CN107889386A - Method for producing shell, housing and electronic equipment - Google Patents
Method for producing shell, housing and electronic equipment Download PDFInfo
- Publication number
- CN107889386A CN107889386A CN201711041560.1A CN201711041560A CN107889386A CN 107889386 A CN107889386 A CN 107889386A CN 201711041560 A CN201711041560 A CN 201711041560A CN 107889386 A CN107889386 A CN 107889386A
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- China
- Prior art keywords
- base material
- film layer
- housing
- electronic equipment
- polishing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The embodiment of the present application discloses a kind of method for producing shell, housing and electronic equipment, and methods described includes：There is provided a base material, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and second surface is towards on the outside of electronic equipment；The second surface of the base material is processed by shot blasting；Film layer is formed on the base material second surface after polishing, for the film layer to be formed using high polymer material with electrical spinning method, the outer surface of the film layer has irregular concaveconvex structure.By in base material towards forming thin film layer on the surface on the outside of electronic equipment, the film layer is to be formed using high polymer material with electrical spinning method, so that the outer surface of film layer has irregular concaveconvex structure, the irregular concaveconvex structure makes light diffusing reflection, realizes resistance and fingerprint resistance effect.
Description
Technical field
The application is related to technical field of electronic equipment, and in particular to a kind of method for producing shell, housing and electronic equipment.
Background technology
At present, electronic equipment, for example mobile phone, the housing outer surface of tablet personal computer easily glue fingerprint.
The content of the invention
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment, and housing outer surface is not easy to stay finger
Escutcheon.
The embodiment of the present application provides a kind of method for producing shell, and the housing is applied to electronic equipment, and the housing makes
Method includes：
There is provided a base material, the base material includes first surface and second surface, and the first surface is towards in electronic equipment
Side, second surface is towards on the outside of electronic equipment；
The second surface of the base material is processed by shot blasting；
Film layer is formed on the base material second surface after polishing, the film layer is to utilize high polymer material
Formed with electrical spinning method, the outer surface of the film layer has irregular concaveconvex structure.
The embodiment of the present application also provides a kind of housing, and applied to electronic equipment, the housing includes a base material and a film
Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction
On the outside of sub- equipment, the film layer is arranged at the second surface of the base material, and the film layer outer surface has irregular recessed
Male structure.
The embodiment of the present application additionally provides a kind of electronic equipment, including housing, and the housing includes a base material and a film
Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction
On the outside of sub- equipment, the film layer is arranged at the second surface of the base material, and the film layer outer surface has irregular recessed
Male structure.
The method for producing shell that the embodiment of the present application provides, by housing base material towards the surface on the outside of electronic equipment
Upper formation thin film layer, the film layer is forms using high polymer material with electrical spinning method, so that the appearance mask of film layer
There is irregular concaveconvex structure, the irregular concaveconvex structure makes light diffusing reflection, realizes matte performance, and realizes resistance to finger
Line effect.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the present application, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for
For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is the structural representation for the electronic equipment that the embodiment of the present application provides；
Fig. 2 is the structural representation for the housing that the embodiment of the present application provides；
Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides；
Fig. 4 is profiles of the Fig. 3 in A-A directions；
Fig. 5 is another profiles of the Fig. 3 in A-A directions；
Fig. 6 is another profiles of the Fig. 3 in A-A directions；
Fig. 7 is another structural representation for the housing that the embodiment of the present application provides；
Fig. 8 is another structural representation for the bonnet that the embodiment of the present application provides；
Fig. 9 is another structural representation for the electronic equipment that the embodiment of the present application provides；
Figure 10 is the first schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides；
Figure 11 is second of schematic flow sheet of the bonnet preparation method that the embodiment of the present application provides；
Figure 12 is the third schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only some embodiments of the present application, rather than whole embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belong to the scope of the application protection.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment.It will carry out respectively below detailed
Explanation.
