CN108026302B - 经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法 - Google Patents
经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法 Download PDFInfo
- Publication number
- CN108026302B CN108026302B CN201680051338.7A CN201680051338A CN108026302B CN 108026302 B CN108026302 B CN 108026302B CN 201680051338 A CN201680051338 A CN 201680051338A CN 108026302 B CN108026302 B CN 108026302B
- Authority
- CN
- China
- Prior art keywords
- sheet
- fibrous
- liquid crystal
- polymer resin
- crystal polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 156
- 239000011347 resin Substances 0.000 title claims abstract description 156
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 84
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 81
- 239000000758 substrate Substances 0.000 title claims description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 43
- 239000013078 crystal Substances 0.000 claims description 53
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 239000002952 polymeric resin Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 206010016654 Fibrosis Diseases 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000004761 fibrosis Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/024—Thermal pre-treatments
- B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
- B29C66/3034—Particular design of joint configurations the joint involving an anchoring effect making use of additional elements, e.g. meshes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
- B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/121—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives by heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/009—Using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/7832—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the overlap between the parts to be joined, e.g. the overlap between sheets, plates or web-like materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/004—Semi-crystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/44—Number of layers variable across the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/704—Crystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/20—Polymers characterized by their physical structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
经处理的液晶聚合物树脂片(2)是具有主表面(2u)的片,其具有非纤维化部(10)和纤维化部(11),所述非纤维化部(10)中共存有纤维状的结晶部(4)和填满结晶部(4)的间隙的非晶部(5),所述纤维化部(11)中的纤维状的结晶部(4)在结晶部(4)的间隙未被填满的状态下露出至主表面(2u)。
Description
技术领域
本发明涉及经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法。
背景技术
日本特开2008-103559号公报(专利文献1)记载了将液晶聚合物膜进行层叠并热压接的电子电路基板的制造方法。该文献中记载了对各液晶聚合物膜的单面或两面进行等离子体处理。
日本特开2015-91642号公报(专利文献2)记载了含有无机填充剂且形成有露出无机填充剂的槽的树脂成形品。
现有技术文献
专利文献
专利文献1:日本特开2008-103559号公报
专利文献2:日本特开2015-91642号公报
发明内容
发明要解决的问题
专利文献1中,等离子体处理提高了液晶聚合物膜的层间的密合性,但未能赋予除此之外的功能、即例如使形状变化等功能。
专利文献2中,需要事先使树脂中含有无机填充剂,但因含有玻璃纤维之类的无机填充剂而导致树脂成形品的柔软性受损。专利文献2的技术难以基于具有柔软性的膜来实施。
因而,本发明的目的在于,提供能够对柔软膜中的期望区域赋予期望功能的经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法。
用于解决问题的方法
为了实现上述目的,本发明的经处理的液晶聚合物树脂片是具有主表面的片,其具有非纤维化部和纤维化部,所述非纤维化部中共存有纤维状的结晶部和填充上述结晶部的间隙的非晶部,所述纤维化部中的纤维状的结晶部在上述结晶部的间隙未被填充的状态下在上述主表面露出。
发明的效果
根据本发明,经处理的液晶聚合物树脂片具有柔软性,且具有非纤维化部和纤维化部,因此,能够对柔软膜中的期望区域赋予期望的功能。
附图说明
图1是本发明的实施方式1中的经处理的液晶聚合物树脂片的截面图。
图2是图1中的Z部的放大图。
图3是本发明的实施方式2中的经处理的液晶聚合物树脂片的制造方法的流程图。
图4是本发明的实施方式2中的经处理的液晶聚合物树脂片的制造方法的第一工序的说明图。
图5是本发明的实施方式2中的经处理的液晶聚合物树脂片的制造方法的第二工序的说明图。
图6是本发明的实施方式3中的树脂多层基板的制造方法的流程图。
图7是本发明的实施方式3中的树脂多层基板的制造方法的第一工序的说明图。
图8是本发明的实施方式3中的树脂多层基板的制造方法的第二工序的说明图。
图9是本发明的实施方式3中的树脂多层基板的制造方法中得到的树脂多层基板的截面图。
图10是本发明的实施方式4中的树脂多层基板的制造方法的第一工序的说明图。
图11是本发明的实施方式4中的树脂多层基板的制造方法的第二工序的说明图。
图12是本发明的实施方式4中的树脂多层基板的制造方法中得到的树脂多层基板的截面图。
图13是本发明的实施方式5中的树脂多层基板的制造方法的说明图。
图14是本发明的实施方式5中的树脂多层基板的制造方法中得到的树脂多层基板的截面图。
图15是本发明的实施方式6中的树脂多层基板的截面图。
具体实施方式
附图中示出的尺寸比不一定忠实地显示现实情况,有时为了便于说明而对尺寸比进行夸张表示。在以下的说明中,提及上或下的概念时,并不是指绝对性的上或下,而是指图示形态中的相对性的上或下。
(实施方式1)
参照图1和图2,针对本发明的实施方式1中的经处理的液晶聚合物树脂片进行说明。将本实施方式中的经处理的液晶聚合物树脂片2的一例示于图1。将图1中的Z部放大并示于图2。经处理的液晶聚合物树脂片2是具有主表面2u的片,其具有非纤维化部10和纤维化部11,所述非纤维化部10中共存有纤维状的结晶部4和填充结晶部4的间隙的非晶部5,所述纤维化部11中的纤维状的结晶部4在上述结晶部的间隙未被填充的状态下在主表面2u露出。
