CN107943137B - Temperature adjusting method, device and system, connection detection method and mobile terminal - Google Patents
Temperature adjusting method, device and system, connection detection method and mobile terminal Download PDFInfo
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- CN107943137B CN107943137B CN201711165420.5A CN201711165420A CN107943137B CN 107943137 B CN107943137 B CN 107943137B CN 201711165420 A CN201711165420 A CN 201711165420A CN 107943137 B CN107943137 B CN 107943137B
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The invention discloses a temperature adjusting method, a device and a system, a connection detection method and a mobile terminal, wherein the temperature adjusting device comprises a charging unit for charging the mobile terminal and a semiconductor temperature adjusting component for adjusting the temperature of the mobile terminal, and the connection detection method comprises the following steps: controlling the semiconductor temperature adjusting assembly to adjust the temperature of the mobile terminal according to the current absorbed by the mobile terminal from the charging unit and the current temperature; during the temperature adjustment, whether the connection between the temperature adjustment device and the mobile terminal is normal is detected according to the current absorbed by the semiconductor temperature adjustment assembly from the charging unit and the temperature difference of at least two monitoring points in the mobile terminal. According to the invention, whether the connection between the temperature adjusting device and the mobile terminal is normal or not is detected by detecting whether the external connection between the temperature adjusting device and the mobile terminal and the internal connection of the mobile terminal are normal or not, so that whether the temperature adjusting device effectively adjusts the temperature of the mobile terminal or not can be known.
Description
Technical Field
The invention relates to the field of mobile terminals, in particular to a connection detection method between a temperature adjusting device and a mobile terminal, a temperature adjusting method of the temperature adjusting device on the mobile terminal, the temperature adjusting device, the mobile terminal and a temperature adjusting system.
Background
Along with the rapid improvement of the performance of the mobile terminal, the heating condition of the mobile terminal becomes an important user experience, and the temperature control level of the mobile terminal is continuously improved through software and hardware optimization in the industry. Specifically, the temperature adjustment device may be disposed inside the mobile terminal, or may be disposed outside the mobile terminal.
At present, a typical external temperature adjusting device is an external heat dissipation leather sheath or an external heat sink, and a device for charging a mobile terminal is used for adjusting the temperature of the mobile terminal. However, either method is an open-loop adjustment method, and there is no concern about whether the actual temperature of the mobile terminal is effectively adjusted.
Disclosure of Invention
The invention aims to overcome the defect that the actual adjusting effect is unknown due to open-loop adjustment of the temperature of a mobile terminal in the prior art, and provides a connection detection method between a temperature adjusting device and the mobile terminal, a temperature adjusting method of the temperature adjusting device on the mobile terminal, the temperature adjusting device, the mobile terminal and a temperature adjusting system.
The invention solves the technical problems through the following technical scheme:
in a first aspect, the present invention provides a connection detection method between a temperature adjustment device and a mobile terminal, the temperature adjustment device including a charging unit for charging the mobile terminal and a semiconductor temperature adjustment component for adjusting a temperature of the mobile terminal, the method including:
controlling the semiconductor temperature adjusting assembly to adjust the temperature of the mobile terminal according to the current absorbed by the mobile terminal from the charging unit and the current temperature of the mobile terminal;
during temperature adjustment, whether the connection between the temperature adjusting device and the mobile terminal is normal or not is detected according to the current absorbed by the semiconductor temperature adjusting assembly from the charging unit and the temperature difference of at least two monitoring points in the mobile terminal, wherein the absolute value of the temperature difference is larger than a preset temperature difference before the temperature adjustment.
Optionally, the controlling the semiconductor temperature adjustment assembly to adjust the temperature of the mobile terminal according to the current absorbed by the mobile terminal from the charging unit and the current temperature of the mobile terminal specifically includes:
if the current temperature of the mobile terminal is higher than a first preset temperature, according to the current absorbed by the mobile terminal from the charging unit;
and searching a cooling current corresponding to the current absorbed by the mobile terminal from the charging unit from the temperature reduction relation table, and loading the searched cooling current to two ends of the semiconductor temperature regulation assembly.
