CN107995705B - Optical assembly applied to industrial temperature range - Google Patents
Optical assembly applied to industrial temperature range Download PDFInfo
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- CN107995705B CN107995705B CN201711243548.9A CN201711243548A CN107995705B CN 107995705 B CN107995705 B CN 107995705B CN 201711243548 A CN201711243548 A CN 201711243548A CN 107995705 B CN107995705 B CN 107995705B
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- ceramic heating
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- metal structural
- circuit board
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- 230000003287 optical effect Effects 0.000 title claims abstract description 75
- 239000000919 ceramic Substances 0.000 claims abstract description 97
- 238000010438 heat treatment Methods 0.000 claims abstract description 71
- 239000002184 metal Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 239000013307 optical fiber Substances 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000011449 Rosa Nutrition 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Automation & Control Theory (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the field of optical communication and provides an optical assembly applied to an industrial temperature range, which comprises a metal structural part, a ceramic heating assembly and a temperature detection chip, wherein the ceramic heating assembly is used for performing temperature compensation on an internal chip of the optical assembly, and the temperature detection chip is used for sensing the temperature of the optical assembly; an optical fiber adapter is arranged on one side of the metal structural part, a ceramic heating component is bonded on the TO-Can on the other side of the metal structural part, and a flexible circuit board is arranged on the ceramic heating component and connected with the temperature detection chip and a module circuit board carrying the temperature detection chip. The invention adopts the ceramic heating component with high heat conduction efficiency and low cost TO carry out temperature compensation on the chip inside the optical component, eliminates the traditional temperature compensation mode, does not need TO customize a TO-Can with a heating resistor or a TEC (semiconductor refrigerator) TO manufacture the required optical component, only needs TO use the TO-Can which is commonly used in the market, greatly reduces the difficulty of obtaining raw materials, prolongs the service life and reduces the cost.
Description
Technical Field
The invention relates to the field of optical communication, in particular to an optical component applied to an industrial temperature range.
Background
With the wide application of optical fiber communication technology in backbone networks, metropolitan area networks and data centers, optical transceiver modules are becoming more and more popular, and due to the reduction of the volume, the increase of density and the increase of power consumption of the optical transceiver modules, the temperature requirements of the optical transceiver modules in industry are becoming more and more strict.
The operating temperature of an optical transceiver module is determined primarily by the optical components (TOSA, ROSA, or BIDI) within the module, because the properties of the III-V materials change with temperature changes due to the material characteristics of the Avalanche Photodiode (APD) and the Laser Diode (LD) being fabricated.
Avalanche Photodiodes (APDs) are one type of optical device with internal gain. After a bias voltage is applied to a PN junction of a photodiode made of III-V material, incident light is utilized by the PN junction to generate photo-generated carriers. Increasing the bias voltage causes an "avalanche" (a double increase in photocurrent, also known as gain effect) phenomenon, with greater gain at higher bias voltages and higher APD sensitivity. The coefficient between APD bias voltage and temperature is typically 0.15V/. Degree.C (-40 ℃ -25 ℃) 0.1V/. Degree.C (25 ℃ -85 ℃); in order to ensure that the gain is unchanged when the temperature changes, a compensation circuit is added on a module circuit board, and the bias voltage is adjusted according to the temperature change. However, because the low temperature range is large, too much voltage is compensated for to the APD, there is a high probability that the bias voltage exceeds the breakdown voltage of the APD itself, and in this case, the APD is damaged.
The Laser Diode (LD) is also made of III-V materials used as optical gain media, and the distributed grating with the function of wavelength selection is very sensitive to the working environment temperature (the coefficient between the wavelength selection and the temperature of the grating is 0.1 nm/DEG C, and the coefficient between the peak displacement of the gain media and the temperature is 0.6 nm/DEG C), so that when the LD is in an industrial temperature range (especially low temperature), the SMSR (side-mode suppression ratio) of the LD is severely reduced, the single-mode working state is changed, and the communication is seriously affected or even interrupted. In order to increase the operating temperature range of an LD, it is common practice to increase the coupling efficiency of a chip when designing the chip. But in this state, the RIN (relative noise intensity) of the LD is increased, which is not suitable for transmission of high-speed signals. To meet the industrial temperature requirements, manufacturers of LD chips typically perform screening at different temperature points at the chip end.
In order TO realize the requirement of wavelength range of WDM, it is now common practice in industry TO integrate thermal controller, LD chip, temperature sensor, monitored photon detector and ESD protector together in TO-Can TO control the temperature of laser diode. However, this method requires a complicated design and cumbersome process to implement, and thus increases the cost of the optical assembly.
