CN107885285B

CN107885285B - Electronic device and noise control method thereof

Info

Publication number: CN107885285B
Application number: CN201710886313.5A
Authority: CN
Inventors: 宋民佑; 金政晧; 郑义粲; 李智雨
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2016-09-30
Filing date: 2017-09-26
Publication date: 2023-09-26
Anticipated expiration: 2037-09-26
Also published as: US10636547B2; CN107885285A; KR20180036238A; EP3301903A3; US20180096754A1; EP3301903A2; EP3301903B1; KR102506428B1

Abstract

An electronic device and a noise control method thereof are provided. The electronic device includes: a cable having a first layer forming a first power line and a second layer forming a second power line. The first and second layers are arranged in a vertically stacked configuration. The cable eliminates a magnetic field generated by a current when charging and discharging a battery cell of the electronic device and eliminates noise caused by a magnetic field generated by a coil-containing assembly of the electronic device. Other various embodiments are possible.

Description

Electronic device and noise control method thereof

Technical Field

The present disclosure relates to an electronic device and a method of controlling minimizing noise of the electronic device.

Background

For example, electronic devices such as smartphones have embedded batteries.

The embedded battery may include a battery cell for storing current, a Flexible Printed Circuit Board (FPCB) for connecting the battery cell with a PCB equipped in the electronic device, and a Protection Circuit Module (PCM) for controlling charge and discharge of the battery cell.

Typically, the FPCB may be configured to include a first power line (i.e., a positive terminal) and a second power line (i.e., a negative terminal) parallel to each other on the same plane.

A typical FPCB is generally subjected to a large current generation caused by charge and discharge operations performed when an application of an electronic device is run.

For example, when a first power line (i.e., positive terminal) and a second power line (i.e., negative terminal) are spaced apart a distance in the X-axis, a certain magnetic field may be generated.

The generated magnetic field affects the coil and the ball, both of which are provided in the camera module disposed adjacent to the FPCB, thereby generating noise such as vibration shake.

In order to prevent such noise from the camera module, the FPCB and the camera module may be designed to be separated from each other as much as possible. However, this results in the FPCB being adjacent to other components (e.g., a motor and a speaker) having a coil, and may cause unintended noise different from noise generated by the camera module.

Accordingly, the structure of the typical FPCB having the first and second power lines parallel to each other on the same plane can prevent various noises from being generated in the electronic device. In addition, a typical FPCB structure may be limited in a mounting structure.

The above information is presented as background information only to aid in the understanding of the present disclosure. It is not determined or admitted that any of the above may be applicable as prior art to the present disclosure.

Disclosure of Invention

Various aspects of the present disclosure are directed to addressing at least the problems and/or disadvantages and to providing at least the advantages described below. Accordingly, it is an aspect of the present disclosure to provide an electronic device in which a Flexible Printed Circuit Board (FPCB) has a vertical stack structure of a first power line and a second power line, and also to provide a control method for minimizing noise generated in the electronic device.

According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes: the cable includes a first layer forming a first power line and a second layer forming a second power line. The first and second layers are arranged in a vertically stacked configuration. The cable eliminates a magnetic field generated by a current when charging and discharging a battery cell of the electronic device and eliminates noise caused by a magnetic field generated by a coil-containing assembly of the electronic device.

According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a communication circuit configured to perform communication with an external device; a memory configured to store setting information; a battery unit configured to supply power to the electronic device; a cable; a power management module; a camera module including an Autofocus (AF) carrier and an Optical Image Stabilization (OIS) carrier; a camera module driver; and a processor electrically connected to the communication circuit, the memory, the battery unit, the cable, the power management module, the camera module, and the camera module driver. The processor controls the AF carrier and the OIS carrier in a direction opposite to a magnetic field when operated, and controls an output voltage of the camera module driver through the power management module.

According to another aspect of the present disclosure, a method of controlling noise of an electronic device is provided. The method comprises the following steps: executing an application, and measuring the current of the battery unit through the power management module; determining whether the measured current of the battery cell exceeds a threshold that produces noise; and reducing the current of the battery cell by controlling the power management module when the measured current of the battery cell exceeds the threshold.

According to another aspect of the present disclosure, an electronic device having a battery and a camera module may have a vertical stack structure of a first power line and a second power line of an FPCB connected to a battery cell, thereby minimizing noise (e.g., vibration jitter) generated from the camera module due to current generated when charging and discharging the battery cell. That is, the electronic device can prevent an electrical effect caused by the coil-containing assembly equipped therein.

According to another aspect of the present disclosure, when executing a certain application, an electronic device may receive noise of an inactive coil through a microphone, analyze a vibration frequency of the received noise, and control minimizing noise generation of the inactive coil based on setting information corresponding to the analyzed range of vibration frequencies.

