CN107907205A - A kind of wireless passive sonic surface wave vibrating sensor - Google Patents
A kind of wireless passive sonic surface wave vibrating sensor Download PDFInfo
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- CN107907205A CN107907205A CN201711033799.4A CN201711033799A CN107907205A CN 107907205 A CN107907205 A CN 107907205A CN 201711033799 A CN201711033799 A CN 201711033799A CN 107907205 A CN107907205 A CN 107907205A
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- 238000005538 encapsulation Methods 0.000 claims abstract description 37
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000009434 installation Methods 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims description 32
- 230000003139 buffering effect Effects 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 8
- 230000035945 sensitivity Effects 0.000 claims description 8
- 238000010897 surface acoustic wave method Methods 0.000 claims description 8
- 229910003327 LiNbO3 Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 230000000644 propagated effect Effects 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910012463 LiTaO3 Inorganic materials 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 7
- 238000012544 monitoring process Methods 0.000 description 7
- 230000001133 acceleration Effects 0.000 description 6
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
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- 239000000872 buffer Substances 0.000 description 4
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- General Physics & Mathematics (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The present invention relates to a kind of wireless passive sonic surface wave vibrating sensor, it includes：Antenna (1), match circuit (2), circuit pcb board (3), encapsulation pipe cap (4), encapsulation tube support (5), cantilever beam fixed pedestal (6), piezoelectric cantilever (8), the first SAW device (9), the second SAW device (10), encapsulation tube support (5)；Capping encapsulation pipe cap (4) on encapsulation tube support (5), forms a closed hollow rectangular space；In the rectangular space, cantilever beam fixed pedestal (6) is installed on encapsulation tube support (5)；One end of piezoelectric cantilever (8) is located on cantilever beam fixed pedestal (6), as fixing end (16), and in its obverse and reverse sides and the first SAW device of corresponding installation (9) and the second SAW device (10)；The other end of piezoelectric cantilever (8) is free end (17), and the quality oscillator (11) is fixedly mounted on it.
Description
Technical field
The invention belongs to the technical field of acoustic technique measurement vibration, and in particular to a kind of wireless passive sonic surface wave vibration
Sensor.
Background technology
Mechanical oscillation are the information sources of the diagnosis and monitoring of various machine inner structures and periphery protection.Based on vibration
Detection can judge technical conditions, design and fabrication quality and reliability etc. of machinery.Mechanical equipment has in operation
Oscillation phenomenon, the vibration more than normal range (NR) can increase mechanical fatigue, influence the service life of parts, or even parts fracture occurs
And equipment damage.Therefore the vibration to critical mechanical component is detected, and can be tieed up in time with effective monitoring equipment defective mode
Shield, plays the role of pinpointing the problems and process problem in advance, this is for keeping the safety in production, extending service life of equipment, save cost
It is of great significance.
At present, generally by the way of wired measuring there is wiring complexity in traditional mechanical oscillation monitoring system, and cable is easy
In abrasion, lack flexibility, it is of high cost, the shortcomings of maintainable difference, rotated and mobile component or equipment for a large amount of, it is wired
Measurement method is difficult to efficiently accomplish monitoring task.Reciprocating compressor is that the one kind for being widely used in petroleum chemical industry is moved
Power machinery, it is with its price is low, the thermal efficiency is high, manufacturing technology is ripe, variable working condition and multiple compressors networking adaptability are good etc.
Advantage and be widely used.But because have the characteristics that operating mode change greatly, forms of motion complexity and running environment it is changeable and
Show the higher one side of rate of breakdown.Bent axle pull rod carries out 3~5 reciprocating motions each second, to motion state target
Monitoring cannot be in a wireless manner；Regular maintenance is inconvenient, and sensor carries battery.
Wherein, wireless passive sonic surface wave sensing technology principle is by having the function of the radar emission of radio-frequency receiving-transmitting and sound table
Wave sensor part is received and changed by the interdigital transducer of surface acoustic wave sensor part by antenna with the electromagnetic wave signal of frequency
Into the surface acoustic wave propagated along piezoelectric crystal surface, surface acoustic wave is reflected and by interdigital transducer in communication process by reflector
Electromagnetic wave signal is re-converted into, then is received via antenna by radar.During acoustic surface wave propagation, such as it is subject to power, magnetic, temperature
Degree etc. influences, i.e., can directly affect acoustic propagation velocity and amplitude.Pass through demodulated received signal, you can obtain corresponding heat transfer agent.
