CN107964375A - The manufacture method of connector - Google Patents
The manufacture method of connector Download PDFInfo
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- CN107964375A CN107964375A CN201710944932.5A CN201710944932A CN107964375A CN 107964375 A CN107964375 A CN 107964375A CN 201710944932 A CN201710944932 A CN 201710944932A CN 107964375 A CN107964375 A CN 107964375A
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- manufacture method
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- absworption peak
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Power Conversion In General (AREA)
Abstract
The present invention provide the resin of light-cured type anisotropic conductive agent is fully melted, can obtain excellent conduction connector manufacture method.Solve the problems, such as that this method is, which has：By the light-cured type anisotropically conducting adhesive (30) containing polymerizable compound, Photoepolymerizationinitiater initiater and light absorber, the second electronic unit (20) is configured into the arrangement step on the first electronic unit (10)；And while the second electronic unit (20) is pressed to the first electronic unit (10) using utensil (40) is crimped, while the irradiation process using light illuminator irradiation light.In irradiation process, the wave-length coverage of light is controlled, after light absorber is activated, activates Photoepolymerizationinitiater initiater.
Description
Technical field
The present invention relates to the connection for being connected electronic unit and substrate etc. using light-cured type anisotropically conducting adhesive
The manufacture method of body.
Background technology
In the past, as the method for being connected electronic unit and substrate etc., anisotropically conducting adhesive is used.It is such each
Anisotropy electrically conducting adhesive is generally by the thermosetting resin group comprising thermosetting epoxy resin, polymerization initiator and electroconductive particle
Compound is formed, and when curing anisotropically conducting adhesive, is heated at high temperature.Therefore, especially with big picture electricity
In the case of regarding etc. as the massive article of representative, warpage, deformation can occur for the substrate of connecting object, its result has generation display not
The problems such as equal.
Therefore, in order to be cured with low temperature, short time, it is proposed that using ultraviolet (UV：Ultraviolet) carry out
Cured light-cured type anisotropic conductive agent is (for example, referring to patent document 1,2.).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 11-060899 publications
Patent document 2：Japanese Unexamined Patent Publication 11-279500 publications
The content of the invention
Problems to be solved by the invention
However, for light-cured type anisotropic conductive agent, the melting of resin is by from height during due to curing
The adapter connector of heat conducts heat to carry out, therefore can for example cause IC (integrated circuit (Integrated sometimes
Circuit thermal expansion, thermal deformation)), occur big warpage.In addition, adapter connector is set to low temperature in order to suppress warpage
In the case of, resin will not be melted fully sometimes.
The present invention is the invention solved the problems, such as in above-mentioned conventional art, its offer can lead light-cured type anisotropy
The resin of electric agent fully melts and obtains the manufacture method of the connector of excellent conduction.
The method used for solving the problem
The inventors of the present invention have made intensive studies, it turns out that by using contain polymerizable compound, photopolymerization trigger
Agent and the light-cured type anisotropically conducting adhesive of light absorber, and after light absorber is activated, make Photoepolymerizationinitiater initiater
Activation, so as to obtain excellent conduction.
That is, the manufacture method of connector of the invention is characterized in that having：By containing photopolymerizable compound, poly-
The light-cured type anisotropically conducting adhesive of initiator and light absorber is closed, the second electronic unit is configured in first ministry of electronics industry
Arrangement step on part；And while using crimp utensil by above-mentioned second electronic unit to above-mentioned first electronic unit carry out by
Pressure, while using the irradiation process of light illuminator irradiation light, in above-mentioned irradiation process, controls the wave-length coverage of above-mentioned light, makes
After stating light absorber activation, activate above-mentioned Photoepolymerizationinitiater initiater.
Invention effect
Wave-length coverage of the invention by controlling light, after activating light absorber, activates Photoepolymerizationinitiater initiater, so as to
Enough obtain excellent conduction.It is thought that because resin melts by the heat of light absorber, crimps utensil is firmly pressed
After entering, resin solidification is just proceeded by.
Brief description of the drawings
[Fig. 1] Fig. 1 is the sectional view of the manufacture method for the connection structural bodies for schematically showing present embodiment, in Fig. 1
(A) arrangement step (S1) is represented, (B) in Fig. 1 represents irradiation process (S2).
[Fig. 2] Fig. 2 is to represent embodiment and the stereogram of the assay method of the conducting resistance of connector that comparative example is related to.