Optionally, the controlling the semiconductor temperature adjustment assembly to adjust the temperature of the mobile terminal according to the current absorbed by the mobile terminal from the charging unit and the current temperature of the mobile terminal specifically includes:
if the current temperature of the mobile terminal is less than or equal to a second preset temperature, according to the current absorbed by the mobile terminal from the charging unit;
and searching a heating current corresponding to the current absorbed by the mobile terminal from the charging unit from the temperature-rising relation table, and loading the searched heating current to two ends of the semiconductor temperature-regulating assembly.
Optionally, the detecting whether the connection between the temperature adjustment device and the mobile terminal is normal according to the current absorbed by the semiconductor temperature adjustment assembly from the charging unit and the temperature difference between at least two monitoring points in the mobile terminal specifically includes:
if the current absorbed by the semiconductor temperature adjusting assembly from the charging unit is gradually reduced and the absolute value of the temperature difference of at least two monitoring points in the mobile terminal is gradually reduced, detecting that the connection between the temperature adjusting device and the mobile terminal is normal;
otherwise, detecting the abnormal connection between the temperature adjusting device and the mobile terminal.
In a second aspect, the present invention provides a method for adjusting a temperature of a mobile terminal by a temperature adjustment device, including:
detecting whether the connection between the temperature adjusting device and the mobile terminal is normal or not by using the method;
if so, sending a first instruction to the mobile terminal, and continuing to adjust the temperature of the mobile terminal; the mobile terminal is used for closing the temperature adjusting function of the mobile terminal after receiving the first instruction;
if not, stopping temperature adjustment of the mobile terminal.
In a third aspect, the present invention provides a temperature adjustment device, comprising a charging unit, a semiconductor temperature adjustment assembly memory, and a processor;
the charging unit is used for charging the mobile terminal;
the semiconductor temperature adjusting component is used for adjusting the temperature of the mobile terminal;
the memory is used for storing a computer program;
the processor is adapted to execute the computer program to implement the method as described above.
Optionally, the semiconductor temperature adjusting component comprises a P-type semiconductor and an N-type semiconductor.
In a fourth aspect, the present invention provides a mobile terminal electrically connected to the temperature adjustment device as described above, for absorbing current from a charging unit in the temperature adjustment device.
In a fifth aspect, the present invention provides a temperature adjustment system, comprising the temperature adjustment apparatus as described above and the mobile terminal as described above.
On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the invention.
The positive progress effects of the invention are as follows: compared with the prior art, the temperature control method and the temperature control device have the advantages that the semiconductor temperature adjusting assembly is controlled to adjust the temperature of the mobile terminal according to the current absorbed by the mobile terminal from the charging unit and the current temperature; during the temperature adjustment, whether the external connection between the temperature adjusting device and the mobile terminal and the internal connection of the mobile terminal are normal or not is detected according to the current absorbed by the semiconductor temperature adjusting assembly from the charging unit and the temperature difference of at least two monitoring points in the mobile terminal, so that whether the connection between the temperature adjusting device and the mobile terminal is normal or not is detected, and whether the temperature adjusting device effectively adjusts the temperature of the mobile terminal or not can be known.
Drawings
Fig. 1 is a schematic view of a connection structure between a temperature adjustment device and a mobile terminal according to an embodiment of the present invention.
Fig. 2 is a flowchart of a connection detection method between a temperature adjustment device and a mobile terminal according to an embodiment of the present invention.
Fig. 3 is a flowchart of a method for adjusting a temperature of a mobile terminal by using a temperature adjustment device according to an embodiment of the present invention.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
The present embodiment provides a connection detection method between a temperature adjustment device and a mobile terminal, as shown in fig. 1, the temperature adjustment device 10 is electrically connected to the mobile terminal 20, and the temperature adjustment device 10 includes a charging unit 11 and a semiconductor temperature adjustment assembly 12. The charging unit 11 is used for charging the mobile terminal 20, and the semiconductor temperature regulating assembly 12 is used for regulating the temperature of the mobile terminal 20. The mobile terminal related in the embodiment can be a mobile phone, a tablet computer, a wearable device and the like.