In the present embodiment, will be described from the angle of bonnet preparation method, method for producing shell can form shell
Body, housing can be set in the electronic device, such as mobile phone, tablet personal computer, palm PC (Personal Digital
Assistant, PDA) etc..
Refer to the structural representation that 1, Fig. 1 is the electronic equipment that the embodiment of the present application provides.Electronic equipment 1 includes housing
10th, display screen 20, printed circuit board 30, battery 40.
Referring to Fig. 2, Fig. 2 is the structural representation for the housing that the embodiment of the present application provides.
Wherein, the housing 10 can include cover plate 11, center 12 and bonnet 13.The cover plate 11, the and of the center 12
The bonnet 13 is mutually combined to form the housing 10.The housing 10, which has, passes through the cover plate 11, the center 12 and institute
A confined space of the formation of bonnet 13 is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
In certain embodiments, the lid of cover plate 11 is set on center 12.The lid of bonnet 13 is set on center 12.Cover plate 11 and bonnet
13 are located at the opposite face of center 12.Cover plate 11 and bonnet 13 are oppositely arranged.The confined space of housing 10 is located at cover plate 11 and bonnet
Between 13.
Cover plate 11 can be transparent glass cover plate.In some embodiments, cover plate 11 can be with sapphire etc.
Glass cover-plate made of material.
Center 12 can be metal shell, such as aluminium alloy center 12.It should be noted that the embodiment of the present application center 12
Material be not limited to this, other manner can also be used, such as：Center 12 can ceramic center, glass center.For another example：
Center 12 can be plastic cement center.Also such as：Center 12 can be the structure that metal and plastic cement cooperate, can be by plastic part
Divide and be molded on sheet metal and formed.
Bonnet 13 can be with metal back cover, such as aluminium alloy bonnet, stainless steel bonnet.Bonnet 13 can also be glass back cover or
Person's ceramics bonnet.
Also referring to Fig. 3, Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides.
Bonnet 13 can include inner surface 131 and the outer surface 132 being oppositely arranged.The inner surface 131 of bonnet 13 is in
Frame 12 and cover plate 11, form a part for the inner surface of housing 10.The outer surface 132 of bonnet 13 away from center 12 and cover plate 11,
Form a part for the outer surface of housing 10.Bonnet 13 can also include through hole 133, and through hole 133 can be used for installing camera.
Also referring to Fig. 4, Fig. 4 is profiles of the Fig. 3 in A-A directions.
For purposes of illustration only, housing is illustrated by taking bonnet 13 as an example below.
Bonnet 13 can include a base material 134 and a film layer 135.Film layer 135 is arranged at bonnet 13 away from cover plate 11
Surface, namely film layer 135 is arranged at the outer surface of housing 11.
Wherein, base material 134 can use aluminium, such as aluminium alloy, can also use stainless steel, can also use glass,
Ceramics, plastics etc..
Base material 134 includes first surface 1341 and second surface 1342.First surface 1341 is towards on the inside of electronic equipment, and the
Two surfaces 1342 are towards on the outside of electronic equipment.In some embodiments, first surface 1341 is towards cover plate 11 and center 12
Direction is set.First surface 1341 can be the inner surface 131 of bonnet 13.First surface 1341 is the inner surface of housing 11.The
Two surfaces 1342 face away from cover plate 11 and the direction of center 12 is set.Second surface 1342 is the outer surface of housing 11.
Film layer 135 is arranged at the second surface 1342 of base material 134.Film layer 135 is to utilize high polymer material electrospinning
Silk method is formed, and the outer surface of film layer has irregular concaveconvex structure.