The present invention designs a kind of novel radio passive sonic surface wave vibrating sensing of girder structure alliteration surface wave (SAW) device model
Device, measures vibration, so as to improve sensitivity and the resolving power of sensor at the same time by designing two SAW devices.
The content of the invention
It is an object of the present invention to solve existing sound surface vibration monitoring device there are drawbacks described above, and be based on
To the monitoring needs of motion state target in a wireless manner；Convenient in view of regular maintenance, sensor cannot carry battery.
Therefore, there is incremental wireless passive sonic surface wave vibrating sensor the present invention provides a kind of.The present invention uses wireless nothing
Source sensing technology, practical application of the wireless and passive sensing technology under the conditions of some extreme environments such as high temperature and pressure are also great
Potentiality.
To achieve the above object, by carrying out the optimization design research to girder structure, a kind of wireless and passive sound table is designed
Surface wave vibrating sensor.Therefore, the present invention provides a kind of wireless passive sonic surface wave vibrating sensor, different from traditional sound table
Surface wave vibrating sensor, the wireless passive sonic surface wave vibrating sensor include：Antenna, match circuit, circuit pcb board, envelope
Tubulature cap, encapsulation tube support, cantilever beam fixed pedestal, piezoelectric cantilever, the first SAW device, the second SAW device,
Quality oscillator.The antenna, the match circuit, the encapsulation tube support, institute is sequentially fixedly mounted on the circuit pcb board successively
State capping on encapsulation tube support and the encapsulation pipe cap is installed, the two forms a closed hollow rectangular space；In the rectangle
In space, the cantilever beam fixed pedestal is fixedly mounted on the encapsulation tube support；One end of the piezoelectric cantilever is positioned at described
On cantilever beam fixed pedestal, as fixing end, and the obverse and reverse sides in the fixing end and corresponding installation first surface acoustic wave
Device and second SAW device；The other end of the piezoelectric cantilever is free end, and fixed on the free end
The quality oscillator is installed.
The circuit pcb board is circuit printed circuit board.
Solid is buffered below installation on the encapsulation tube support, buffering is solid above installation on the inner wall of the encapsulation pipe cap
Body.
The top buffering solid and lower section buffering solid are separately positioned on the free end of the piezoelectric cantilever
At upper and lower maximum displacement, for protecting the piezoelectric cantilever, prevent from being damaged because Oscillation Amplitude is excessive.
The lower section buffering solid and top buffering solid are made of flexible material, and its thermal coefficient of expansion
It is small, such as rubber, silica gel, TPU, TPE, TPR etc..The lower section buffers the distance between solid and the piezoelectric cantilever, is equal to
The top buffers the distance between solid and the quality oscillator；And top buffering solid and the quality oscillator it
Between distance be more than the piezoelectric cantilever free end end maximum vibration displacement.
Preferably, lower section buffering the distance between the solid and the piezoelectric cantilever are arranged to 1mm~3mm.
First SAW device and second SAW device are two identical SAW devices, and
It is deposited in the obverse and reverse sides of the piezoelectric cantilever using semiconductor technology, is included：Interdigital transducer, the first reflection
Device, the second reflector；Wherein, first SAW device and second SAW device form reflective delay line
Structure or mode of resonance structure.
In the reflective delay line structure, be sequentially fixedly mounted successively the interdigital transducer, first reflector,
Second reflector；The piezoelectric cantilever selects YZ LiNbO3, 41 ° of YX LiNbO3, 128 ° of YX LiNbO3, or 36 ° of YX
LiTaO3。
In the mode of resonance structure, first reflector, the interdigital transducer, described are sequentially fixedly mounted successively
Two reflectors；The piezoelectric cantilever is selected rotates 0 °~30 ° cuttings and the quartz crystal propagated in X direction around Y-direction.
The interdigital transducer is made of aluminium, platinum or copper product, is preferably aluminium.The interdigital transducer all leads are to institute
State on the pin of encapsulation tube support.
