CN107891427A - Robot arm and conveying machine people - Google Patents
Robot arm and conveying machine people Download PDFInfo
- Publication number
- CN107891427A CN107891427A CN201710864986.0A CN201710864986A CN107891427A CN 107891427 A CN107891427 A CN 107891427A CN 201710864986 A CN201710864986 A CN 201710864986A CN 107891427 A CN107891427 A CN 107891427A
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- Prior art keywords
- air
- face
- robot arm
- holding
- chip
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Robot arm and conveying machine people are provided, processing bits is not adhered to.The robot arm (2) of tabular has the first holding unit (21), and it makes air flow along a face (211a) and carries out non-contact adhesion holding to chip；With the second holding unit (22), it carries out attracting holding on another face (221a) to chip, and holding unit (21) has：First board member (211)；Groove (213), it is formed at a face, peripheral openings of its one end to board member；Ejiction opening (214), it sprays air from the other end of groove towards one end；With offer road (215), it is formed inside holding unit, ejiction opening is connected with the first connector (216) possessed by installation portion (12), holding unit (22) has：Second board member (221)；Suction port (224), it connects in another face with attraction source (61)；And attraction road (223), it is formed inside holding unit, and suction port (224) is connected with the second connector (226) possessed by the installation portion (12) for being installed on robot (1).
Description
Technical field
The present invention relates to the robot arm kept on processing unit (plant) etc. to chip and utilize robot arm
Chip is kept and transports the conveying machine people of chip.
Background technology
In the processing unit (plant)s such as the topping machanism or grinding attachment being processed to semiconductor wafer etc., such as from being placed in
The inside of the box of box microscope carrier is taken out plate workpiece and transported to holding workbench, or after the process finishing of plate workpiece,
Plate workpiece after processing is accommodated in box.Also, it is equipped with chip and is taken out from box or by crystalline substance in processing unit (plant)
Piece is accommodated in the conveying machine people in box, and conveying machine people has robot arm, and the robot arm has on one face
There is the retaining surface for chip adsorb holding (for example, referring to patent document 1).
Patent document 1：Japanese Unexamined Patent Publication 2013-198960 publications
Robot arm described in above-mentioned patent document 1, formed with suction port, and is internally formed in its retaining surface
There is the access that the attraction source for making retaining surface be formed with by device for vacuum generation etc. connects.Also, connect making retaining surface with chip
In the state of touching, attraction source is attracted and caused attraction is transferred to the suction port in retaining surface, so as to robot arm
Attracting holding can be carried out to chip.
Here, when warpage on chip be present or front becomes convex-concave, attracting holding can not be carried out.Therefore, sometimes
Air is sprayed from the retaining surface of robot arm and produces Bernoulli effect to carry out absorption holding.But such robot
Arm needs to spray substantial amounts of air, and in order to increase the logical circulation road to be ventilated in robot arm, thickness can be thickening, therefore
Sometimes robot arm cannot be introduced into box.In addition, for example in the invention of Japanese Patent Publication No. 4299111, maintaining part enters
In box, but because the thickness of robot arm is thicker, when the thickness of chip is thickening, it is impossible into box.
In addition, in the case where the processing unit (plant) for being equipped with conveying machine people is, for example, grinding attachment, sometimes as removing
Send and grindstone dust caused by grinding is attached with the chip after the processing of object, when making being ground for robot arm and chip
When bevel contacts and carries out attracting holding to chip, grindstone dust can be adhered in the retaining surface of robot arm sometimes.Also, grind
The robot arm that swarf is attached to the state in retaining surface carries out attracting holding to the new chip before processing, so as to sometimes
Adhere to grindstone dust on chip before processing.
Therefore, for being arranged at possessed by the conveying machine people of processing unit (plant), to entering as the chip of conveyance object
For the robot arm that row is kept, following problems be present：The taking-up for carrying out chip in box can be entered to be put into, will not
Retaining surface is polluted because being attached in retaining surface the processing such as grindstone dust bits, and newly implements processing according to being attached to processing bits
Mode on chip is transported.
The content of the invention
The present invention be in view of above-mentioned problem and complete, its object is to provide a kind of robot arm and conveying machine
People, it is ensured that processing bits will not be attached to the new chip for implementing processing.
It is robot arm for solving the present invention of above-mentioned problem, it is the robot arm of tabular, and it has：To crystalline substance
Piece adsorb a face of holding；And the installation portion of robot is installed on, wherein, the robot arm, which has, keeps single
Member, the holding unit make a face be connected with air offer source, spray air and make air stream along the direction in a face
Move and produce negative pressure, so as to carry out absorption holding to chip, the holding unit has：Groove, its one end is on one face in periphery
Edge opening；Air ejiction opening, it sprays air from the other end of the groove towards the one end；And air provides road, it is formed at
The inside of the holding unit, the air ejiction opening is connected with connector possessed by the installation portion, make from the air ejiction opening
The air of ejection circulates and negative pressure is produced on a face in the cell, so as to carry out absorption holding to chip, the robot
Arm can take out chip and by wafer storage in box from being accommodated with shelf-like in the box of chip.
It is preferred that in the robot arm, there is switch unit, the switch unit is to the first air mass flow and the second air
Flow switches over, wherein, first air mass flow is to make to circulate in the groove from the air that the air ejiction opening sprays
And to chip adsorb the air mass flow of holding in a non-contact manner using one face, second air mass flow is to make
Air more than first air mass flow circulates and contacts face of chip and this so as to be adsorbed to chip in the cell
The air mass flow of holding, first air mass flow and second air mass flow are switched over by the switch unit, so as to right
Non-contact and contact is selected and carries out absorption holding.
