CN108003347A - A kind of preparation method for high-power encapsulation MDT silicones - Google Patents

A kind of preparation method for high-power encapsulation MDT silicones Download PDF

Info

Publication number
CN108003347A
CN108003347A CN201711179671.9A CN201711179671A CN108003347A CN 108003347 A CN108003347 A CN 108003347A CN 201711179671 A CN201711179671 A CN 201711179671A CN 108003347 A CN108003347 A CN 108003347A
Authority
CN
China
Prior art keywords
acid
alcohol
silicones
water
phenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201711179671.9A
Other languages
Chinese (zh)
Inventor
秦余磊
陈维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yantai Darbond Technology Co Ltd
Original Assignee
YANTAI DEBANG ADVANCED SILICON MATERIALS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YANTAI DEBANG ADVANCED SILICON MATERIALS CO Ltd filed Critical YANTAI DEBANG ADVANCED SILICON MATERIALS CO Ltd
Priority to CN201711179671.9A priority Critical patent/CN108003347A/en
Publication of CN108003347A publication Critical patent/CN108003347A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)

Abstract

The present invention relates to a kind of preparation method for high-power encapsulation MDT silicones, including:Acid is added in four-hole bottle, dimethyldialkylammonium oxysilane, methyl phenyl di-alkoxy silane, phenyl trialkoxysilane, alcohol and water, stirring, be heated to 25 DEG C reaction 12 it is small when, remaining total water and vinyl double seal head is added dropwise at the same time at room temperature after the completion of reaction, hexamethyldisiloxane, temperature in control system is between 30 40 DEG C, when reaction 12 is small at 70 DEG C after being added dropwise, then the alcohol in system is steamed, then the pH=9 10 of the toluene and alkali regulation system more than theoretical amount of resin is added, when 90 DEG C of reactions 1 are small, then heating steams remaining alcohol and water in system, finally cool down again, neutralized with acid, it is washed to the pH=6 7 of system, toluene is evaporated off up to silicones in 120 DEG C of backspins;The MDT silicones of preparation is mainly used for the reinforcing agent of packaging plastic, organosilicon adhesive and silicone molding compound.