As shown in fig. 2, the connection detection method between the temperature adjustment device 10 and the mobile terminal 20 includes the following steps:
In an optional implementation manner, step 201 specifically includes the following steps:
and if the current temperature of the mobile terminal is higher than the first preset temperature, controlling the semiconductor temperature adjusting assembly to cool and adjust the mobile terminal according to the current absorbed by the mobile terminal from the charging unit. The value of the first preset temperature may be set according to actual needs, and may be set to 50 degrees or 60 degrees, for example.
Specifically, the cooling current corresponding to the current absorbed by the mobile terminal from the charging unit can be searched from the cooling relation table, and the searched cooling current is loaded to two ends of the semiconductor temperature adjustment assembly, so that the cooling adjustment of the mobile terminal is realized. The cooling relation table is preset and stores the corresponding relation between the current absorbed by the mobile terminal from the charging unit and the cooling current. For example, the current absorbed by the mobile terminal from the charging unit is 800mA, and the corresponding cooling current is 400 mA; the current absorbed by the mobile terminal from the charging unit is 1500mA, and the corresponding cooling current is 800 mA. In addition, the refrigeration voltage corresponding to the current absorbed by the mobile terminal from the charging unit can be searched from the cooling relation table, and the searched refrigeration voltage is loaded to two ends of the semiconductor temperature adjusting assembly, so that the cooling adjustment of the mobile terminal is realized. The cooling relation table stores the corresponding relation between the current absorbed by the mobile terminal from the charging unit and the cooling voltage.
In an optional implementation manner, step 201 specifically includes the following steps:
and if the current temperature of the mobile terminal is less than or equal to a second preset temperature, controlling the semiconductor temperature regulating assembly to carry out temperature rise regulation on the mobile terminal according to the current absorbed by the mobile terminal from the charging unit. The value of the second preset temperature may be set according to actual needs, and may be set to 0 degree or 5 degrees, for example.
Specifically, the heating current corresponding to the current absorbed by the mobile terminal from the charging unit can be searched from the temperature-rise relation table, and the searched heating current is loaded to two ends of the semiconductor temperature adjustment assembly, so that the temperature rise adjustment of the mobile terminal is realized. The temperature-rise relation table is preset and stores the corresponding relation between the current absorbed by the mobile terminal from the charging unit and the heating current. Heating voltage corresponding to the current absorbed by the mobile terminal from the charging unit can be searched from the temperature-rising relation table, and the searched heating voltage is loaded to two ends of the semiconductor temperature-regulating component, so that temperature-rising regulation of the mobile terminal is realized. The temperature-rise relation table stores the corresponding relation between the current absorbed by the mobile terminal from the charging unit and the heating voltage.
In the above embodiment, the value of the first preset temperature and the value of the second preset temperature may be different or the same, and may be specifically set according to actual needs.
In another optional embodiment, step 201 specifically includes the following steps:
specifically, the adjustment current corresponding to the current absorbed by the mobile terminal from the charging unit and the current temperature of the mobile terminal may be searched from the preset relationship table, and the searched adjustment current is loaded to the two ends of the semiconductor temperature adjustment assembly. The preset relation table stores the corresponding relation among the current absorbed by the mobile terminal from the charging unit, the current temperature of the mobile terminal and the adjustment current. And the adjustment voltage corresponding to the current absorbed by the mobile terminal from the charging unit and the current temperature of the mobile terminal can be searched from the preset relation table, and the searched adjustment voltage is loaded to two ends of the semiconductor temperature adjustment assembly. The preset relation table stores the corresponding relation among the current absorbed by the mobile terminal from the charging unit, the current temperature of the mobile terminal and the adjustment voltage.