Symbol description
10：First electronic unit；11：The first terminal arranges；20：Second electronic unit；21：Second terminal arranges；30：Respectively to different
Property electrically conducting adhesive；31：Electroconductive particle；40：Crimp utensil；51：Projection；52：Distribution.
Embodiment
Hereinafter, for embodiments of the present invention, while one side describes in detail according to following orders referring to the drawings.
1. the manufacture method of connector
2. embodiment
<1. the manufacture method of connector>
The manufacture method of connector of the present embodiment has：By triggering containing polymerizable compound, photopolymerization
Agent and the light-cured type anisotropically conducting adhesive of light absorber, by the configuration of the second electronic unit on the first electronic unit
Arrangement step；And while the second electronic unit is pressed to the first electronic unit using utensil is crimped, while utilizing light
The irradiation process of irradiator irradiation light, in irradiation process, controls the wave-length coverage of light, after light absorber is activated, gathers light
Close initiator activation.Thus, resin is melted by the heat of light absorber, crimped after utensil is firmly pressed into, just start into
Row resin solidification, therefore excellent conduction can be obtained.Here, activation is meant, molecule absorption light, other energy and by
Higher-energy state is excited into, becomes the state for easily causing chemical reaction.
In addition, in the case that light-cured type anisotropically conducting adhesive contains photosensitizer, irradiation process (S2) is preferred to be controlled
The wave-length coverage of light processed, is activated with the order of light absorber, photosensitizer, Photoepolymerizationinitiater initiater.Thus, photosensitizer can be to
Photoepolymerizationinitiater initiater transmits energy, therefore can solve the problems, such as that the energy of Photoepolymerizationinitiater initiater is insufficient, prevents from curing deficiency.
In addition, the absworption peak wavelength of Photoepolymerizationinitiater initiater is preferably in shorter wavelength than the absworption peak wavelength of light absorber
Side.Thus, Photoepolymerizationinitiater initiater can be activated by the light of the high short wavelength of energy, therefore having excellent fast curing, energy
Enough obtain high production rate.
In addition, the absworption peak wavelength of Photoepolymerizationinitiater initiater is preferably in shorter wavelength than the absworption peak wavelength of photosensitizer
Side.Thus, in the case of being activated using the light for the short wavelength being difficult to inside arrival resin to Photoepolymerizationinitiater initiater,
Also photosensitizer can be activated using the light for the long wavelength for being easier to infiltrate into inside resin and is passed to Photoepolymerizationinitiater initiater
Energy is passed, therefore can solve the problems, such as that the energy of Photoepolymerizationinitiater initiater is insufficient, prevents the curing deficiency inside resin.
, can be according to the curing system of photocuring anisotropically conducting adhesive from purple as the light irradiated by light illuminator
Outside line (UV：Ultraviolet), luminous ray (visible light), infrared ray (IR：Infrared) equiwavelength's band domain into
Row selection.Wherein, the light irradiated by light illuminator preferably comprises the high ultraviolet of energy.
Ultraviolet has the wavelength of 10nm~400nm, and the short ultraviolet energy of wavelength is high, but has and be difficult to reach in resin
The property in portion, on the other hand, the ultraviolet energy of wavelength length are slightly smaller, but with the property for being easier to infiltrate into inside resin.This
Outside, if wavelength becomes below 200nm, easily it is consumed to decompose oxygen or is easily absorbed by oxygen.Therefore, by illumination
The light of emitter irradiation preferably comprises the near ultraviolet ray that wavelength is more than 200nm.The light source of the light of near ultraviolet ray is included as irradiation,
For example, the high-pressure mercury-vapor lamp that height output is carried out with wavelength 248nm, 313nm, 334nm, 365nm, 405nm, 436nm can be enumerated
Deng.
Hereinafter, for the light of the anisotropically conducting adhesive using ultraviolet hardening and irradiation bag light with violet rays
The arrangement step (S1) and irradiation process (S2) in source illustrate.Fig. 1 is the system for the connector for schematically showing present embodiment
Make the sectional view of method, (A) in Fig. 1 represents arrangement step (S1), and (B) in Fig. 1 represents irradiation process (S2).
[arrangement step (S1)]
As shown in (A) in Fig. 1, arrangement step (S1) is by containing photopolymerizable compound, Photoepolymerizationinitiater initiater and light
The light-cured type anisotropically conducting adhesive 30 of absorbent, the second electronic unit 20 is configured on the first electronic unit 10.