Description

A kind of preparation method for high-power encapsulation MDT silicones
Technical field
The present invention relates to a kind of preparation method for high-power encapsulation MDT silicones, belong to the synthesis skill of silicones Art field.
Technical background
In recent years, with the development of semiconductor light emitting technology, semiconductor lighting substitute high energy consumption, low light efficiency incandescent lamp As inexorable trend, cause global extensive concern.Organosilicon material is due to its good resistant of high or low temperature and recyclability, especially It is the silicon rubber or silicones vulcanized by hydrosilylation mode, is that high power LED device is most preferable so far Encapsulating material, the silicones of MDT types is one kind in organic siliconresin, it by single functionality silica chain link (R3SiO1/2, M chain links), the organosilicon of two degree of functionality silica chain links (R2SiO, D chain link) and three-functionality-degree silica chain link (RSiO3/2, T chain link) Monomer is formed through cohydrolysis-polycondensation reaction.
In existing technology, in relation to existing for the general refractive index control of MDT silicones used in LED packaging silicon rubbers Between 1.50-1.55, belong to high refractive index silicone;But as LED is encapsulated towards high-power, large-sized development, simple High refractive index resins have been unable to meet the requirement of higher.A kind of MDT resins of the present invention preferably meet LED packaging silicon rubbers to resistant to sulfur Change, the requirement of thermal shock performance and high-power, large scale for light decay under higher high temperature.
The content of the invention
For the deficiency of existing MDT silicones, the present invention provides a kind of by methyl M links, vinyl M links, methylbenzene The synthetic method for the MDT resins that base D links, methyl ethylene D links, phenyl T links form.
Technical scheme is as follows:
A kind of preparation method for high-power encapsulation MDT silicones, it is characterised in that in four-hole bottle add acid, Dimethyldialkylammonium oxysilane, methyl phenyl di-alkoxy silane, phenyl trialkoxysilane, alcohol and suitable water, stirring, add When hot to 25 DEG C reaction 1-2 are small, remaining total water and vinyl double seal head, pregnancy is added dropwise at the same time at room temperature after the completion of reaction Base disiloxane, the temperature in control system reacted between 30-40 DEG C, after being added dropwise at 70 DEG C 1-2 it is small when, then steam Alcohol in system, then adds the pH=9-10 of the toluene and alkali regulation system more than theoretical amount of resin, when 90 DEG C of reactions 1 are small, Then heating steams remaining alcohol and water in system, finally cools down again, is neutralized with acid, is washed to the pH=6-7 of system;120℃ Toluene is evaporated off up to silicones in backspin;
The acid, vinyl double seal head, hexamethyldisiloxane, dimethyldimethoxysil,ne, alcohol, water, aminomethyl phenyl Dialkoxy silicane, the mass ratio of phenyl trialkoxysilane are (1.18-1.99):(5.58-38.50):(30.46- 113.24):(60.11-240.44):(11.80-19.95):(50.20-120.80):(182.29-210.35):(198.26- 240.37)。
Preferable according to the present invention, the dimethyldialkylammonium oxysilane is dimethyldimethoxysil,ne, dimethyl two Ethoxysilane;
It is preferable according to the present invention, play the compatibility of increase system using alcohol is added and suppress to react too fast;
Preferable according to the present invention, the phenyl methyl dialkoxy silicane is aminomethyl phenyl dimethoxysilane, methyl Diethylamino phenyl oxysilane;
Preferable according to the present invention, the phenyl trialkoxysilane is phenyltrimethoxysila,e, phenyl triethoxy Silane;
Preferable according to the present invention, the acid is hydrochloric acid, sulfuric acid, phosphoric acid, Emathlite, trifluoromethane sulfonic acid and acidity sun Ion exchange resin;
Preferable according to the present invention, the dosage of water is phenyl trialkoxysilane, methyl phenyl di-alkoxy silane and two 1.4-2.7 times of methyl dioxane oxysilane total moles quality;
Preferable according to the present invention, the alcohol is ethanol, methanol;The alkali is Na2CO3、NaHCO3、K2CO3、KHCO3、 NaOH、KOH;
Preferable according to the present invention, speed of agitator is 200-450 revs/min;
Preferable according to the present invention, vinyl mass percent is 1.5%-6%;
Preferable according to the present invention, the value of R/Si is 1.1-1.8;
Preferable according to the present invention, the MDT silicones of synthesis accurately can control alkoxy by deviating from the amount of alcohol Surplus;
Preferable according to the present invention, the reactor is equipped with thermometer, constant pressure funnel, spherical condensation tube, tetrafluoro The four round flask of stirring rod.
MDT silicones prepared by invention is mainly used for the reinforcing agent of packaging plastic, organosilicon adhesive and silicone molding compound.
Embodiment
Embodiment 1
1.77g concentrated hydrochloric acids, 30.46g dimethyldimethoxysil,nes, 182.29g aminomethyl phenyls two are added in four-hole bottle Methoxy silane, 198.26g phenyltrimethoxysila,es, 15.10g ethanol and 5g water, stir, be heated to 25 DEG C reaction 2 it is small when, instead 57.40g water and 15.13g vinyl double seal heads, 67.70g hexamethyldisiloxane is added dropwise at the same time at room temperature after the completion of answering, controls Temperature in system processed when reaction 2 is small at 70 DEG C after being added dropwise, then steams the alcohol in system, then between 30-40 DEG C 300g toluene and the pH=10 of suitable Na2CO3 regulation systems are added, when 90 DEG C of reactions 1 are small, 120 DEG C then heated to and steams Remaining alcohol and water in system, finally cools down, the pH=6-7 of system is neutralized, be washed to acetic acid again;120 DEG C of backspins are evaporated off Toluene is up to silicones;Its yield is 95%.
Embodiment 2
1.77g concentrated hydrochloric acids, 30.46g dimethyl diethoxysilanes, 210.35g aminomethyl phenyls two are added in four-hole bottle Ethoxy silane, 240.37g phenyl triethoxysilanes, 15.10g ethanol and 5g water, stir, be heated to 25 DEG C reaction 2 it is small when, instead 57.40g water and 15.13g vinyl double seal heads, 67.70g hexamethyldisiloxane is added dropwise at the same time at room temperature after the completion of answering, controls Temperature in system processed when reaction 2 is small at 70 DEG C after being added dropwise, then steams the alcohol in system, then between 30-40 DEG C 300g toluene and the pH=10 of suitable NaHCO3 regulation systems are added, when 90 DEG C of reactions 1 are small, 120 DEG C then heated to and steams Remaining alcohol and water in system, finally cools down, the pH=6-7 of system is neutralized, be washed to acetic acid again;120 DEG C of backspins are evaporated off For toluene up to silicones, its yield is 94%.
Embodiment 3
The 1.60g concentrated sulfuric acids, 30.46g dimethyldimethoxysil,nes, 182.29g aminomethyl phenyls two are added in four-hole bottle Methoxy silane, 198.26g phenyltrimethoxysila,es, 15.10g alcohol and 5g water, stir, be heated to 25 DEG C reaction 2 it is small when, reaction After the completion of at room temperature at the same time 57.40g water and 15.13g vinyl double seal heads, 67.70g hexamethyldisiloxane is added dropwise, control Temperature in system when reaction 2 is small at 70 DEG C after being added dropwise, then steams the alcohol in system, Ran Houjia between 30-40 DEG C Enter 300g toluene and the pH=10 of suitable NaOH regulation systems, when 90 DEG C of reactions 1 are small, then heat to 120 DEG C and steam system Interior remaining alcohol and water, finally cools down, the pH=6-7 of system is neutralized, be washed to acetic acid again;Toluene is evaporated off in 120 DEG C of backspins Up to silicones;Its yield is 90%.
Embodiment 4
1.50g trifluoromethane sulfonic acids, 30.46g dimethyldimethoxysil,nes, 182.29g methyl are added in four-hole bottle Phenyl dimethoxy silane, 198.26g phenyltrimethoxysila,es, 15.10g methanol and 5g water, stir, are heated to 25 DEG C of reactions 2 Hour, 57.40g water and 15.13g vinyl double seal heads, two silicon of 67.70g hexamethyls is added dropwise at the same time at room temperature after the completion of reaction Oxygen alkane, the temperature in control system when reaction 2 is small at 70 DEG C after being added dropwise, are then steamed in system between 30-40 DEG C Alcohol, then adds 300g toluene and the pH=10 of suitable KOH regulation systems, when 90 DEG C of reactions 1 are small, then heats to 120 DEG C Remaining alcohol and water in system is steamed, finally cools down again, the pH=6-7 of system is neutralized, be washed to acetic acid;Rotated at 120 DEG C Toluene is removed up to silicones;Its yield is 93%.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention scope, every in the present invention Spirit and principle within, any modification, equivalent substitution, improvement and etc. done, should be included in protection scope of the present invention Within.