In this embodiment, two factors to be considered for detecting whether the connection between the temperature adjustment device and the mobile terminal is normal are: one is the current absorbed by the semiconductor temperature adjusting assembly from the charging unit, and is used for detecting whether the external connection of the mobile terminal is normal; the other is the temperature difference of at least two monitoring points in the mobile terminal, which is used for detecting whether the internal connection of the mobile terminal is normal. The absolute value of the temperature difference of the monitoring point in the mobile terminal is greater than the preset temperature difference before the temperature adjustment, that is, the monitoring point needs to be set according to the fact that the absolute value of the temperature difference is greater than the preset temperature difference before the temperature adjustment. For example, two monitoring points are arranged in the mobile terminal, before the semiconductor temperature adjusting component adjusts the temperature of the mobile terminal, the absolute value of the temperature difference between the two monitoring points is 0.5 degrees, during the temperature adjustment, the absolute value of the temperature difference always fluctuates about 0.5 degrees due to the close proximity of the two monitoring points, and in this case, whether the internal connection of the mobile terminal is normal or not cannot be detected according to the change of the temperature difference.
It should be noted that different heat conduction paths are formed from the connection port of the temperature adjustment device and the mobile terminal to the different heating elements in the mobile terminal. The temperature of the monitoring point near the starting point of the heat conduction path can be better regulated by the semiconductor temperature regulating assembly than the monitoring point near the end point of the heat conduction path.
In an optional embodiment, step 202 specifically includes the following steps:
during the temperature adjustment, if the relation between the current absorbed by the semiconductor temperature adjustment assembly from the charging unit and the time conforms to a current-time preset curve, and the relation between the temperature difference of at least two monitoring points in the mobile terminal and the time conforms to a temperature difference-time preset curve, it is detected that the connection between the temperature adjustment device and the mobile terminal is normal. In this embodiment, the current-time preset curve and the temperature difference-time preset curve can be obtained according to experimental data.
Otherwise, detecting the abnormal connection between the temperature adjusting device and the mobile terminal.
In another optional embodiment, step 202 specifically includes the following steps:
during the temperature adjustment, if the current absorbed by the semiconductor temperature adjustment assembly from the charging unit is gradually reduced and the absolute value of the temperature difference of at least two monitoring points in the mobile terminal is gradually reduced, the connection between the temperature adjustment device and the mobile terminal is detected to be normal.
Otherwise, detecting the abnormal connection between the temperature adjusting device and the mobile terminal.
In this embodiment, when the semiconductor temperature adjustment assembly adjusts the temperature of the mobile terminal, the semiconductor temperature adjustment assembly needs to absorb current from the charging unit, and if the absolute value of the absorbed current and the absolute value of the temperature difference between the monitoring points are both gradually decreased, it is indicated that the semiconductor temperature adjustment assembly effectively adjusts the temperature of the mobile terminal.
In another optional embodiment, step 202 specifically includes the following steps:
during the temperature adjustment, if the current absorbed by the semiconductor temperature adjustment assembly from the charging unit is continuously greater than the preset current, or the absolute value of the temperature difference between at least two monitoring points in the mobile terminal is greater than the preset temperature difference, detecting that the connection between the temperature adjustment device and the mobile terminal is abnormal.
Otherwise, detecting that the connection between the temperature adjusting device and the mobile terminal is normal.
In this embodiment, the preset current may be set according to specific requirements, for example, the preset current may be set according to a current or a voltage applied to two ends of the semiconductor temperature adjustment component. In a specific example, when the current absorbed by the semiconductor temperature regulation component from the charging unit is continuously greater than 90% of the current loaded across the semiconductor temperature regulation component, the external connection of the mobile terminal is considered abnormal, indicating that the semiconductor temperature regulation component is not actively regulating the temperature of the mobile terminal.
Similarly, when the absolute value of the temperature difference of at least two monitoring points in the mobile terminal is greater than the preset temperature difference, the internal connection of the mobile terminal is abnormal. For example, the monitoring point a is close to the starting point of the heat conducting path, the monitoring point B is close to the ending point of the heat conducting path, the temperatures of the monitoring points a and B are 15 degrees and 30 degrees respectively before the temperature reduction adjustment, and the absolute value of the temperature difference is 15 degrees and is greater than the preset temperature difference by 10 degrees. At a certain moment during the temperature reduction adjustment, the temperatures of the monitoring points A and B are respectively 10 degrees and 28 degrees, and the absolute value of the temperature difference is 18 degrees and is greater than the preset temperature difference by 10 degrees. This indicates that a problem occurs in the mobile terminal in the heat conduction path between monitoring points a and B, that is, an abnormality occurs in the internal connection of the mobile terminal.