In addition, the present invention is robot arm, it is the robot arm of tabular, and it has：Absorption guarantor is carried out to chip
The face held；Another face of attracting holding is carried out to chip；And the installation portion of robot is installed on, wherein, the machine
Human arm has：First holding unit, it makes a face and air provide source connect, makes air ejection and along a face
Direction makes air flow and produces negative pressure, so as to carry out absorption holding to chip；And second holding unit, it makes another face
Attracting holding is carried out to chip with attracting source to connect, first holding unit has：First board member of tabular；Groove, its shape
As one end on a face to the periphery side opening of first board member；Air ejiction opening, its other end court from the groove
Air is sprayed to the one end；And air provide road, it is formed at the inside of first holding unit, make the air ejiction opening and
First connector possessed by the installation portion connects, and second holding unit has：Second board member of tabular；Suction port, its
Another face is set to be connected with attraction source；And attraction road, it is formed at the inside of second holding unit, make the suction port and
Second connector possessed by the installation portion connects.
In addition, being conveying machine people for solving the present invention of above-mentioned problem, it is transported to chip, and it, which has, supplies institute
The support of the installation portion installation for the robot arm stated, conveying machine people have：Access, its via with the access
One end connection valve and optionally provide source with the attraction source and the air and connect；And connection unit, itself and this
The other end connection of access, by described the of the connection destination of the access and the robot arm for being installed on the support
One connector and second connector link, and the connection unit has：Branch, the access is branched off into two by it；The
One pipe arrangement, it connects the branch with first connector；First check-valve, it is disposed in first pipe arrangement, will from this
The flowing of one connector towards the air in the direction of the branch separates；Second pipe arrangement, its by the branch and this second connection
Mouth connection；Choke valve, it is disposed in second pipe arrangement；And second check-valve, its be disposed in parallel with the choke valve this
Two pipe arrangements, it will separate from the branch towards the flowing of the air in the direction of second connector.
The robot arm of the present invention has holding unit, and it makes a face be connected with air offer source, sprays air
And make air flow along face direction and produce negative pressure, so as to carry out absorption holding to chip, holding unit has：Groove, its
One end is on one face in outer circumferential openings；Air ejiction opening, it sprays air from the other end of groove towards the one end；It is and empty
Air lift supplies road, and it is formed at the inside of the holding unit, and air ejiction opening is connected with connector possessed by installation portion, make from
The air that air ejiction opening sprays circulates and produces negative pressure on one face using Bernoulli effect in the cell, so as to chip
Absorption holding is carried out, therefore even if there is the chip of warpage or convex-concave, can also carry out attracting holding, and can relatively thinly form
Robot arm, so as to make it into box.
In addition, the robot arm of the present invention has the first holding unit, it makes a face be connected with air offer source,
Spray air and make air flow along a face and produce negative pressure, so as to carry out absorption holding to chip；And second keep
Unit, it makes another face be connected with attraction source and attracting holding is carried out to chip, and the first holding unit has：The first of tabular
Board member；Groove, it is formed as one end on a face to the periphery side opening of first board member；Air ejiction opening, its from
The other end of groove sprays air to one end；And air provides road, it is formed at the inside of the first holding unit, air is sprayed
Mouth connects with the first connector possessed by installation portion, and the second holding unit has：Second board member of tabular；Suction port, its
Another face is set to be connected with attraction source；And attraction road, it is formed at the inside of the second holding unit, by suction port and installation portion
Possessed second connector connection.Therefore, robot arm of the invention can optionally enter in the holding to chip
Row is kept with contact condition or kept with contactless state, for example, it is contacted with the second holding unit to the chip before processing and
Attracting holding is carried out, thus allows for transporting, passes through the first holding unit to being attached with the chip after the processing of grindstone dust etc.
Absorption holding is carried out in a non-contact manner, and grindstone dust can not be made to be attached on robot arm and transported.Also,
Robot arm will not be ground after chip on the pollution such as accompanying grindstone dust, therefore can prevent robot arm from making mill
Swarf is attached on the new chip for implementing processing.
The conveying machine people of the present invention is as the optimal device for making the robot arm of the present invention effectively act
Structure, grindstone dust can not be made to be attached on the new chip for implementing processing and wafer transfer is transported into position as defined in.
Brief description of the drawings
Fig. 1 is the stereogram of one for showing conveying machine people.
Fig. 2 (A) is to show the stereogram of one by binding face towards the first holding unit of the state of upside, Fig. 2
(B) be to show as the solid of one of chip adsorption plane first holding unit facing to the state of upside
Figure.
Fig. 3 (A) is to show the stereogram of one by binding face towards the second holding unit of the state of upside, Fig. 3
(B) be show using as wafer suction face another facing to upside state the second holding unit the solid of one
Figure.
Fig. 4 is the sectional view of one for showing robot arm.
Fig. 5 is to show that one of robot arm on one face formed with the first connector and the second connector cuts open
View.
Fig. 6 is the explanation figure for the structure for schematically showing connection unit, valve and access.
Fig. 7 is to show the top view of one of the profile for the first rectangular-shaped holding unit.
Fig. 8 is the top view of one for showing the first holding unit formed with 1 groove.