Disclosure of Invention
The invention aims to provide an optical component applied to an industrial temperature range, which solves the technical problems at present, utilizes the existing low-cost ceramic heating plate to replace the traditional LD and APD temperature compensation mode, solves the problem that the existing APD is easy to damage, and solves the problem that the existing LD has higher cost.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: an optical assembly applied to an industrial temperature range comprises a metal structural part, a ceramic heating assembly and a temperature detection chip, wherein the ceramic heating assembly is used for performing temperature compensation on an internal chip of the optical assembly, and the temperature detection chip is used for sensing the temperature of the optical assembly; the optical fiber temperature sensor is characterized in that an optical fiber adapter is arranged on one side of the metal structural part, the ceramic heating component is adhered TO the TO-Can on the other side of the metal structural part, and a flexible circuit board is arranged on the ceramic heating component and connected with the temperature detection chip and a module circuit board carrying the temperature detection chip.
Further, the metal structural part is cylindrical, and the optical fiber adapter and the TO-Can are respectively positioned at two round surfaces of the metal structural part; the ceramic heating assembly is fixed on the emitting end TO-Can of the optical assembly through glue, the ceramic heating assembly comprises a square first ceramic plate, the first ceramic plate is provided with a plurality of first through holes for pins of the optical assembly TO pass through, the first ceramic plate is plated with a first thin film resistor, two electrodes of the first thin film resistor are respectively provided with a first gold-plated circuit, and the pins of the optical assembly are connected with two first gold-plated circuits through the flexible circuit board.
Further, both the first gold plating circuits extend along the edges of the first ceramic board; each first through hole is positioned in a circle formed by surrounding the two first gold plating circuits.
Further, the metal structural part is cylindrical, and the optical fiber adapter and the TO-Can are respectively positioned at two round surfaces of the metal structural part; the ceramic heating component is fixed on a receiving end TO-Can of the optical component through glue, the ceramic heating component comprises a circular second ceramic plate, the second ceramic plate is provided with a plurality of second through holes for pins of the optical component TO pass through, a second thin film resistor is plated on the second ceramic plate, two electrodes of the second thin film resistor are respectively provided with a second gold-plated circuit, and the pins of the optical component are connected with two second gold-plated circuits through the flexible circuit board.
Further, the two second gold-plating circuits are distributed at the edge positions of the second ceramic plate, and each second through hole is located at the same side of the two second gold-plating circuits.
Further, the metal structural member is cuboid, two ceramic heating components are arranged, and the optical fiber adapter and the two ceramic heating components are respectively adhered to three side surfaces of the metal structural member.
Further, the optical component is provided with a transmitting end and a receiving end, wherein one ceramic heating component is adhered TO the TO-Can transmitting end, and the other ceramic heating component is adhered TO the TO-Can receiving end.
Further, the ceramic heating component and the flexible circuit board are fixed through soldering tin
Further, the pins of the optical assembly are fixed with the flexible circuit board through soldering tin.
The beneficial effects of the invention are as follows:
1. the ceramic heating component with high heat conduction efficiency and low cost is adopted to carry out temperature compensation on the chip inside the optical component, the traditional APD and LD temperature compensation modes are omitted, the service life is prolonged, and the cost is reduced.
2. The TO-Can with heating resistor or TEC (semiconductor refrigerator) is not required TO be customized TO manufacture the required optical component, and only the TO-Can which is commonly used in the market is required TO be used, so that the difficulty of obtaining raw materials is greatly reduced, the service life is prolonged, and the cost is reduced.
3. The adoption film resistor is more stable than the existing mode of attaching a resistor or an external heating strip to the FPC, and is low in price and higher in availability.