The embodiment further provides a method for adjusting the temperature of the mobile terminal by using the temperature adjusting device, as shown in fig. 3, the method specifically includes the following steps:
step 301, detecting whether the connection between the temperature adjustment device and the mobile terminal is normal by using the method of the above embodiment, if so, executing step 302, and if not, executing step 303.
And step 303, stopping temperature adjustment of the mobile terminal. At this time, the temperature adjustment device supplies power only to the mobile terminal.
The embodiment also provides a temperature adjusting device, which comprises a charging unit, a semiconductor temperature adjusting component memory and a processor.
The charging unit is used for charging the mobile terminal;
the semiconductor temperature adjusting component is used for adjusting the temperature of the mobile terminal;
the memory is used for storing a computer program;
the processor is configured to execute the computer program to implement the connection detection method and/or the temperature adjustment method of the above embodiments.
In an alternative embodiment, the semiconductor temperature regulating assembly includes a P-type semiconductor and an N-type semiconductor.
The present embodiment further provides a mobile terminal, electrically connected to the temperature adjustment device of the above embodiment, for absorbing current from a charging unit in the temperature adjustment device.
The embodiment also provides a temperature adjusting system, which comprises the temperature adjusting device and the mobile terminal of the embodiment.
It should be noted that the division of the modules of the above apparatus is only a logical division, and the actual implementation may be wholly or partially integrated into one physical entity, or may be physically separated. And these modules can be realized in the form of software called by processing element; or may be implemented entirely in hardware; and part of the modules can be realized in the form of calling software by the processing element, and part of the modules can be realized in the form of hardware. For example, the sending module may be a processing element separately set up, or may be implemented by being integrated in a chip of the apparatus, or may be stored in a memory of the apparatus in the form of program code, and the processing element of the apparatus calls and executes the functions of the sending module. Other modules are implemented similarly. In addition, all or part of the modules can be integrated together or can be independently realized. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in the form of software.
For example, the above modules may be one or more integrated circuits configured to implement the above methods, such as: one or more Application Specific Integrated Circuits (ASICs), or one or more microprocessors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs), among others. For another example, when one of the above modules is implemented in the form of a Processing element scheduler code, the Processing element may be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. For another example, these modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).
Those of ordinary skill in the art will understand that: all or a portion of the steps of implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.
Claims (9)
1. A connection detection method between a temperature adjustment device and a mobile terminal, the temperature adjustment device including a charging unit for charging the mobile terminal and a semiconductor temperature adjustment component for adjusting a temperature of the mobile terminal, the method comprising:
controlling the semiconductor temperature adjusting assembly to adjust the temperature of the mobile terminal according to the current absorbed by the mobile terminal from the charging unit and the current temperature of the mobile terminal;
during temperature adjustment, whether the connection between the temperature adjusting device and the mobile terminal is normal or not is detected according to the current absorbed by the semiconductor temperature adjusting assembly from the charging unit and the temperature difference of at least two monitoring points in the mobile terminal, wherein the absolute value of the temperature difference is larger than a preset temperature difference before the temperature adjustment.
2. The method according to claim 1, wherein the controlling the semiconductor temperature regulating component to regulate the temperature of the mobile terminal according to the current drawn by the mobile terminal from the charging unit and the current temperature of the mobile terminal comprises:
if the current temperature of the mobile terminal is higher than a first preset temperature, according to the current absorbed by the mobile terminal from the charging unit, the refrigerating current corresponding to the current absorbed by the mobile terminal from the charging unit is searched from a cooling relation table, and the searched refrigerating current is loaded to two ends of the semiconductor temperature adjusting assembly.
