CN107962313B - 半导体装置用接合线 - Google Patents

半导体装置用接合线 Download PDF

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Publication number
CN107962313B
CN107962313B CN201711344468.2A CN201711344468A CN107962313B CN 107962313 B CN107962313 B CN 107962313B CN 201711344468 A CN201711344468 A CN 201711344468A CN 107962313 B CN107962313 B CN 107962313B
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China
Prior art keywords
bonding wire
wire
concentration
semiconductor device
bonding
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CN201711344468.2A
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English (en)
Chinese (zh)
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CN107962313A (zh
Inventor
山田隆
小田大造
榛原照男
大石良
斋藤和之
宇野智裕
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Nippon Steel & Sumitomo New Materials Co ltd
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Nippon Steel Chemical and Materials Co Ltd
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Priority claimed from PCT/JP2015/070861 external-priority patent/WO2016203659A1/ja
Application filed by Nippon Steel and Sumikin Chemical Co Ltd, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to CN201711344468.2A priority Critical patent/CN107962313B/zh
Priority claimed from PCT/JP2016/064926 external-priority patent/WO2016203899A1/ja
Publication of CN107962313A publication Critical patent/CN107962313A/zh
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    • H—ELECTRICITY
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
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JP7036838B2 (ja) 2017-12-28 2022-03-15 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP7293674B2 (ja) * 2019-01-31 2023-06-20 株式会社プロテリアル ボンディングワイヤ
CN113088837A (zh) * 2021-04-15 2021-07-09 江西富鸿金属有限公司 一种医疗用高弹性镀锡合金线及其制备方法
TWI796739B (zh) * 2021-07-26 2023-03-21 樂金股份有限公司 合金銲線
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