纤维状的结晶部4和填充结晶部4的间隙的非晶部5均包含液晶聚合物树脂,但是否呈现结晶状态是不同的。在结晶部4的间隙被非晶部5填充的情况下,两者即使存在界线也几乎无法目视观察到,因此,在图2中,非纤维化部10中的两者的界线作为潜在的存在而用虚线表示。图2中,结晶部4以一定粗度的短纤维的形式来表示,在纤维化部11中,这样的结晶部4以多个发生缠绕的形式示意性地示出,然而作为结晶部4的纤维的粗度不一定是恒定的。此外,作为结晶部4的纤维的长度也不限定于图示的长度。此外,结晶部4的相互缠绕情况也在图2中示意性地简化示出,实际上也可以更复杂地缠绕。
本实施方式中的经处理的液晶聚合物树脂片2以液晶聚合物树脂作为主要材料,因此具有柔软性。该经处理的液晶聚合物树脂片2具有非纤维化部10和纤维化部11,因此,能够对柔软膜中的期望区域赋予例如下述那样的期望功能。
针对如何制造这种结构的经处理的液晶聚合物树脂片2,在实施方式2中详细说明。
需要说明的是,想要通过例如使特定的粉体附着于片来赋予期望的功能时,通过将该粉体撒落、抖落在经处理的液晶聚合物树脂片2上,粉体在非纤维化部10处发生脱落,且粉体在纤维化部11处与以纤维状露出的结晶部缠结。通过进行这样的处理,能够对片上的期望区域选择性地赋予功能。
此外,作为其它的用法,也可以考虑下述的用法。由于纤维化部11处的表面积变大,因此,以钯为代表的无电解镀铜的催化剂容易附着。无电解镀铜通过铜离子在催化剂上被还原而进行,因此,在纤维化部11处,与未经纤维化的部位相比,镀层的生长明显变快。因此,通过预先将纤维化部11形成为期望的图案,也能够使基于镀敷的导体图案仅在期望形状的区域生长。
此外,作为其它的用法,也可以考虑下述的用法。经处理的液晶聚合物树脂片2的纤维化部11具有缓冲性,因此,如果使该纤维化部11在表面露出来使用,则能够使表面的期望部分具备缓冲性。
(实施方式2)
参照图3~图5,针对本发明的实施方式2中的经处理的液晶聚合物树脂片的制造方法进行说明。将本实施方式中的经处理的液晶聚合物树脂片的制造方法的流程图示于图3。
本实施方式中的经处理的液晶聚合物树脂片的制造方法包括:准备液晶聚合物树脂片的工序S1,所述液晶聚合物树脂片具有主表面,在上述主表面共存有纤维状的结晶部和填充上述结晶部的间隙的非晶部;通过对上述主表面局部地照射脉冲激光,从而在上述主表面之中的一部分区域形成纤维化部的工序S2,所述纤维化部中的纤维状的结晶部在间隙未被填充的状态下露出。
针对各工序进行详细说明。作为工序S1,如图4所示,准备液晶聚合物树脂片12。作为液晶聚合物树脂片12,使用具有主表面12u且在主表面12u共存有纤维状的结晶部和填充上述结晶部的间隙的非晶部的液晶聚合物树脂片。由于结晶部与非晶部在该状态下基本无法分辨其界线,因此,在图4中作为单纯的1片来表示。通常,市售的液晶聚合物树脂片已经满足这样的条件。
作为工序S2,如图5所示,对液晶聚合物树脂片12的主表面12u局部地照射脉冲激光13。从激光照射装置14照射脉冲激光13。脉冲激光13以仅扫描主表面12u之中的期望区域的方式进行照射。脉冲激光13以例如3J/cm2以上且35J/cm2以下的能量密度进行照射即可。脉冲激光13以例如点径的20%以上且80%以下的脉冲间隔进行等间距照射即可。脉冲激光13的频率可以是10kHz以上且1000kHz以下。通过照射脉冲激光13,在主表面12u之中的一部分区域形成纤维化部,所述纤维化部中的纤维状的结晶部在间隙未被填充的状态下露出。
在液晶聚合物树脂的片中,存在结晶部和非晶部。两者在材料上是单一的,但在内部晶体结构并不相同。因该结构的不同而导致熔点不同。结晶部具有比非晶部更高的熔点。通过对这样的片照射脉冲激光13,熔点低的非晶部选择性地蒸发,熔点高的结晶部残留。由于结晶部呈现纤维状,因此,仅残留结晶部的区域成为纤维化部。其结果,如图1和图2所示那样地形成纤维化部11。
根据本实施方式中的经处理的液晶聚合物树脂片的制造方法,能够对柔软膜的期望区域赋予期望的功能。
需要说明的是,通常对材料照射激光的作业是为了切割或表面改性。如果是用于切割的激光照射,则会贯穿材料。另一方面,如果是用于表面改性的激光照射,则材料不会被去除,仅表面状态发生变化。例如,仅表面附近的晶体结构发生变化。与此相对,本实施方式的目的不在于材料整体的去除,其目的在于,仅残留混入至材料内的特定结构,去除其它部分。
通过采用该方法,能够在液晶聚合物树脂这样的单一材料的片中部分性地形成纤维化部。即使在柔软的薄片中也能够部分性地形成纤维化部。在纤维化部中,材料的密度变小。
(实施方式3)
参照图6~图9,针对本发明的实施方式3中的树脂多层基板的制造方法进行说明。将本实施方式中的树脂多层基板的制造方法的流程图示于图6。本实施方式中的树脂多层基板的制造方法包括:准备多个液晶聚合物树脂片的工序S11,所述多个液晶聚合物树脂片包含实施方式1中说明的经处理的液晶聚合物树脂片;以及,通过使上述多个液晶聚合物树脂片层叠并热压接而进行一体化的工序S12。
