CN108044484B - Polishing head with self-adaption - Google Patents
Polishing head with self-adaption Download PDFInfo
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- CN108044484B CN108044484B CN201810002749.8A CN201810002749A CN108044484B CN 108044484 B CN108044484 B CN 108044484B CN 201810002749 A CN201810002749 A CN 201810002749A CN 108044484 B CN108044484 B CN 108044484B
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- polishing head
- annular flange
- assembly
- groove
- outer peripheral
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- 238000005498 polishing Methods 0.000 title claims abstract description 86
- 230000002093 peripheral effect Effects 0.000 claims abstract description 47
- 230000003044 adaptive effect Effects 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 description 20
- 238000003825 pressing Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 230000035939 shock Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing head with self-adaptability, which comprises: the pivot assembly consists of a shaft body and a disc body, the base body is provided with a shaft hole suitable for being matched with the shaft body, and the clip assembly is provided with a groove suitable for being matched with the disc body; the shaft body on the pivot assembly is matched with the shaft hole on the base body, and the disc body on the pivot assembly is arranged in the groove on the clamping piece assembly; the outer peripheral wall of the tray body is provided with an annular flange, and the outer peripheral surface of the annular flange is in line contact with the inner peripheral wall of the groove. According to the polishing head with self-adaptability, the centering function of the polishing head can be ensured, and the stability and self-adaptability of the polishing head are improved.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing head with self-adaptability.
Background
The polishing head is an important component of the chemical mechanical polishing unit, the polishing head in the related art is equivalent to a universal joint, the pivot assembly can only absorb the vertical vibration between the clamping piece assembly and the base, and the pivot assembly is driven by the rotary driving mechanism to do high-speed rotary motion relative to the base, so that the pivot assembly can deflect to a certain extent, can swing circumferentially, and has the problems of insufficient centering function and poor self-adaptability.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to some extent. Therefore, the invention provides a polishing head with self-adaption, which can effectively reduce the swing of a pivot assembly, so that the stability and the self-adaption are improved
According to an embodiment of the present invention, a polishing head with adaptivity includes: the pivot assembly comprises a shaft body and a disc body, the disc body is connected with the shaft body and is coaxially arranged with the shaft body, and an annular flange is arranged on the peripheral wall of the disc body; the clamping piece assembly is provided with a groove suitable for being matched with the disc body, the disc body is matched in the groove, and the outer peripheral surface of the annular flange is in line contact with the inner peripheral wall of the groove.
Therefore, according to the polishing head with self-adaption, the outer peripheral surface of the annular flange is in contact with the inner Zhou Bixian of the groove, so that when the polishing head rotates, the pivot assembly can be prevented from moving in the radial direction on one hand, the centering function of the polishing head is guaranteed, and the annular flange can swing in the groove in an adaption mode, so that the stability and self-adaption of the polishing head can be improved, the parallelism of a substrate is improved, and the polishing characteristic of the substrate is improved.
In addition, the polishing head with adaptivity according to the embodiment of the invention may also have the following additional technical features:
according to some embodiments of the invention, an orthographic projection of the outer circumferential surface of the annular flange on a cross section of the disc body passing through the central axis is an outer contour line a, and the outer contour line a is an arc.
According to some embodiments of the invention, an orthographic projection of the outer peripheral surface of the annular flange on a cross section of the disc passing through the central axis is an outer contour line a comprising at least one arcuate segment and at least one straight segment.
According to some embodiments of the invention, an orthographic projection of the outer circumferential surface of the annular flange on a cross section of the disc body passing through the central axis is an outer contour line a, the outer contour line a comprising a plurality of straight lines.
According to some embodiments of the invention, a vibration absorbing ring is respectively arranged above the annular flange and below the annular flange, and a through hole is arranged on one side of the annular flange matched with the vibration absorbing ring.
According to some embodiments of the invention, an inner cavity is defined between the disc body and the shaft body, and a plurality of rib plates are arranged in the inner cavity and respectively connected with the outer peripheral wall of the shaft body and the inner peripheral wall of the inner cavity.
Optionally, the ribs extend in a radial direction of the inner cavity, and the ribs are arranged at intervals along a circumferential direction of the inner cavity.
