CN107959099A - There is the cover layer of EMI - Google Patents
There is the cover layer of EMI Download PDFInfo
- Publication number
- CN107959099A CN107959099A CN201610906460.XA CN201610906460A CN107959099A CN 107959099 A CN107959099 A CN 107959099A CN 201610906460 A CN201610906460 A CN 201610906460A CN 107959099 A CN107959099 A CN 107959099A
- Authority
- CN
- China
- Prior art keywords
- emi
- cover layer
- glue
- line
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000696 magnetic material Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims 2
- 230000005389 magnetism Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 55
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241001232787 Epiphragma Species 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/002—Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
Abstract
There is the cover layer of EMI, including magnetic material layer and the first glue-line arranged on magnetic material layer lower surface the invention discloses a kind of.The cover layer is suitable for being used for the traditional cover layer for replacing wiring board to use above, simplifies process, improves production efficiency, reduce product thickness, saves the advantages such as material cost.
Description
Technical field
There is EMI work(the invention belongs to near-field communication technology (NFC) and wireless charging (WPC) field, more particularly to one kind
The cover layer of energy.
Background technology
Near-field communication technology (NFC) be (RFID) is identified by non-contact radio-frequency and the Technology Integration that interconnects develops and
Come, combining induction card reader, icah wavw and point-to-point function on one chip, can set in short distance with compatible
It is standby to be identified and data exchange.NFC antenna is to be used for launching or receiving the component of electromagnetic wave in wireless device, it is biography
The guided wave propagated on defeated line, changes the electromagnetic wave propagated in unbounded medium (being typically free space) into, or carries out opposite
Conversion.The engineering systems such as radio communication, broadcast, TV, radar, navigation, electronic countermeasure, remote sensing, radio astronomy, every profit
Information is transmitted with electromagnetic wave, depends on antenna to work.In addition, in terms of energy is transmitted with electromagnetic wave, non-signal
Energy radiation be also required to antenna.
Wireless charging (WPC) comes from wireless power transmission technology, and low-power wireless charges frequently with induction (such as right
The Qi modes of mobile phone charging, also there is the induction type that a small amount of electric automobile wireless charging mode uses certainly), high-power wireless charging
Frequently with resonant mode (most of electric automobile charging uses this mode), electricity consumption is transmitted its energy to by power supply unit (charger)
Device, which charges battery using the energy that receives, and is used at the same time for itself running.Since charger is with using
Energy is transmitted with magnetic field between electric installation, is not run wires between the two, therefore charger and the device of electricity consumption can be done
It is exposed to no conductive junction point.
Refering to Figure 1, NFC, WPC antenna are generally (one or more by wiring board, the magnetic material of antijamming capability
Material) composition.Traditional production method generally use wiring board 1, magnetic material 2, coil 3 are combined, thus exist plus
The work cycle is long, and thickness is thicker, and production efficiency is relatively low, it is of high cost the defects of.Refer to shown in Fig. 2, and traditional antenna class
Circuit board machining process substantially flow is:Circuit is bonded protective film protection circuit (pasting epiphragma) after making, and then will
The protective layer such as gold-plated/change gold (being surface-treated) is done in the feed point region exposed, and then does the rear processes such as fitting gum.Shown in Fig. 3
Protective film folds structure used by as current wiring board, is made of PI insulating layers and glue-line (binding agent).
The content of the invention
The technical problems to be solved by the invention be to provide it is a kind of there is the cover layer of EMI, suitable for for instead of line
Traditional cover layer that road plate uses above, simplifies process, improves production efficiency, reduces product thickness, and it is excellent to save material cost etc.
Gesture.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme that：
This has the function of the cover layer of EMI, including magnetic material layer and the first glue-line arranged on magnetic material layer lower surface.
Further include the second glue-line arranged on magnetic material layer upper surface and the insulating layer arranged on the second glue-line upper surface.
Further include the insulating layer arranged on the first glue-line lower surface and the second glue-line arranged on insulating layer lower surface.
The insulating layer is PI dielectric films.
The thickness of the magnetic material layer is 20-300 μm.
The thickness of the PI dielectric films is 5-50 μm.
The thickness of first glue-line is 5-35 μm.
The thickness of second glue-line is 5-35 μm.