According to another aspect of the present disclosure, an electronic device may detect an orientation of the electronic device through an acceleration sensor during a telephone call (e.g., time Division Multiple Access (TDMA)), and control minimizing noise generation of an inactive coil based on setting information corresponding to the detected orientation.

Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

Drawings

The foregoing and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram illustrating a network environment including an electronic device, according to various embodiments of the present disclosure;

FIG. 2 is a block diagram illustrating an electronic device according to various embodiments of the present disclosure;

FIG. 3 is a block diagram illustrating program modules according to various embodiments of the present disclosure;

fig. 4 is a block diagram showing a configuration of an electronic device according to various embodiments of the present disclosure;

fig. 5 is a plan view illustrating an internal structure of an electronic device according to various embodiments of the present disclosure;

fig. 6 is a side view illustrating a vertical arrangement structure of a Flexible Printed Circuit Board (FPCB) according to various embodiments of the present disclosure;

Fig. 7 is a schematic view illustrating a configuration of an FPCB according to various embodiments of the present disclosure;

fig. 8 is an exploded perspective view illustrating a configuration of an FPCB according to various embodiments of the present disclosure;

fig. 9A, 9B, 9C, 9D, and 9E are side views illustrating examples of vertical arrangement structures of FPCBs according to various embodiments of the present disclosure;

fig. 10 is a flowchart illustrating a noise control method of an electronic device according to various embodiments of the present disclosure;

FIG. 11 is a graph illustrating current values and vibration noise variations according to power levels according to various embodiments of the present disclosure;

FIG. 12 is a diagram illustrating voltage control according to an orientation of an electronic device according to various embodiments of the present disclosure;

fig. 13 is a diagram illustrating an operation state in a camera module according to an operation voltage applied from a power management module to a camera module driver according to various embodiments of the present disclosure;

FIG. 14 is a flowchart illustrating another noise control method of an electronic device according to various example embodiments of the present disclosure; and

fig. 15 is a diagram illustrating a spectrum of vibration noise of a camera module according to various embodiments of the present disclosure.

It should be noted that throughout the appended drawings, like reference numerals are used to describe the same or similar elements, features and structures.

Detailed Description

The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the disclosure defined by the claims and their equivalents. The following description includes various specific details to aid in understanding, but these specific details should be considered exemplary only. Thus, one of ordinary skill in the art will recognize that: various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to their written meanings, but are used by the inventors only to achieve a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following descriptions of the various embodiments of the present disclosure are provided for illustration only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

It should be understood that the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to a "component surface" includes reference to one or more of such surfaces.

The terms "having," "can have," "including," and "can include," as used herein, indicate that corresponding features (e.g., elements such as numerical values, functions, operations, or components) are present, and do not exclude the presence of additional features.

The term "a or B", "at least one of a or/and B" or "one or more of a or/and B" as used herein includes all possible combinations of the listed items. For example, "a or B", "at least one of a and B" or "at least one of a or B" means (1) including at least one a, (2) including at least one B or (3) including both at least one a and at least one B.

Terms such as "first" and "second" as used herein may modify various elements regardless of the order and/or importance of the corresponding elements and do not limit the corresponding elements. These terms may be used for the purpose of distinguishing elements from each other. For example, the first user device and the second user device may represent different user devices, regardless of order or importance. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure.

It will be understood that when an element (e.g., a first element), "is (operably or communicatively) coupled to" or "connected to" another element (e.g., a second element), the element may be directly coupled to the other element or intervening elements (e.g., a third element) may be present between the element and the other element. In contrast, it will be understood that when an element (e.g., a first element) is "directly coupled to" or "directly connected to" another element (e.g., a second element), there are no intervening elements (e.g., a third element) between the element and the other element.

The expression "(configured to) as used in this disclosure is (or is set to)" interchangeable with: "adapted", "having ability of.," (being) designed for "," adapted "," made for "or" capable ". The term "configured to (set to)" does not necessarily mean "specially designed to" hardware. In contrast, the expression "a device configured to" may mean that the device is "capable of" with other devices or components "in a particular context. For example, "a processor configured (arranged) to perform A, B and C" may mean a dedicated processor (e.g., an embedded processor) for performing corresponding operations or a general-purpose processor (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) capable of performing corresponding operations by executing one or more software programs stored in a storage device.

The terminology used in describing the various embodiments of the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless the context clearly indicates otherwise, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Terms defined in the general dictionary should be construed to have the same or similar meaning as the context meaning of the related art and should not be construed to have an idealized or exaggerated meaning unless they are explicitly defined herein. According to some cases, even the terms defined in the present disclosure should not be construed as excluding the embodiments of the present disclosure.

