 | 2015-10-07 | 合肥微晶材料科技有限公司 | Silver nanowire etching solution and etching method |
-
2017
- 2017-12-13 CN CN201711330168.9A patent/CN108048842A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103215592A (en) * | 2013-04-27 | 2013-07-24 | 苏州诺菲纳米科技有限公司 | Etching cream, applications of etching cream, and method for etching nano silver conductive material by utilizing etching cream |
CN104805441A (en) * | 2013-04-27 | 2015-07-29 | 苏州诺菲纳米科技有限公司 | Etching paste, application of etching paste and method for etching nanosilver conductive material by utilizing etching paste |
CN104962919A (en) * | 2015-07-31 | 2015-10-07 | 合肥微晶材料科技有限公司 | Silver nanowire etching solution and etching method |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3817523A4 (en) * | 2018-06-26 | 2022-03-16 | DIC Corporation | Method of manufacturing printed wiring board |
EP3817524A4 (en) * | 2018-06-26 | 2022-03-16 | DIC Corporation | Method of manufacturing printed wiring board |
WO2020171051A1 (en) * | 2019-02-19 | 2020-08-27 | Dic株式会社 | Etching liquid for silver, and method for producing printed wiring board using same |
JPWO2020171051A1 (en) * | 2019-02-19 | 2021-03-11 | Dic株式会社 | Etching solution for silver and manufacturing method of printed wiring board using it |
CN113260736A (en) * | 2019-02-19 | 2021-08-13 | Dic株式会社 | Etching solution for silver and method for manufacturing printed wiring board using same |
US11639470B2 (en) | 2020-12-28 | 2023-05-02 | Samsung Display Co., Ltd. | Etching composition for thin film containing silver, method for forming pattern and method for manufacturing a display device using the same |
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Application publication date: 20180518 |
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RJ01 | Rejection of invention patent application after publication |