CN107910451A - 复合膜及其制造方法和封装结构 - Google Patents
复合膜及其制造方法和封装结构 Download PDFInfo
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- CN107910451A CN107910451A CN201711219151.6A CN201711219151A CN107910451A CN 107910451 A CN107910451 A CN 107910451A CN 201711219151 A CN201711219151 A CN 201711219151A CN 107910451 A CN107910451 A CN 107910451A
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- 239000002131 composite material Substances 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 80
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Abstract
本发明公开了一种复合膜及其制造方法和封装结构。该复合膜包括:基质膜和位于所述基质膜内部的至少一个阻水膜。本发明的技术方案中,复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
Description
分案说明:本案是申请号为201310529205.4,申请日为2013年10 月31日,名称为“复合膜及其制造方法和封装结构”的发明专利申请的分案申请。
技术领域
本发明涉及显示技术领域,特别涉及一种复合膜及其制造方法和封装结构。
背景技术
有机发光二极管(Organic Light-Emitting Diode,简称:OLED)
具有自发光的特性,当有电流通过时,OLED就会发光。OLED显示装置可视角度大,且能够显著节省电能,因此OLED显示装置具备了许多液晶显示器(Liquid CrystalDisplay,简称:LCD)不可比拟的优势,在显示技术领域的应用越来越广泛。
OLED中的有机膜层结构易受水氧侵蚀而失效,因此需要在OLED上方形成能够阻隔水氧的封装层以实现对OLED的保护。封装层通常采用高阻水性的硬质封装基板,例如玻璃或金属片,在承载OLED的基板上涂覆封装胶,封装胶位于OLED之外,通过封装胶将承载OLED的基板和硬质封装基板贴合起来,在两片基板之间形成水氧分子难以渗透的密闭空间,从而实现对OLED的保护。但是,由于硬质封装基板属于刚性器件,其柔性较差,因此不适用于对柔性OLED进行封装。
为解决上述硬质封装基板不适用于对柔性OLED的问题,现有技术中提出了采用阻水性薄膜作为封装层的技术方案。阻水性薄膜可采用致密的薄膜,例如:SiOx,但是致密的薄膜弯曲性差;或者,阻水性薄膜可采用弯曲性好的薄膜,例如:聚合物膜,但弯曲性好的薄膜阻水性差。因此,现有技术中为获得具有较好的阻水性和弯曲性的封装层,通常采用无机层和有机层多层交叠设置的结构作为封装层。但是此种封装层中的膜层数多且每一层结构均需要根据材料采用相应的膜制备工艺制成,因此制造封装层的过程中所需的膜制备工艺种类多、步骤多且制造时间长,制造过程需要在惰性保护环境(例如:真空或者氮气环境)中,且制造过程需要采用多种复杂设备,因而提高了生产成本,降低了生产效率。
发明内容
本发明提供一种复合膜及其制造方法和封装结构,用于降低生产成本,提高生产效率。
为实现上述目的,本发明提供了一种复合膜,包括:基质膜和位于所述基质膜内部的至少一个阻水膜;所述基质膜的数量为多层,且多层所述基质膜之间相互独立;每层所述基质膜内的阻水膜的数量为多个且均设置于同一平面上,相邻层所述基质膜内部的阻水膜交错设置。