First electronic unit 10 possesses the first terminal row 11, and the second electronic unit 20 possesses opposite with the first terminal row 11
Second terminal row 21.First electronic unit 10 and the second electronic unit 20 are not particularly limited, and it is suitable to be carried out according to purpose
Selection.As the first electronic unit 10, for example, LCD (liquid crystal display (Liquid Crystal Display)) can be enumerated
Transparent substrate, the printing distributing board of panel, organic EL (OLED) etc. flat-panel monitor (FPD) purposes, touch panel purposes etc.
(PWB) etc..The material of printing distributing board is not particularly limited, it is, for example, possible to use the expoxy glass such as FR-4 base materials, can also make
With the plastics such as thermoplastic resin, ceramics etc..In addition, as long as transparent substrate transparency height is not particularly limited, glass can be enumerated
Glass substrate, plastic base etc..In addition, as the second electronic unit 20, for example, IC (integrated circuit (Integrated can be enumerated
Circuit)), flexible base board (FPC：Flexible Printed Circuits), carrier package (TCP) substrate, IC installed
In COF (membrane of flip chip (Chip On Film)) on FPC etc..
Anisotropically conducting adhesive 30 can be membranaceous anisotropic conductive film (ACF：Anisotropic
Conductive Film) or paste anisotropic conductive paste (ACP：Anisotropic conductive paste) in
Any one.Consider from handling easiness, be preferably anisotropic conductive film, be preferably that anisotropy is led from the aspect of cost
Electricity paste.In addition, as long as anisotropically conducting adhesive 30 is photo-polymerization type, can be light cationic polymerization type, time from
Any one of sub- aggretion type or optical free radical aggretion type, in addition, being hindered as long as no special, then can be used together.Gather as light
Mould assembly and use-case, can enumerate light cationic polymerization type and optical free radical aggretion type and with etc..
[anisotropically conducting adhesive of light cationic polymerization type]
Hereinafter, the anisotropically conducting adhesive for enumerating light cationic polymerization type illustrates.Light cationic polymerization type
Anisotropically conducting adhesive contains film and forms resin, polymerizable compound, the light cationic polymerization as Photoepolymerizationinitiater initiater
Initiator, light cation adsorbent and conducting particles 31 as light absorber.
Film forms resin for example equivalent to the high molecular weight resin that average molecular weight is more than 10000, from film formative
Viewpoint considers, is preferably the average molecular weight of 10000~80000 degree.As film formed resin, can enumerate phenoxy resin,
Polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, polyimide resin, butyral resin etc. are various
The resin of various kinds, they can be used alone, and can also be used in combination of two or more.Wherein, from film formed state, connection can
Consider by viewpoints such as property, preferably suitably use phenoxy resin.As commercially available concrete example, Nippon Steel can be enumerated
Firmly trade name " YP-70 " of aurification (strain) etc..Relative to 50 mass parts of polymerizable compound, the content that film forms resin is preferred
For 5~50 mass parts, more preferably 10~30 mass parts.
As polymerizable compound, as long as the compound that can carry out cationic polymerization is just not particularly limited, but from admittedly
The viewpoint such as the property changed, the physical characteristic of solidified resin, optical characteristics considers, preferably using epoxide, oxetanes chemical combination
Thing, vinyl ether compound etc., particularly preferably using epoxide.
As epoxide, preferably form three dimensional network structure and good heat resistance, cementability can be assigned
Epoxide, preferably and with solid epoxidic compound and liquid epoxy compound.Here, solid epoxidic compound it is meant that
It is the epoxide of solid during room temperature.In addition, liquid epoxy compound is it is meant that be the epoxide of liquid during room temperature.
In addition, room temperature is it is meant that 5~35 DEG C of temperature range specified in JIS Z 8703.
As solid epoxidic compound, as long as mixing with liquid epoxy compound and being solid-like during room temperature just without special
Limit, bisphenol A type epoxy compound, bisphenol F type epoxy compound, multifunctional type ring oxygen compound, two rings penta 2 can be enumerated
Ene-type epoxide, phenol novolak-type epoxy compound, biphenyl type epoxy compound, naphthalene type ring oxygen compound etc., can
With the one kind being used alone in them or it is used in combination of two or more.Wherein, preferably using bisphenol A type epoxy compound.Make
For commercially available concrete example, Nippon Steel can be enumerated and live trade name " YD-014 " of aurification (strain) etc..