Claims (2)

1. a kind of preparation method for high-power encapsulation MDT silicones, it is characterised in that acid, two are added in four-hole bottle Methyl dioxane oxysilane, methyl phenyl di-alkoxy silane, phenyl trialkoxysilane, alcohol and water, stir, are heated to 25 DEG C When reaction 1-2 is small, remaining total water and vinyl double seal head, two silica of hexamethyl is added dropwise at the same time at room temperature after the completion of reaction Alkane, the temperature in control system reacted between 30-40 DEG C, after being added dropwise at 70 DEG C 1-2 it is small when, then steam in system Alcohol, then adds the pH=9-10 of the toluene and alkali regulation system more than theoretical amount of resin, when 90 DEG C of reactions 1 are small, then heats up Remaining alcohol and water in system is steamed, is finally cooled down again, is neutralized with acid, is washed to the pH=6-7 of system;120 DEG C of backspins are evaporated off Toluene is removed up to silicones;
The acid, vinyl double seal head, hexamethyldisiloxane, dimethyldimethoxysil,ne, alcohol, water, aminomethyl phenyl dioxane Oxysilane, the mass ratio of phenyl trialkoxysilane are (1.18-1.99):(5.58-38.50):(30.46-113.24): (60.11-240.44):(11.80-19.95):(50.20-120.80):(182.29-210.35):(198.26-240.37).
2. preparation method according to claim 1, it is characterised in that the dimethyldialkylammonium oxysilane is dimethyl two Methoxy silane or dimethyl diethoxysilane;The phenyl methyl dialkoxy silicane is aminomethyl phenyl dimethoxysilane Or aminomethyl phenyl diethoxy silane;The acid be hydrochloric acid, sulfuric acid, phosphoric acid, Emathlite, trifluoromethane sulfonic acid and acid sun from One kind in sub-exchange resin;The alcohol is one kind in ethanol, methanol;The alkali is Na2CO3、NaHCO3、K2CO3、KHCO3、 One kind in NaOH, KOH.
CN201711179671.9A 2017-11-23 2017-11-23 A kind of preparation method for high-power encapsulation MDT silicones Withdrawn CN108003347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711179671.9A CN108003347A (en) 2017-11-23 2017-11-23 A kind of preparation method for high-power encapsulation MDT silicones

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711179671.9A CN108003347A (en) 2017-11-23 2017-11-23 A kind of preparation method for high-power encapsulation MDT silicones

Publications (1)

Publication Number Publication Date
CN108003347A true CN108003347A (en) 2018-05-08

Family

ID=62053551

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711179671.9A Withdrawn CN108003347A (en) 2017-11-23 2017-11-23 A kind of preparation method for high-power encapsulation MDT silicones