以下,针对各工序进行详细说明。作为工序S11,例如图7所示,准备多个液晶聚合物树脂片60。多个液晶聚合物树脂片60中,作为实施方式1中说明的经处理的液晶聚合物树脂片,包含经处理的液晶聚合物树脂片2a、2b。此外,多个液晶聚合物树脂片60包含未形成纤维化部的液晶聚合物树脂片12。此处示出的多个液晶聚合物树脂片60的组合只不过是一例,不限定于此。也可以是多个液晶聚合物树脂片60均形成有纤维化部的经处理的液晶聚合物树脂片。
作为工序S12,如图8所示,将多个液晶聚合物树脂片60层叠而制成层叠体。通过对该层叠体实施加热和加压,即:使其热压接而使层叠体实现一体化。由此能够得到图9所示的树脂多层基板101。在图7~图9中,属于多个液晶聚合物树脂片60的片数达到4,但这只不过是一例,片数不限定于4。
更优选的是,本实施方式中,多个液晶聚合物树脂片如图7所示,包含第一片21和第二片22,所述第一片21以局部地覆盖表面的方式具备导电体部7,所述第二片22具有纤维化部11。导电体部7可以是在树脂片的表面由导体箔等形成的导体图案。导电体部7可以是金属膜。导电体部7可以是加工成期望形状的铜箔。纤维化部11可以设置在第二片22的主表面的多处,此处为了便于说明而简化地示出1处纤维化部11。在一体化的工序S12(参照图6)中,将第一片21与第二片22叠合,使得导电体部7与纤维化部11直接重叠。通过这样地重叠,如图8所示,导电体部7挤压纤维化部11的一部分,进入至作为纤维化部11的空间的一部分中。换言之,导电体部7导致的高低差被纤维化部11吸收。如果考虑到误差,则优选以纤维化部11比导电体部7略宽的方式进行设计,此时,如图8所示,在导电体部7被纤维化部11吸收后,在纤维化部11的端部的一部分,纤维状的结晶部4在间隙未被填充的状态下残留。通过使其热压接而使层叠体实现一体化后,呈现图9所示那样的状态。在作为纤维化部11而残留的部分中,在进行热压接时从周边流入树脂而已将纤维状的结晶部4填埋。
本实施方式中,利用包含实施方式1中说明的经处理的液晶聚合物树脂片的多个液晶聚合物树脂片而制作树脂多层基板,因此,在层叠体中包含纤维化部。因此,能够对柔软膜的期望区域赋予期望的功能且得到树脂多层基板。此处,将所层叠的多个片之中的位于最上方的片记作第一片22,将紧接其下的片记作第二片22来进行说明,可作为第一片21和第二片22的片不限于这种位置的2层。也可以将所层叠的多个片之中的其它位置中的2个片作为第一片21和第二片22。
纤维化部11是露出有纤维状的结晶部4的部分,因此,在固体进入其中的情况下,结晶部4可被容易地挤压。由此,能够在纤维化部的区域内容纳固体。本实施方式中,因第一片21的导电体部7而产生的高低差被第二片22的纤维化部11吸收,因此能够抑制在层叠体的表面产生高低差。因此,能够抑制在树脂多层基板的表面产生高低差。
(实施方式4)
参照图10~图12,针对本发明的实施方式4中的树脂多层基板的制造方法进行说明。本实施方式中的树脂多层基板的制造方法基本与实施方式3中的树脂多层基板的制造方法共通,因此,仅针对不同的部分进行说明。
本实施方式中,多个液晶聚合物树脂片如图10所示,包含第一片21和第二片,所述第一片21以局部地覆盖表面的方式具备导电体部7,所述第二片具有纤维化部11a、11b。此处示出了在2处设置有纤维化部的例子,但纤维化部的数量可以为1处,也可以为3处以上。在一体化的工序S12(参照图6)中,将第一片21与第二片22叠合,使得通过在导电体部7重叠于树脂部分的状态下施加热和压力而产生的树脂流动被纤维化部11a、11b吸收。即,纤维化部11a、11b以可被因导电体部7重叠于第二片22而产生的树脂流动所波及的程度而配置在距离导电体部7的投影区域较近的范围内。纤维化部11a、11b可以与导电体部7的投影区域部分地重叠。图10所示的例子中,纤维化部11a、11b被配置在与导电体部7的投影区域不同的位置。
在工序S12中,通过导电体部7重叠于树脂部分且施加用于热压接的热和压力,如图11所示,树脂的流动从导电体部7向着周边进行。该流动如箭头91、92所示地向纤维化部11a、11b流入。纤维化部11a、11b是纤维状的结晶部4以间隙未被填充的状态残留的部分,因此,密度比其它部分小。向该部分流入树脂时,在纤维状的结晶部4的间隙容纳树脂,树脂流动的势头会削弱。由此,如图12所示,能够得到树脂多层基板103。树脂的流动被作为纤维化部的部分吸收,其外侧不受树脂流动的影响。图12中,示意性地示出纤维化部11a、11b的痕迹。实际上,纤维化部11a、11b的痕迹不限定于用这种形式表示。根据热压接的条件,也存在这种纤维化部11a、11b的痕迹不会残留的情况。
在纤维化部中,进行热压接时,流动的树脂被容纳于纤维状的结晶部4的间隙,因此,如果纤维化部的体积充分大,则也能够阻断树脂的流动。如本实施方式所示那样,通过在成为树脂流动出路的位置预先配置纤维化部,能够抑制乃至控制树脂流动。例如,通过以在俯视观察下包围导电体部7的方式配置纤维化部,由此能够利用纤维化部吸收从导电体部7向周边扩展的方向的树脂流动。通过这样操作,能够使纤维化部的外侧不受树脂流动的影响。