According to various embodiments of the present disclosure, an electronic device may include at least one of: such as a smart phone, a tablet Personal Computer (PC), a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), a moving picture experts group (MPEG-1 or MPEG-2) audio layer 3 (MP 3) player, an ambulatory medical device, a camera, or a wearable device. According to embodiments of the present disclosure, a wearable device may include at least one of: an ornamental device (e.g., a wristwatch, a ring, a bracelet, a chain of feet, a necklace, glasses, contact lenses, or a Head Mounted Device (HMD)), a clothing or apparel integrated wearable device (e.g., electronic apparel), a body worn device (e.g., a skin patch or tattoo), or an implantable wearable device (e.g., an implantable circuit).

The electronic device may be a smart home appliance. For example, the smart home appliance may include at least one of: for example, televisions (TVs), digital Versatile Disc (DVD) players, stereos, refrigerators, air conditioners, cleaners, ovens, microwave ovens, washing machines, air cleaners, set-top boxes, home automation panels, security control panels, TV boxes (e.g., samsung HomeSync) ^TM 、Apple TV ^TM Or Google TV ^TM ) Game machine (e.g. Xbox) ^TM PlayStation ^TM ) An electronic dictionary, an electronic key, a camera, or an electronic photo frame.

The electronic device may include at least one of: various medical devices such as various portable medical measurement devices (e.g., blood glucose meters, heart rate monitors, blood pressure monitors, or thermometers, etc.), magnetic Resonance Angiography (MRA) devices, magnetic Resonance Imaging (MRI) devices, computed Tomography (CT) devices, scanners, or ultrasound devices, etc., navigation devices, global Positioning System (GPS) receivers, event Data Recorders (EDRs), flight Data Recorders (FDRs), vehicle infotainment devices, marine electronics (e.g., navigation systems, compasses, etc.), avionics, security devices, vehicle headend units, industrial or home robots, automated Teller Machines (ATMs), point of sale (POS) devices, or internet of things (IoT) devices (e.g., light bulbs, various sensors, electricity or gas meters, sprinklers, fire alarms, thermostats, street lights, toasters, sports equipment, hot water tanks, heaters, boilers, etc.).

The electronic device may further comprise at least one of: a portion of a piece of furniture or building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring instruments (e.g., a water meter, an electricity meter, a gas meter, or a wave meter, etc.). The electronic device may be a combination of one or more of the above devices. The electronic device may be a flexible electronic device. Further, the electronic device is not limited to the above-described device, and may include a new type of electronic device according to new technological developments.

Hereinafter, an electronic device according to various embodiments of the present disclosure will be described with reference to the accompanying drawings. The term "user" as used herein may refer to a person using an electronic device, or may refer to a device using an electronic device (e.g., an artificial intelligence electronic device).

Fig. 1 illustrates a network environment including an electronic device according to an embodiment of the present disclosure.

Referring to fig. 1, a network environment 100 includes an electronic device 101 having a bus 110, a processor 120, a memory 130, an input/output interface 150, a display 160, and a communication interface 170. At least one of the above components may be omitted in the electronic device 101, or another component may be further included in the electronic device 101.

Bus 110 may be circuitry that connects the above-described components 120, 130, and 150-170 and transmits communications (e.g., control messages and/or data) between the above-described components.

Processor 120 may include one or more of a CPU, an AP, and a Communication Processor (CP). The processor 120 can control at least one of the other electronic devices of the electronic device 101 and/or process data and operations related to the communication.

Memory 130 may include volatile memory and/or nonvolatile memory. The memory 130 is capable of storing data or commands related to at least one of the other components of the electronic device 101. The memory 130 can store software and/or program modules 140. For example, program modules 140 may include a kernel 141, middleware 143, application Programming Interfaces (APIs) 145, and/or application programs (or applications) 147, among others. At least a portion of kernel 141, middleware 143, or APIs 145 may be referred to as an Operating System (OS).

Kernel 141 is capable of controlling or managing system resources (e.g., bus 110, processor 120, memory 130, etc.) for executing operations or functions of other programs (e.g., middleware 143, API 145, and application 147). Kernel 141 provides an interface that enables middleware 143, API 145, and application 147 to access and control/manage the individual components of electronic device 101.

Middleware 143 can act as an interface between API 145 or application 147 and kernel 141 such that API 145 or application 147 can communicate with kernel 141 and exchange data therebetween. Middleware 143 can process one or more task requests received from applications 147 according to priority. For example, middleware 143 can assign priority to at least one application 147 to use system resources of electronic device 101 (e.g., bus 110, processor 120, memory 130, etc.). For example, middleware 143 processes one or more task requests according to priorities assigned to at least one application, thereby performing scheduling or load balancing of task requests.