Optionally, the polishing head with adaptivity further comprises: and the buffer piece is arranged on the clamping piece assembly and is positioned between the base body and the clamping piece assembly.
Optionally, the buffer member is a buffer column, and the buffer column is a plurality of, and a plurality of buffer columns are arranged at intervals along the circumference of the clamping piece assembly.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a schematic view of a pivot assembly having an adaptive polishing head according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a pivot assembly having an adaptive polishing head according to one embodiment of the present invention;
FIG. 3 is an enlarged view of A in FIG. 2;
FIG. 4 is a schematic view of the structure of an annular flange portion of a pivot assembly having an adaptive polishing head according to another embodiment of the present invention;
fig. 5 is an enlarged view at a through hole of a disk body having an adaptive polishing head according to an embodiment of the present invention;
fig. 6 is a schematic view of a structure having an adaptive polishing head according to an embodiment of the present invention;
fig. 7 is an enlarged view of the portion B in fig. 6;
fig. 8 is a schematic structural view of a chemical mechanical polishing apparatus according to an embodiment of the present invention.
Reference numerals:
1000: a chemical mechanical polishing device;
100: a polishing head having an adaptability;
10: a pivot assembly; 11: a shaft body; 12: a tray body; 13: an inner cavity; 14: rib plates; 15: an annular flange; 16: a through hole;
20: clip assembly, 21: a groove;
30: matrix, 31: shaft hole, 32: a vent hole;
40: elastic member, 41: sealed cavity, 42: platen, 43: a gland;
50: cushioning member, 51: a threaded fastener;
60: cover, 61: cover seal ring, 62: a mounting cavity;
70: retaining ring, 71: upper shock absorbing ring, 72: a lower vibration absorbing ring;
80: a compression ring;
200: polishing disk; 210: a polishing pad;
300: a substrate.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
A polishing head 100 having adaptivity according to an embodiment of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 1-7, a polishing head 100 having adaptivity according to an embodiment of the invention may include a pivot assembly 10 and a clip assembly 20.
Specifically, the pivot assembly 10 includes a shaft 11 and a disc 12, the disc 12 is connected to the shaft 11 and coaxially disposed with the shaft 11, an annular flange 15 is disposed on an outer peripheral wall of the disc 12, a groove 21 adapted to be engaged with the disc 12 is disposed on the clip assembly 20, the disc 12 is engaged in the groove 21, and an outer peripheral surface of the annular flange 15 is in contact with an inner peripheral wall of the groove 21.
As shown in fig. 6 and 8, the pivot assembly 10 is fixed on the clip assembly 20, the substrate 300 to be polished may be fixed on the clip assembly 20, the pivot assembly 10 includes a shaft 11 and a tray 12, the tray 12 is disposed at a lower portion of the shaft 11 and coaxially disposed with the shaft 11, and the tray 12 and the shaft 11 may be integrally formed.
The outer peripheral wall of the tray 12 is provided with an annular flange 15, the annular flange 15 may be formed by extending the outer peripheral wall of the tray 12 outwards in the radial direction, the annular flange 15 extends along the circumferential direction of the tray 12, the clip assembly 20 is provided with a groove 21, the tray 12 is fitted in the groove 21 and the annular flange 15 is adapted to be in contact with the groove 21, as shown in fig. 6, the upper portion of the groove 21 is formed in a stepped shape, the inner peripheral wall of the groove 21 is formed with a stepped portion, and the annular flange 15 is adapted to be in contact with the stepped portion.
The outer circumferential surface of the annular flange 15 contacts the groove 21 with the Zhou Bixian, in other words, when the tray 12 is fitted in the groove 21, the outer circumferential wall of the annular flange 15 contacts the clip assembly 20 in a line contact manner to prevent the pivot assembly 10 from shaking, that is, the annular flange 15 is adapted to fit in the groove 21 and the inner circumferential wall of the groove 21 can limit the annular flange 15, so that the tray 12 can be limited to prevent the pivot assembly 10 from shaking.