想要使树脂多层基板之中的一定区域内不受树脂流动的影响时,可以应用本实施方式的想法,适当地配置纤维化部。
(实施方式5)
参照图13~图14,针对本发明的实施方式5中的树脂多层基板的制造方法进行说明。本实施方式中的树脂多层基板的制造方法基本与实施方式3中的树脂多层基板的制造方法共通,因此,仅针对不同的部分进行说明。
本实施方式中,多个液晶聚合物树脂片如图13所示,包含实施方式1中说明那样的经处理的液晶聚合物树脂片、即A片23和B片24。在一体化的工序S12中,将A片23与B片24叠合,使得形成在俯视时呈现A片23的纤维化部11的至少一部分与B片24的纤维化部11的至少一部分重叠的位置关系。在图13所示的例子中,A片23和B片24分别在相同位置具有相同尺寸的纤维化部11,但A片23和B片24分别具有的纤维化部11不限定于相同位置,不限定于相同尺寸。A片23的纤维化部11的至少一部分与B片24的纤维化部11的至少一部分重叠即可。
通过满足这样的条件来进行工序S12,如图14所示,在纤维化部11彼此重叠的部位,纤维化部11被挤压而变薄。由此,能够得到具有较薄部分15和较厚部分16a、16b的树脂多层基板104。需要说明的是,A片23和B片24也可以在任意部位具有导电体部。
本实施方式中,能够在树脂多层基板中形成变薄的部分15和较厚的部分16a、16b,因此,利用该方法进行操作,使得在最终的树脂多层基板中针对想要制成柔部的部分形成较薄部分15、针对想要制成刚部的部分形成较厚部分16即可。
通过如本实施方式那样地操作,在柔部与刚部的界线,片彼此接触的界面不会露出。在露出有这种界面的情况下,界面的露出部位容易形成剥离的起点,但本实施方式中,这样的界面不会露出,因此,能够制成难以剥离的树脂多层墓板。
在图13所示的例子中,不限定于A片23和B片24,进而其它树脂片也存在纤维化部11,以3个片的纤维化部11彼此重叠的方式进行工序S12。像这样,也可以在3个以上的片上设置有纤维化部,并以它们叠合的方式进行工序S12。纤维化部11的叠合层数越多,则纤维化部11被挤压而导致的厚度减量越大,因此,能够增大刚部与柔部的最终厚度差。
(实施方式6)
参照图15,针对本发明的实施方式6中的树脂多层基板的制造方法进行说明。实施方式1中,针对经处理的液晶聚合物树脂片2进行了说明,也可以以包含至少1个经处理的液晶聚合物树脂片2的形式利用多个液晶聚合物树脂片构成树脂多层基板,并以经处理的液晶聚合物树脂片2的纤维化部11在树脂多层基板的表面露出的方式进行配置。例如图15所示那样,树脂多层基板可以是将经处理的液晶聚合物树脂片2与1个以上的液晶聚合物树脂片64层叠而得到的。此处示出多个液晶聚合物树脂片64,但这些液晶聚合物树脂片64之中的一部分或全部可以是经处理的液晶聚合物树脂片2。液晶聚合物树脂片64也可以是单纯的液晶聚合物树脂片。
实施方式6中的树脂多层基板105是多个液晶聚合物树脂片在层叠状态下通过热压接进行了一体化的状态的树脂多层基板,具有露出于外侧的主表面62,在主表面62具有非纤维化部10和纤维化部11,所述非纤维化部10中共存有纤维状的结晶部和填充上述结晶部的间隙的非晶部,所述纤维化部11中的纤维状的结晶部在上述结晶部彼此之间的间隙未被填充的状态下在上述主表面露出。在图15所示的例子中,在树脂多层基板105的内部配置有几个导电体部7。
根据本实施方式中的树脂多层基板,能够使树脂多层基板的表面的期望部分具有缓冲性。需要说明的是,为了获得本实施方式中的树脂多层基板,不采用对整个树脂片照射脉冲激光而形成纤维化部后再层叠并一体化的制造方法,而可以采用下述制造方法:预先进行将树脂片层叠并一体化的工序后,作为整体上的表面,对露出于外侧的主表面局部地照射脉冲激光,从而在主表面之中的期望的一部分区域形成纤维化部。
需要说明的是,也可以将上述实施方式之中的多个适当组合并采用。
需要说明的是,本次公开的上述实施方式在所有方面均为例示,但没有限制。本发明的范围不由上述说明表示,而由权利要求书表示,包括与权利要求书均等的含义和范围内的所有变更。
附图标记说明
2经处理的液晶聚合物树脂片;2u主表面;4结晶部;5非晶部;7导电体部;10非纤维化部;11、11a、11b纤维化部;12液晶聚合物树脂片;12u主表面;13脉冲激光;14激光照射装置;15(较薄)部分;16a、16b(较厚)部分;21第一片;22第二片;23A片;24B片;60多个液晶聚合物树脂片;62(树脂多层基板的)主表面;64液晶聚合物树脂片;91、92箭头;101、103、104、105树脂多层基板。
Claims (7)
1.一种经处理的液晶聚合物树脂片,其是具有主表面的片,其具有非纤维化部和纤维化部,