Label declaration
1：Conveying machine people；12：Installation portion；14：Support；2：Robot arm；21：First holding unit；211：First
Board member；211a：One face of robot arm；211b：The binding face of first board member；212：Base portion；213：Groove；213a：
One end of groove；213b：The other end of groove；214：Air ejiction opening；215：Air provides road；215a：Air provides the one end on road；
215b：Air provides the other end on road；216：First connector；22：Second holding unit；221：Second board member；221a：Machine
Another face of device human arm；221b：The binding face of second board member；222：Base portion；223：Attraction road；223a：Attraction road
One end；224：Suction port；226：Second connector；3：Drive division；30：First arm；31：Second arm；32：Robot arm rotates
Unit；33：First arm rotary unit；34：Second arm rotary unit；40：Motor；40a：The leading section of motor；40b：Electricity
The rearward end of motivation；41：Housing；42：Encoder；9：Z-direction travel mechanism；7：Valve；8：Access；5：Connection unit；50：
Branch；51：First pipe arrangement；52：Second pipe arrangement；53：First check-valve；54：Choke valve；55：Second check-valve；60：Air
Offer source；61：Attraction source；W：Chip；Wa：The front of chip；Wb：The back side of chip；T：Keep workbench；T1：Adsorption section；
T1a：Retaining surface；T2：Framework.
Embodiment
Conveying machine people 1 shown in Fig. 1 carries out following operations such as disposed on grinding attachment (not shown)：To be in put
The wafer W that tabular is accommodated in box is taken out of from box, or wafer W is kept using the robot arm 2 of tabular and received
It is contained in box, or conveyance is extremely kept on workbench T.The robot arm 2 of tabular possessed by conveying machine people 1 has：With
Non-contacting mode to wafer W adsorb a face 211a of holding；Another face 221a of attracting holding is carried out to chip；
And it is installed on the installation portion 12 of conveying machine people 1.
Wafer W shown in Fig. 1 is, for example, the semiconductor wafer that profile is circular plate-like shape, is formed on the positive Wa of wafer W
There are multiple devices, such as be pasted with protection band (not shown) on positive Wa and positive Wa is protected.The back side Wb of wafer W
As the machined surface for implementing grinding etc..
Robot arm 2 shown in Fig. 1 has：First holding unit 21, it makes in Fig. 1 towards a face 211a of downside
Source 60 is provided with air to connect, air is sprayed and makes air flow along a face 211a and produce negative pressure, so as to wafer W
Carry out absorption holding；And second holding unit 22, it makes another face 221a in Fig. 1 towards upside be connected with attraction source 61
And attracting holding is carried out to wafer W.
The first holding unit 21 shown in Fig. 2 (A), (B) can utilize the principle of Bernoulli Jacob right in a non-contact manner
Wafer W carries out absorption holding.First board member 211 of first holding unit 21 for example with tabular, the first plate portion of the tabular
Part 211 is made up of the engineering plastics such as acrylic acid or makrolon or stainless steel etc., be formed as have with it is discoideus shown in Fig. 1
The circular of the roughly the same external diameter of the external diameter of wafer W, rectangle is integrally formed with the outer peripheral portion of the first board member 211
The base portion 212 of shape.In addition, a face 211a of the first board member 211 surface is smoothly finished, in addition can be first
Chamfering is implemented in one face 211a of board member 211 end (crest line), to cause what is contacted in the first board member 211 with wafer W
In the case of not damage wafers W.The profile of first holding unit 21 is not limited to circular shape, such as can also be such as Fig. 2 (B)
In as shown in chain-dotted line L2, be formed as the triangle crosswise that forms of a part of local excision of circle.
Formed with groove 213 on a face 211a of the first board member 211, one end 213a of the groove 213 is to the first plate portion
The periphery side opening of part 211.The face of the side opposite with a face 211a of first board member 211 as with shown in Fig. 1
The binding face 211b of two holding units 22 fitting.Groove 213 is for example from face 211a center towards the first board member 211
Radial outside is extended radially with the angle (such as 120 degree) of equalization in three directions, with from a face 211a to the
The depth of the degree of the pars intermedia of the thickness direction (Z-direction) of one board member 211.The width and depth of each groove 213 have phase
With the constant cross section of size.In addition, the formation number of groove 213 is not limited to the number in present embodiment, can also be at one
Circumferentially more than four are formed on the 211a of face so that the interval of equalization is radial.Alternatively, it is also possible to be, by make groove 213 one
Partial width is narrow, and the air passed through in groove 213 is accelerated using the narrow part.By the first holding unit 21
In the case of the second holding unit 22 combination shown in (A), (B) with Fig. 3, base portion 212 leans on-Y sides compared with imaginary line L1
The installation portion 12 shown in Fig. 1 is formed to the part of side, the installation portion 12 is installed on conveying machine people 1.In addition, for example can also be
The peripheral end of first board member 211, which sets up separately, puts guide portion, and the guide portion contacts with the outer region of wafer W and wafer W is existed
The face side of first board member 211 moves up (that is, wafer W slide laterally) and limited.The guide portion for example by rubber or
Sponge etc. is formed, in the outer circumference end part of the first board member 211 circumferentially across certain interval according to one end with groove 213
The mode that 213a staggers is fixed multiple (such as fixing four with 90 degree of intervals).