API 145 may be an interface configured to allow application 147 to control the functionality provided by kernel 141 or middleware 143. API 145 may include at least one interface or function (e.g., instructions) for file control, window control, image processing, text control, etc.

The input/output interface 150 is capable of transmitting instructions or data received from a user or an external device to one or more components of the electronic device 101. The input/output interface 150 is capable of outputting input instructions or data received from one or more components of the electronic device 101 to a user or an external device.

The display 160 may include a Liquid Crystal Display (LCD), a flexible display, a transparent display, a Light Emitting Diode (LED) display, an Organic LED (OLED) display, a microelectromechanical system (MEMS) display, an electronic paper display, and the like. The display 160 can display various types of content (e.g., text, images, video, icons, symbols, etc.). Display 160 may also be implemented using a touch screen. In this case, the display 160 can receive touch, gesture, proximity input, or hover input via the stylus or the user's body.

The communication interface 170 is capable of establishing communication between the electronic device 101 and external devices. For example, the communication interface 170 can communicate with external devices connected to the network 162 via wired or wireless communication.

The wireless communication may employ at least one of the following as cellular communication protocols: long Term Evolution (LTE), LTE-advanced (LTE-a), code Division Multiple Access (CDMA), wideband CDMA (WCDMA), universal Mobile Telecommunications System (UMTS), wireless broadband (WiBro), and global system for mobile communications (GSM). The wireless communications may also include short-range wireless communications 164. Short-range wireless communications 164 may include at least one of wireless fidelity (Wi-Fi), bluetooth (BT), near Field Communications (NFC), magnetic Security Transmission (MST), and Global Navigation Satellite System (GNSS). Depending on GNSS usage area, bandwidth, etc., a GNSS may include at least one of: GPS, global navigation satellite System (Glonass), beidou NSS, galileo, european Global satellite System. In this disclosure, "GPS" and "GNSS" may be used interchangeably. The wired communication may include, for example, at least one of: universal Serial Bus (USB), high Definition Multimedia Interface (HDMI), recommended standard-232 (RS-232), plain Old Telephone Service (POTS). Network 162 may include at least one of: telecommunication networks, such as computer networks (e.g., local Area Networks (LANs) or Wide Area Networks (WANs)), the internet, and telephone networks.

The first external electronic device 102 and the second external electronic device 104 may each be the same as or different from the electronic device 101 in terms of type. According to an embodiment, the server 106 can include a group of one or more servers. According to various embodiments, some or all of the operations performed on electronic device 101 may be performed on another electronic device or multiple other electronic devices (e.g., electronic devices 102 and 104, or server 106). According to an embodiment, when an electronic device needs to perform a function or service automatically or upon request, the function or service is not performed, but at least a portion of the functions related to the function or service can be additionally requested from another electronic device (e.g., electronic devices 102 and 104, or server 106). The other electronic device (e.g., electronic device 102 or 104, or server 106) can perform the function requested by the electronic device or additional functions and send the result of the execution to electronic device 101. The electronic device 101 may process the received results or may further process additionally to provide the requested function or service. Thus, the electronic device 101 may use cloud computing, distributed computing, or client-server computing techniques.

Fig. 2 is a block diagram showing a configuration of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 2, an electronic device 201 may include some or all of the components in the electronic device 101 shown in fig. 1. The electronic device 201 may include one or more processors 210 (e.g., an AP), a communication module 220, a Subscriber Identity Module (SIM) 224, a memory 230, a sensor module 240, an input device 250, a display 260, an interface 270, an audio module 280, a camera module 291, a power management module 295, a battery 296, an indicator 297, and a motor 298.

The processor 210 can drive, for example, an OS or an application program, to control a plurality of hardware or software components connected to the processor 210, process various data, and perform operations. For example, the processor 210 may be implemented as a system on a chip (SoC). Processor 210 may also include a Graphics Processing Unit (GPU) and/or an Image Signal Processor (ISP). Processor 210 may also include at least a portion of the components shown in fig. 2 (e.g., cellular module 221). The processor 210 is capable of loading commands or data received by at least one of the other components (e.g., the non-volatile memory) onto the volatile memory, and processing the loaded commands or data. The processor 210 is capable of storing various data in a non-volatile memory.

The communication module 220 may include the same or similar configuration as the communication interface 170 shown in fig. 1. For example, the communication interface 170 can include, for example, a cellular module 221, a WiFi module 223, a BT module 225, a GNSS module 227 (e.g., GPS module, glonass module, beidou module, or galileo module), an NFC module 228, and a Radio Frequency (RF) module 229.