As liquid epoxy compound, as long as being just not particularly limited for liquid during room temperature, bisphenol type epoxy can be enumerated
Compound, bisphenol F type epoxy compound, phenol novolak-type epoxy compound, naphthalene type ring oxygen compound etc., can individually make
With one kind in them or it is used in combination of two or more.The consideration of the viewpoints such as adhesivity, flexibility especially from film, preferably using
Bisphenol A type epoxy compound.As commercially available concrete example, the trade name of Mitsubishi Chemical's (strain) can be enumerated
" EP828 " etc..
As light cationic polymerization initiator, for example, iodine can be enumeratedSalt, sulfonium salt, aromatic diazoSalt,
Salt, seleniumSalt etc.The complex compounds such as salt, metal-arene complex, silanol/aluminium complex, benzoin toluene fulfonate, adjacent nitre
Base benzyl toluene sulfonate etc..In addition, coordination anion during as forming salt, can enumerate propylene carbonate, hexafluoro-antimonic acid
Salt, hexafluorophosphate, tetrafluoroborate, four (pentafluorophenyl group) borates etc..
Light cationic polymerization initiator can be used alone one kind in them or be used in combination of two or more.Wherein,
Aromatic series sulfonium salt due to even in more than 300nm wavelength region also have Ultraviolet Light and curability it is excellent,
Can suitably it use.As commercially available concrete example, trade name " SP-170 " of ADEKA (strain) etc. can be enumerated.
Relative to 50 mass parts of polymerizable compound, the content of light cationic polymerization initiator is preferably 0.1~20 mass parts, more preferably
For 1~10 mass parts.
As light cation adsorbent, ultra-violet absorber, the optical free radical that ultraviolet is converted into thermal energy can be enumerated
Polymerization initiator etc., can be according to the spatial distribution, viscous of the absworption peak wavelength of light cationic polymerization initiator, ultraviolet radiation device
Mixture resin and the intermiscibility of other compositions, ultraviolet radiation absorption energy etc. are suitably selected.
As ultra-violet absorber, for example, enumerate BTA system, triazine system, benzophenone series etc. can be enumerated, as market
Upper obtainable concrete example, can enumerate trade name " LA-31 " of ADEKA (strain) etc..Trigger in addition, polymerizeing as optical free radical
Agent, can enumerate benzophenone series, thioxanthones system, acetophenone system, acylphosphanes system etc..Relative to 50 mass of polymerizable compound
Part, the content of light cation adsorbent is preferably 0.1~20 mass parts, more preferably 1~10 mass parts.
As conducting particles 31, the known electroconductive particle used in anisotropic conductive film can be used.For example,
The various metals such as nickel, iron, copper, aluminium, tin, lead, chromium, cobalt, silver, gold, the particle of metal alloy can be enumerated, metal oxide,
The surface of the particles such as carbon, graphite, glass, ceramics, plastics is coated with the particle of metal, is further coated on the surface of these particles
There is the particle of insulation film.In the case that the surface of resin particle is coated with metal, as resin particle, it is, for example, possible to use
Epoxy resin, phenolic resin, acrylic resin, acrylonitrile-styrene (AS) resin, benzoguanamine resin, divinyl
The particle of base benzene series resin, phenylethylene resin series etc..It can be obtained as the in the market that nickel and golden plating are implemented to resin particle
Concrete example, trade name " AUL704 " of ponding chemical (strain) etc. can be enumerated.
It is usually 1~30 μm as the average grain diameter of conducting particles 31, is preferably 2~20 μm, more preferably 2.5~15 μ
m.In addition, relative to 50 mass parts of polymerizable compound, the content of conducting particles 31 is preferably 10~50 mass parts, more preferably
20~40 mass parts.
In addition, conducting particles 31 can be dispersed in insulative resin, can also be each independent in membrane plane view,
It additionally can arbitrarily configure and exist.When configuring conducting particles, the size for the electrode that can be connected according to anisotropy, cloth
Office sets distance etc. between number density, conducting particles.Therefore, there is effect in enhancing seizure, suppression short circuit etc., also may be used
To expect the cost minimizing effects such as yield rate raising.
In addition, anisotropically conducting adhesive preferably comprises the light cation that energy is transmitted to light cationic polymerization initiator
Sensitizer.Energy thereby, it is possible to solve the problems, such as light cationic polymerization initiator is insufficient, prevents from curing deficiency.
As light cation sensitizer, benzoin system, benzophenone series, thioxanthones system, anthraquinone system, acridone can be enumerated
System etc., as commercially available concrete example, can enumerate trade name " UVS-1331 " of Kawasaki chemical conversion industry (strain) etc..This
A little light cation sensitizers can be used alone, and can also be used in combination of two or more.Relative to 50 matter of polymerizable compound
Part is measured, the content of light cation sensitizer is preferably 0.1~20 mass parts, more preferably 1~10 mass parts.