The other end 213b of each groove 213 connects with being formed at a face 211a central each air ejiction opening 214.Each sky
The radial outside openings that gas blowout outlet 214 is respectively facing a face 211a, from the other end 213 of each groove 213 towards b to one end 213a
Flatly spray air.Such as the area of air ejiction opening 214 is formed smaller than the sectional area that air provides road 215.In addition, example
The nozzle pad that can be removed can also be such as arranged on a face 211a of the first board member 211, is formed on the nozzle pad empty
Gas blowout outlet 214, rather than air ejiction opening 214 is formed at a face 211a as present embodiment.
As shown in Fig. 2 (A), in the inside of the first holding unit 21, i.e. from the inside of the first board member 211 to base portion
212 inside, be formed as linearly extending for the air offer road 215 of air circulation.In addition, air provides road 215 the
It is not open on the binding face 211b of one holding unit 21.One end 215a that air provides road 215 is formed as from the inside of base portion 212
Towards a face 211a, connected with the first connector 216 of a face 211a upper shed.As shown in Fig. 2 (B), air carries
Connected for the other end 215b on road 215 with each air ejiction opening 214.Air shown in first connector 216 and Fig. 1 provides source 60
Connection.Alternatively, it is also possible to be provided in air on road 215 formed with the throttling for making to provide the air acceleration in road 215 by air
Hole etc..
Second board member 221 of second holding unit 22 for example with tabular shown in Fig. 3 (A), (B), second keeps
Unit 22 have with the identical shape of the first holding unit 21, wherein, the second board member 221 of the tabular is by acrylic acid or poly- carbon
The engineering plastics such as acid esters or stainless steel etc. are formed, and are formed as with the external diameter roughly the same with the external diameter of discoideus wafer W
Circular.Furthermore it is possible to implement chamfering in another face 221a of the second board member 221 end (crest line), to cause
Not damage wafers W in the case that second board member 221 contacts with wafer W.Second board member 221 has (A), (B) institute with Fig. 2
The binding face 221b of the binding face 211b fittings for the first board member 211 shown, the face conduct of binding face 221b opposite side
Robot arm 2 carries out another face 221a of attracting holding to wafer W.The profile of second holding unit 22 is not limited to substantially
Toroidal, for example, in (B) such as Fig. 2 as shown in imaginary chain-dotted line L2, first holding unit 21 is shaped so as to
In the case of the triangle crosswise that forms of a part of local excision of circle, preferably the second holding unit 22 be identically formed for
Triangle crosswise.
Rectangular-shaped base portion 222 is integrally formed with the outer peripheral portion of the second board member 221.As shown in Fig. 3 (A),
Attraction road 223 has been internally formed in the inside of the second holding unit 22, i.e. from the inside of base portion 222 to the second board member 221.
Attraction road 223 is formed as in the inside of base portion 222 towards linearly extension in the second board member 221 and in the second board member 221
Inside extends in circular arc along the periphery of the second board member 221.In addition, fitting of the attraction road 223 in the second holding unit 22
It is not open on the 221b of face.
Make the another of the second board member 221 formed with multiple suction ports 224, the suction port 224 in the second board member 221
The attraction source 61 shown in Fig. 1 that individual face 221a is formed with by compressor and device for vacuum generation etc. connects.Suction port 224 for example with
It is one group that 3 × 3, which amount to 9, and each suction port 224 is formed through from attraction road 223 towards another face 221a, with attraction
Road 223 connects.For example, altogether 9 and circumferentially divide as the outer peripheral portion of one group of each suction port 224 in another face 221a
It is open respectively at three positions from the angle (such as 120 degree) of equalization.In addition, the shape and suction port 224 of attraction road 223
Arrange number and arrange form and be not limited to present embodiment, such as attraction road 223 can also be linearly in the inside of base portion 222
Center in towards the second board member 221 extends and the center out of second board member 221 is radially oriented outside with the angle of equalization
Degree extends radially.In addition, suction port 224 can also be circumferentially separated the angle of equalization in another face 221a outer peripheral portion
Spend and be open respectively more than four positions, the bore of suction port 224 can also be increased in addition, in another face 221a periphery
Part is circumferentially separated 120 degree and each opening one is distinguished at three positions.Alternatively, it is also possible to be arranged on each suction port 224
The attracting pad for the ring-type being made up of elastomeric elements such as rubber.
One end 223a of the side of base portion 222 of attraction road 223 shown in Fig. 3 (A) from the inside of base portion 222 towards another
Face 221a and formed, connected with the second connector 226 in the 221a upper sheds of another face.By the second holding unit 22 and
In the case that one holding unit 21 combines, the part formation with imaginary line L1 compared with by -Y direction side of base portion 222 is installed on and removed
Send the installation portion 12 shown in Fig. 1 of robot 1.
Make Fig. 2 (A), (A) of first holding unit 21 and Fig. 3 shown in (B), the second holding unit shown in (B)
In the state of 22 overlap, as shown in figure 4, the binding face 211b of the first holding unit 21 and second is protected using appropriate bonding agent
The binding face 221b bondings of unit 22 are held, so as to be assembled into robot arm by the first holding unit 21 and the second holding unit 22
2.Alternatively, it is also possible to form screwed hole etc. on the first holding unit 21 and the second holding unit 22, to be entered using screw thread etc.
The fitting of row the first holding unit 21 and the second holding unit 22.
In addition, in the present embodiment, the first board member 211 and this two plate fittings of the second board member 221 are formed
Robot arm 2, but the first holding unit 21 and the second holding unit 22 can also be formed with a plate without fitting.