Country Status (1)

Country Link
CN (1) CN108003347A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109438710A (en) * 2018-11-06 2019-03-08 烟台德邦科技有限公司 Preparation method of MDT resin for Molding silica gel
CN116178724A (en) * 2022-11-07 2023-05-30 湖北兴瑞硅材料有限公司 Synthesis method of methyl phenyl silicone oil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151731A (en) * 1980-04-25 1981-11-24 Japan Synthetic Rubber Co Ltd Preparation of silicone resin
CN103232601A (en) * 2013-04-28 2013-08-07 成都硅宝科技股份有限公司 Phenyl MDT silicon resin and preparation method thereof
CN103450481A (en) * 2013-09-17 2013-12-18 深圳市鑫东邦科技有限公司 Preparation method of methyl phenyl vinyl silicone

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151731A (en) * 1980-04-25 1981-11-24 Japan Synthetic Rubber Co Ltd Preparation of silicone resin
CN103232601A (en) * 2013-04-28 2013-08-07 成都硅宝科技股份有限公司 Phenyl MDT silicon resin and preparation method thereof
CN103450481A (en) * 2013-09-17 2013-12-18 深圳市鑫东邦科技有限公司 Preparation method of methyl phenyl vinyl silicone

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109438710A (en) * 2018-11-06 2019-03-08 烟台德邦科技有限公司 Preparation method of MDT resin for Molding silica gel
CN116178724A (en) * 2022-11-07 2023-05-30 湖北兴瑞硅材料有限公司 Synthesis method of methyl phenyl silicone oil
CN116178724B (en) * 2022-11-07 2024-05-17 湖北兴瑞硅材料有限公司 Synthesis method of methyl phenyl silicone oil

Similar Documents

Publication Publication Date Title
CN103342816B (en) A kind of organic siliconresin and curable organopolysiloxane composition and application
TWI432521B (en) White heat-curable silicone resin composition, optoelectronic part case, and molding method
CN102898651B (en) Preparation method of vinylphenyl silicon resin for LED (light-emitting diode) packaging
WO2011032356A1 (en) Light-conversion flexible polymer material and use thereof
CN105400446B (en) A kind of high refractive index LED liquid casting glue tackifier and preparation method thereof
CN104004491A (en) LED ultraviolet curable organosilicon encapsulation adhesive and preparation method thereof
CN103848990B (en) High index of refraction Vinylphenyl silicon resin is used in a kind of LED encapsulation
CN102888001B (en) Vinylphenyl silicon resin
CN106700077A (en) Preparation method of high-temperature-resistant anti-cracking MDQ silicon resin
CN104073215A (en) Preparation method for nano silicon dioxide modified organic silicon sealant for packaging of light emitting diode (LED)
CN108003347A (en) A kind of preparation method for high-power encapsulation MDT silicones
CN102639590B (en) Curable resin composition and cured product thereof
CN106381121A (en) Transparent organic pouring sealant
CN105418928A (en) Trifluoropropyl-group-modification methyl phenyl vinyl silicon resin and LED packaging adhesive
CN104031388A (en) Phenyl siloxane rubber nanometer composite material and preparation method thereof
CN109337643A (en) A kind of high refractive index aminomethyl phenyl LED encapsulation silastic material and preparation method thereof
CN106751893A (en) A kind of refractive power LED encapsulation add-on type liquid silicon rubbers high and preparation method thereof
CN109438710A (en) Preparation method of MDT resin for Molding silica gel
CN106751346A (en) The synthetic method of fluorochemical monomer modified organosilicon encapsulating material
CN102686633A (en) Epoxy resin composition
CN106084230A (en) A kind of preparation method of low thermal weight loss low-refraction Narrow Molecular Weight Distribution silicones
CN103145993A (en) Silicon oil for packaging LED (light-emitting diode) and preparation method thereof
CN106221237A (en) A kind of LED encapsulation organic silica gel and preparation method thereof
CN107226999A (en) A kind of preparation method of graphene LED encapsulation material
CN103012799B (en) A kind of LED phenylakenyl silicone resin and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20190225

Address after: 264006 No. 3-24 Kaifeng Road Renewable Resource Processing Demonstration Zone, Yantai Development Zone, Shandong Province

Applicant after: Yantai Darbond Technology Co., Ltd.

Address before: 264006 Kaifeng Road 3-3 Resource Regeneration and Processing Demonstration Zone, Yantai Development Zone, Shandong Province

Applicant before: Yantai Debang Advanced Silicon Materials Co.,Ltd.

WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20180508