Wherein, film layer 315 uses high polymer material can be used comprising Kynoar (PVDF,
Polyvinylidene Fluoride), Kynoar -co- hexafluoropropene (Polyvinylidene fluoride-co-
Hexafluoropropylene), (per) fluoropolymer (perf luoropolymer), polyvinyl chloride (polyvinyl
) or polyvinylidene chloride (pol yvinylidene chloride) and their copolymer and polyethylene glycol two chloride
Alkyl ether (polyet hylene glycol dialkylether) and polyethylene glycol dialkyl ester (polyethylene
Glycol dialkyl ester) polyethyleneglycol derivative, include polyformaldehyde-oligomeric-oxygen ethene (poly ox
Ymethylene oligo oxyethylene), PEO (polyethyleneoxide) and PPOX
(polypropyleneoxide) polyoxide (polyoxide), includes polyvinyl acetate (polyvinyl
Acetate), polyvinylpyrrolidone-polyvinyl acetate (poly vinylpyrrolidone-vinyl acetate), poly-
Styrene (polystyrene) and polystyrene acrylonitrile (poly styrene acrylonitrile) copolymer, polypropylene
The polyacrylonitrile copolymer of nitrile methacrylate (poly acrylonitrile methacrylate) copolymer, methyl-prop
E pioic acid methyl ester (methyl methacrylate), methylmethacrylate copolymer and their mixture.
Film layer 135 utilizes high polymer material, is formed using spinning process on the second surface 1342 of base material 134.
Specifically, film layer 135 carries out Electrospun first with polymer substance forms filament, it is filametntary a diameter of
0.2 micron -2.0 microns.
Then by filament on the second surface 1342 of base material 134 accumulation form film layer 135, film layer 135 has
Multiple stomatas.Therefore the surface of the outer surface of film layer 135 is formed as irregular form.
Please refer to fig. 5, Fig. 5 is another profiles of the Fig. 3 in A-A directions.In the present embodiment, if need not
During using color as bonnet of base material 134 color of itself, then, one can be set between base material 134 and film layer 135
Oxide layer 136.
Oxide layer 136 is arranged between base material 134 and film layer 135.Oxide layer 136 can form one by once oxidation
Layer oxide layer.Such as：Monochrome oxidation forms oxide layer, can specifically be formed by being coloured after oxidation technology.
It should be noted that in some embodiments, it is also possible to formed using oxidation twice or oxidation more than twice more
Layer oxide layer.
In some embodiments, oxide layer can also carry out double-colored oxidation, or polychrome oxidation.Specifically, can be first single
Color aoxidizes a part of base material, then changes the monochromatic oxidation another part base material of another color.So obtain the base material of two kinds of colors.
In some embodiments, oxide layer 136 can have multiple oxide regions, and different oxide regions set different face
Color, to form pattern.
In some embodiments, can be right in order that film layer 135 can more be firmly adhered to oxide layer 136
Oxide layer 136 is processed by shot blasting, to increase the flatness on the surface of oxide layer 136, is being aoxidized so as to add film layer 135
The adhesive force of layer 136, and then film layer 135 is firmly adhered to oxide layer 136.
In some embodiments, the thickness of film layer 135 is less than 500 nanometers, to cause film layer 135 to have well
Photopermeability, avoid the blocking to the color of oxide layer 136 of film layer 135.
In some embodiments, film layer 135 is prepared using spinning process, therefore according to high polymer material
Spinning amount freely adjusts thickness.
Also referring to Fig. 6, Fig. 6 is another profiles of the Fig. 3 in A-A directions.In the present embodiment, film layer 135
On the protective layer 137 of layer of transparent can also be set.The thickness of the protective layer 137 is nanoscale, does not influence film layer outer surface
Irregular concaveconvex structure.
In some embodiments, the thickness of protective layer 137 is less than 500 nanometers.
It should be noted that the structure of the embodiment of the present application housing is not limited to this, such as, referring to Fig. 7, Fig. 7 is this
Apply for another structural representation for the housing that embodiment provides.