For example, the cellular module 221 can provide a voice call, a video call, a Short Message Service (SMS), an internet service, etc. through a communication network. The cellular module 221 is capable of performing identification and authentication of the electronic device 201 in a communication network by using the SIM 224. The cellular module 221 is capable of performing at least a portion of the functions provided by the processor 210. The cellular module 221 may include a CP.

Each of the Wi-Fi module 223, BT module 225, GPS module 227, and NFC module 228 may include a processor for processing data transmitted or received by the corresponding module. At least a portion (e.g., two or more) of the cellular module 221, wi-Fi module 223, BT module 225, GNSS module 227, NFC module 228 may be included in an Integrated Chip (IC) or an IC package.

The RF module 229 is capable of transmitting/receiving data such as a communication signal (e.g., RF signal). The RF module 229 can include a transceiver, a Power Amplification Module (PAM), a frequency filter, a Low Noise Amplifier (LNA), an antenna, and the like. At least one of the cellular module 221, wi-Fi module 223, BT module 225, GNSS module 227, and NFC module 228 can transmit/receive RF signals through a separate RF module.

Memory 230 may include an internal memory 232 or an external memory 234. The internal memory 232 can include at least one of: volatile memory (e.g., dynamic Random Access Memory (DRAM), static RAM (SRAM), synchronous Dynamic RAM (SDRAM), etc.), and nonvolatile memory (e.g., one-time programmable read-only memory (OTPROM), programmable ROM (PROM), erasable Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), mask ROM, flash memory (e.g., NAND flash memory, NOR flash memory, etc.), hard disk drive, solid State Drive (SSD), etc.).

The external memory 234 may include a flash drive such as Compact Flash (CF), secure Digital (SD), micro SD (Mic-SD), mini SD (Mini-SD), limited digital (xD), multimedia card (MMC), memory stick, etc. The external memory 234 may be functionally or physically connected to the electronic device 201 through various interfaces.

The sensor module 240 is capable of measuring/detecting a physical quantity or an operation state of the electronic device 201, and converting the measured or detected information into an electrical signal. The sensor module 240 may include at least one of: gesture sensor 240A, gyroscope sensor 240B, barometric sensor 240C, magnetic sensor 240D, acceleration sensor 240E, grip sensor 240F, proximity sensor 240G, color sensor 240H (e.g., red, green, blue (RGB) sensor), biological sensor 240I, temperature/humidity sensor 240J, illuminance sensor 240K, and Ultraviolet (UV) sensor 240M. Additionally or alternatively, the sensor module 240 may also include an electronic nose sensor, an Electromyography (EMG) sensor, an electroencephalogram (EEG) sensor, an Electrocardiogram (ECG) sensor, an Infrared (IR) sensor, an iris sensor, and/or a fingerprint sensor. The sensor module 240 may also include control circuitry for controlling one or more sensors included therein. The electronic device 201 may include a processor configured as part of the processor 210 or as a separate component for controlling the sensor module 240. In this case, although the processor 210 operates in the sleep mode, the processor can control the sensor module 240.

The input device 250 may include a touch panel 252, (digital) pen sensor 254, keys 256, and an ultrasonic input unit 258. The touch panel 252 may be implemented using at least one of: capacitive touch systems, resistive touch systems, infrared touch systems, and ultrasonic touch systems. The touch panel 252 may also include control circuitry, and the touch panel 252 may include a haptic layer to provide a haptic response to a user. The (digital) pen sensor 254 may be implemented using a portion of the touch panel, or a separate identification sheet. The keys 256 may include physical buttons, optical keys, or a keypad. The ultrasonic input unit 258 is capable of detecting ultrasonic waves generated in the input tool through the microphone 288 and recognizing data corresponding to the detected ultrasonic waves.

The display 260 may include a panel 262, a holographic unit 264, or a projector 266. The panel 262 may include the same or similar components as the display 160 shown in fig. 1. The panel 262 may be implemented as flexible, transparent, or wearable. The panel 262 may also be incorporated as a module with the touch panel 252. The hologram unit 264 can display a three-dimensional image in the air by using interference of light. The projector 266 can display an image by projecting light on a screen. The screen may be located inside or outside the electronic device 201. The display 260 may also include control circuitry for controlling the panel 262, the holographic unit 264, or the projector 266.

The interface 270 may include an HDMI 272, a USB 274, an optical interface 276, or a D-sub 278.

The interface 270 may be included in the communication interface 170 shown in fig. 1. Additionally or alternatively, the interface 270 may include a mobile high definition link (MHL) interface, an SD card/MMC interface, or an IR data association (IrDA) standard interface.