可选地,所述阻水膜之间形成有间隔,某一层所述基质膜内部的阻水膜之间的间隔与相邻层所述基质膜内部的阻水膜相对设置。
可选地,所述基质膜的数量为2至4层。
可选地,所述基质膜的厚度为1μm至1000μm。
可选地,所述基质膜为柔性结构,所述阻水膜为刚性结构。
为实现上述目的,本发明提供了一种封装结构,其包括:衬底基板、有机发光二极管和上述的复合膜,所述有机发光二极管位于所述衬底基板上,所述复合膜位于所述有机发光二极管上。
为实现上述目的,本发明提供了一种复合膜的制造方法,其包括:
形成基质膜,且在形成基质膜的工艺过程中在所述基质膜内部形成至少一个阻水膜;所述基质膜的数量为多层,每层所述基质膜内的阻水膜的数量为多个且均设置于同一平面上,相邻层所述基质膜内部的阻水膜交错设置。
可选地,所述形成基质膜,且在形成基质膜的工艺过程中在所述基质膜内部形成至少一个阻水膜包括:
形成一基质膜前驱层;
在所述基质膜前驱层上形成至少一个阻水膜;
在所述阻水膜上形成另一基质膜前驱层;
进行固化处理,以形成所述基质膜。
可选地,所述的复合膜的制造方法还包括:
将形成的多层所述基质膜进行贴合处理。
可选地,所述进行固化处理包括:通过UV固化或者热固化的方式实现固化处理。
本发明具有以下有益效果:
本发明提供的复合膜及其制造方法和封装结构的技术方案中,复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED 进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
附图说明
图1为本发明实施例一提供的一种复合膜的结构示意图;
图2为基质膜11的平面示意图;
图3为本发明实施例二提供的一种复合膜的结构示意图;
图4为本发明实施例三提供的一种封装结构的示意图;
图5为本发明实施例五的一种复合膜的制造方法的流程图;
图6a为实施例五中形成基质膜前驱层的一种示意图;
图6b为实施例五中形成阻水膜的示意图;
图6c为实施例五中形成基质膜前驱层的另一种示意图;
图6d为实施例五中固化处理的示意图;
图7为本发明实施例六提供的一种复合膜的制造方法的流程图;
图8a为实施例六中形成基质膜前驱层的一种示意图;
图8b为实施例六中形成阻水膜的示意图;
图8c为实施例六中形成基质膜前驱层的另一种示意图;
图8d为实施例六中形成阻水膜和基质膜前驱层的示意图;
图8e为实施例六中形成阻水膜和基质膜前驱层的另一种示意图;
图8f为实施例六中固化处理的示意图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案,下面结合附图对本发明提供的复合膜及其制造方法和封装结构进行详细描述。
图1为本发明实施例一提供的一种复合膜的结构示意图,如图1所示,该复合膜包括:基质膜和位于基质膜内部的至少一个阻水膜。
基质膜的数量可以为多层,多个基质膜叠加设置。优选地,所述基质膜的数量为2至4层。本实施例中,以基质膜的数量为3层为例进行描述,则3层基质膜分别包括:基质膜11、基质膜12和基质膜13,基质膜 11、基质膜12和基质膜13叠加设置,且基质膜11位于基质膜12的上方,基质膜12位于基质膜13的上方。
优选地,基质膜的厚度为1μm至1000μm。本实施例中,基质膜的厚度采用1μm至1000μm,可有效避免基质膜的厚度太薄而导致的机械性能差和阻水性差的问题以及避免基质膜的厚度太厚而导致的弯折性差和透光性差的问题,从而既保证了基质膜具备良好的机械性能和阻水性能,又保证了基质膜具备良好的弯折性和透光性。优选地,每层基质膜的厚度相同。每层基质膜采用相同的厚度便于制造。
优选地,基质膜为柔性结构,则基质膜的材料可包括:聚亚酰胺、聚丙烯酸酯、聚乙烯,聚丙烯、基苯乙烯、聚对苯二甲酸乙二醇酯、聚砜醚、聚对萘二甲酸乙二酯醇、聚碳酸酯、聚氯乙烯、聚甲基丙烯酸甲酯、聚对苯二甲酸丁二醇酯或者聚对苯二乙基砜;阻水膜为刚性结构,则阻水膜的材料可包括:SiOx、SiNx、Al2O3、Al、Ag、金、超薄玻璃、金刚石、石墨烯、ZnO、ZrO或者TiO2。
每层基质膜内的阻水膜的数量为多个,阻水膜能够阻隔水氧分子。以基质膜11为例,图2为基质膜11的平面示意图,结合图1和图2所示,基质膜11内的阻水膜的数量为多个,图1和图2中示出了位于基质膜11 内部的阻水膜111、阻水膜112和阻水膜113。优选地,基质膜内部的多个阻水膜设置于同一平面上,基质膜11内部的阻水膜111、阻水膜112 和阻水膜113设置于同一平面上。多个阻水膜位于同一平面上使得阻水膜的制造过程简单且易于实现。对基质膜12和基质膜13内部阻水膜的描述可参见基质膜11,此处不再赘述。优选地,每层基质膜内的阻水膜均匀设置。
优选地,相邻层基质膜内部的阻水膜交错设置,如图1和图2所示,基质膜11内部的阻水膜和基质膜12内部的阻水膜交错设置,基质膜12 和基质膜13内部的阻水膜交错设置。具体地,阻水膜之间形成有间隔,某一层基质膜内部的阻水膜之间的间隔与相邻层基质膜内部的阻水膜相对设置,此时该间隔被相邻层基质膜内部的阻水膜覆盖,如图1和图2所示,例如:基质膜11内部的阻水膜111和阻水膜112之间形成有间隔114,间隔114与相邻的基质膜12内部的阻水膜121相对设置。由于基质膜采用的是柔性结构,而阻水膜采用的是刚性结构,因此阻水膜之间设置间隔的目的在于保证整个复合膜能够进行一定程度的弯曲,保证了复合膜具有良好的弯曲性,从而使得复合膜能够适用于柔性OLED。本实施例中,复合膜的弯曲性与阻水膜的尺寸和排布位置相关,因此在实际应用中可根据所需的弯曲性设置阻水膜的尺寸和排布位置。水氧分子可透过阻水膜之间形成的间隔,因此本实施例采用间隔与相邻层基质膜内部的阻水膜相对设置的结构,图1中的虚线箭头为水氧分子在复合膜中的渗透路径,水氧分子透过基质膜11内部的间隔后被基质膜12内部的阻水膜阻挡而延缓了渗透过程,水氧分子进一步透过基质膜12内部的间隔后被基质膜13内的阻水膜阻挡而进一步延缓了渗透过程。综上所述,本实施例采用某一层基质膜内部的间隔与相邻层基质膜内部的阻水膜相对设置的结构,通过延长水氧分子的渗透路径的长度,极大的延缓了水氧分子的渗透过程,从而保证了复合膜具有良好的阻水性。
本实施例提供的复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
图3为本发明实施例二提供的一种复合膜的结构示意图,如图3所示,该复合膜包括:基质膜31和位于基质膜31内部的至少一个阻水膜。
基质膜31的数量为一层。优选地,基质膜的厚度为1μm至1000μm。本实施例中,基质膜的厚度采用1μm至1000μm,可有效避免基质膜的厚度太薄而导致的机械性能差和阻水性差的问题以及避免基质膜的厚度太厚而导致的弯折性差和透光性差的问题,从而既保证了基质膜具备良好的机械性能和阻水性能,又保证了基质膜具备良好的弯折性和透光性。
优选地,基质膜为柔性结构,则基质膜的材料可包括:聚亚酰胺、聚丙烯酸酯、聚乙烯,聚丙烯、基苯乙烯、聚对苯二甲酸乙二醇酯、聚砜醚、聚对萘二甲酸乙二酯醇、聚碳酸酯、聚氯乙烯、聚甲基丙烯酸甲酯、聚对苯二甲酸丁二醇酯或者聚对苯二乙基砜;阻水膜为刚性结构,则阻水膜的材料可包括:SiOx、SiNx、Al2O3、Al、Ag、金、超薄玻璃、金刚石、石墨烯、ZnO、ZrO或者TiO2。
阻水膜的数量为多个,阻水膜能够阻隔水氧分子。多个阻水膜分层设置。本实施例中,以基质膜31内部设置3层阻水膜为例进行描述,如图3所示,位于第一层的阻水膜包括:阻水膜311、阻水膜312和阻水膜 313,位于第二层的阻水膜包括:阻水膜314、阻水膜315和阻水膜316,位于第三层的阻水膜包括:阻水膜317、阻水膜318和阻水膜319。优选地,位于同层的多个阻水膜设置于同一平面上。优选地,阻水膜均匀设置。
优选地,相邻层的阻水膜交错设置。如图3所示,位于第一层的阻水膜和位于第二层的阻水膜交错设置,位于第二层的阻水膜和位于第三层的阻水膜交错设置。具体地,每一层的阻水膜之间形成有间隔,某一层阻水膜之间的间隔与相邻层阻水膜相对设置,此时该间隔被相邻层阻水膜覆盖,如图3所示,例如:位于第一层的阻水膜311和阻水膜312之间形成有间隔320,间隔320与第二层的阻水膜314相对设置。由于基质膜采用的是柔性结构,而阻水膜采用的是刚性结构,因此阻水膜之间设置间隔的目的在于保证整个复合膜能够进行一定程度的弯曲,保证了复合膜具有良好的弯曲性,从而使得复合膜能够适用于柔性OLED。本实施例中,复合膜的弯曲性与阻水膜的尺寸和排布位置相关,因此在实际应用中可根据所需的弯曲性设置阻水膜的尺寸和排布位置。水氧分子可透过阻水膜之间形成的间隔,因此本实施例采用间隔与相邻层基质膜内部的阻水膜相对设置的结构,图3中的虚线箭头为水氧分子在复合膜中的渗透路径,水氧分子透过位于第一层的阻水膜之间的间隔后被位于第二层阻水膜阻挡而延缓了渗透过程,水氧分子进一步透过位于第二层的阻水膜之间的间隔后被位于第三层的阻水膜阻挡而进一步延缓了渗透过程。综上所述,本实施例采用某一层阻水膜之间的间隔与相邻层阻水膜相对设置的结构,通过延长水氧分子的渗透路径的长度,极大的延缓了水氧分子的渗透过程,从而保证了复合膜具有良好的阻水性。
本实施例提供的复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
图4为本发明实施例三提供的一种封装结构的示意图,如图4所示,该封装结构包括:衬底基板1、OLED 2和复合膜3,OLED 2位于衬底基板 1上,复合膜3位于OLED 2上。其中,复合膜3可采用上述实施例一或者实施例二中所述的复合膜,此处不再详细描述。
复合膜3能够对OLED 2起到阻水的作用。可选地,复合膜3覆盖整个衬底基板1。
可选地,该封装结构还可包括:缓冲层4,该缓冲层4位于OLED 2 和复合膜3之间,且该缓冲层4覆盖整个衬底基板1。
本实施例提供的封装结构中,复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
本发明实施例四提供了一种复合膜的制造方法,该方法包括:形成基质膜,且在形成基质膜的工艺过程中在基质膜内部形成至少一个阻水膜。
本实施例提供的复合膜的制造方法制成的复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
图5为本发明实施例五的一种复合膜的制造方法的流程图,如图5 所示,该方法包括:
步骤101、形成一基质膜前驱层。
图6a为实施例五中形成基质膜前驱层的一种示意图,如图6a所示,通过旋涂、刮涂或者喷涂形成一层基质膜前驱层61。
步骤102、在基质膜前驱层上形成至少一个阻水膜。
图6b为实施例五中形成阻水膜的示意图,如图6b所示,通过放置、物理沉积或者化学沉积在基质膜前驱层61上形成阻水膜62。
步骤103、在阻水膜上形成另一基质膜前驱层。
图6c为实施例五中形成基质膜前驱层的另一种示意图,如图6c所示,通过旋涂、刮涂或者喷涂在阻水膜62上形成一层基质膜前驱层63。
步骤104、对完成步骤103的结构进行固化处理,以形成基质膜。
图6d为实施例五中固化处理的示意图,如图6d所示,通过UV固化或者热固化的方式对完成步骤103的结构进行固化处理,以形成基质膜 64。
步骤105、重复执行步骤101至步骤104,制备出多层基质膜。
步骤106、将形成的多层基质膜进行贴合处理。
具体地,可通过贴附设备对形成的多层基质膜进行贴合处理,以形成复合膜。
本实施例提供的复合膜的制造方法可用于制造上述实施例一所述的复合膜,因此对于基质膜和阻水膜的具体描述可参见上述实施例一,此处不再赘述。
本实施例提供的复合膜的制造方法制成的复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
图7为本发明实施例六提供的一种复合膜的制造方法的流程图,如图7所示,该方法包括:
步骤201、形成一基质膜前驱层。
图8a为实施例六中形成基质膜前驱层的一种示意图,如图8a所示,通过旋涂、刮涂或者喷涂形成一层基质膜前驱层81。