Thus, during the working process of the polishing head 100, the annular flange 15 is located in the groove 21, the disc 12 can be positioned through the groove 21 to limit the disc 15 to translate horizontally (for example, left and right directions as shown in fig. 6), meanwhile, when the disc 12 can swing in the up and down directions due to the contact of the annular flange 15 with the inner Zhou Bixian of the groove 21, the annular flange 15 can swing in the groove 21, for example, the disc 12 is coaxially arranged with the groove 21, when the polishing head 100 is in working, the disc 12 needs to swing adaptively due to the contact and fit of the annular flange 15 and the groove 21, namely, the disc 12 can swing relatively in the up and down directions to change adaptively, so that the centering effect of the polishing head 100 can be ensured, and the adaptability and flexibility of the polishing head 100 can be improved.
Thus, according to the polishing head 100 having the self-adaptation, the outer circumferential surface of the annular flange 15 is in contact with the inner portion Zhou Bixian of the groove 21, so that the pivot assembly 10 is prevented from moving in the radial direction when the polishing head 100 rotates, thereby ensuring the centering function of the polishing head 100, reducing friction between the disk body 12 and the clip assembly 20, and the outer circumferential surface of the annular flange 15 is in line contact with the inner circumferential wall of the groove 21, improving stability and self-adaptation of the polishing head 100, improving parallelism of the substrate 300, further improving planarization quality of the substrate 300, and improving polishing characteristics of the substrate 300.
Wherein regarding the shape of the inner wall surface of the groove 21 and the outer peripheral surface of the annular flange 15, it is only necessary to achieve line contact of the inner wall surface of the groove 21 and the outer peripheral surface of the annular flange 15.
In the example shown in fig. 1 and 2, the outer peripheral surface of the annular flange 15 is shown as an outer contour line a in the cross section of the center axis of the disc body 12, and the inner peripheral wall of the groove 21 fitted with the annular flange 15 is a straight line extending in the vertical direction in the cross section of the center axis of the spindle body 11 of the polishing head 100, so that not only the centering function of the disc body 12 but also the self-adaption and flexibility of the disc body 12 can be ensured by improving the outer peripheral surface structure of the annular flange 15 so that the outer peripheral surface of the annular flange 15 is fitted with the inner wall line of the groove 21. And also facilitates the manufacturing of the components of the polishing head 100, facilitating assembly of the tray 12 and the clip assembly 20. The shape of the outer peripheral surface of the annular flange 15 is not limited as long as it can be brought into facial line contact with the inner wall of the groove 21.
In some examples of the invention, as shown in fig. 1 and 2, the orthographic projection of the outer peripheral surface of the annular flange 15 on a cross section of the disc body 12 passing through the central axis is an outer contour line a, which may be an arc shape. That is, the outer peripheral surface of the annular flange 15 is formed into an arc surface, whereby not only the line contact between the outer peripheral surface of the annular flange 15 and the inner wall surface of the groove 21 can be realized, but also the outer periphery of the annular flange 15 can be made smoother and more attractive, which is also advantageous for the production and manufacture of the annular flange 15, and the manufacturing process is simplified.
In other examples of the invention, the orthographic projection of the outer peripheral surface of the annular flange 15 on a cross-section of the disc 12 passing through the central axis is an outer contour line a, which may comprise at least one arcuate segment and at least one straight segment, that is, the outer peripheral surface of the annular flange 15 comprises a combination of curved and beveled surfaces. In the example shown in fig. 4, the outer contour line a may include two axis segments and one arc segment, wherein the arc segment portion of the outer peripheral surface of the annular flange 15 may be adapted to be in line contact with the outer peripheral wall of the groove 21.
In still other examples of the invention, the orthographic projection of the outer peripheral surface of the annular flange 15 on a cross-section of the disc 12 passing through the central axis is an outer contour line a, which may comprise a plurality of straight lines. In some specific examples of the invention, the outer peripheral surface of the annular flange 15 may be formed in a substantially conical shape, wherein the tip of the conical shape may be directed toward the outer peripheral surface of the groove 21 to achieve a line contact fit with the outer peripheral surface of the groove 21, and the space on the upper and lower sides of the fit of the outer peripheral surface of the annular flange 15 with the groove 21 is relatively large, and the swinging of the annular flange 15 may be facilitated to further improve the adaptivity.