Drawings
FIG. 1 is a schematic structural diagram of a ceramic heating element applied to a specific emission end of an optical element in an industrial temperature range according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a TOSA structure for an optical module in an industrial temperature range according to one embodiment of the invention;
FIG. 3 is a schematic structural diagram of a ceramic heating element with a receiving end for an optical element applied to an industrial temperature range according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an optical assembly ROSA applied to an industrial temperature range according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an optical module applied to an industrial temperature range in BIDI products according to an embodiment of the present invention;
in the reference numerals: 1-a metal structural member; a 2-ceramic heating assembly; 20-a first ceramic plate; 21-a first through hole; 22-a first thin film resistor; 23-a first gold plating circuit; 24-a second ceramic plate; 25-a second through hole; 26-a second sheet resistance; 27-a second gold plating circuit; a 3-fiber optic adapter; 4-a flexible circuit board; 5-TO-Can.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, an embodiment of the present invention provides an optical module for use in an industrial temperature range, which includes a metal structural member 1, a ceramic heating module 2, and a temperature detection chip for sensing the temperature of the optical module, wherein the ceramic heating module 2 is used for temperature compensation of an internal chip of the optical module, and is more stable than the conventional temperature compensation by APD, and has a longer service life and a much lower cost than the conventional LD. The optical fiber adapter 3 is installed on one side of the metal structure, the ceramic heating component 2 is encapsulated by the TO-Can5 on the other side, a required optical component is manufactured without customizing the TO-Can5 with a heating resistor, only the TO-Can5 which is commonly used in the market is needed, and the availability of raw materials is greatly improved. The ceramic heating component 2 is provided with a flexible circuit board 4, and the flexible circuit board 4 is connected with the temperature detection chip and a module circuit board carrying the temperature detection chip. The temperature detection module is an existing module, and can sense the temperature around the tube assembly, then supply current to the ceramic heating assembly 2 through the FPC (flexible circuit board 4), the ceramic heating assembly 2 starts to work to generate heat, and finally the heat is conducted into the optical assembly to realize the function of temperature compensation of the chip.
The following are specific examples:
in embodiment 1, referring to fig. 1 and 2, the metal structural member 1 is cylindrical, and the optical fiber adapter 3 and the ceramic heating element 2 are respectively located at two circular surfaces of the cylindrical metal structural member 1. The optical component is TOSA, the ceramic heating component 2 is fixed on the emitting end TO-Can of the optical component through glue, the ceramic heating component 2 comprises a first ceramic plate 20 which is square, a plurality of first through holes 21, preferably 4, are penetrated through the first ceramic plate 20, 4 pins of TOSA Can penetrate through the first ceramic plate 20, a first thin film resistor 22 is plated on the first ceramic plate 20, and the resistor covers the surface of the whole square ceramic plate, but penetrates through the first through holes 21 and is matched with the in-out of the pins. The first gold-plating circuits 23 are arranged on the two electrodes of the first thin film resistor 22, and the pins of the optical component are connected with the two first gold-plating circuits 23 through the flexible circuit board 4. The first gold plating circuit 23 is used for leading out two poles of the resistor, and compared with the existing mode of using a chip resistor or an external heating strip on an FPC, the adopted first film resistor 22 is more stable, low in cost and higher in availability. This example is an implementation in which the ceramic heating element 2 is used as a TOSA. In this embodiment, the first ceramic plate 20 may be formed in a circular shape or other shapes.
With further optimization of the above solution, referring to fig. 1, two first gold plating circuits 23 extend along the edges of the first ceramic plate 20, and each first through hole 21 is located in a circle formed around the two first gold plating circuits 23. The first gold plating circuit 23 is plated along the edge of the ceramic plate, so that positions can be reserved for the first through holes 21, and interference with the first through holes can be avoided.
In example 2, fig. 3 and fig. 4, the metal structural member 1 is also cylindrical, and the optical fiber adaptor 3 and the ceramic heating element 2 are respectively located on two circular surfaces of the cylindrical metal structural member 1. The optical component is a ROSA end, the ceramic heating component 2 is fixed on a receiving end TO-Can of the optical component through glue, the ceramic heating component 2 comprises a second ceramic plate 24 which is round, a plurality of second through holes 25, preferably 5, are penetrated through the second ceramic plate 24, 5 pins of the ROSA of the optical component Can penetrate through, a second thin film resistor 26 is plated on the second ceramic plate 24, and the resistor covers the surface of the whole round ceramic plate, but penetrates through the second through holes 25 and is matched with the in-out of the pins. The two electrodes of the second thin film resistor 26 are respectively provided with a second gold-plating circuit, and the pins of the optical assembly are connected with the two gold-plating circuits through the flexible circuit board 4. The second gold plating circuit 27 is used for leading out two poles of the resistor, and compared with the existing mode of using a chip resistor or an external heating strip on an FPC, the adopted second film resistor 26 is more stable, low in cost and higher in availability. This example is an embodiment in which the ceramic heating element 2 is used as the ROSA end. In this embodiment, the second ceramic plate 24 may also be square or other shape.