所述非纤维化部中共存有纤维状的结晶部和填充所述结晶部的间隙的非晶部,
所述纤维化部中的纤维状的结晶部在所述结晶部的间隙未被填充的状态下在所述主表面露出。
2.一种树脂多层基板,其是多个液晶聚合物树脂片在层叠的状态下通过热压接而进行了一体化的状态的树脂多层基板,其具有露出于外侧的主表面,
在所述主表面具有非纤维化部和纤维化部,
所述非纤维化部中共存有纤维状的结晶部和填充所述结晶部的间隙的非晶部,
所述纤维化部中的纤维状的结晶部在所述结晶部彼此之间的间隙未被填充的状态下在所述主表面露出。
3.一种经处理的液晶聚合物树脂片的制造方法,其包括:
准备液晶聚合物树脂片的工序,
所述液晶聚合物树脂片具有主表面,在所述主表面共存有纤维状的结晶部和填充所述结晶部的间隙的非晶部;以及
对所述主表面局部地照射脉冲激光使得在所述主表面之中的俯视观察下的一部分区域形成纤维化部中的纤维状的结晶部在间隙未被填充的状态下露出的纤维化部的工序。
4.一种树脂多层基板的制造方法,其包括:
准备包含权利要求1所述的经处理的液晶聚合物树脂片的多个液晶聚合物树脂片的工序;以及
通过使所述多个液晶聚合物树脂片层叠并热压接而进行一体化的工序。
5.根据权利要求4所述的树脂多层基板的制造方法,其中,所述多个液晶聚合物树脂片包含第一片和第二片,
所述第一片以局部地覆盖表面的方式具备导电体部,所述第二片具有所述纤维化部,
在所述一体化的工序中,将所述第一片与所述第二片叠合而使得所述导电体部与所述纤维化部直接重叠。
6.根据权利要求4所述的树脂多层基板的制造方法,其中,所述多个液晶聚合物树脂片包含第一片和第二片,
所述第一片以局部地覆盖表面的方式具备导电体部,所述第二片具有所述纤维化部,
在所述一体化的工序中,将所述第一片与所述第二片叠合,使得通过在所述导电体部重叠于树脂部分的状态下施加热和压力而产生的树脂流动被所述纤维化部吸收。
7.根据权利要求4所述的树脂多层基板的制造方法,其中,所述多个液晶聚合物树脂片均包含作为所述经处理的液晶聚合物树脂片的A片和B片,
在所述一体化的工序中,将所述A片与所述B片叠合,使得形成在俯视时所述A片的所述纤维化部的至少一部分与所述B片的所述纤维化部的至少一部分重叠的位置关系。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-179609 | 2015-09-11 | ||
JP2015179609 | 2015-09-11 | ||
PCT/JP2016/074613 WO2017043312A1 (ja) | 2015-09-11 | 2016-08-24 | 処理済液晶ポリマー樹脂シート、その製造方法、樹脂多層基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108026302A CN108026302A (zh) | 2018-05-11 |
CN108026302B true CN108026302B (zh) | 2020-12-01 |
Family
ID=58239639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680051338.7A Active CN108026302B (zh) | 2015-09-11 | 2016-08-24 | 经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10864698B2 (zh) |
JP (1) | JP6460251B2 (zh) |
CN (1) | CN108026302B (zh) |
WO (1) | WO2017043312A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018133676A1 (de) * | 2018-12-28 | 2020-07-02 | Airbus Operations Gmbh | Fügeverfahren sowie Bearbeitungskopf und Fertigungsmaschine zum Durchführen des Verfahrens |
CN110943283B (zh) * | 2019-12-24 | 2021-12-03 | 刘良江 | 一种复合天线材料的制造方法、复合天线及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06114962A (ja) * | 1992-09-30 | 1994-04-26 | Mazda Motor Corp | 液晶樹脂複合体の成形装置 |
CN1739323A (zh) * | 2003-01-20 | 2006-02-22 | 株式会社藤仓 | 多层布线板及其制造方法 |