In addition, in the present embodiment, using forming the first connector 216 on a face 211a and in another face
The structure of the second connector 226 is formed on 221a, but can also be on a face 211a or another face 221a arbitrary face
Form the first connector 216 and the second connector 226.Such as can also be as shown in figure 5, forming first on the 221a of another face
The connector 226 of connector 216 and second.
Conveying machine people 1 shown in Fig. 1 has drive division 3, and the drive division 3 makes robot arm 2 be moved to defined position
Put.Drive division 3 is for example by the first arm 30, the second arm 31, the robot arm rotation for making robot arm 2 rotate in the horizontal direction
Turn unit 32, the first arm rotary unit 33 and the second arm rotary unit 34 to form, by by memory elements such as CPU and memories
The control unit (not shown) formed acts to it to be controlled.
The upper surface of one end of the first arm 30 and the robot arm rotary unit 32 of shaft-like link.In the another of the first arm 30
On the lower surface of one end, the upper surface of one end of the second arm 31 is connected with via the first arm rotary unit 33.In the second arm 31
The other end lower surface on be linked with the second arm rotary unit 34.Also, the second arm rotary unit 34 is disposed in Z-direction shifting
On motivation structure 9.
Robot arm rotary unit 32 makes robot arm 2 using revolving force caused by rotary driving source (not shown)
Flatly rotated relative to the first arm 30.First arm rotary unit 33 utilizes revolving force caused by rotary driving source (not shown)
The first arm 30 is set flatly to be rotated relative to the second arm 31.Second arm rotary unit 34 is produced using rotary driving source (not shown)
Raw revolving force makes the second arm 31 flatly be rotated relative to Z-direction travel mechanism 9.Also, Z-direction travel mechanism 9
Action is controlled by control unit, robot arm 2 is moved up and down on grinding attachment (not shown) along Z-direction.
Housing 41 is fixed with the upper end side of robot arm rotary unit 32, the housing 41 will have and vertical (Z
Direction of principal axis) orthogonal Y direction axle center the supporting of motor 40 can to rotate.Motor is accommodated with the inside of housing 41
40 rearward end 40b and link with the rearward end 40b of motor 40 and make the encoder 42 of the rotation driving of motor 40.It is electronic
The leading section 40a of machine 40 is prominent from housing 41 to -Y direction, and in the leading section, 40a is connected with the installation portion for robot arm 2
The support 14 of 12 installations.As encoder 42 rotates motor 40, the robot being connected by support 14 with motor 40
Arm 2 rotates, so as to make robot arm 2 face 211a and robot arm 2 another face 221a anti-up and down
Turn.In addition, motor 40 such as be configured to can by cylinder from housing 41 towards horizontal direction move.
First connector 216 of the first holding unit 21 and the second connector 226 of the second holding unit are with being installed on branch
The connection unit 5 switched over to the first connector 216 and the second connector 226 of the robot arm 2 of frame 14 connects.Such as
In the connection unit 5 being disposed on support 14, the connection being made up of the pitch tube with flexibility or metal pipe arrangement etc. is connected with
The other end 8a on road 8.Side of the access 8 such as using swivel joint (not shown) in the inside of drive division 3 that can bend
Formula is equipped with pipe.Or pipe is equipped in a manner of it can bend in the outside of drive division 3, the other end 8b of access 8 via
It is fixed on the valve 7 of the side of the second arm rotary unit 34 of drive division 3 and optionally provides source 60 with attraction source 61 and air
Connection.
Valve 7 shown in Fig. 1, Fig. 6 plays switches to attraction source 61 and air provides source by the connection destination with access 8
The effect of any one in 60, valve 7 are, for example, solenoid (electromagnet) valve as shown in Figure 6, and electric current flows in electromagnet
It is dynamic and produce magnetic force, pull the spool in valve to move it using the magnetic force, so as to the stream of air is switched over
Just it is provided with attraction source 61 or air any one in source 60 connect.In addition, valve 7 is not limited to solenoid valve.
As shown in fig. 6, connected via valve 7 and access 8 with any one in attraction source 61 and air offer source 60
Connection unit 5 have：Branch 50, access 8 is branched off into two by it；First pipe arrangement 51, it is by branch 50 and first
Connector 216 connects；First check-valve 53, it is disposed in the first pipe arrangement 51, by from the first connector 216 towards branch 50
The flowing cut-off of the air in direction；Second pipe arrangement 52, it connects the connector 226 of branch 50 and second；Choke valve 54, it is matched somebody with somebody
Located at the second pipe arrangement 52；And second check-valve 55, it is disposed in the second pipe arrangement 52 in parallel with choke valve 54, will be from branch
The 50 flowing cut-off to the air in the direction of the second connector 226.
Hereinafter, for being kept using the robot arm 2 shown in Fig. 1 to wafer W and by conveying machine people 1 to crystalline substance
Piece W transported in the case of, the action of robot arm 2 and the action of conveying machine people 1 illustrate.
First, motor 40 rotates connection unit 5, and robot arm 2 is arranged into another face 221a towards downside
State.Then, the Z-direction travel mechanism 9 shown in Fig. 1 makes conveying machine people 1 move in the Z-axis direction and by conveying machine
People 1 positions, to be accommodated in the back side Wb of the wafer W of wafer case (not shown) etc. and robot arm 2 another face
221a is opposed.
Then, drive division 3 rotates robot arm 2, and robot arm 2 is positioned, to cause such as wafer W
Back side Wb be centrally located at by the suction port 224 at three positions on the 221a of another face be connected obtained by triangle.