Housing 10a includes cover plate 16 and bonnet 17.In certain embodiments, the directly lid of cover plate 16 is set on bonnet 17.Lid
Plate 16 and bonnet 17 are mutually combined to form housing 10a.Housing 10a has the confined air formed by cover plate 16 and bonnet 17
Between, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
Compared to the housing 10 shown in Fig. 2, Fig. 7 housing 10a does not include center, or perhaps by the He of center 12 in Fig. 2
Bonnet 13 is integrally formed to form the structure of a bonnet 17.
Specifically, referring to Fig. 8, Fig. 8 is another structural representation for the bonnet that the embodiment of the present application provides.
In certain embodiments, bonnet 17 includes inner surface 171 and outer surface 172, inner surface 171 and the phase of outer surface 172
To setting, the whole surface of bonnet 17 is formed.Each Rotating fields of bonnet 17 can refer to bonnet 13, will not be repeated here.
Printed circuit board 30 is installed in the housing 10, and printed circuit board 30 can be the mainboard of electronic equipment 1, printed circuit
The function group such as antenna, motor, microphone, camera, light sensor, receiver and processor can be integrated with plate 30
Part.In certain embodiments, printed circuit board 30 is fixed in housing 10.Specifically, printed circuit board 30 can pass through screw
It is screwed on center 12, can also be fitted on using card by the way of buckle on center 12.It should be noted that the embodiment of the present application prints
The mode that circuit board 30 processed is specifically fixed on center 12 is not limited to this, can be with other manner, for example passes through buckle and spiral shell
The mode that nail is fixed jointly.
Battery 40 is installed in the housing 10, and battery 40 is electrically connected with printed circuit board 30, to be provided to electronic equipment 1
Power supply.Housing 10 can be as the battery cover of battery 40.Housing 10 covers battery 40 to protect battery 40, particularly bonnet 13
Covering battery 40 reduces collision, the damage falling etc. and be subject to of the battery 40 due to electronic equipment 1 to protect battery 40.
Display screen 20 is installed in the housing 10, meanwhile, display screen 20 is electrically connected on printed circuit board 30, to form electronics
The display surface of equipment 1.Display screen 20 includes viewing area 14 and non-display area 15.Viewing area 14 can be used for showing electronics
The picture of equipment 1 carries out touching manipulation etc. for user.The top area of non-display area 15 is opened up for sound and light biography
The perforate led, non-display area 15 can set the functional units such as fingerprint module, touch controlled key on bottom.Its cover plate 11 is installed
Onto display screen 20, to cover display screen 20, formed with the identical viewing area of display screen 20 and non-display area, specifically can be with
Viewing area and non-display area refering to display screen 20.
It should be noted that the structure of display screen 20 is not limited to this.For example display screen can be comprehensive screen or the opposite sex
Screen, specifically, referring to Fig. 9, Fig. 9 is another structural representation for the electronic equipment that the embodiment of the present application provides.Electricity in Fig. 9
Sub- equipment and the difference of the electronic equipment in Fig. 1 are：Non-display area 15a is formed directly on display screen 20a, such as aobvious
Display screen 20a non-display area 15a is arranged to transparent configuration, so that optical signal passes through, or directly in the non-aobvious of display screen 20a
Show that region is opened up for structures such as the perforate of light conduction or breach, front camera, photoelectric sensor etc. can be arranged at non-
Viewing area position, so that front camera is taken pictures, photoelectric sensor detects.It is whole that viewing area 14a is paved with electronic equipment 1a
Surface.It should be noted that more than the device such as housing 10, printed circuit board 30 and battery 40 in electronic equipment 1a can refer to
Content, it will not be repeated here.
The present invention also provides a kind of preparation method of housing.
It should be noted that illustrated below by taking bonnet as an example, but the embodiment of the present application method for producing shell is not
It is limited to bonnet.
Referring to Fig. 10, Figure 10 is the schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.Housing makes
Method comprises the following steps：
Step 101 a, there is provided base material, base material include first surface and second surface, and first surface is towards in electronic equipment
Side, second surface is towards on the outside of electronic equipment.