JP2007088288A (ja) * | 2005-09-22 | 2007-04-05 | Sumitomo Electric Ind Ltd | 回路基板、その製造方法及び多層回路基板 |
CN101790429A (zh) * | 2007-08-31 | 2010-07-28 | 旭硝子株式会社 | 液晶聚合物层压体的制造方法 |
CN102683220A (zh) * | 2011-03-08 | 2012-09-19 | 中国科学院微电子研究所 | 一种制作多层有机液晶聚合物基板结构的方法 |
TW201442850A (zh) * | 2013-02-12 | 2014-11-16 | Polyplastics Co | 具有溝槽之樹脂成形品 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6205657B1 (en) * | 1996-11-08 | 2001-03-27 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method for producing the same |
JP2004356588A (ja) * | 2003-05-30 | 2004-12-16 | Toppan Printing Co Ltd | 超短パルスレーザーによる材料加工方法、プリント配線板、及びその製造方法 |
EP1743209B1 (en) * | 2004-04-16 | 2016-11-23 | D.K. And E.L. Mcphail Enterprises Pty Ltd | Method of forming an optically active matrix with void structures |
EP1622435A1 (en) * | 2004-07-28 | 2006-02-01 | ATOTECH Deutschland GmbH | Method of manufacturing an electronic circuit assembly using direct write techniques |
JP2006135090A (ja) * | 2004-11-05 | 2006-05-25 | Seiko Epson Corp | 基板の製造方法 |
KR100912999B1 (ko) * | 2006-02-10 | 2009-08-20 | 레프 테크놀로지 인코포레이티드 | 액정 폴리머의 개질 방법 |
JP5154055B2 (ja) | 2006-10-19 | 2013-02-27 | 株式会社プライマテック | 電子回路基板の製造方法 |
JP2008126283A (ja) * | 2006-11-21 | 2008-06-05 | Seiko Epson Corp | 微細構造体の製造方法、露光方法 |
WO2008129664A1 (ja) * | 2007-04-17 | 2008-10-30 | Lef Technology, Inc. | レーザー光による有機反応の制御方法および反応装置 |
JP2010258415A (ja) * | 2009-02-12 | 2010-11-11 | Sumitomo Bakelite Co Ltd | 複合体、複合体の製造方法及び半導体装置 |
US8735739B2 (en) | 2011-01-13 | 2014-05-27 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
KR20150094076A (ko) * | 2014-02-10 | 2015-08-19 | 삼성전기주식회사 | 동박적층판 및 이의 제조방법 |
-
2016
- 2016-08-24 JP JP2017539100A patent/JP6460251B2/ja active Active
- 2016-08-24 WO PCT/JP2016/074613 patent/WO2017043312A1/ja active Application Filing
- 2016-08-24 CN CN201680051338.7A patent/CN108026302B/zh active Active
-
2018
- 2018-02-28 US US15/907,355 patent/US10864698B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06114962A (ja) * | 1992-09-30 | 1994-04-26 | Mazda Motor Corp | 液晶樹脂複合体の成形装置 |