It is using the present invention that there is the cover layer of EMI, this have the advantage that：1st, magnetic material is incorporated big wiring board
Manufacturing process in, save the process-cycle；2nd, due to using mode is integrally formed, eliminating magnetic material and wiring board fitting production
Raw alignment tolerance.
Brief description of the drawings
The present invention is described in detail with reference to the accompanying drawings and detailed description：
Fig. 1 is the NFC of the prior art, the structure diagram of WPC antennas.
Fig. 2 is traditional antenna class wiring board processing process figure.
Fig. 3 is that the protective film of the wiring board of the prior art folds structure schematic diagram.
Fig. 4 is the structure diagram of the embodiment one of the cover layer of the present invention.
Fig. 5 is the structure diagram of the manufacture application of the cover layer of Fig. 4.
Fig. 6 is the structure diagram of the embodiment two of the cover layer of the present invention.
Fig. 7 is the structure diagram of the manufacture application of the cover layer of Fig. 6.
Fig. 8 is the structure diagram of the embodiment three of the cover layer of the present invention.
Fig. 9 is the structure diagram of the manufacture application of the cover layer of Fig. 8.
Embodiment
The present invention's has the function of the cover layer of EMI, mainly including magnetic material layer (i.e. EMI layers) and arranged on magnetic material
First glue-line of layer lower surface.
The present invention have the function of EMI cover layer further include arranged on magnetic material layer upper surface the second glue-line and be arranged on
The insulating layer of second glue-line upper surface.
The cover layer with EMI of the present invention is further included arranged on the insulating layer of the first glue-line lower surface and arranged on insulation
Second glue-line of layer lower surface.
Insulating layer described above can use PI dielectric films.
The EMI materials of the magnetic material layer can be selected according to performance in table 1 below and demand：
Table 1
The thickness of the PI dielectric films is 5-50 μm.
The thickness of first glue-line is 5-35 μm.
The thickness of second glue-line is 5-35 μm.
It is described in detail below by concrete example：
Embodiment one：
The present embodiment has the function of the cover layer of EMI as shown in figure 4, it includes successively from bottom to up：PI dielectric films 11,
Second glue-line 12, EMI layers 13, the first glue-line 14.
Wherein, the thickness of PI dielectric films 11 is 12.5 μm, and the thickness of the first glue-line 14 is 15 μm, and the thickness of EMI layers 13 is
40 μm, the thickness of the second glue-line 12 is 25 μm.
The present embodiment has the function of the manufacture application process of the cover layer of EMI, using following steps：PI dielectric films 11,
The raw material that second glue-line 12 is integrated, i.e., common cover layer on wiring board, by PI dielectric films 11, the second glue-line 12 and first
Glue-line 14 is pressed in the two sides of EMI layers 13,110 DEG C of pressing-in temp, 10 seconds time, pressure 5kg/cm in advance at the same time2, obtain the present embodiment
There is the cover layer of EMI, the cover layer that this can finally be had the function of to EMI presses to wiring board 15, upper pressing-in temp
180 DEG C, time 2 h, pressure 45kg/cm2, structure is as shown in Figure 5.
Embodiment two：
The present embodiment has the function of the cover layer of EMI as shown in fig. 6, it includes successively from bottom to up：EMI layers 13,
One glue-line 14, PI dielectric films 11, the second glue-line 12.
Wherein, the thickness of PI dielectric films 11 is 12.5 μm, and the thickness of the first glue-line 14 is 15 μm, and the thickness of EMI layers 13 is
40 μm, the thickness of the second glue-line 12 is 10 μm.
The present embodiment has the function of the manufacture application process of the cover layer of EMI, using following steps：PI dielectric films 11,
The raw material that second glue-line 12 is integrated, i.e., common cover layer on wiring board, PI dielectric films 11, the second glue-line 12 are pressed together on
The one side of EMI layers 13,110 DEG C of pressing-in temp, 10 seconds time, pressure 35kg/cm2；The second glue-line 12 is pressed in PI insulation in advance again
The one side of film 11,110 DEG C of pressing-in temp, 10 seconds time, pressure 5kg/cm2, obtain the present embodiment has the function of the covering of EMI
Film, the cover layer that this can finally be had the function of to EMI press to wiring board 15, upper 180 DEG C of pressing-in temp, time 2 h, pressure
45kg/cm2, structure is as shown in Figure 7
Embodiment three：
The present embodiment has the function of the cover layer of EMI as shown in figure 8, it includes successively from bottom to up：EMI layers 13 and
One glue-line 14.