With further optimization of the above-mentioned scheme, referring to fig. 3, two second gold plating circuits 27 are distributed at the edge positions of the second ceramic plate 24, and each second through hole 25 is located at the same side of the two second gold plating circuits 27. As with TOSA packages described above, the purpose of this design is also to prevent interference.
As an optimization scheme of the embodiment of the present invention, when the metal structural member 1 is in a cuboid shape, two ceramic heating assemblies 2 are provided, and the ceramic heating assemblies 2 in the two embodiments are provided. At this time, the optical fiber adapter 3 and the two ceramic heating elements 2 are respectively located on three sides of the metallic structural member 1.
Further optimizing the above scheme, in embodiment 3, referring TO fig. 5, the optical module has a transmitting end and a receiving end, wherein one ceramic heating module 2 is adhered TO the TO-Can transmitting end, and the other ceramic heating module 2 is adhered TO the TO-Can receiving end, in this embodiment, the two ports are used on the same product, and the optical module is suitable for being applied TO the BIDI product.
Continuing TO optimize the solution described above, example 4, the optical module has two emission ends, and two ceramic heating modules 2 are bonded TO the two emission ends of TO-Can, respectively.
Continuing TO optimize the solution described above, example 5, the optical module has two receiving ends, and two ceramic heating modules 2 are bonded TO the two receiving ends of TO-Can, respectively.
As an optimization scheme of the embodiment of the invention, the ceramic heating component 2 and the flexible circuit board 4 are fixed through soldering tin, and the pins of the optical component and the flexible circuit board 4 are fixed through soldering tin. The soldering tin is adopted for fixation, so that the fixation is firm. In addition, the ceramic heating component 2 and the optical component TO-Can5 are bonded by using heat conducting glue, and no thermal resistance exists in the middle.
The optical component at the ROSA end is an optical receiving component, the optical component at the TOSA end is an optical transmitting component, and TO-Can5 is a packaging mode.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. An optical module for use in an industrial temperature range, characterized by: the temperature-compensating ceramic heating device comprises a metal structural part, a ceramic heating component and a temperature detection chip, wherein the ceramic heating component is used for performing temperature compensation on a chip inside the optical component, and the temperature detection chip is used for sensing the temperature of the optical component; an optical fiber adapter is arranged on one side of the metal structural member, the ceramic heating component is adhered TO the TO-Can on the other side of the metal structural member, the ceramic heating component is provided with a flexible circuit board, the flexible circuit board is connected with the temperature detection chip and a module circuit board carrying the temperature detection chip, the metal structural member is cylindrical, and the optical fiber adapter and the TO-Can are respectively positioned on two round surfaces of the metal structural member; the ceramic heating assembly is fixed on the emitting end TO-Can of the optical assembly through glue, the ceramic heating assembly comprises a square first ceramic plate, the first ceramic plate is provided with a plurality of first through holes for pins of the optical assembly TO pass through, the first ceramic plate is plated with a first thin film resistor, two electrodes of the first thin film resistor are respectively provided with a first gold-plated circuit, the pins of the optical assembly are connected with two first gold-plated circuits through the flexible circuit board, and the first through holes are four.
2. An optical module for use in an industrial temperature range as claimed in claim 1, wherein: both the first gold plating circuits extend along the edges of the first ceramic plate; each first through hole is positioned in a circle formed by surrounding the two first gold plating circuits.
3. An optical module for use in an industrial temperature range, characterized by: the temperature-compensating ceramic heating device comprises a metal structural part, a ceramic heating component and a temperature detection chip, wherein the ceramic heating component is used for performing temperature compensation on a chip inside the optical component, and the temperature detection chip is used for sensing the temperature of the optical component; an optical fiber adapter is arranged on one side of the metal structural member, the ceramic heating component is adhered TO the TO-Can on the other side of the metal structural member, the ceramic heating component is provided with a flexible circuit board, the flexible circuit board is connected with the temperature detection chip and a module circuit board carrying the temperature detection chip, the metal structural member is cylindrical, and the optical fiber adapter and the TO-Can are respectively positioned on two round surfaces of the metal structural member; the ceramic heating component is fixed on a receiving end TO-Can of the optical component through glue, the ceramic heating component comprises a circular second ceramic plate, the second ceramic plate is provided with a plurality of second through holes for pins of the optical component TO pass through, the second ceramic plate is plated with a second thin film resistor, two electrodes of the second thin film resistor are respectively provided with a second gold-plated circuit, the pins of the optical component are connected with two second gold-plated circuits through the flexible circuit board, and the second through holes are five.