CN1739323A (zh) * | 2003-01-20 | 2006-02-22 | 株式会社藤仓 | 多层布线板及其制造方法 |
JP2007088288A (ja) * | 2005-09-22 | 2007-04-05 | Sumitomo Electric Ind Ltd | 回路基板、その製造方法及び多層回路基板 |
CN101790429A (zh) * | 2007-08-31 | 2010-07-28 | 旭硝子株式会社 | 液晶聚合物层压体的制造方法 |
CN102683220A (zh) * | 2011-03-08 | 2012-09-19 | 中国科学院微电子研究所 | 一种制作多层有机液晶聚合物基板结构的方法 |
TW201442850A (zh) * | 2013-02-12 | 2014-11-16 | Polyplastics Co | 具有溝槽之樹脂成形品 |
Also Published As
Publication number | Publication date |
---|---|
US10864698B2 (en) | 2020-12-15 |
CN108026302A (zh) | 2018-05-11 |
JP6460251B2 (ja) | 2019-01-30 |
US20180186115A1 (en) | 2018-07-05 |
WO2017043312A1 (ja) | 2017-03-16 |
JPWO2017043312A1 (ja) | 2018-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI415541B (zh) | 多層配線板 | |
CN102170745B (zh) | 多层布线板及其制造方法 | |
US10090238B2 (en) | Wiring substrate and method for manufacturing the same | |
JP5212549B2 (ja) | リジッド−フレキシブル多層配線基板の製造方法および集合基板 | |
TW200820866A (en) | Flex-rigid wiring board and method of manufacturing the same | |
JP2017123497A (ja) | 印刷回路基板及びその製造方法 | |
TW200950612A (en) | Multilayer wiring board and method for manufacturing the same | |
JP2012146983A (ja) | 配線板及びその製造方法 | |
TW201206287A (en) | Printed wiring board and method for manufacturing printed wiring board | |
CN108026302B (zh) | 经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法 | |
JP2018006386A (ja) | 配線板の製造方法 | |
WO2014185218A1 (ja) | 樹脂多層基板の製造方法 | |
WO2014091869A1 (ja) | 配線基板およびその製造方法 | |
KR101164957B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
JP6259813B2 (ja) | 樹脂多層基板、および樹脂多層基板の製造方法 | |
US20150245492A1 (en) | Multilayer wiring board with built-in electronic component | |
KR20190115911A (ko) | 인쇄회로기판 및 인쇄회로기판 스트립 | |
JP4069712B2 (ja) | 多層プリント基板 | |
JP2018116963A (ja) | パッケージ用基板、およびその製造方法 | |
KR101685289B1 (ko) | 다층 배선 기판 및 그 제조 방법 | |
CN105378912B (zh) | 半导体封装件的制造方法以及半导体封装件 | |
JP5618029B2 (ja) | 樹脂多層基板およびその製造方法 | |
WO2015093593A1 (ja) | 電子装置 | |
JP5257518B2 (ja) | 基板製造方法および樹脂基板 | |
JP2017037863A (ja) | 電子装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |