CN107908082B - Exposure automatic adjusting system and method of exposure machine - Google Patents
Exposure automatic adjusting system and method of exposure machine Download PDFInfo
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- CN107908082B CN107908082B CN201711479352.XA CN201711479352A CN107908082B CN 107908082 B CN107908082 B CN 107908082B CN 201711479352 A CN201711479352 A CN 201711479352A CN 107908082 B CN107908082 B CN 107908082B
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- line distance
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses an exposure automatic regulating system of an exposure machine, which comprises: the system comprises an acquisition unit, a processing unit and a control unit, wherein the acquisition unit is used for acquiring a preset line distance preset by the system; the modeling unit is used for establishing a function model between a preset line distance and an exposed measurement line distance corresponding to the preset line distance; the calculation unit is used for substituting the detected current preset line distance into the function model to obtain the current measurement line distance; and the exposure adjusting unit is used for adjusting the exposure of the exposure machine according to the current measuring line distance. The invention also discloses an exposure automatic adjusting method of the exposure machine. The method determines the corresponding relation between the preset line distance and the measured actual line distance by adopting the relation between the line distances of the base plate patterns before and after exposure, determines the due measured line distance after the exposure by combining the corresponding relation with the system preset line distance acquired in real time, and then adjusts the exposure according to the measured line distance, thereby realizing the automatic adjustment of the exposure and leading the exposure to be capable of realizing the expected process parameters all the time.
Description
Technical Field
The invention relates to the technical field of photoetching, in particular to an exposure automatic adjusting system and method of an exposure machine.
Background
At present, in the production of a liquid crystal panel, as long as exposure adjustment parameters of an exposure machine are manually input, in the actual production process, due to interference of various external variables, the Offline CD (off-line dimension, i.e., measurement performed separately from a machine) of a photoresist obtained by a process of a color film factory fluctuates, and at this time, the exposure of the exposure machine needs to be manually adjusted, so as to expect to obtain desired process parameters.
In order to prevent overlarge fluctuation caused by interference, in the actual operation process, the measurement result of an Inline CD machine table needs to be artificially monitored, so that an actual fluctuation trend is expected to be obtained, the exposure of an exposure machine can be timely and effectively adjusted, the situation that the monitoring is not in place can be generated due to the fact that the manpower is consumed in data monitoring, the phenomenon that the Offline CD of a product fluctuates too much is caused, and adverse effects are caused on the quality of the product.
Disclosure of Invention
In view of the defects of the prior art, the invention provides an exposure automatic adjusting system and method of an exposure machine, which can realize automatic monitoring and automatic adjustment of the exposure machine, liberate labor force and ensure exposure precision.
In order to achieve the purpose, the invention adopts the following technical scheme:
an exposure automatic regulating system of an exposure machine comprises:
the acquisition unit is used for acquiring a preset line distance of a substrate pattern preset by a system;
the modeling unit is used for establishing a function model of the measuring line distances and the preset line distances according to the plurality of groups of preset line distances and the exposed measuring line distance data corresponding to the preset line distances;
the calculation unit is used for substituting the preset line distance of the current substrate pattern detected by the acquisition unit into a function model of the measurement line distance and the preset line distance to obtain the corresponding measurement line distance of the current substrate pattern;
and the exposure adjusting unit is used for adjusting the exposure of the exposure machine according to the measuring line distance of the current substrate pattern obtained by the calculating unit.
As one of the embodiments, the relationship between the exposure amount of the exposure machine and the measured line pitch of the current substrate pattern obtained by the calculation unit satisfies: and k is less than 0, wherein y is the exposure amount of the exposure machine, and x is the measured line distance of the current substrate pattern obtained by the calculation unit.
As an embodiment, the automatic exposure amount adjusting system of the exposure machine further includes a judging unit, wherein the judging unit is configured to compare the measured line distance of the current substrate pattern obtained by the calculating unit with a preset line distance range, and when the measured line distance exceeds the preset line distance range, the exposure machine suspends operation.
As an implementation manner, the automatic exposure amount adjusting system of the exposure machine further comprises a warning unit, and the warning unit is used for sending out a reminding signal when the measured line distance exceeds the preset line distance range.
As one embodiment, the preset line distance range is that the preset line distance is shifted up and down by no more than 10%.
Another object of the present invention is to provide an exposure amount automatic adjusting method for an exposure machine, comprising:
establishing a function model of the measuring line distances and the preset line distances according to the plurality of groups of preset line distances and the exposed measuring line distance data corresponding to the preset line distances;
acquiring a preset line distance of a substrate pattern preset by a system;
substituting the acquired preset line distance of the current substrate pattern into a function model of the measurement line distance and the preset line distance to acquire a corresponding measurement line distance of the current substrate pattern;
and adjusting the exposure of the exposure machine according to the obtained measuring line distance of the current substrate pattern.
As one of the embodiments, the relationship between the exposure amount of the exposure machine and the obtained measurement line pitch of the current substrate pattern satisfies: and k is less than 0, wherein y is the exposure amount of the exposure machine, and x is the measured line distance of the obtained current substrate pattern.
As one embodiment, the method for automatically adjusting the exposure of the exposure machine further comprises: and comparing the obtained measuring line distance of the current substrate pattern with a preset line distance range, and pausing the operation of the exposure machine when the measuring line distance exceeds the preset line distance range.
As one embodiment, the method for automatically adjusting the exposure of the exposure machine further comprises: and sending out a reminding signal when the measuring line distance exceeds the preset line distance range.
As one embodiment, the preset line distance range is that the preset line distance is shifted up and down by no more than 10%.
The invention determines the corresponding relation between the preset line distance and the measured actual line distance by adopting the difference relation between the line distances of the substrate patterns before and after exposure, determines the actual line distance of the substrate patterns which can be manufactured by the exposure machine by combining the corresponding relation with the line distance of the substrate patterns preset by the system collected in real time, and then adjusts the exposure of the exposure machine according to the actual line distance. The mode realizes the automatic adjustment of the exposure, and can ensure that the exposure can always realize the expected process parameters.
Drawings
FIG. 1 is a block diagram of an automatic exposure control system according to an embodiment of the present invention;
FIG. 2 is another block diagram of the automatic exposure adjustment system according to the embodiment of the present invention;
FIG. 3 is a flowchart of an automatic exposure adjustment method according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the automatic exposure amount adjusting system of the exposure machine according to the embodiment of the present invention mainly includes:
an acquisition unit 1, configured to acquire a preset line pitch L1 of a substrate pattern preset by a system;
the modeling unit 2 is used for establishing a function model of the measured line distances and the preset line distances according to a plurality of groups of preset line distances L1 and the exposed measured line distance L2 data corresponding to the preset line distances, the plurality of groups of preset line distances and the exposed measured line distance L2 data corresponding to the preset line distances can be obtained by artificially performing repeated processes on the exposure machine for a plurality of times, in the process, the preset line distances L1 can be automatically obtained, and the measured line distances L2 are uploaded after the measurement results are manually read, or can be uploaded to an adjusting system after being recorded by a machine;
the calculating unit 3 is configured to bring the preset line distance L1 of the current substrate pattern obtained by the obtaining unit into a function model of the measurement line distance L2 and the preset line distance L1, and obtain a corresponding measurement line distance L2 of the current substrate pattern;
an exposure amount adjusting unit 4 for adjusting the exposure amount of the exposure machine according to the measurement line pitch of the current substrate pattern obtained by the calculating unit.
As one embodiment, the predetermined line distance L1 is an on-line measured dimension, and the measured line distance L2 is an off-line measured dimension of the substrate pattern. The preset line distance L1 is always a fixed and unchangeable size, and the difference value between the measured line distance L2 and the preset line distance L1 is related to the exposure amount of the exposure machine, and the relationship between the exposure amount of the exposure machine and the measured line distance L2 of the current substrate pattern obtained by the calculation unit satisfies the following conditions: y is kx + b, and k is less than 0, wherein y is the exposure amount of the exposure machine, and x is the measured line distance of the current substrate pattern obtained by the calculation unit, i.e., the extent to which the exposure amount of the exposure machine needs to be adjusted is inversely proportional to the actually measured variation of the measured line distance L2.
According to the invention, the exposure required by the exposure machine can be accurately obtained by indirectly acquiring the theoretical measurement line distance L2, so that the accurate adjustment of the exposure is realized, and the phenomenon of inaccurate adjustment of the exposure caused by fluctuation of the measurement line distance L2 due to the interference of external variables is avoided.
In addition, as a modification of the above embodiment, as shown in fig. 2, the automatic exposure amount adjusting system of the present embodiment further includes a judging unit 5, the judging unit 5 is configured to compare the measured line distance L2 of the current substrate pattern obtained by the calculating unit 3 with a preset line distance range, and when the measured line distance L2 exceeds the preset line distance range, the exposure machine is suspended. Furthermore, the automatic exposure amount adjusting system further comprises a warning unit 6, when the judging unit 5 judges that the measuring line distance L2 exceeds the preset line distance range, the warning unit can also send out a warning signal, and when the measuring line distance L2 exceeds the preset line distance range, the measuring line distance L2 is considered not to be in the manufacturing precision range of the exposure machine, and meanwhile, the warning unit sends out warning information, such as voice prompt or signal light prompt, so that the equipment cannot realize the specified manufacturing process, and the manual intervention is facilitated. In one embodiment, the predetermined line distance range is that the predetermined line distance L1 is shifted up and down by no more than 10%, and the predetermined line distance L1 is beyond the range, which means that the process cannot be realized.
As shown in fig. 3, the present invention further provides an automatic exposure adjusting method for an exposure machine, comprising:
s01, establishing a function model of the measuring line distance L2 and the preset line distance L1 according to a plurality of groups of preset line distances L1 and the corresponding data of the measuring line distances L2 after exposure, wherein the preset line distance L1 is an online measuring size, and the measuring line distance L2 is an offline measuring size of the substrate pattern;
s02, acquiring a preset line distance L1 of a substrate pattern preset by a system;
s03, substituting the acquired preset line distance L1 of the current substrate pattern into a function model of the measuring line distance L2 and the preset line distance L1, and acquiring the corresponding measuring line distance L2 of the current substrate pattern;
s04, adjusting the exposure amount of the exposure machine according to the obtained measuring line distance L2 of the current substrate pattern, wherein the relationship between the exposure amount y of the exposure machine and the obtained measuring line distance L2 of the current substrate pattern satisfies: y is kx + b, and k is less than 0, when adjusting the exposure of the exposure machine, the adjustment range of the exposure machine is in inverse proportion to the actually measured change of the measuring line distance L2.
As one embodiment, the method for automatically adjusting the exposure amount of the exposure machine further comprises: after the above step S03 and before the step S04, the obtained measured line distance L2 of the current substrate pattern is compared with a preset line distance range, preferably, the preset line distance range is shifted up and down by not more than 10% from the preset line distance L1. When the measured line distance L2 exceeds the preset line distance range, the exposure machine suspends operation, and if the preset line distance range is satisfied, the process continues to step S04. When the measured line distance L2 exceeds the preset line distance range, the system sends out a reminding signal to remind the human intervention.
The invention determines the corresponding relation between the preset line distance and the measured actual line distance by adopting the difference relation between the line distances of the substrate patterns before and after exposure, determines the actual line distance of the substrate patterns which can be manufactured by the exposure machine by combining the corresponding relation with the line distance of the substrate patterns preset by the system collected in real time, and then adjusts the exposure of the exposure machine according to the actual line distance. The mode realizes the automatic adjustment of the exposure, and can ensure that the exposure can always realize the expected process parameters.
The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
Claims (4)
1. An exposure automatic regulating system of an exposure machine is characterized by comprising:
the acquisition unit is used for acquiring a preset line distance of a substrate pattern preset by a system;
the modeling unit is used for establishing a function model of the measuring line distances and the preset line distances according to the plurality of groups of preset line distances and the exposed measuring line distance data corresponding to the preset line distances;
the calculation unit is used for substituting the preset line distance of the current substrate pattern acquired by the acquisition unit into a function model of the measurement line distance and the preset line distance to acquire the corresponding measurement line distance of the current substrate pattern;
an exposure amount adjusting unit for adjusting the exposure amount of the exposure machine according to the measurement line distance of the current substrate pattern obtained by the calculating unit; the relationship between the exposure amount of the exposure machine and the measured line distance of the current substrate pattern obtained by the calculation unit satisfies: y is kx + b, and k is less than 0, wherein y is the exposure amount of an exposure machine, and x is the measured line distance of the current substrate pattern obtained by the calculation unit;
and the judging unit is used for comparing the measured line distance of the current substrate pattern obtained by the calculating unit with a preset line distance range, and when the measured line distance exceeds the preset line distance range, the exposure machine stops working, wherein the preset line distance range is that the vertical offset of the preset line distance is not more than 10%.
2. The system for automatically adjusting the exposure of an exposure machine according to claim 1, further comprising an alarm unit for sending out a warning signal when the measured line distance exceeds the preset line distance range.
3. An exposure automatic adjusting method of an exposure machine is characterized by comprising the following steps:
establishing a function model of the measuring line distances and the preset line distances according to the multiple groups of preset line distances and the exposed measuring line distance data corresponding to the preset line distances;
acquiring a preset line distance of a substrate pattern preset by a system;
substituting the acquired preset line distance of the current substrate pattern into a function model of the measurement line distance and the preset line distance to acquire a corresponding measurement line distance of the current substrate pattern; comparing the obtained measurement line distance of the current substrate pattern with a preset line distance range, and when the measurement line distance exceeds the preset line distance range, pausing the operation of the exposure machine, wherein the preset line distance range is that the vertical offset of the preset line distance is not more than 10%;
adjusting the exposure of an exposure machine according to the obtained measuring line distance of the current substrate pattern;
the relationship between the exposure amount of the exposure machine and the obtained measurement line distance of the current substrate pattern satisfies: and k is less than 0, wherein y is the exposure amount of the exposure machine, and x is the measured line distance of the obtained current substrate pattern.
4. The automatic exposure amount adjustment method of an exposure machine according to claim 3, further comprising: and sending out a reminding signal when the measuring line distance exceeds the preset line distance range.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711479352.XA CN107908082B (en) | 2017-12-29 | 2017-12-29 | Exposure automatic adjusting system and method of exposure machine |
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| CN201711479352.XA CN107908082B (en) | 2017-12-29 | 2017-12-29 | Exposure automatic adjusting system and method of exposure machine |
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| CN107908082A CN107908082A (en) | 2018-04-13 |
| CN107908082B true CN107908082B (en) | 2020-08-28 |
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| US7960078B2 (en) * | 2004-11-16 | 2011-06-14 | Tokyo Electron Limited | Exposure condition setting method, substrate processing device, and computer program |
| CN104898377A (en) * | 2014-03-04 | 2015-09-09 | 郑博文 | Optical processing system |
| CN106209378B (en) * | 2016-07-06 | 2019-10-25 | ***股份有限公司 | Safety information interaction method based on virtual secure information carrier |
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