In some embodiments of the invention, shock absorbing rings are provided above the annular flange 15 and below the annular flange 15, respectively. The vibration of the pivot assembly 10 and the clip assembly 20 in the up-down direction can be absorbed by the vibration absorbing ring to further improve the overall stability of the polishing head 100. In the example shown in fig. 6 and 7, an upper shock absorbing ring 71 is provided above the annular flange 15, a lower shock absorbing ring 72 is provided below the annular flange 15, and the lower shock absorbing ring 72 is provided between the annular flange 15 and the clip assembly 20. Further, as shown in fig. 7, the shock absorbing ring may be spaced apart from the inner peripheral wall of the groove 21 by a certain distance, thereby facilitating the up-and-down swing of the annular flange 15 within the groove 21.
Alternatively, as shown in fig. 5, the annular flange 15 is provided with a through hole 16 on the side thereof which cooperates with the shock absorbing ring. The through hole 16 can be designed as a process hole, so that the vibration absorbing ring can be conveniently detached, and the convenience of later maintenance of the pivot assembly 10 is ensured. As shown in fig. 6, the adaptive polishing head 100 may further include a pressure ring 80, where the pressure ring 80 is fixed to the annular flange 15 of the disc 12, so as to achieve connection and fixation of the disc 12 and the clip assembly 20. In the example shown in fig. 7, the pressing ring 80 is formed in a circular shape and the pressing ring 80 is disposed above the upper vibration absorbing ring 71, and at least a portion covers the upper vibration absorbing ring 71 and another portion is fixedly connected to the clip assembly 20. Alternatively, the pressure ring 80 may be secured to the clip assembly 20 by threaded fasteners 51 to secure the tray 12 to the clip assembly 20.
In some embodiments of the present invention, an inner cavity 13 may be defined between the disc 12 and the shaft 11, and a plurality of ribs 14 are disposed in the inner cavity 13, where the ribs 14 are respectively connected to an outer peripheral wall of the shaft 11 and an inner peripheral wall of the inner cavity 13. As shown in fig. 1, 2 and 6, the tray 12 is disposed at a lower portion of the shaft 11, the shaft 11 is disposed coaxially with the tray 12, an inner cavity 13 is defined between an inner wall surface of the tray 12 and an outer wall surface of the tray 11, and a plurality of rib plates 14 are connected between the shaft 11 and the tray 12 and located in the inner cavity 13, so that structural strength of the pivot assembly 10 can be enhanced.
Alternatively, each rib 14 may extend in the radial direction of the inner cavity 13, and a plurality of ribs 14 may be provided at intervals in the circumferential direction of the inner cavity 13. Thereby further increasing the strength of the pivot assembly 10. As shown in fig. 1, a plurality of rib plates 14 are provided in the inner cavity 13, both ends of each rib plate 14 are respectively connected with the shaft body 11 and the disc body 12, and extend in the radial direction of the inner cavity 13, and the plurality of rib plates 14 are uniformly spaced apart in the circumferential direction of the inner cavity 13.
In some embodiments of the present invention, the polishing head 100 may further include: the base 30, the base 30 has a shaft hole 31, the pivot assembly 10 is disposed between the base 30 and the clip assembly 20 and the shaft 11 is fitted in the shaft hole 31. Therefore, the shaft body 11 is limited in the shaft hole 31, the disc body 12 is limited in the groove 21 of the clamping piece assembly 20, and the effective centering of the pivot assembly 10 is realized and the self-adaptability of the pivot assembly 10 is improved through the matching of the shaft body 11 and the base body 30 and the matching of the disc body 12 and the clamping piece assembly 20. The pivot assembly 10 can effectively reduce the circumferential swing of the pivot assembly 10 while absorbing the vertical vibration of the clip assembly 20, effectively improve the parallelism between the substrate 300 and the polishing pad 210, and ensure the global planarization effect of the substrate 300.