Wherein, the thickness of the first glue-line 14 is 15 μm, and the thickness of EMI layers 13 is 40 μm.
The present embodiment has the function of the manufacture application process of the cover layer of EMI, using following steps：By the first glue-line 14
The pre- one side for being pressed in EMI layers 13,110 DEG C of pressing-in temp, 10 seconds time, pressure 5kg/cm2, obtain the present embodiment has EMI
The cover layer of function, the cover layer that this can finally be had the function of to EMI press to wiring board 15, upper 180 DEG C of pressing-in temp, time
2 it is small when, pressure 5kg/cm2, structure is as shown in Figure 9
But those of ordinary skill in the art is it should be appreciated that the embodiment of the above is intended merely to explanation originally
Invention, and be not used as limitation of the invention, as long as in the spirit of the present invention, to embodiment described above
Change, modification will all fall in the range of claims of the present invention.
Claims (8)
1. a kind of have the function of the cover layer of EMI, it is characterised in that：Including magnetic material layer and arranged on magnetic material layer lower surface
The first glue-line.
2. according to claim 1 have the function of the cover layer of EMI, it is characterised in that：Further include and be arranged on magnetic material layer
Second glue-line of upper surface and the insulating layer arranged on the second glue-line upper surface.
3. according to claim 1 have the function of the cover layer of EMI, it is characterised in that：Further include under the first glue-line
The insulating layer on surface and the second glue-line arranged on insulating layer lower surface.
4. there is the cover layer of EMI according to any one of claim 2-3, it is characterised in that：The insulating layer
For PI dielectric films.
5. according to any one of claim 1-3 have the function of the cover layer of EMI, it is characterised in that：The magnetism material
The thickness of the bed of material is 20-300 μm.
6. according to claim 4 have the function of the cover layer of EMI, it is characterised in that：The thickness of the PI dielectric films is
5-50μm。
7. according to any one of claim 1-3 have the function of the cover layer of EMI, it is characterised in that：First glue
The thickness of layer is 5-35 μm.
8. there is the cover layer of EMI according to any one of claim 2-3, it is characterised in that：Second glue
The thickness of layer is 5-35 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610906460.XA CN107959099A (en) | 2016-10-18 | 2016-10-18 | There is the cover layer of EMI |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610906460.XA CN107959099A (en) | 2016-10-18 | 2016-10-18 | There is the cover layer of EMI |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107959099A true CN107959099A (en) | 2018-04-24 |
Family
ID=61953491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610906460.XA Pending CN107959099A (en) | 2016-10-18 | 2016-10-18 | There is the cover layer of EMI |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107959099A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5473110A (en) * | 1995-03-07 | 1995-12-05 | Unisys Corporation | Magnetically-attachable EMI shielding cover for attenuating electromagnetic emanation |
| CN1940125A (en) * | 2005-09-30 | 2007-04-04 | 佛山市顺德区汉达精密电子科技有限公司 | Method for coating EMI metal film layer and adhering plastic matrix at vacuum |
| JP2007156668A (en) * | 2005-12-02 | 2007-06-21 | Dainippon Printing Co Ltd | Non-contact ic tag label and non-contact ic tag sheet |
| US20080035739A1 (en) * | 2006-08-11 | 2008-02-14 | Sheng-Chang Huang | Label with a rfid to be stuck on a product to be formed in a mold |
| JP2008270714A (en) * | 2007-12-17 | 2008-11-06 | Taiyo Yuden Co Ltd | Electromagnetic wave shielding sheet |