First SAW device and second SAW device are placed in the free end of the piezoelectric cantilever
The quick region of power in, for measure vibrate.Preferably, by first SAW device and second SAW device
It is positioned in the range of the fixing end of the piezoelectric cantilever and the cross-linked areas of free end, i.e. maximum strain sensitizing range, obtains most
Big response effect and larger detection sensitivity.
Since the sensory characteristic of SAW vibrating sensors depends primarily upon the material and physical dimension of cantilever beam, so can
Cantilever beam structure is modeled by using finite element software COMSOL, calculates the stress distribution of piezoelectric substrate.Consider
Limited to piezoelectricity cantilever thickness by process conditions and quartzy beam maximum allowable stress in itself limits, and pass through analyte sensors
Sensitive mechanism, determines the material and physical dimension of the piezoelectric cantilever.The thickness of the piezoelectric cantilever for 0.2~
0.45mm, the width of the piezoelectric cantilever by first SAW device and second SAW device acoustic aperture
Footpath determines that the length of the piezoelectric cantilever is determined by given acceleration dynamic range.
The encapsulation pipe cap uses Metal Packaging or ceramic package form.Wherein it is preferred to the encapsulation pipe cap is using pottery
Porcelain packing forms.
The encapsulation tube support uses the direct insertion pedestal of metal or ceramic paster formula pedestal.Wherein it is preferred to the package tube
Seat uses the direct insertion pedestal of metal.
The Antenna selection microstrip antenna, slot antenna, loop aerial or upright antenna.Wherein it is preferred to the day
Line uses microstrip antenna.
Should no more than the maximum allowable of selected piezoelectric cantilever material in the acceleration dynamic range of given ± 10g
Power, and higher cantilever beam intrinsic frequency can be obtained, ensure the good of the wireless passive sonic surface wave vibrating sensor response
The linearity.The quality oscillator is made of copper, aluminium or stainless steel material；The quality oscillator is by glue sticking in the piezoelectricity
On the surface of cantilever beam.
The match circuit, for ensure first SAW device, second SAW device respectively with
Impedance matching between the antenna, makes the antenna obtain maximum input power.The match circuit is by a LC connection in series-parallel
Circuit forms, and the LC series-parallel circuits are capacitor and inductor series-parallel circuit.
When the sensor is vibrated, the quality oscillator of the free end of piezoelectric cantilever is due to acceleration vibrated
Degree, causes the piezoelectric cantilever to produce a displacement along force direction, and the piezoelectric cantilever occurs bending and deformation and causes
Its surface strain changes in distribution.If piezoelectric cantilever strains upwards, the second SAW device produces the compression with degree, and
First SAW device produces the stretching with degree, by calculating the first SAW device and the second SAW device
Stack result is responded, sensitivity and the resolving power of sensor can be improved.
The advantage of the invention is that：
The present invention designs 2 SAW devices and is respectively placed in piezoelectric cantilever just by optimizing cantilever beam structure
Anti- two sides, so as to improve the measurement sensitivity and resolving power of sensor.The surface acoustic wave sensor of the present invention has high accuracy, high
Sensitivity, it is small, it is light-weight, it is low in energy consumption, it is also with good stability, it is enable to respond quickly, low manufacture cost, Er Qieke
Wireless and passive measurement method is realized, particularly suitable for high temperature and pressure and the extreme applications environment such as unattended, great application prospect.
Brief description of the drawings
Fig. 1 is a kind of structure diagram of wireless passive sonic surface wave vibrating sensor of the present invention；
Fig. 2 is the signal in the quick region of non-force and the quick region of power of its free end of the fixing end of the piezoelectric cantilever of the present invention
Figure；
Fig. 3 is the reflective delay line knot that the first SAW device of the present invention and the second SAW device are respectively provided with
The schematic diagram of structure；
Fig. 4 is showing for the mode of resonance structure that the first SAW device of the present invention and the second SAW device are respectively provided with
It is intended to；
Fig. 5 is the schematic diagram of the match circuit of the present invention；
Fig. 6 is the knot being positioned over using reflective delay line structure on piezoelectric cantilever in the specific embodiment of the present invention
Structure schematic diagram.