Also, robot arm 2 declines to -Z direction, another face 221a contacts with the back side Wb of wafer W.
Conveying machine people 1 is set to the state for connecting in attraction source 61 with access 8 by valve 7, by shown in Fig. 1,6
Attraction source 61 attracted, by suction port 224, attraction road 223, the second connector 226, connection unit 5, the and of access 8
Valve 7 form stream in, produce from another face 221a towards the direction in attraction source 61 air flowing.In connection unit 5
Inside, the second check-valve 55 for being disposed in the second pipe arrangement 52 shown in Fig. 6 opens, from another face 221a towards attracting source 61
The air in direction pass through second check-valve 55.First check-valve 53 in first pipe arrangement 51 is not opened, therefore in the first pipe arrangement
The flowing of air is not produced in 51.By producing the flowing of the air from the direction in another face 221a direction attractions source 61,
Attraction is produced on another face 221a of second board member 221, by the attraction, wafer W is by robot arm 2 with contact
State carries out attracting holding.
Drive division 3 is driven to robot arm 2, by the wafer W of 2 attracting holdings of robot arm from (not shown)
Take out of, transported to the holding workbench T shown in Fig. 1 in wafer case.Holding workbench T such as its profile shown in Fig. 1 is circle
Shape, have：Maintaining part T1, it is made up of porous member etc., and attracting holding is carried out to wafer W；And framework T2, it is to keeping
Portion T1 is supported.The robot arm 2 of attracting holding is carried out to the back side Wb of wafer W according to turning into the back side Wb of wafer W
Wafer W is placed in and kept on workbench T by the mode of upside.Maintaining part T1 connects with attraction source (not shown), by attracting source
Attracted and caused attraction is transferred to retaining surface T1a, so as to keep workbench T to be carried out on retaining surface T1a to wafer W
Attracting holding.In addition, the attraction for attracting source 61 to be carried out stops, and provide source 60 to attraction source 61 and air by valve 7 and enter
Row switching, make it that providing source 60 with air with the access 8 for the state for attracting source 61 to connect connects.Also, air provides source
60 provide air via valve 7 and access 8 to connection unit 5.The air provided by the choke valve 54 of connection unit 5,
And by the second connector 226, attraction road 223 and suction port 224 and from another face 221a of robot arm 2 downward
Spray a small amount of air.Using the injection pressure of the air, destroy the vacuum residued between another face 221a and wafer W and inhale
Attached power, wafer W is set reliably to depart from from robot arm 2.Also, make another face of wafer W from robot arm 2
221a departs from, and keeps workbench T to keep wafer W, and robot arm 2 is kept out of the way from holding workbench T.
In addition, when providing the offer air of source 60 from air as described above, air is sprayed from another face 221a, and
Air is sprayed from a face 211a.
With back side Wb towards the state of upside be kept workbench T holding wafer W by grinding unit (not shown) from
Back side Wb sides are ground, and are thinned to defined thickness.In grinding, although being carried out using rinse water to the back side Wb of wafer W
Cleaning, but turn into the state that the grindstone dust not cleaned thoroughly is attached on the back side Wb of wafer W.The wafer W that grinding terminates
Taken out of by conveying machine people 1 from holding workbench T.
When wafer W is taken out of from holding workbench T, first, motor 40 rotates connection unit 5, by robot
Arm 2 is arranged to states of the face 211a towards downside.Then, drive division 3 rotates robot arm 2, and the Z shown in Fig. 1
Direction of principal axis travel mechanism 9 makes conveying machine people 1 move in the Z-axis direction, and conveying machine people 1 is positioned, so as to be carried on the back
The state of face Wb sides upward is held in the back side Wb with robot arm 2 that keep the wafer W on workbench T 211a pairs of a face
Put.
Then, robot arm 2 drops to a face 211a of robot arm 2 and the back side Wb of wafer W to -Z direction
The position of discontiguous degree.After robot arm 2 drops to the defined position of Z-direction, air provide source 60 to
Valve 7 provides the air of authorized pressure.Conveying machine people 1 is set to provide what source 60 connected with access 8 by air by valve 7
State, therefore in the stream being made up of valve 7, access 8, connection unit 5, the first connector 216, groove 213 and air ejiction opening 214
Produced in road from air and flowing of the source 60 towards the air in the first retaining surface 211a direction is provided.In the inside of connection unit 5,
The first check-valve 53 for being disposed in the first pipe arrangement 51 is opened, and the air that the offer of source 60 is provided from air passes through first check-valve 53.
Second check-valve 55 in second pipe arrangement 52 is not opened, but a small amount of air to be throttled by choke valve 54 passes through the second connector
226 and from another face 221a spray.That is, when providing the offer air of source 60 from air, from a face 211a and another face
The two faces of 221a spray air.
The air sprayed from air ejiction opening 214 is in each groove 213 on a face 211a is formed at towards radiation direction
High speed circulation.Here, the air such as shown in Fig. 2 (A) provides the air spray shown in (B) of the sectional area less than Fig. 2 on road 215
The sectional area of outlet 214, therefore when being moved from air offer road 215 to air ejiction opening 214, the flow velocity of air accelerates, quiet
Pressure increase, the absorption affinity adsorbed to wafer W is produced so as to suck the air of surrounding.In addition, air is in rectilinear form
Circulated at high speed towards radiation direction with rectification state in each groove 213, so as to due to Bernoulli effect, the week of the both sides of groove 213
The air enclosed is inhaled into inside groove 213, and negative pressure is produced near groove 213, so as to produce the absorption affinity to wafer W.Also, machine
Human arm 2 carries out absorption holding with contactless state using a face 211a to wafer W.