The audio module 280 is capable of providing bi-directional conversion between sound and electrical signals. At least some of the components of audio module 280 may be included in input/output interface 150 shown in fig. 1. The audio module 280 is capable of processing sound information input or output through a speaker 282, an earpiece 284, a headset 286, a microphone 288, and the like.

The camera module 291 is a device capable of capturing both still images and moving images. The camera module 291 may include one or more image sensors (e.g., a front-end image sensor or a rear-end image sensor), lenses, ISPs, flash lamps (e.g., LEDs or xenon lamps), and the like.

The power management module 295 is capable of managing power of the electronic device 201. The power management module 295 may include a Power Management Integrated Circuit (PMIC), a charger IC, or a battery gauge (battery gauge). The PMIC may employ a wired charging and/or a wireless charging method. Examples of wireless charging methods are magnetic resonance charging, magnetic induction charging, and electromagnetic charging. To this end, the PMIC may also include additional circuitry for wireless charging, e.g., coil loops, resonant circuits, rectifiers, etc. The battery gauge can measure the remaining capacity, charge voltage, current, or temperature of the battery 296.

The battery 296 may take the form of a rechargeable battery or a solar cell.

The indicator 297 can display certain states of the electronic device 201 or a portion thereof (e.g., the processor 210), such as a boot state, a message state, a charge state, and the like. The motor 298 can convert the electrical signal into mechanical vibrations, such as vibrations, haptic effects, and the like. The electronic device 201 may also include a processing unit (e.g., GPU) for supporting mobile TV. The processing unit for supporting mobile TV may be for example according to a Digital Multimedia Broadcasting (DMB), digital Video Broadcasting (DVB) or media flo, for example ^TM Etc. to process media data.

FIG. 3 is a block diagram of a programming module according to an embodiment of the present disclosure.

Referring to fig. 3, program modules 310 (e.g., program module 140 shown in fig. 1) can include an OS for controlling resources associated with an electronic device (e.g., electronic device 101) and/or various applications executing on the OS (e.g., application program 147 shown in fig. 1). The OS may be Android, iOS, windows, symbian, tizen, bada, etc.

Programming module 310 can include kernel 320, middleware 330, API 360, and/or application 370. At least a portion of program modules 310 may be preloaded onto an electronic device or downloaded from a server (e.g., electronic device 102 or 104, server 106, etc.).

Kernel 320 (e.g., kernel 141) may include a system resource manager 321 and/or a device driver 323. The system resource manager 321 may comprise, for example, a process manager, a memory manager, and a file system manager. The system resource manager 321 may perform system resource control, allocation, and recall. The device driver 323 may include, for example, a display driver, a camera driver, a bluetooth driver, a shared memory driver, a USB driver, a keypad driver, a Wi-Fi driver, and an audio driver. Further, according to an embodiment, the device driver 323 may include an inter-process communication (IPC) driver.

Middleware 330 may provide commonly required functionality through application 370. In addition, middleware 330 may provide functionality through API 360 to allow applications 370 to efficiently use limited system resources within the electronic device. According to embodiments, middleware 330 (e.g., middleware 143) may include at least one of: the runtime library 335, the application manager 341, the window manager 342, the multimedia manager 343, the resource manager 344, the power manager 345, the database manager 346, the package manager 347, the connection manager 348, the notification manager 349, the location manager 350, the graphics manager 351, and the security manager 352. Additionally, although not shown, middleware 330 may also include a payment manager.

The runtime library 335 may include a library module, for example, used by a compiler, to add new functionality through a programming language while executing the application 370. According to an embodiment, the runtime library 335 performs inputs and outputs, management of memory, functions associated with arithmetic functions, and the like.

The application manager 341 may manage, for example, a lifecycle of the at least one application 370. The window manager 342 can manage GUI resources used on the screen. The multimedia manager 343 may detect formats required for reproducing various media files and perform encoding or decoding of the media files using a codec suitable for the corresponding format. The resource manager 344 manages resources, such as source code, memory, or storage space, of at least one application 370.

The power manager 345 may operate in conjunction with a basic input/output system (BIOS) to manage battery or power and provide power information required for operation. Database manager 346 may manage the generation, searching, and changing of databases to be used in at least one application 370. The package manager 347 may manage the installation or updating of applications distributed in the form of package files.

The connection manager 348 may manage, for example, wireless connections, such as Wi-Fi or bluetooth. The notification manager 349 may display or notify the user of events such as arrival messages, reservations, proximity alarms, etc., in a manner that does not disturb the user. The location manager 350 may manage location information of the electronic device. The graphic manager 351 may manage graphic effects or User Interfaces (UIs) related to the graphic effects to be provided to the user. The security manager 352 provides the general security functions required for system security or user authentication. According to one embodiment, when an electronic device (e.g., electronic device 101) has a call function, then middleware 330 further includes a telephony manager for managing voice or video call functions of the electronic device.