| CN101472455A (en) * | 2007-12-29 | 2009-07-01 | 3M创新有限公司 | Electromagnetic shielding liner and method for filling clearance of electromagnetic shielding system |
| JP2009283901A (en) * | 2008-04-21 | 2009-12-03 | Shin Etsu Polymer Co Ltd | Cover lay film and flexible printed wiring board |
| CN202601831U (en) * | 2012-03-20 | 2012-12-12 | 上海安费诺永亿通讯电子有限公司 | Antenna structure |
| CN203492324U (en) * | 2013-09-29 | 2014-03-19 | 新高电子材料（中山）有限公司 | Flexible cover film structure with electromagnetic shielding function |
| CN105027355A (en) * | 2013-03-05 | 2015-11-04 | 阿莫先恩电子电器有限公司 | Composite sheet for shielding magnetic field and electromagnetic wave, and antenna module comprising same |
| KR20160103397A (en) * | 2015-02-24 | 2016-09-01 | 주식회사 진영이에스 | Coated tape with preventing electromagnetic interference and method for manufacturing of the same |
| CN206134908U (en) * | 2016-10-18 | 2017-04-26 | 上海光线新材料科技有限公司 | Cover membrane with EMI function |
-
2016
- 2016-10-18 CN CN201610906460.XA patent/CN107959099A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5473110A (en) * | 1995-03-07 | 1995-12-05 | Unisys Corporation | Magnetically-attachable EMI shielding cover for attenuating electromagnetic emanation |
| CN1940125A (en) * | 2005-09-30 | 2007-04-04 | 佛山市顺德区汉达精密电子科技有限公司 | Method for coating EMI metal film layer and adhering plastic matrix at vacuum |
| JP2007156668A (en) * | 2005-12-02 | 2007-06-21 | Dainippon Printing Co Ltd | Non-contact ic tag label and non-contact ic tag sheet |
| US20080035739A1 (en) * | 2006-08-11 | 2008-02-14 | Sheng-Chang Huang | Label with a rfid to be stuck on a product to be formed in a mold |
| JP2008270714A (en) * | 2007-12-17 | 2008-11-06 | Taiyo Yuden Co Ltd | Electromagnetic wave shielding sheet |
| CN101472455A (en) * | 2007-12-29 | 2009-07-01 | 3M创新有限公司 | Electromagnetic shielding liner and method for filling clearance of electromagnetic shielding system |
| JP2009283901A (en) * | 2008-04-21 | 2009-12-03 | Shin Etsu Polymer Co Ltd | Cover lay film and flexible printed wiring board |
| CN202601831U (en) * | 2012-03-20 | 2012-12-12 | 上海安费诺永亿通讯电子有限公司 | Antenna structure |
| CN105027355A (en) * | 2013-03-05 | 2015-11-04 | 阿莫先恩电子电器有限公司 | Composite sheet for shielding magnetic field and electromagnetic wave, and antenna module comprising same |
| CN203492324U (en) * | 2013-09-29 | 2014-03-19 | 新高电子材料（中山）有限公司 | Flexible cover film structure with electromagnetic shielding function |
| KR20160103397A (en) * | 2015-02-24 | 2016-09-01 | 주식회사 진영이에스 | Coated tape with preventing electromagnetic interference and method for manufacturing of the same |
| CN206134908U (en) * | 2016-10-18 | 2017-04-26 | 上海光线新材料科技有限公司 | Cover membrane with EMI function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20180424 Assignee: Shenzhen Sunway Communication Co., Ltd. Assignor: SHANGHAI GUANGXIAN NEW MATERIAL TECHNOLOGY CO., LTD. Contract record no.: 2019310000013 Denomination of invention: Cover film with EMI function License type: Common License Record date: 20190130 |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200605 Address after: 201800 room 118, floor 1, building 1, 4500 Baoqian Road, Jiading District, Shanghai Applicant after: SHANGHAI LANPEI NEW MATERIAL TECHNOLOGY Co.,Ltd. Applicant after: SHENZHEN SUNWAY COMMUNICATION Co.,Ltd. Address before: 201505 Shanghai Jinshan District City Lin Zhen Lin Shing Road 198 Building 9 Applicant before: SHANGHAI GUANGXIAN NEW MATERIALS TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 578-1 Yanxin Road, Wuxi Huishan Economic Development Zone, Wuxi City, Jiangsu Province Applicant after: Wuxi lanpei New Material Technology Co., Ltd Applicant after: SHENZHEN SUNWAY COMMUNICATION Co.,Ltd. Address before: 201800 room 118, floor 1, building 1, 4500 Baoqian Road, Jiading District, Shanghai Applicant before: SHANGHAI LANPEI NEW MATERIAL TECHNOLOGY Co.,Ltd. Applicant before: SHENZHEN SUNWAY COMMUNICATION Co.,Ltd. |