Reference numeral：
1st, antenna 2, match circuit 3, circuit pcb board
4th, pipe cap 5, encapsulation tube support 6, cantilever beam fixed pedestal are encapsulated
7th, lower section buffering solid 8, piezoelectric cantilever 9, the first SAW device
10th, the second SAW device 11, quality oscillator 12, top buffering solid
13rd, interdigital transducer 14, the first reflector 15, the second reflector
16th, fixing end 17, free end
18th, matching inductance 19, matching capacitance
Embodiment
As shown in Figure 1, present invention offer is a kind of to have incremental wireless passive sonic surface wave vibrating sensor, it is different from
Traditional surface acoustic wave vibrating sensor, including：Antenna 1, match circuit 2, circuit pcb board 3, encapsulation pipe cap 4, encapsulation tube support 5,
Cantilever beam fixed pedestal 6, piezoelectric cantilever 8, the first SAW device 9, the second SAW device 10, quality oscillator 11.
The antenna 1, the match circuit 2, the encapsulation tube support 5, the envelope is sequentially fixedly mounted on the circuit pcb board 3 successively
The capping installation encapsulation pipe cap 4 on tubulature seat 5, the two forms a closed hollow rectangular space；It is empty in the rectangle
In, the cantilever beam fixed pedestal 6 is fixedly mounted on the encapsulation tube support 5；The left end of the piezoelectric cantilever 8 is positioned at described
On cantilever beam fixed pedestal 6, as fixing end 16, and the obverse and reverse sides in the fixing end 16 and corresponding installation first sound
Surface wave device 9 and second SAW device 10；The right end of the piezoelectric cantilever is free end 17, and in the freedom
The quality oscillator 11 is fixedly mounted on the end at end 17.
The circuit pcb board 3 is circuit printed circuit board.The height of the cantilever beam fixed pedestal 6 is 1.5mm.It is described
Quality oscillator 11 is 0.6g.
As shown in Figure 1, installation lower section buffers solid 7 on the encapsulation tube support 5, installed on the inner wall of the encapsulation pipe cap 4
Top buffers solid 12.
The top buffering solid 12 and lower section buffering solid 7 are separately positioned on the freedom of the piezoelectric cantilever 8
At the upper and lower maximum displacement at end 17, for protecting the piezoelectric cantilever 8, prevent from being damaged because Oscillation Amplitude is excessive.
The lower section buffering solid 7 and top buffering solid 12 are made of flexible material, and its thermal expansion
Coefficient is small, such as rubber, silica gel, TPU, TPE, TPR etc..Between lower section buffering solid 7 and the piezoelectric cantilever 8 away from
From buffering the distance between solid 12 and the quality oscillator 11 equal to the top, and be 1mm；And the top is delayed
The maximum of end for rushing the free end 17 that the distance between solid 12 and described quality oscillator 11 are more than the piezoelectric cantilever 8 is shaken
Dynamic displacement.
Preferably, lower section buffering the distance between the solid 7 and the piezoelectric cantilever 8 are arranged to 1mm.
As shown in Figure 1, first SAW device 9 and second SAW device 10 are two identical sound
Surface wave device, and the upper and lower faces of the piezoelectric cantilever 8, set of frequency 890M are deposited in using semiconductor technology
Hz；Include：Interdigital transducer 13, the first reflector 14, the second reflector 15；Wherein, 9 He of the first SAW device
Second SAW device 10 forms reflective delay line structure or mode of resonance structure.
As shown in figure 3, in the reflective delay line structure, it is anti-that interdigital transducer 13, first is fixedly mounted in order successively
Emitter 14, the second reflector 15；The piezoelectric cantilever 8 selects YZ LiNbO3.13 interdigital electrode number 20 of interdigital transducer
Right, the first reflector 14 and the second reflector 15 use short-circuiting reflection grid-type, corresponding interdigital electrode number be successively 7 pairs and
It is 8.5 right.The distance between interdigital transducer 13 and first reflector 14 are 854 λ；Wherein, λ is that corresponding sound wave is grown, first
The distance between reflector 14 and second reflector 15 are 66.75 λ.The finger of interdigital transducer 13 is staggeredly placed, and mutually
It is parallel, do not close；The finger width of interdigital transducer 13 is 1.101 microns, and electrode thickness is 300 nanometers, each finger spacing
It it is 1.101 microns, sound aperture is 1586.160 microns.The finger width of first reflector 14 and the second reflector 15 is
1.101 microns, electrode thickness is 300 nanometers, and each finger spacing is 1.101 microns, and finger length is 440.600 micro-
Rice.Wherein, as shown in Figure 1, the first SAW device 9 is deposited in below piezoelectric cantilever 8, the second SAW device 10
It is deposited in above piezoelectric cantilever 8.