In addition, in anisotropic conductive film, acrylic rubber, various can be suitably coordinated optionally and according to purpose
The dilution such as acrylic monomer monomer, filler, softening agent, colouring agent, fire retardant, thixotropic agent, silane coupling agent etc. as
Other compositions.
In the anisotropically conducting adhesive of such light cationic polymerization type, the absorption of light cationic polymerization initiator
Absworption peak wavelength of the spike length preferably than light cation adsorbent is in shorter wavelength side.Thus, light cationic polymerization triggers
Agent can be activated by the light of the high short wavelength of energy, therefore having excellent fast curing, can obtain high production rate.
In addition, at absworption peak wavelength of the absworption peak wavelength of light cationic polymerization initiator preferably than light cation sensitizer
In shorter wavelength side.Thus, light cationic polymerization is triggered even in using the light for being difficult to reach the short wavelength inside resin
In the case that agent is activated, the light for being easier to infiltrate into the long wavelength inside resin can be also utilized to light cation sensitizer
Activated and transmit energy to light cationic polymerization initiator, therefore the energy of light cationic polymerization initiator can be solved not
The problem of sufficient, prevent the curing deficiency inside resin.
More specifically, the absworption peak wavelength of light cationic polymerization initiator is preferably 290nm~330nm, light cation
The absworption peak wavelength of absorbent is preferably 340nm~380nm.In addition, the absworption peak wavelength of light cation sensitizer is preferably
390nm~450nm.Thus, filter is ended by using the light source and bandpass filter of light of the irradiation comprising near ultraviolet ray, short wavelength
The wave filters such as ripple device, long wavelength cutoff wave filter, control the wave-length coverage of irradiation light, so as to trigger light cationic polymerization
Agent, light cation adsorbent and light cation sensitizer optionally activate.
[irradiation process (S2)]
As shown in (B) in Fig. 1, in irradiation process (S2), while using crimp utensil 40 by the second electronic unit 20 to
First electronic unit 10 is pressed, while utilizing light illuminator irradiation light.In crimping process (S2), using crimping utensil 40,
Pressed with the temperature of preferably less than 80 DEG C of temperature, more preferably less than 50 DEG C of temperature, further preferred room temperature.By with
Such low temperature is pressurizeed, and can suppress influence of the heat to the first electronic unit 10 and the second electronic unit 20.
In addition, in irradiation process (S2), the wave-length coverage of light is controlled, after light cation adsorbent is activated, makes light positive
Cation polymerization initiator activates.Thus, resin melts by the heat of light cation adsorbent, crimps utensil 40 and firmly pressed
After entering, resin solidification is just proceeded by, therefore excellent conduction can be obtained.
In addition, in the case that anisotropically conducting adhesive contains light cation sensitizer, irradiation process (S2) is preferred to be controlled
The wave-length coverage of light processed, is lived with the order of light cation adsorbent, light cation sensitizer, light cationic polymerization initiator
Change.Thus, light cation sensitizer can transmit energy to light cationic polymerization initiator, therefore can solve light cation and gather
The problem of energy of conjunction initiator is insufficient, prevents from curing deficiency.
On light illuminator, according to the wave-length coverage of irradiation time change light, so that the activation of light cation adsorbent, hair
Heat, melts adhesive, then, with conducting particles 31 by 11 and second electronic unit of the first terminal row of the first electronic unit 10
The state that 20 Second terminal row 21 are seized on both sides by the arms makes light cationic polymerization initiator activation, makes adhesive curing, will be turned between terminal
Connection.
As the light source of light illuminator, can use in light cationic polymerization initiator, light cation adsorbent and light sun
There is the mercury vapor lamp of the spatial distribution with peak, trigger across comprising light cationic polymerization in ion sensitized dose of absworption peak wavelength domain
The wavelength domain of the absworption peak wavelength of agent, light cation adsorbent and light cation sensitizer and irradiate the metal halide of ultraviolet
Lamp etc..In addition, the light source as light illuminator, can use in light cationic polymerization initiator, light cation adsorbent and light
Multiple LED light of maximum luminous wavelength are individually present in the absworption peak wavelength domain of cation sensitizer.Wherein, as light illuminator
Light source, preferably irradiation include the light for the near ultraviolet ray that wavelength is more than 200nm.Light as light of the irradiation comprising near ultraviolet ray
Source, for example, the high-pressure mercury that height output is carried out with wavelength 248nm, 313nm, 334nm, 365nm, 405nm, 436nm can be enumerated
Lamp etc..