4. A light assembly for use in an industrial temperature range as claimed in claim 3, wherein: the two second gold-plating circuits are distributed at the edge positions of the second ceramic plate, and each second through hole is located at the same side of the two second gold-plating circuits.
5. A light assembly for use in an industrial temperature range as claimed in claim 1 or 3, wherein: when the cuboid metal structural member is adopted, two ceramic heating components are arranged, and the optical fiber adapter and the two ceramic heating components are respectively adhered to three side surfaces of the metal structural member.
6. An optical module for use in an industrial temperature range as claimed in claim 5, wherein: the optical component is provided with two TO-Can transmitting ends or two TO-Can receiving ends, and the two ceramic heating components are respectively adhered TO the two TO-Can transmitting ends or the two ceramic heating components are respectively adhered TO the two TO-Can receiving ends.
7. A light assembly for use in an industrial temperature range as claimed in claim 1 or 3, wherein: the ceramic heating component and the flexible circuit board are fixed through soldering tin.
8. A light assembly for use in an industrial temperature range as claimed in claim 1 or 3, wherein: the pins of the optical assembly are fixed with the flexible circuit board through soldering tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243548.9A CN107995705B (en) | 2017-11-30 | 2017-11-30 | Optical assembly applied to industrial temperature range |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243548.9A CN107995705B (en) | 2017-11-30 | 2017-11-30 | Optical assembly applied to industrial temperature range |
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| CN107995705A CN107995705A (en) | 2018-05-04 |
| CN107995705B true CN107995705B (en) | 2024-03-22 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109189116B (en) * | 2018-08-14 | 2022-01-14 | 上海华虹宏力半导体制造有限公司 | Temperature maintaining device and method for integrated circuit chip |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5694503A (en) * | 1996-09-09 | 1997-12-02 | Lucent Technologies Inc. | Article comprising a temperature compensated optical fiber refractive index grating |
| JP2008294262A (en) * | 2007-05-25 | 2008-12-04 | Nippon Telegr & Teleph Corp <Ntt> | Optical element module and its manufacturing method |
| CN202772418U (en) * | 2012-09-13 | 2013-03-06 | 索尔思光电（成都）有限公司 | Circuit for starting laser in low temperature condition |
| CN103036144A (en) * | 2012-12-28 | 2013-04-10 | 索尔思光电（成都）有限公司 | Transmitter Optical Subassembly (TOSA) outer heating device and control circuit |
| CN103278891A (en) * | 2013-05-17 | 2013-09-04 | 武汉电信器件有限公司 | High-speed optical receiver module of integrated limiting amplifier and preparation method for high-speed optical receiver module |
| CN107132625A (en) * | 2017-04-21 | 2017-09-05 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module and its temperature compensation |
| CN207706472U (en) * | 2017-11-30 | 2018-08-07 | 武汉联特科技有限公司 | A kind of optical assembly applied to industrial temperature range |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100637930B1 (en) * | 2004-11-08 | 2006-10-24 | 한국전자통신연구원 | Wavelength tunable light source module for wavelength division multiplexed passive optical network system |
-
2017
- 2017-11-30 CN CN201711243548.9A patent/CN107995705B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5694503A (en) * | 1996-09-09 | 1997-12-02 | Lucent Technologies Inc. | Article comprising a temperature compensated optical fiber refractive index grating |
| JP2008294262A (en) * | 2007-05-25 | 2008-12-04 | Nippon Telegr & Teleph Corp <Ntt> | Optical element module and its manufacturing method |
| CN202772418U (en) * | 2012-09-13 | 2013-03-06 | 索尔思光电（成都）有限公司 | Circuit for starting laser in low temperature condition |
| CN103036144A (en) * | 2012-12-28 | 2013-04-10 | 索尔思光电（成都）有限公司 | Transmitter Optical Subassembly (TOSA) outer heating device and control circuit |
| CN103278891A (en) * | 2013-05-17 | 2013-09-04 | 武汉电信器件有限公司 | High-speed optical receiver module of integrated limiting amplifier and preparation method for high-speed optical receiver module |
| CN107132625A (en) * | 2017-04-21 | 2017-09-05 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module and its temperature compensation |
| CN207706472U (en) * | 2017-11-30 | 2018-08-07 | 武汉联特科技有限公司 | A kind of optical assembly applied to industrial temperature range |
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| CN107995705A (en) | 2018-05-04 |
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