After robot arm 2 has carried out absorption holding to wafer W in a non-contact manner, release and keep workbench T
To the attracting holding of wafer W.In addition, robot arm 2 rises to +Z direction, so as to which wafer W takes out of from holding workbench T.It is logical
The robot arm 2 that portion 3 makes in a non-contact manner to carry out the wafer W after processing absorption holding of overdriving rotates, after processing
Wafer W be transported to wafer cleaner etc..The robot arm 2 transported to the wafer W after processing is in order to reality
The wafer W of Shi Xin processing is transported and moved.
Alternatively, it is also possible to be, being provided in air between source 60 and valve 7 has choke valve (not shown), to providing to non-return
The flow of the air of the side of valve 53 is adjusted and wafer W is carried out with contactless state by a face 211a of robot arm 2
Absorption is kept.In this case, by increasing the flow of provided air wafer W can also be made to be contacted with a face 211a
And carry out absorption holding.I.e., it is possible to make choke valve play function as switch unit, the switch unit is to utilizing a face with non-
The mode of contact carries out adsorbing the first air mass flow of holding and makes the air more than first air mass flow in groove to chip
The second air mass flow for circulating and to chip adsorb holding with a face in the way of contacting switches over.Make wafer W
Contacted with a face 211a and carry out absorption holding to wafer W by a face 211a, so as to prevent the transverse direction of wafer W sliding
It is dynamic.
So, robot arm 2 of the invention can optionally carry out protecting with contact condition in the holding to wafer W
Hold or kept with contactless state, as described previously for the wafer W before processing, make it another with the second holding unit 22
Individual face 221a contact and carry out attracting holding so as to transport, for being attached with the wafer W after the processing of grindstone dust etc., pass through
First holding unit 21 carries out absorption holding in a non-contact manner, so as to not make grindstone dust be attached to robot arm 2
Above and transported.Also, robot arm 2 will not be attached to the pollutions such as the grindstone dust in the wafer W after grinding, so as to
It can prevent robot arm 2 from grindstone dust is attached in the new wafer W for implementing processing.
The conveying machine people 1 of the present invention can make robot arm 2 efficiently take place without the action for adhering to grindstone dust, from
And grindstone dust can not be made to be attached to the new wafer W for implementing processing and by wafer transfer to defined conveyance position.
In addition, the robot arm 2 and conveying machine people 1 of the present invention are not limited to above-mentioned embodiment, in addition, accompanying drawing institute
The robot arm 2 shown and the size of each structure of conveying machine people 1 or shape etc. are also not necessarily limited to this, can play this
Suitably changed in the range of The effect of invention.Such as the first holding unit 21, there are various embodiments as shown below.
Such as the first holding unit 23 shown in Fig. 7 has：First board member 231 of the tabular of rectangle, it is by acrylic acid
Or the engineering plastics such as makrolon or stainless steel etc. are formed；And rectangular-shaped base portion 232, itself and the first board member 231 are integrally
Ground is formed.On a face 231a of the first board member 231, the periphery according to one end 233a to the front end of the first board member 231
Linearly formed with a groove 233, a face 231a is used as to be inhaled the mode of side opening to wafer W in a non-contact manner
The face of attached holding.The other end 233b of groove 233 end face connects with an air ejiction opening 234, the air ejiction opening 234 according to
Face 231a center is formed at towards the mode of face 231a face direction opening.Air ejiction opening 234 is from groove 233
Other end 233b sprays air to one end 233a.In the inside of the first holding unit 23, i.e. from air ejiction opening 234 to base portion
232 inside, be formed as linearly extending for two air offer road 235 of air circulation.As shown in fig. 7, two air
The other end 235a interflow for providing road 235 connects for one with air ejiction opening 234.Each air provides the one end on road 235
235b connects with each first connector 236, and each first connector 236 is from the inside of base portion 232 towards a face 231a and shape
Into and a face 231a upper shed.Each first connector 236 provides source 60 with the air shown in Fig. 1 and connected.Alternatively, it is also possible to
Throttle orifice accelerated on road 235 formed with the air for making to pass through in air offer road 235 etc. is provided in each air.In addition,
There is the suction port with attracting source to connect, pair in the same manner as the first holding unit 23 on one face 231a another opposite face
The second holding unit that rectangular shape is formed is bonded.Alternatively, it is also possible in the phase of face 231a sides or a face 231a
The second connection for arranging the first connector 236 on the same face of any one of another anti-surface side and being connected with attraction source
Mouthful.
Such as can also be that the first holding unit 24 as shown in Figure 8 is such, by the first holding unit 23 shown in Fig. 7
The first board member 231 be changed to be formed as with the external diameter roughly the same with the external diameter of the discoideus wafer W shown in Fig. 1
First board member 241 of the tabular of circular.For by the first board member 231 be changed to this point of the first board member 241 with
Outer structure, the first holding unit 24 are formed in the same manner as the first holding unit 23.The first board member 231 and Fig. 8 shown in Fig. 7
The part formation compared with imaginary line L1 by -Y direction side of the base portion 232 of the first shown board member 241 is installed on shown in Fig. 1
Conveying machine people 1 installation portion.