Furthermore it is preferred that filtered by using bandpass filter, short wavelength's cut-off filter, long wavelength cutoff wave filter etc.
Device, changes the wave-length coverage of light.Thereby, it is possible to the light of desired wavelength band domain is optionally irradiated according to irradiation time.Example
Such as, the absworption peak wavelength of light cationic polymerization initiator is in shorter wavelength side than the absworption peak wavelength of light cation adsorbent
In the case of, the short wavelength's cut-off filter ended to the absworption peak wavelength of light cationic polymerization initiator is opened, so that
Activate light cationic polymerization initiator and activate light cation adsorbent, close short wavelength's cut-off filter, so as to
Enough activate light cationic polymerization initiator and light cation adsorbent.
In addition, the condition such as the irradiation time of light illuminator, illumination, total exposure can be from adhesive composition, connector presser
The pressure of tool 40, time etc. set out, it is contemplated that the progress of the curing reaction of adhesive and using crimping the company after utensil 40 is pressed into
The raising of reliability, adhesive strength is connect, is set appropriately.
In addition, the direction of illumination on light, as long as can be irradiated to anisotropically conducting adhesive just without special
Limit.For example, can be from the operation console lower section irradiation light for being placed with the first electronic unit 10.In addition, such as larger panel that
In the case that sample bond area is big, can move luminous point or convolution (yaw) while to anisotropically conducting adhesive into
Row irradiation.Furthermore, it is possible to there are multiple light illuminators.In addition, electronic unit is not through ultraviolet and can not be from upside or downside
In the case of irradiating ultraviolet, anisotropically conducting adhesive (junction surface) can be irradiated from tilted direction or transverse direction.
In addition, fender can be used between 40 and second electronic unit 20 of utensil is crimped.As fender, can make
With polytetrafluoroethylene (PTFE) (PTFE：Polytetrafluoroethylene), polyimides, glass cloth, silicon rubber etc..
<3. embodiment>
[embodiment]
Hereinafter, illustrated for the embodiment of the present invention.In the present embodiment, making has coordinated polymerizable compound, light
The anisotropic conductive film of cationic polymerization initiators and light cation adsorbent.Then, irradiated and wrapped with various conditions
Light with violet rays and make connector, measure the conducting resistance after the conducting resistance and reliability test at initial stage.Said
Bright, the present invention is not limited to these embodiments.
[making of connector]
Evaluation IC is configured on the glass substrate across anisotropic conductive film, using crimping utensil (width 10.0mm, length
Degree 40.0mm) pressurize, and cure anisotropic conductive film by light irradiation, make connector sample.
Anisotropic conductive film uses 20 μm of thickness, width 4.0mm, the anisotropic conductive film of length 40.0mm.Evaluation
It is thickness 0.5mm with IC chip, width 1.8mm, length 34mm, is used using formed with the conducting measure measure of distribution (projection)
TEG (testing element group (Test Element Group)).Glass substrate has conducting measure with matching somebody with somebody using the formation of thickness 0.5mm
The measure TEG of line.
Using crimping the pressurization of utensil across thickness 0.05mm by polytetrafluoroethylene (PTFE) (PTFE：
Polytetrafluoroethylene) fender formed carries out.In addition, crimping condition is set to RT-70MPa-5 seconds.
The UV that light irradiation is radiated at the light source of the ultraviolet with summit at wavelength 313nm, 365nm, 405nm using possessing
Irradiation unit (REX-250, morning sun light splitting Co. Ltd. system), and use bandpass filter, short wavelength's cut-off filter or length
Wavelength cut-off wave filter and irradiate the ultraviolet of desired wavelength band domain.In addition, ultraviolet irradiation is sized to width about
4.0mm × length about 44.0mm.In addition, ultraviolet irradiation time is set to 5 seconds on the whole.
[measure of conducting resistance]
On evaluation IC chip and the connection status of glass substrate, using digital multimeter measure connection initial stage and reliably
Property experiment after conducting resistance (Ω).The measure of conduction resistance value is as shown in Fig. 2, digital multimeter is connected to and evaluation IC
The distribution 52 for the glass substrate that the projection 51 of chip connects, conducting resistance is measured with the voltage of 50V, according to so-called 4 terminal method
Value.In addition, the condition of reliability test be set to 85 DEG C of temperature, humidity 85%RH, time 500 it is small when.