As shown in figure 4, in the mode of resonance structure, first reflector 14, described interdigital is sequentially fixedly mounted successively
Transducer 13, second reflector 15；The piezoelectric cantilever 8, which is selected, to be rotated 0 °~30 ° cuttings around Y-direction and passes in X direction
The quartz crystal broadcast.
Wherein, in the present embodiment, present invention employs reflective delay line structure.Wherein,
The interdigital transducer 13 is made of aluminium, platinum or copper product, is preferably aluminium.The interdigital transducer 13 all leads
Onto the pin of the encapsulation tube support 5.
As shown in Fig. 2, first SAW device 9 and second SAW device 10 are placed in the piezoelectricity and hang
In the quick region of power of the free end 17 of arm beam 8, vibrated for measuring.Preferably, by first SAW device 9 and described
Second SAW device 10 is positioned in the range of the fixing end 16 of the piezoelectric cantilever 8 and the cross-linked areas of free end 17,
That is maximum strain sensitizing range, obtains peak response effect and larger monitoring sensitivity.
Since the sensory characteristic of SAW vibrating sensors depends primarily upon the material and physical dimension of cantilever beam, so can
Cantilever beam structure is modeled by using finite element software COMSOL, calculates the stress distribution of piezoelectric substrate.Consider
Limited to piezoelectricity cantilever thickness by process conditions and quartzy beam maximum allowable stress in itself limits, and pass through analyte sensors
0.45mm, the width of the piezoelectric cantilever 8 is 2mm, by first SAW device and the second surface acoustic wave device
The sound aperture of part determines that the length of the piezoelectric cantilever is 12mm, is determined by given acceleration dynamic range.
The encapsulation pipe cap 4 uses Metal Packaging or ceramic package form.Wherein it is preferred to the encapsulation pipe cap 4 uses
Ceramic package form.
The encapsulation tube support 5 is using the direct insertion pedestal of metal or ceramic paster formula pedestal.Wherein it is preferred to the encapsulation
Tube socket 5 uses the direct insertion pedestal of metal.
The antenna 1 chooses microstrip antenna, slot antenna, loop aerial or upright antenna.It is wherein it is preferred to described
Antenna 1 uses microstrip antenna.
Should no more than the maximum allowable of selected piezoelectric cantilever material in the acceleration dynamic range of given ± 10g
Power, and higher cantilever beam intrinsic frequency can be obtained, ensure the good of the wireless passive sonic surface wave vibrating sensor response
The linearity.The quality oscillator 11 is made of copper, aluminium or stainless steel material；As shown in Figure 1, the quality oscillator 11 passes through glue
It is bonded on the surface of the piezoelectric cantilever 8.
As shown in figure 5, the match circuit 2, for ensureing first SAW device 9, the rising tone surface
The impedance matching between the antenna 1 respectively of wave device 10, makes the antenna 1 obtain the input power of maximum.Matching electricity
Road 2 is made of a LC series-parallel circuit, and the LC series-parallel circuits are capacitor and inductor series-parallel circuit.Tool according to the present invention
The parameter setting requirement of body embodiment, it is not necessary to place matching capacitance 19, which only connects 9.1nH size
Matching inductance 18.And sending-end impedance output is matched to 50 ohm.
When the sensor is vibrated, the quality oscillator of the free end of piezoelectric cantilever is due to acceleration vibrated
Degree, causes the piezoelectric cantilever to produce a displacement along force direction, and the piezoelectric cantilever occurs bending and deformation and causes
Its surface strain changes in distribution.If piezoelectric cantilever strains upwards, the second SAW device produces the compression with degree, and
First SAW device produces the stretching with degree, by calculating the first SAW device and the second SAW device
Stack result is responded, sensitivity and the resolving power of sensor can be improved.
It should be noted last that the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted.Although ginseng
The present invention is described in detail according to embodiment, it will be understood by those of ordinary skill in the art that, to the technical side of the present invention
Case technical scheme is modified or replaced equivalently, without departure from the spirit and scope of technical solution of the present invention, it should all cover in the present invention
Right among.