Base material can be metal material, such as aluminium, further, such as aluminium alloy.It should be noted that base material can be with
Directly be commercially available, sheet fabrication can also be obtained, for example, aluminum alloy plate materials are forged and pressed, the PROCESS FOR TREATMENT such as timeliness obtains
Arrive.Base material can also use glass, ceramics, plastics etc..
First surface is set towards the direction of cover plate and center.First surface can be the inner surface of bonnet.First surface
For the inner surface of housing.Second surface faces away from cover plate and the direction of center is set.Second surface is the outer surface of housing.
Step 102, the second surface of base material is processed by shot blasting.
In some embodiments, can be with order that film layer can more be firmly adhered to the second surface of base material
The second surface of base material is processed by shot blasting, to increase the flatness of the second surface of base material, existed so as to add film layer
The adhesive force of the second surface of base material, and then film layer is firmly adhered to the second surface of base material.
In certain embodiments, can be by the way of machinery, chemistry, electrochemistry or ultrasonic wave etc. to the second table of base material
Realize polishing in face.To cause the second surface roughness of base material to reduce, to obtain the second table of bright, flat surface base material
Face.Wherein, chemical polishing mode is to carry out regular dissolving to the second surface of base material to reach smooth.Wherein, electrochemistry
It using the second surface of base material as anode, insoluble petal is negative electrode that polishing mode, which is, and the two poles of the earth are immersed in electrolytic cell simultaneously, is led to
Direct current and produce selective anodic dissolution so that the second surface brightness increase of base material is big.Wherein mechanically polish
Mode be by cut base material second surface so that base material second surface plastic deformation remove polishing after convex portion and obtain
Even surface.The mode of wherein ultrasonic polishing is that base material is put into abrasive suspension and is placed in together in ultrasound field, is relied on
The oscillation action of ultrasonic wave, make abrasive material in the second surface grinding-polishing of base material.
In certain embodiments, can be first to the second of base material before being processed by shot blasting to the second surface of base material
Surface carries out grinding process, and then the second surface of the base material after grinding process is processed by shot blasting again, imitates polishing
Fruit is more preferably so that the second surface of base material is more smooth.Here, it should be noted that grinding process can be understood as to polishing
The roughing of before processing.I.e., it is possible to first carry out once thick polishing to rear exterior surface, then once carefully polished, complete polishing
Processing.
Step 103, film layer is formed on the base material second surface after polishing, film layer is to utilize high polymer material
Formed with electrical spinning method, the outer surface of film layer has irregular concaveconvex structure.
Wherein, the high polymer material that film layer uses, which can be used, includes Kynoar (PVDF, Polyvinylidene
Fluoride), Kynoar -co- hexafluoropropene (Polyvinylidene fluoride-co-
Hexafluoropropylene), (per) fluoropolymer (perf luoropolymer), polyvinyl chloride (polyvinyl
) or polyvinylidene chloride (pol yvinylidene chloride) and their copolymer and polyethylene glycol two chloride
Alkyl ether (polyet hylene glycol dialkylether) and polyethylene glycol dialkyl ester (polyethylene
Glycol dialkyl ester) polyethyleneglycol derivative, include polyformaldehyde-oligomeric-oxygen ethene (poly ox
Ymethylene oligo oxyethylene), PEO (polyethyleneoxide) and PPOX
(polypropyleneoxide) polyoxide (polyoxide), includes polyvinyl acetate (polyvinyl
Acetate), polyvinylpyrrolidone-polyvinyl acetate (po ly vinylpyrrolidone-vinyl acetate), poly-
Styrene (polystyrene) and polystyrene acrylonitrile (poly styrene acrylonitrile) copolymer, polypropylene
The polyacrylonitrile copolymer of nitrile methacrylate (poly acrylonitrile methacrylate) copolymer, methyl-prop
E pioic acid methyl ester (methyl methacrylate), methylmethacrylate copolymer and their mixture.
Film layer utilizes high polymer material, is formed using spinning process on the second surface of base material.