<Embodiment 1~3, comparative example 1~3>
Coordinate the material shown in table 1, make the anisotropic conductive film of 20 μm of thickness.
[table 1]
Evaluation IC is configured on the glass substrate across anisotropic conductive film, is pressurizeed using utensil is crimped, and
The ultraviolet at wavelength 310nm with summit is radiated at according to the irradiation opportunity shown in table 2 and carries at wavelength 365nm summit
Ultraviolet, cure anisotropic conductive film, make the connector sample of embodiment 1~3 and comparative example 1~3.
[table 2]
<Embodiment 4>
Coordinate the material shown in table 3, make the anisotropic conductive film of 20 μm of thickness.
[table 3]
Evaluation IC is configured on the glass substrate across anisotropic conductive film, is pressurizeed using utensil is crimped, and
The ultraviolet with summit at wavelength 310nm is radiated at according to the irradiation opportunity shown in table 4, summit is carried at wavelength 365nm
Ultraviolet and at wavelength 405nm carry summit ultraviolet, cure anisotropic conductive film, make embodiment 4 company
Junctor sample.
[table 4]
<Evaluation>
In comparative example 1, without using wave filter, 5 seconds are irradiated in wavelength 310nm and wavelength from the moment that crimping utensil is fallen
The ultraviolet of summit is carried at 365nm.In this case, the resistance value after reliability test becomes higher.It is thought that because carrying out
The resin solidification as caused by Photoepolymerizationinitiater initiater takes place while resin melting as caused by the heat of light absorber, melts institute
The resin discharge of initiation becomes inadequate, and does not form the state that crimping utensil is firmly pressed into.
In comparative example 2, without using wave filter, 2 seconds are irradiated in wavelength 310nm and wavelength from the moment that crimping utensil is fallen
At 365nm after the ultraviolet with summit, the short wavelength's cut-off filter ended to below wavelength 350nm, irradiation 3 are used
Second carries the ultraviolet of summit at wavelength 365nm.In this case, the resistance value after reliability test becomes higher.It is thought that because
For, it is same with comparative example 1, drawn while carrying out the resin melting caused by the heat of light absorber by Photoepolymerizationinitiater initiater
The resin solidification risen, the triggered resin discharge of melting become inadequate, and do not form the state that crimping utensil is firmly pressed into.
In comparative example 3, using the long wavelength cutoff wave filter ended to more than wavelength 350nm, fall from crimping utensil
Under moment from irradiate 2 seconds at wavelength 310nm after the ultraviolet with summit, without using wave filter, irradiation 3 seconds is in wavelength
The ultraviolet of summit is carried at 310nm and wavelength 365nm.In this case, the resistance value after initial stage and reliability test becomes higher.
It is thought that because beginning to carry out the resin solidification as caused by Photoepolymerizationinitiater initiater from the moment that utensil is fallen, after 2 seconds
Resin solidification has been carried out when proceeding by the resin melting as caused by the heat of light absorber, resin discharge becomes difficult, not
Crimping utensil can be firmly pressed into.
In embodiment 1, using the short wavelength's cut-off filter ended to below wavelength 350nm, fall from crimping utensil
Under moment from irradiate 1 second at wavelength 365nm after the ultraviolet with summit, without using wave filter, irradiation 4 seconds is in wavelength
The ultraviolet of summit is carried at 310nm and wavelength 365nm.In this case, the resistance value after initial stage and reliability test is lower.
It is thought that because, in initial 1 second the effect of light absorber account for leading, resin melting is abundant as caused by the heat of absorbent
Carry out, crimping utensil can be firmly pressed into, afterwards, proceed by the curing as caused by Photoepolymerizationinitiater initiater.
In embodiment 2, using the short wavelength's cut-off filter ended to below wavelength 350nm, fall from crimping utensil
Under moment from irradiate 2 seconds at wavelength 365nm after the ultraviolet with summit, without using wave filter, irradiation 3 seconds is in wavelength
The ultraviolet of summit is carried at 310nm and wavelength 365nm.In this case, the resistance value after initial stage and reliability test is than real
It is lower to apply example 1.It is thought that because the time of the resin melting as caused by the heat production of light absorber is longer than embodiment 1, therefore energy
It is enough to be firmly pressed into crimping utensil.