Claims (11)
- A kind of 1. wireless passive sonic surface wave vibrating sensor, it is characterised in that including：Antenna (1), match circuit (2), circuit Pcb board (3), encapsulation pipe cap (4), encapsulation tube support (5), cantilever beam fixed pedestal (6), piezoelectric cantilever (8), the first surface acoustic wave Device (9), the second SAW device (10) and quality oscillator (11)；Antenna (1), match circuit (2), encapsulation tube support (5), package tube is fixedly mounted in order successively on the circuit pcb board (3) Capping installation encapsulation pipe cap (4) on seat (5), the two forms a closed hollow rectangular space；In the rectangular space, Cantilever beam fixed pedestal (6) is fixedly mounted on encapsulation tube support (5)；One end of piezoelectric cantilever (8) is located at cantilever beam fixed pedestal (6) fixing end (16) is used as on, and in the obverse and reverse sides and the first SAW device of corresponding installation (9) of the fixing end (16) With second SAW device (10)；The other end of piezoelectric cantilever (8) is free end (17), is consolidated on the free end (17) Dingan County is equipped with the quality oscillator (11).
- 2. wireless passive sonic surface wave vibrating sensor according to claim 1, it is characterised in that the encapsulation tube support (5) lower section buffering solid (7) is installed on, top buffering solid (12) is installed on the inner wall of the encapsulation pipe cap (4).
- 3. wireless passive sonic surface wave vibrating sensor according to claim 2, it is characterised in that the top buffering is solid Body (12) and lower section buffering solid (7) are separately positioned on the upper and lower maximum of the free end (17) of the piezoelectric cantilever (8) At displacement, for protecting the piezoelectric cantilever.
- 4. wireless passive sonic surface wave vibrating sensor according to claim 3, it is characterised in that the lower section buffering is solid Body (7) and top buffering solid (12) are made of flexible material；The lower section buffering solid (7) is hanged with the piezoelectricity The distance between arm beam (8) is equal to the distance between top buffering solid (12) and described quality oscillator (11)；And institute State the free end that the distance between top buffering solid (12) and described quality oscillator (11) are more than the piezoelectric cantilever (8) (17) the maximum vibration displacement of end.
- 5. wireless passive sonic surface wave vibrating sensor according to claim 4, it is characterised in that the lower section buffering is solid The distance between body (7) and the piezoelectric cantilever (8) are arranged to 1mm~3mm.
- 6. wireless passive sonic surface wave vibrating sensor according to claim 1, it is characterised in that the first sound surface Wave device (9) is two identical SAW devices with second SAW device (10), and uses semiconductor work Skill is deposited in the obverse and reverse sides of the piezoelectric cantilever (8), is included：Interdigital transducer (13), the first reflector (14), Second reflector (15)；Wherein, first SAW device (9) and second SAW device (10) form reflection Type delay-line structure or mode of resonance structure.
- 7. wireless passive sonic surface wave vibrating sensor according to claim 6, it is characterised in that the reflection-type delay In cable architecture, interdigital transducer (13), the first reflector (14), the second reflector (15) is fixedly mounted in order successively；The pressure Electric cantilever beam (8) selects YZ LiNbO3, 41 ° of YX LiNbO3, 128 ° of YX LiNbO3, or 36 ° of YX LiTaO3。
- 8. wireless passive sonic surface wave vibrating sensor according to claim 6, it is characterised in that the mode of resonance structure In, the first reflector (14), interdigital transducer (13), the second reflector (15) is fixedly mounted in order successively；The piezoelectric cantilever Beam (8) is selected rotates 0 °~30 ° cuttings and the quartz crystal propagated in X direction around Y-direction.
- 9. wireless passive sonic surface wave vibrating sensor according to claim 6, it is characterised in that the first sound surface Wave device (9) and second SAW device (10) are placed in the Li Min areas of the free end (17) of the piezoelectric cantilever (8) In domain, vibrated for measuring；First SAW device (9) and second SAW device (10) are positioned over institute State in the range of the fixing end (16) of piezoelectric cantilever (8) and the cross-linked areas of free end (17), obtain larger detection sensitivity.
- 10. wireless passive sonic surface wave vibrating sensor according to claim 1, it is characterised in that the piezoelectric cantilever The thickness of beam (8) is 0.2~0.45mm.