Middleware 330 can include modules that configure various combinations of the functions of the above components. Middleware 330 can provide modules that are specialized according to the type of operating system to provide differentiated functionality. The middleware 330 may be adaptively configured in a manner to remove a portion of an existing component or to include a new component.

API 360 (e.g., API 145) may be a collection of API programming functions and may have different configurations depending on the OS. For example, in Android or iOS, a single set of APIs may be provided for each platform. In Tizen, two or more API sets may be provided.

Applications 370 (e.g., application 147) may include one or more applications capable of performing various functions, such as home page 371, dialer 372, SMS/Multimedia Messaging Service (MMS) 373, instant Message (IM) 374, browser 375, camera 376, reminder 377, contact 378, voice dialing 379, email 380, calendar 381, media player 382, album 383, and clock 384. Further, although not shown, the applications 370 may also include healthcare (e.g., applications for measuring exercise amounts, blood glucose levels, etc.) and environmental information (e.g., applications for providing atmospheric pressure, humidity, temperature, etc.).

According to an embodiment, the applications 370 can include applications for supporting information exchange between an electronic device (e.g., electronic device 101) and external devices (e.g., electronic devices 102 and 104), hereinafter referred to as 'information exchange applications'. For example, the information exchange application can include a notification relay application for relaying specific information to the external device or a device management application for managing the external device.

According to an embodiment of the application, the applications 370 can include applications (e.g., ambulatory medical devices, etc.) having specified attributes of external devices (e.g., electronic devices 102 and 104). According to an embodiment, the applications 370 can include applications received from an external device (e.g., the server 106, or the electronic device 102 or 104). According to an embodiment, the applications 370 can include preloaded applications or third party applications that can be downloaded from a server. It should be appreciated that the components of program module 310 may be referred to by different names depending on the type of OS.

The term "module" according to embodiments of the present disclosure means, but is not limited to, a unit of one of software, hardware, and firmware, or any combination thereof. The term "module" may be used interchangeably with the terms "unit," logic circuit, "" logic block, "" component, "or" circuit. The term "module" may denote the smallest unit of a component or a portion thereof. The term "module" may be the smallest unit that performs at least one function or part thereof. The modules may be implemented mechanically or electrically. For example, a module may include at least one of an Application Specific Integrated Circuit (ASIC) chip, a Field Programmable Gate Array (FPGA), and a programmable logic device known or developed for particular operations.

According to various embodiments of the present disclosure, an apparatus (e.g., a module or their functionality) or method may be implemented as computer program instructions stored in a computer-readable storage medium. In the case of execution of instructions by at least one processor (e.g., processor 120), the at least one processor performs the function corresponding to the instructions. The computer readable storage medium may be the memory 130. At least a portion of the programming modules may be implemented (e.g., executed) by the processor 120. At least a portion of the programming modules may include modules, programs, routines, instruction sets, and processes for performing at least one function.

Computer readable storage media include magnetic media such as floppy disks and magnetic tape, optical media including Compact Disk (CD) ROMs, and DVD ROMs, magneto-optical media such as floptical disks, and hardware devices designed for storing and executing program commands, such as ROMs, RAMs, and flash memories. The program commands include language code executable by a computer using a compiler and machine language code generated by the compiler. The foregoing hardware devices may be implemented with one or more software modules to perform the operations of the various embodiments of the disclosure.

The modules or programming modules of the present disclosure may include at least one of the components described above with some components omitted or other components added. The operations of the modules, programming modules, or other components may be performed serially, in parallel, recursively, or heuristically. In addition, some operations may be performed in a different order or omitted, or may be extended to have other operations.

Fig. 4 is a block diagram illustrating a configuration of an electronic device according to various embodiments of the present disclosure.

Fig. 5 is a plan view illustrating an internal structure of an electronic device according to various embodiments of the present disclosure.

Referring to fig. 4 and 5, an electronic device 400 according to various embodiments of the present disclosure may include a communication circuit 410, an antenna 415, a microphone 420, an acceleration sensor 430, a memory 440, a battery cell 450, a Flexible Printed Circuit Board (FPCB) 460, a power management module 470, a camera module 480, a camera module driver 485, and a processor 490.