Optionally, a resilient member 40 may be disposed between the base 30 and the clip assembly 20, the resilient member 40, the base 30 and the clip assembly 20 defining a sealed cavity 41 therebetween. As shown in fig. 6, the lower portion of the base 30 is connected to the clip assembly 20 through the elastic member 40, one end of the elastic member 40 is fixed to the clip assembly 20, a sealing chamber 41 is defined between the elastic member 40, the base 30, the clip assembly 20 and the pivot assembly 10, and the up and down movement of the clip assembly 20 can be controlled by controlling the pressure in the sealing chamber 41. In the example shown in fig. 6, the upper end of the elastic member 40 may be fixed to the base 30 by a pressing plate 42, and the lower end of the elastic member 40 is fixed to the clip assembly 20 by a pressing cover 43.
Further, the base 30 may be provided with a vent hole 32, the vent hole 32 communicates with the air source and the sealing cavity 41, and the opening and closing of the vent hole 32 are controlled to control the internal pressure of the sealing cavity 41, so as to achieve the picking of the substrate 300 on the clip assembly 20. As shown in fig. 6, the upper part of the machine body is provided with a vent hole 32, the vent hole 32 penetrates the base 30 in the up-down direction, the vent hole 32 can be connected with a vent source through a pipeline, and the vent source passes through the vent hole 32 to introduce gas into the sealing cavity 41, thereby controlling the pressure in the sealing cavity 41.
In some examples of the invention, the adaptive polishing head 100 may further include a bumper 50, the bumper 50 being disposed on the clip assembly 20 and between the base 30 and the clip assembly 20. Therefore, the lower end of the base 30 is in contact with the buffer member 50, so that the hard contact between the base 30 and the clamping piece assembly 20 can be effectively avoided, the buffer effect of the base 30 and the clamping piece assembly 20 is ensured, and the damage of the clamping piece assembly 20 and the base 30 is reduced.
Further, the buffer member 50 may be a buffer column, and the buffer column may be plural. Thus, the lower end of the base 30 can be in contact engagement with the plurality of buffer posts, thereby enhancing the buffer effect between the base 30 and the clip assembly 20, and further improving the adaptability of the polishing head 100. The cushioning effect may be further enhanced by providing a plurality of cushioning posts, which may alternatively be spaced apart along the circumference of the clip assembly 20. Thus, the cushioning effect between the base 30 and the clip assembly 20 is more uniform, and the polishing head 100 structure is more stable. Further, the buffer post may be made of an engineering plastic having excellent elasticity, which can effectively avoid hard contact between the base 30 and the clip assembly 20.
In the example shown in fig. 6 and 7, the upper vibration absorbing ring 71 and the pressing ring 80 are disposed above the disc body 12, the upper vibration absorbing ring 71 can be fixed on the clip assembly 20 through the pressing ring 80, the buffer column is disposed above the pressing ring 80 and can be fixed by screws, wherein the screws can penetrate through the pressing ring 80 and the upper vibration absorbing ring 71 to be connected with the clip assembly 20, and therefore, the fixing of the pressing ring 80, the upper vibration absorbing ring 71 and the buffer column can be achieved through one screw, and the structure is simple and the assembly is convenient.
In some embodiments of the present invention, the adaptive polishing head 100 may further include a cover 60, where the cover 60 is fixed to the clip assembly 20 and is provided with a cover seal 61 with the clip assembly 20. As shown in fig. 6, the cover 60 is fixed above the clip assembly 20, and defines a mounting cavity 62 together with the clip assembly 20, an upper end portion of the cover 60 is open, the base 30 and the pivot assembly 10 are at least partially disposed in the mounting cavity 62, and a cover seal 61 is disposed between the cover 60 and the clip assembly 20, and the cover seal 61 prevents the polishing liquid from entering the polishing head 100.
In some embodiments of the present invention, the adaptive polishing head 100 may further include a retaining ring 70, the retaining ring 70 being mounted to the lower end of the clip assembly 20, the substrate 300 being located below the clip assembly 20 and within the retaining ring 70. The substrate 300 is restrained by the retaining ring 70 to prevent the substrate 300 from being deflected or flying out. In the example shown in fig. 6 and 8, the clip assembly 20 has a mounting groove at a lower portion thereof, the retaining ring 70 is mounted in the mounting groove with a lower end surface of the retaining ring 70 beyond a lower end surface of the clip assembly 20, and the substrate 300 is adsorbed on the clip assembly 20 and is positioned on the retaining ring 70.