- 11. wireless passive sonic surface wave vibrating sensor according to claim 1, it is characterised in that the match circuit (2), for ensure first SAW device (9), second SAW device (10) respectively with the antenna (1) Between impedance matching, obtain maximum input power；The match circuit (2) is made of a capacitor and inductor series-parallel circuit.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109708744A (en) * | 2019-03-07 | 2019-05-03 | 北京世纪之星应用技术研究中心 | Double oscillator solid acoustic sensor devices |
| CN109839180A (en) * | 2019-02-20 | 2019-06-04 | 中国电子科技集团公司第四十九研究所 | A kind of highly sensitive sonic transducer of resonant mode |
| CN111398872A (en) * | 2020-03-19 | 2020-07-10 | 西安交通大学 | Magnetic sensor based on surface acoustic wave and magnetic torque effect and preparation method |
| CN114136507A (en) * | 2021-12-07 | 2022-03-04 | 中国电子科技集团公司第四十八研究所 | Wireless passive surface acoustic wave pressure sensor and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2689592Y (en) * | 2004-04-08 | 2005-03-30 | 中国科学院声学研究所 | Sound surface wave delaying lines |
| CN103929147A (en) * | 2013-01-11 | 2014-07-16 | 中国科学院声学研究所 | Single-ended pair SAW resonator with high quality factors |
| US20150013461A1 (en) * | 2013-07-12 | 2015-01-15 | Environetix Technologies Corp. | Device and method for measuring physical parameters using saw sensors |
| CN206208380U (en) * | 2016-11-18 | 2017-05-31 | 中国计量大学 | A kind of optical fiber raster vibration sensor based on cantilever beam structure |
| CN107238431A (en) * | 2017-06-08 | 2017-10-10 | 中电科技德清华莹电子有限公司 | A kind of wireless passive sonic surface wave vibrating sensor |
| CN107289883A (en) * | 2017-07-25 | 2017-10-24 | 中国科学院声学研究所 | A kind of wireless passive sonic surface wave strain transducer of differential type resonator type |
-
2017
- 2017-10-30 CN CN201711033799.4A patent/CN107907205A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2689592Y (en) * | 2004-04-08 | 2005-03-30 | 中国科学院声学研究所 | Sound surface wave delaying lines |
| CN103929147A (en) * | 2013-01-11 | 2014-07-16 | 中国科学院声学研究所 | Single-ended pair SAW resonator with high quality factors |
| US20150013461A1 (en) * | 2013-07-12 | 2015-01-15 | Environetix Technologies Corp. | Device and method for measuring physical parameters using saw sensors |
| CN206208380U (en) * | 2016-11-18 | 2017-05-31 | 中国计量大学 | A kind of optical fiber raster vibration sensor based on cantilever beam structure |
| CN107238431A (en) * | 2017-06-08 | 2017-10-10 | 中电科技德清华莹电子有限公司 | A kind of wireless passive sonic surface wave vibrating sensor |
| CN107289883A (en) * | 2017-07-25 | 2017-10-24 | 中国科学院声学研究所 | A kind of wireless passive sonic surface wave strain transducer of differential type resonator type |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109839180A (en) * | 2019-02-20 | 2019-06-04 | 中国电子科技集团公司第四十九研究所 | A kind of highly sensitive sonic transducer of resonant mode |
| CN109839180B (en) * | 2019-02-20 | 2020-11-13 | 中国电子科技集团公司第四十九研究所 | Resonant high-sensitivity acoustic sensor |
| CN109708744A (en) * | 2019-03-07 | 2019-05-03 | 北京世纪之星应用技术研究中心 | Double oscillator solid acoustic sensor devices |
| CN109708744B (en) * | 2019-03-07 | 2024-05-24 | 北京世纪之星应用技术研究中心 | Double-vibrator solid sound sensor device |
| CN111398872A (en) * | 2020-03-19 | 2020-07-10 | 西安交通大学 | Magnetic sensor based on surface acoustic wave and magnetic torque effect and preparation method |
| CN114136507A (en) * | 2021-12-07 | 2022-03-04 | 中国电子科技集团公司第四十八研究所 | Wireless passive surface acoustic wave pressure sensor and preparation method thereof |
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