3. The method according to claim 1, wherein the controlling the semiconductor temperature regulating component to regulate the temperature of the mobile terminal according to the current drawn by the mobile terminal from the charging unit and the current temperature of the mobile terminal comprises:
if the current temperature of the mobile terminal is less than or equal to a second preset temperature, searching a heating current corresponding to the current absorbed by the mobile terminal from the charging unit from a temperature-rising relation table according to the current absorbed by the mobile terminal from the charging unit, and loading the searched heating current to two ends of the semiconductor temperature-regulating assembly.
4. The method according to any one of claims 1-3, wherein the detecting whether the connection between the temperature adjustment device and the mobile terminal is normal according to the current absorbed by the semiconductor temperature regulation assembly from the charging unit and the temperature difference of at least two monitoring points in the mobile terminal comprises:
if the current absorbed by the semiconductor temperature adjusting assembly from the charging unit is gradually reduced and the absolute value of the temperature difference of at least two monitoring points in the mobile terminal is gradually reduced, detecting that the connection between the temperature adjusting device and the mobile terminal is normal;
otherwise, detecting the abnormal connection between the temperature adjusting device and the mobile terminal.
5. A method for adjusting the temperature of a mobile terminal by a temperature adjusting device is characterized by comprising the following steps:
detecting whether a connection between a temperature adjustment device and a mobile terminal is normal using the method of any one of claims 1-4;
if so, sending a first instruction to the mobile terminal, and continuing to adjust the temperature of the mobile terminal; the mobile terminal is used for closing the temperature adjusting function of the mobile terminal after receiving the first instruction;
if not, stopping temperature adjustment of the mobile terminal.
6. A temperature adjusting device comprises a charging unit, a semiconductor temperature adjusting component, a memory and a processor;
the charging unit is used for charging the mobile terminal;
the semiconductor temperature adjusting component is used for adjusting the temperature of the mobile terminal;
the memory is used for storing a computer program;
characterized in that the processor is configured to execute the computer program to implement the method according to any of claims 1 to 5.
7. The temperature adjustment device of claim 6, wherein the semiconductor temperature adjustment component comprises a P-type semiconductor and an N-type semiconductor.
8. A mobile terminal, characterized in that it is electrically connected to a temperature adjustment device according to claim 6 or 7 for drawing current from a charging unit in the temperature adjustment device.
9. A temperature adjustment system, characterized by comprising the temperature adjustment apparatus according to claim 6 or 7 and the mobile terminal according to claim 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711165420.5A CN107943137B (en) | 2017-11-21 | 2017-11-21 | Temperature adjusting method, device and system, connection detection method and mobile terminal |
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| CN201711165420.5A CN107943137B (en) | 2017-11-21 | 2017-11-21 | Temperature adjusting method, device and system, connection detection method and mobile terminal |
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| CN107943137B true CN107943137B (en) | 2020-06-16 |
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| CN104750141A (en) * | 2013-12-31 | 2015-07-01 | 启碁科技股份有限公司 | Temperature control system and method and method for determining threshold of temperature digital value |
| US9751427B2 (en) * | 2014-09-03 | 2017-09-05 | Ford Global Technologies, Llc | Vehicle traction battery thermal conditioning |
| KR101806616B1 (en) * | 2015-09-17 | 2017-12-08 | 현대자동차주식회사 | Charging control method for electric vehicle |
| CN206602393U (en) * | 2017-04-01 | 2017-10-31 | 江苏紫米电子技术有限公司 | A kind of intelligent temperature controls onboard charger |
| CN107248763A (en) * | 2017-06-20 | 2017-10-13 | 深圳天珑无线科技有限公司 | Charger temprature control method, device and charger |
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Address after: 266100 No. 151, Zhuzhou Road, Laoshan District, Shandong, Qingdao Patentee after: Qingdao Hisense Mobile Communication Technology Co.,Ltd. Address before: 266100 No. 151, Zhuzhou Road, Laoshan District, Shandong, Qingdao Patentee before: HISENSE MOBILE COMMUNICATIONS TECHNOLOGY Co.,Ltd. |
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