As shown in FIG. 8, FIG. 8 is a schematic view of a device having the above embodimentThe chemical polishing apparatus 1000 of the adaptive polishing head 100 according to the embodiment of the present invention, the chemical mechanical polishing apparatus 1000 may include a polishing disk 200 and a polishing head 100.
Specifically, the polishing disk 200 is provided with a polishing pad 210, the polishing head 100 is the adaptive polishing head 100 of the above embodiment, the polishing head 100 is provided above the polishing disk 200, and the substrate 300 is mounted between the polishing head 100 and the polishing pad 210.
Wherein the substrate 300 may be pressed between the polishing pad 210 and the clip assembly 20, the polishing disk 200 is rotated, and the polishing head 100 is self-transferred and the polishing head 100 is moved back and forth, and an appropriate amount of polishing liquid is supplied between the substrate 300 and the polishing pad 210 to complete the chemical mechanical polishing of the substrate 300.
In the chemical mechanical polishing process, the polishing head 100 is driven by the driving mechanism to rotate at a high speed to drive the substrate 300 on the clamping piece assembly 20 to rotate, and the polishing head 100 of the chemical mechanical polishing device 1000 in the related art vibrates to different degrees under the influence of external factors and internal factors, that is, the parallelism between the substrate 300 on the clamping piece assembly 20 and the polishing pad 210 is affected.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (8)
1. The polishing head with the self-adaptability comprises a pivot assembly, a base body and a clamping piece assembly, wherein the pivot assembly consists of a shaft body and a disc body, the base body is provided with a shaft hole which is suitable for being matched with the shaft body, and the clamping piece assembly is provided with a groove which is suitable for being matched with the disc body; the shaft body on the pivot assembly is matched with the shaft hole on the base body, and the disc body on the pivot assembly is arranged in the groove on the clamping piece assembly; the novel disc is characterized in that an annular flange is arranged on the outer peripheral wall of the disc body, and the outer peripheral surface of the annular flange is in line contact with the inner peripheral wall of the groove; vibration absorption rings are respectively arranged above the annular flange and below the annular flange, and a through hole is formed in one side of the annular flange matched with the vibration absorption rings; a gap is arranged between the vibration absorption ring and the inner peripheral wall of the groove; the clamping piece assembly comprises a clamping piece assembly, and is characterized by further comprising a clamping ring which is formed into a ring shape and is arranged above the upper vibration absorbing ring, at least one part of the clamping piece assembly covers the upper vibration absorbing ring, and the other part of the clamping piece assembly is fixedly connected with the clamping piece assembly.
2. A polishing head with adaptivity according to claim 1, characterized in that an orthographic projection of the outer peripheral surface of the annular flange on a cross section of the disk body passing through a central axis is an outer contour line a, which is arc-shaped.
3. A polishing head with adaptivity according to claim 1, characterized in that the orthographic projection of the outer peripheral surface of the annular flange on the cross section of the disk body passing through the central axis is an outer contour line a comprising at least one arc-shaped section and at least one straight line section.
4. A polishing head with adaptivity according to claim 1, characterized in that an orthographic projection of the outer peripheral surface of the annular flange on a cross section of the disk body passing through a central axis is an outer contour line a, the outer contour line a comprising a plurality of straight lines.
5. The adaptive polishing head of claim 1, wherein the disc and the shaft define an inner cavity therebetween, and wherein a plurality of ribs are disposed in the inner cavity, the ribs being respectively connected to an outer peripheral wall of the shaft and an inner peripheral wall of the inner cavity.
6. A polishing head according to claim 5, wherein the ribs extend in a radial direction of the inner cavity, and a plurality of ribs are provided at intervals in a circumferential direction of the inner cavity.
7. The adaptive polishing head of claim 1, further comprising a buffer disposed on the clip assembly between the base and the clip assembly.