In embodiment 3, using the short wavelength's cut-off filter ended to below wavelength 350nm, fall from crimping utensil
Under moment from irradiate 1 second at wavelength 365nm after the ultraviolet with summit, without using wave filter, irradiation 1 second is in wavelength
The ultraviolet of summit is carried at 310nm and wavelength 365nm, further uses the short wavelength ended to below wavelength 350nm
Cut-off filter, irradiation after the ultraviolet with summit, without using wave filter, irradiate 2 seconds in wavelength in 1 second at wavelength 365nm
The ultraviolet of summit is carried at 310nm and wavelength 365nm.In this case, the resistance value after initial stage and reliability test is lower.
It is thought that because, similarly to Example 1, in initial 1 second the effect of light absorber account for leading, by absorbent thermal conductivity cause
Resin melting fully carry out, can will crimping utensil firmly be pressed into.
In embodiment 4, using the bandpass filter that centre wavelength is 365nm, the irradiation 2 from the moment that crimping utensil is fallen
After second carrying the ultraviolet of summit at wavelength 365nm places, using the short wavelength's cut-off filter ended to below wavelength 350nm,
1 second ultraviolet that summit is carried wavelength 365nm and wavelength 405nm at of irradiation, further without using wave filter, irradiate 2 seconds
The ultraviolet of summit is carried at wavelength 310nm, wavelength 365nm and wavelength 405nm.In this case, initial stage and reliability test
Resistance value afterwards becomes lower.It is thought that because, in initial 2 seconds the effect of light absorber account for leading, by absorbent
Resin melting caused by heat fully carries out, and can firmly be pressed into crimping utensil, be carried out in ensuing 1 second by photosensitizer
The curing of the depths of the depth direction of caused resin, carries out the skin section for including resin as caused by Photoepolymerizationinitiater initiater afterwards
Curing inside, has carried out sufficient resin solidification.
Claims (8)
1. a kind of manufacture method of connector, it is characterised in that have：
Arrangement step, is led by the light-cured type anisotropy containing polymerizable compound, Photoepolymerizationinitiater initiater and light absorber
Electric bonding agent, by the configuration of the second electronic unit on the first electronic unit；And
Irradiation process, while being pressed second electronic unit to first electronic unit using utensil is crimped, one
Lateral dominance light illuminator irradiation light,
In the irradiation process, the wave-length coverage of the light is controlled, after the light absorber is activated, draws the photopolymerization
Send out agent activation.
2. the manufacture method of connector according to claim 1, the light-cured type anisotropically conducting adhesive contains
Photosensitizer,
In the irradiation process, the wave-length coverage of the light is controlled, with the light absorber, the photosensitizer, the photopolymerization
The order of initiator is activated.
3. the manufacture method of connector according to claim 1, described in the absworption peak wavelength ratio of the Photoepolymerizationinitiater initiater
The absworption peak wavelength of light absorber is in shorter wavelength side.
4. the manufacture method of connector according to claim 2, described in the absworption peak wavelength ratio of the Photoepolymerizationinitiater initiater
The absworption peak wavelength of light absorber is in shorter wavelength side.
5. the manufacture method of the connector according to claim 2 or 4, the absworption peak wavelength of the Photoepolymerizationinitiater initiater compares institute
The absworption peak wavelength for stating photosensitizer is in shorter wavelength side.
6. the manufacture method of connector according to claim 1 or 2, the light irradiated using the light illuminator includes purple
Outside line,
In the irradiation process, change the wave-length coverage of light according to irradiation time.
7. the manufacture method of connector according to claim 1 or 2, the Photoepolymerizationinitiater initiater is that light cationic polymerization draws
Agent is sent out, the light absorber is ultra-violet absorber or optical free radical polymerization initiator.
8. the manufacture method of connector according to claim 1 or 2, the absworption peak wavelength of the Photoepolymerizationinitiater initiater are
290nm~330nm, the absworption peak wavelength of the light absorber is 340nm~380nm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-204912 | 2016-10-19 | ||
| JP2016204912A JP2018065916A (en) | 2016-10-19 | 2016-10-19 | Method for producing connection body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107964375A true CN107964375A (en) | 2018-04-27 |
Family
ID=61997648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710944932.5A Withdrawn CN107964375A (en) | 2016-10-19 | 2017-09-30 | The manufacture method of connector |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2018065916A (en) |
| KR (1) | KR20180043169A (en) |
| CN (1) | CN107964375A (en) |
| HK (1) | HK1254503A1 (en) |
| TW (1) | TW201828376A (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| HK1254503A1 (en) | 2019-07-19 |
| TW201828376A (en) | 2018-08-01 |
| KR20180043169A (en) | 2018-04-27 |
| JP2018065916A (en) | 2018-04-26 |
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