Claims (4)
1. a kind of robot arm, it is the robot arm of tabular, its have to chip carry out adsorb holding a face with
And the installation portion of robot is installed on, wherein,
The robot arm has holding unit, and the holding unit makes a face be connected with air offer source, sprays air
And make air flow along the direction in a face and produce negative pressure, so as to carry out absorption holding to chip,
The holding unit has：
Groove, its one end is on one face in outer circumferential openings；
Air ejiction opening, it sprays air from the other end of the groove towards the one end；And
Air provides road, and it is formed at the inside of the holding unit, makes to be connected possessed by the air ejiction opening and the installation portion
Mouth connection,
Make to circulate in the cell from the air that the air ejiction opening sprays and negative pressure is produced on a face, so as to enter to chip
Row absorption is kept,
The robot arm can take out chip and by wafer storage in box from being accommodated with shelf-like in the box of chip.
2. robot arm according to claim 1, wherein,
The robot arm has switch unit, and the switch unit switches over to the first air mass flow and the second air mass flow,
Wherein, first air mass flow is to make to circulate and utilize one in the groove from the air that the air ejiction opening sprays
Face to chip adsorb the air mass flow of holding in a non-contact manner, and second air mass flow is to make to be more than first air
The air of flow circulates and chip is contacted with one face so as to chip adsorb the air stream of holding in the cell
Amount,
First air mass flow and second air mass flow are switched over by the switch unit, so as to non-contact and contact
Selected and carry out absorption holding.
3. a kind of robot arm, it is the robot arm of tabular, and it has the face, right for chip adsorb holding
Chip carries out another face of attracting holding and is installed on the installation portion of robot, wherein,
The robot arm has：
First holding unit, it makes a face be connected with air offer source, sprays air and make along the direction in a face
Air flow and produce negative pressure, so as to carrying out absorption holding to chip；And
Second holding unit, it makes another face be connected with attraction source and attracting holding is carried out to chip,
First holding unit has：
First board member of tabular；
Groove, it is formed as one end on a face to the periphery side opening of first board member；
Air ejiction opening, it sprays air from the other end of the groove towards the one end；And
Air provides road, and it is formed at the inside of first holding unit, makes possessed by the air ejiction opening and the installation portion
First connector connects,
Second holding unit has：
Second board member of tabular；
Suction port, it makes another face be connected with attraction source；And
Attraction road, it is formed at the inside of second holding unit, makes the second connection possessed by the suction port and the installation portion
Mouth connection.
4. a kind of conveying machine people, it is transported to chip, has the peace for the robot arm described in claim 3
The support of dress portion installation, wherein,
Conveying machine people has：
Access, it is optionally provided via the valve that one end with the access is connected with the attraction source and the air
Source connects；And
Connection unit, it is connected with the other end of the access, by the connection destination of the access and is installed on the support
First connector of the robot arm and second connector link,
The connection unit has：
Branch, the access is branched off into two by it；
First pipe arrangement, it connects the branch with first connector；
First check-valve, it is disposed in first pipe arrangement, by the air from first connector towards the direction of the branch
Flowing cut-off；
Second pipe arrangement, it connects the branch with second connector；
Choke valve, it is disposed in second pipe arrangement；And
Second check-valve, it is disposed in second pipe arrangement in parallel with the choke valve, will from the branch towards this second connection
The flowing cut-off of the air in the direction of mouth.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016196279A JP6853646B2 (en) | 2016-10-04 | 2016-10-04 | Robot hand and transfer robot |
| JP2016-196279 | 2016-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107891427A true CN107891427A (en) | 2018-04-10 |
| CN107891427B CN107891427B (en) | 2022-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710864986.0A Active CN107891427B (en) | 2016-10-04 | 2017-09-22 | Robot arm and transfer robot |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6853646B2 (en) |
| KR (1) | KR102258464B1 (en) |
| CN (1) | CN107891427B (en) |
| TW (1) | TWI718335B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111958615A (en) * | 2020-08-19 | 2020-11-20 | 西安奕斯伟硅片技术有限公司 | Assembly and method for conveying wafer |
| CN112077830A (en) * | 2019-06-12 | 2020-12-15 | 株式会社迪思科 | Robot arm |
| CN112743564A (en) * | 2021-01-12 | 2021-05-04 | 南京迪海智科精密机械有限公司 | Chip grabbing robot and grabbing method |
| CN113510725A (en) * | 2020-04-10 | 2021-10-19 | 日本电产三协（浙江）有限公司 | Hand of industrial robot and industrial robot |
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|---|---|---|---|---|
| US11254014B2 (en) * | 2017-07-21 | 2022-02-22 | Electro Scientific Industries, Inc. | Non-contact handler and method of handling workpieces using the same |
| KR102157822B1 (en) * | 2018-06-21 | 2020-09-18 | 에이피시스템 주식회사 | Substrate carrier apparatus and method |
| JP7359583B2 (en) * | 2019-07-22 | 2023-10-11 | 株式会社ディスコ | processing equipment |
| JP7339860B2 (en) * | 2019-11-15 | 2023-09-06 | 株式会社ディスコ | processing equipment |
| JP2023041150A (en) | 2021-09-13 | 2023-03-24 | 株式会社ディスコ | robot hand |
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Also Published As
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| KR20180037579A (en) | 2018-04-12 |
| KR102258464B1 (en) | 2021-06-01 |
| CN107891427B (en) | 2022-05-13 |
| TWI718335B (en) | 2021-02-11 |
| TW201813794A (en) | 2018-04-16 |
| JP2018058139A (en) | 2018-04-12 |
| JP6853646B2 (en) | 2021-03-31 |
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