8. The adaptive polishing head of claim 7, wherein the buffer is a plurality of buffer posts spaced apart circumferentially of the clip assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/099568 WO2019029605A1 (en) | 2017-08-11 | 2018-08-09 | Adaptive polishing head |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721010434 | 2017-08-11 | ||
| CN201710687742X | 2017-08-11 | ||
| CN201710687742.XA CN107363717A (en) | 2017-08-11 | 2017-08-11 | Rubbing head with adaptivity and the chemical mechanical polishing apparatus with it |
| CN2017210104345 | 2017-08-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108044484A CN108044484A (en) | 2018-05-18 |
| CN108044484B true CN108044484B (en) | 2024-02-13 |
Family
ID=62126046
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810002749.8A Active CN108044484B (en) | 2017-08-11 | 2018-01-02 | Polishing head with self-adaption |
| CN201820006107.0U Active CN207915211U (en) | 2017-08-11 | 2018-01-02 | Rubbing head with adaptivity |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820006107.0U Active CN207915211U (en) | 2017-08-11 | 2018-01-02 | Rubbing head with adaptivity |
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| CN (2) | CN108044484B (en) |
| WO (1) | WO2019029605A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108044484B (en) * | 2017-08-11 | 2024-02-13 | 清华大学 | Polishing head with self-adaption |
| CN111469049B (en) * | 2020-04-18 | 2020-10-27 | 华海清科股份有限公司 | Polishing head with self-adaptability |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
| US6572462B1 (en) * | 1998-05-04 | 2003-06-03 | Motorola, Inc. | Carrier assembly for chemical mechanical planarization systems and method |
| CN201867206U (en) * | 2010-11-29 | 2011-06-15 | 承德菲时博特自动化设备有限公司 | Damping device used in measuring tube of rotor flow meter |
| CN103889656A (en) * | 2011-09-12 | 2014-06-25 | 应用材料公司 | Carrier head with composite plastic portions |
| CN104854680A (en) * | 2012-11-30 | 2015-08-19 | 应用材料公司 | Three-zone carrier head and flexible membrane |
| CN204833440U (en) * | 2015-07-29 | 2015-12-02 | 山东新北洋信息技术股份有限公司 | Clear extension of recognition subassembly and paper currency |
| CN207915211U (en) * | 2017-08-11 | 2018-09-28 | 清华大学 | Rubbing head with adaptivity |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121410A (en) * | 1999-10-29 | 2001-05-08 | Applied Materials Inc | Wafer polisher |
| US8998677B2 (en) * | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
| CN103072077B (en) * | 2013-01-29 | 2016-06-15 | 中国科学院长春光学精密机械与物理研究所 | A kind of double-flexibility self adaptation grinding head for polishing |
| CN107363717A (en) * | 2017-08-11 | 2017-11-21 | 清华大学 | Rubbing head with adaptivity and the chemical mechanical polishing apparatus with it |
-
2018
- 2018-01-02 CN CN201810002749.8A patent/CN108044484B/en active Active
- 2018-01-02 CN CN201820006107.0U patent/CN207915211U/en active Active
- 2018-08-09 WO PCT/CN2018/099568 patent/WO2019029605A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6572462B1 (en) * | 1998-05-04 | 2003-06-03 | Motorola, Inc. | Carrier assembly for chemical mechanical planarization systems and method |
| US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
| CN201867206U (en) * | 2010-11-29 | 2011-06-15 | 承德菲时博特自动化设备有限公司 | Damping device used in measuring tube of rotor flow meter |
| CN103889656A (en) * | 2011-09-12 | 2014-06-25 | 应用材料公司 | Carrier head with composite plastic portions |
| CN104854680A (en) * | 2012-11-30 | 2015-08-19 | 应用材料公司 | Three-zone carrier head and flexible membrane |
| CN204833440U (en) * | 2015-07-29 | 2015-12-02 | 山东新北洋信息技术股份有限公司 | Clear extension of recognition subassembly and paper currency |
| CN207915211U (en) * | 2017-08-11 | 2018-09-28 | 清华大学 | Rubbing head with adaptivity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108044484A (en) | 2018-05-18 |
| WO2019029605A1 (en) | 2019-02-14 |
| CN207915211U (en) | 2018-09-28 |
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