步骤202、在基质膜前驱层上形成至少一个阻水膜。
图8b为实施例六中形成阻水膜的示意图,如图8b所示,通过放置、物理沉积或者化学沉积在基质膜前驱层81上形成阻水膜82。
步骤203、在阻水膜上形成另一基质膜前驱层。
图8c为实施例六中形成基质膜前驱层的另一种示意图,如图8c所示,通过旋涂、刮涂或者喷涂在阻水膜82上形成一层基质膜前驱层83。
步骤204、重复执行步骤202和步骤203,直至形成所需层数的阻水膜。
本实施例中阻水膜所需层数为三层。图8d为实施例六中形成阻水膜和基质膜前驱层的示意图,如图8d所示,通过放置、物理沉积或者化学沉积在基质膜前驱层83上形成阻水膜84,并通过旋涂、刮涂或者喷涂在阻水膜84上形成一层基质膜前驱层85;图8e为实施例六中形成阻水膜和基质膜前驱层的另一种示意图,如图8e所示,通过放置、物理沉积或者化学沉积在基质膜前驱层85上形成阻水膜86,并通过旋涂、刮涂或者喷涂在阻水膜86上形成一层基质膜前驱层87。
步骤205、对完成步骤204的结构进行固化处理,以形成基质膜。
图8f为实施例六中固化处理的示意图,如图8f所示,通过UV固化或者热固化的方式对完成步骤204的结构进行固化处理,以形成基质膜8。
采用本实施例提供的复合膜的制造方法制成的复合膜中,基质膜的数量为一层,阻水膜的数量为多个且多个阻水膜分层设置。
本实施例提供的复合膜的制造方法可用于制造上述实施例二所述的复合膜,因此对于基质膜和阻水膜的具体描述可参见上述实施例二,此处不再赘述。
本实施例提供的复合膜的制造方法制成的复合膜包括基质膜和位于基质膜内部的至少一个阻水膜,采用该复合膜对OLED进行封装时可直接将该复合膜设置于OLED之上,封装工艺过程中所采用的工艺简单,工艺步骤少,工艺时间短,且所需设备较为简单,从而降低了生产成本,提高了生产效率。
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。
Claims (10)
1.一种复合膜,其特征在于,包括:基质膜和位于所述基质膜内部的至少一个阻水膜;所述基质膜的数量为多层,且多层所述基质膜之间相互独立;每层所述基质膜内的阻水膜的数量为多个且均设置于同一平面上,相邻层所述基质膜内部的阻水膜交错设置。
2.根据权利要求1所述的复合膜,其特征在于,所述阻水膜之间形成有间隔,某一层所述基质膜内部的阻水膜之间的间隔与相邻层所述基质膜内部的阻水膜相对设置。
3.根据权利要求1或2所述的复合膜,其特征在于,所述基质膜的数量为2至4层。
4.根据权利要求1或2所述的复合膜,其特征在于,所述基质膜的厚度为1μm至1000μm。
5.根据权利要求1或2所述的复合膜,其特征在于,所述基质膜为柔性结构,所述阻水膜为刚性结构。
6.一种封装结构,其特征在于,包括:衬底基板、有机发光二极管和上述权利要求1至5任一所述的复合膜,所述有机发光二极管位于所述衬底基板上,所述复合膜位于所述有机发光二极管上。
7.一种复合膜的制造方法,其特征在于,包括:
形成基质膜,且在形成基质膜的工艺过程中在所述基质膜内部形成至少一个阻水膜;所述基质膜的数量为多层,每层所述基质膜内的阻水膜的数量为多个且均设置于同一平面上,相邻层所述基质膜内部的阻水膜交错设置。
8.根据权利要求7所述的复合膜的制造方法,其特征在于,所述形成基质膜,且在形成基质膜的工艺过程中在所述基质膜内部形成至少一个阻水膜包括:
形成一基质膜前驱层;
在所述基质膜前驱层上形成至少一个阻水膜;
在所述阻水膜上形成另一基质膜前驱层;
进行固化处理,以形成所述基质膜。
9.根据权利要求8所述的复合膜的制造方法,其特征在于,还包括:
将形成的多层所述基质膜进行贴合处理。
10.根据权利要求8或9所述的复合膜的制造方法,其特征在于,所述进行固化处理包括:通过UV固化或者热固化的方式实现固化处理。
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