Also referring to Figure 11, Figure 11 is second of flow signal for the bonnet preparation method that the embodiment of the present application provides
Figure.In the present embodiment, film layer is formed on the base material second surface after polishing, can included：
Step S1031, using polymer substance carry out Electrospun formed filament, filametntary a diameter of 0.2 micron-
2.0 micron.
Step S1032, filament had into multiple gas accumulating the film layer of formation, film layer on base material second surface
Hole.
Therefore the surface of the outer surface of film layer is formed as irregular form.
In some embodiments, if only need the color for using the color of base material itself as bonnet, then, it is thin
Film layer can be directly arranged at the second surface of base material.
Figure 12 is referred to, Figure 12 is the third schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.
In present embodiment, if do not need color of the self color of base material 134 as bonnet, then, in step S102 and S103
Between also include：
Step S102a, one oxide layer is set in the second surface of the base material of polishing.
Oxide layer is arranged between base material and film layer.Oxide layer can form layer of oxide layer by once oxidation.Than
Such as：Monochrome oxidation forms oxide layer, can specifically be formed by being coloured after oxidation technology.
It should be noted that in some embodiments, it is also possible to formed using oxidation twice or oxidation more than twice more
Layer oxide layer.
In some embodiments, oxide layer can also carry out double-colored oxidation, or polychrome oxidation.Specifically, can be first single
Color aoxidizes a part of base material, then changes the monochromatic oxidation another part base material of another color.So obtain the base material of two kinds of colors.
In some embodiments, oxide layer can have multiple oxide regions, and different oxide regions set different colours,
To form pattern.
Step S102b, is processed by shot blasting to oxide layer.
In some embodiments, can be to oxide layer in order that film layer can more be firmly adhered to oxide layer
It is processed by shot blasting, to increase the flatness on the surface of oxide layer, so as to add adhesive force of the film layer in oxide layer, and then
Film layer is set to be firmly adhered to oxide layer.
In some embodiments, the thickness of film layer is less than 500 nanometers, to cause film layer that there is good light to pass through
Property, avoid film layer blocking to the color of oxide layer.
In some embodiments, film layer is prepared using spinning process, therefore according to the spinning of high polymer material
Silk is measured freely to adjust thickness.
In some embodiments, the protective layer of layer of transparent can also be set in film layer.The protective layer is nanoscale,
The irregular concaveconvex structure of film layer outer surface is not influenceed.
In some embodiments, the thickness of protective layer is less than 500 nanometers.
In summary, the method for producing shell that the embodiment of the present application provides, by housing base material towards electronic equipment
Thin film layer is formed on the surface in outside, the film layer is forms using high polymer material with electrical spinning method, so that film layer
Outer surface there is irregular concaveconvex structure, the irregular concaveconvex structure makes light diffusing reflection, realizes matte performance, and
And realize resistance and fingerprint resistance effect.
It will be understood by those skilled in the art that the structure of the electronic equipment 1 shown in Fig. 1 is not formed to electronic equipment 1
Restriction.Electronic equipment 1 can be included than illustrating more or less parts, either combine some parts or different portions
Part is arranged.Electronic equipment 1 can also include memory, bluetooth module etc., will not be repeated here.
Method for producing shell, housing and the electronic equipment provided above the embodiment of the present application is described in detail, this
Apply specific case in text to be set forth the principle and embodiment of the application, the explanation of above example is only intended to
Help understands the application.Meanwhile for those skilled in the art, according to the thought of the application, in embodiment and answer
With there will be changes in scope, in summary, this specification content should not be construed as the limitation to the application.
Claims (11)
1. a kind of method for producing shell, the housing is applied to electronic equipment, it is characterised in that the method for producing shell bag
Include：
One base material is provided, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and the
Two surfaces are towards on the outside of electronic equipment；
The second surface of the base material is processed by shot blasting；
Film layer is formed on the base material second surface after polishing, the film layer is to utilize high polymer material electricity consumption
Spin processes are formed, and the outer surface of the film layer has irregular concaveconvex structure.
2. method for producing shell as claimed in claim 1, it is characterised in that place is polished to the second surface of the base material
After the step of reason, in addition to：
Oxidation processes are carried out to the second surface of the base material after polishing；
It is the step of formation film layer on the base material second surface after polishing：After the oxidising treat-ment described
Film layer is formed on base material second surface.
3. method for producing shell as claimed in claim 2, it is characterised in that to the second table of the base material after polishing
Face carry out oxidation processes the step of be：Monochromatic oxidation or double-colored oxidation are carried out to the second surface of the base material after polishing
Processing.
4. method for producing shell as claimed in claim 1, it is characterised in that the base material second surface after the oxidising treat-ment
After the step of upper formation film layer, in addition to：
Transparent protective layer is set in the film layer.
5. method for producing shell as claimed in claim 4, it is characterised in that the thickness of the protective layer is less than 500 nanometers.
6. method for producing shell as claimed in claim 1, it is characterised in that the base material second surface after polishing
The step of upper formation film layer, including：
Using polymer substance carry out Electrospun formed filament, described filametntary a diameter of 0.2 micron -2.0 microns；
The filament is accumulated to the film layer of formation, the film layer on the base material second surface after polishing
With multiple stomatas.
A kind of 7. housing, applied to electronic equipment, it is characterised in that：The housing includes a base material and a film layer, the base
Material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and second surface is towards outside electronic equipment
Side, the film layer are arranged at the second surface of the base material, and the film layer outer surface has irregular concaveconvex structure.
8. housing as claimed in claim 7, it is characterised in that：Also include an oxide layer, the oxide layer is set and the base
Between the second surface and film layer of material.
9. housing as claimed in claim 7, it is characterised in that：Also include a protective layer, the protective layer is arranged at described thin
On the outer surface of film layer.
10. housing as claimed in claim 9, it is characterised in that the thickness of the protective layer is less than 500 nanometers.
11. a kind of electronic equipment, it is characterised in that including housing, the housing is as any one of claim 7 to 10
Housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711041560.1A CN107889386B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711041560.1A CN107889386B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
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| CN107889386A true CN107889386A (en) | 2018-04-06 |
| CN107889386B CN107889386B (en) | 2021-03-02 |
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| CN201711041560.1A Active CN107889386B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
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| CN (1) | CN107889386B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080242384A1 (en) * | 2007-03-30 | 2008-10-02 | Sutech Trading Limited | Mobile device housing and method for manufacturing such |
| CN104159745A (en) * | 2012-03-06 | 2014-11-19 | 阿莫绿色技术有限公司 | Matte film and manufacturing method therefor |
| CN104805485A (en) * | 2015-04-07 | 2015-07-29 | 广东欧珀移动通信有限公司 | Surface treatment method for die-cast aluminum alloy |
| CN106572208A (en) * | 2016-09-08 | 2017-04-19 | 广东欧珀移动通信有限公司 | Housing and making method thereof, and mobile terminal |
-
2017
- 2017-10-30 CN CN201711041560.1A patent/CN107889386B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080242384A1 (en) * | 2007-03-30 | 2008-10-02 | Sutech Trading Limited | Mobile device housing and method for manufacturing such |
| CN104159745A (en) * | 2012-03-06 | 2014-11-19 | 阿莫绿色技术有限公司 | Matte film and manufacturing method therefor |
| CN104805485A (en) * | 2015-04-07 | 2015-07-29 | 广东欧珀移动通信有限公司 | Surface treatment method for die-cast aluminum alloy |
| CN106572208A (en) * | 2016-09-08 | 2017-04-19 | 广东欧珀移动通信有限公司 | Housing and making method thereof, and mobile terminal |
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| Publication number | Publication date |
|---|---|
| CN107889386B (en) | 2021-03-02 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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