According to various embodiments, the communication circuit 410 may perform communication functions of the electronic device 400. The communication circuit 410 may establish a communication channel with a network to support at least one of voice calls, video calls, and data communications with at least one external device. The communication circuit 410 may include various communication modules, such as a mobile communication module (at least one module capable of supporting various communication schemes such as 2G, 3G, 4G, and 5G), a WiFi module, and a short-range communication module. The communication circuit 410 may include an RF transmitter for up-converting the frequency of the output signal and amplifying the up-converted signal, and an RF receiver for low noise amplifying the input signal and down-converting the frequency of the amplified signal. The communication circuit 410 may receive data through a wireless channel and then transmit the data to the processor 490, and may also transmit data output from the processor 490 to an external device through the wireless channel.

According to an embodiment, the communication circuit 410 may support the electronic device 400 to perform telephone calls with other electronic devices based on, for example, time Division Multiple Access (TDMA) communications.

The antenna 415 is electrically connected to the communication circuit 410 and can transmit or receive signals generated during a call between the electronic device 400 and any other electronic device.

According to various embodiments, the microphone 420 may be used to collect external sounds, i.e., ambient noise. Microphone 420 may include a plurality of microphones. For example, when the electronic device 400 performs a call with another electronic device, external sounds may be collected by other microphones of the plurality of microphones 420 than the specific microphone for the call.

According to an embodiment, the microphone 420 may receive noise of the inactive coil when an application of the electronic device 400 is executed. The microphone 420 may record noise such as vibration jitter generated by components (e.g., the camera module 480, the motor 481, and the speaker 483) having coils in the electronic device 400. After current control by the power management module 470 and the processor 490, the microphone 420 may check whether noise such as vibration jitter is generated. In addition to the basic sound generated in the electronic device 400, vibration dithering may refer to any type of sound mixed with noise.

For example, when the electronic device 400 performs a phone call with other electronic devices using TDMA communication, the acceleration sensor 430 may sense a state of the electronic device 400 held by the user and then may transmit a sensing signal to the processor 490. The acceleration sensor 430 may detect the orientation of the electronic device 400 with respect to the up, down, left, and right directions. The acceleration sensor 430 may measure acceleration, vibration, shock, and motion of the electronic device 400. Although TDMA communications are illustratively described in embodiments, other communication types may be further or alternatively available.

According to various embodiments, the memory 440 may store programs for processing and control of the processor 490, an OS of the electronic device 400, various application programs, and input/output data. The memory 440 may store UIs provided in the electronic device 400 and various setting information required for the functions of the electronic device 400.

According to an embodiment, the memory 440 may store setting information related to conditions for minimizing noise generation in the electronic device 400. The memory 440 may store setting information related to a current generated during a telephone call and a control variable of a coil corresponding to the current.

The battery unit 450 may supply the charging power as the driving power of the electronic device 400.

The FPCB 460 may be a cable having one end connected to the battery cell 450 and the other end connected to a PCB equipped in the electronic device 400. The other end of the FPCB 460 may be formed of a locking type connector such as a board-board type connector. The FPCB 460 may have a stacked structure in which a first power line (+461) and a second power line (-, 462) are vertically arranged. The FPCB 460 may include a battery gauge and a battery gauge ground terminal between the first power line 461 and the second power line 462. The battery gauge may measure, for example, at least one of a battery level, a charging voltage, a charging current, and a temperature of the battery cell.

In the first power line 461 and the second power line 462 of the FPCB 460, a large current may be generated during charge and discharge operations of the battery when the application of the electronic device 400 is performed.

The FPCB 460 according to various embodiments of the stacked structure having the first power line 461 and the second power line 462 may eliminate a magnetic field generated by a current when the battery is charged and discharged. Accordingly, noise due to a magnetic field generated from components including coils (e.g., the camera module 480, the motor 481, and the speaker 483) can be removed.

According to one embodiment, such an assembly comprising coils may be a device of a vibrating element arranged between the coils and the magnets. For example, the camera module 480 may have a ball disposed between a magnet and a coil. The motor 481 may be comprised of a stator with magnets and a rotor wound with coils. The speaker 483 may have a diaphragm disposed between the magnet and the coil.

According to various embodiments, the power management module 470 may manage power of the electronic device 400. The power management module 470 may include a PMIC, a charger integrated circuit, or a battery or fuel gauge. For example, when the electronic device 400 is powered on, the power management module 470 may supply power charged in the battery unit 450 to other elements (e.g., the processor 490 and the camera module driver 485). The power management module 470 may receive commands from the processor 490 and manage power in response to the received commands. For example, the power management module 470 may provide power to a display (not shown) and the camera module 480 in response to commands received from the processor 490. The power management module 470 may conform to a wired and/or wireless charging scheme. For example, the wireless charging scheme may be a magnetic resonance scheme, a magnetic induction scheme, or an electromagnetic wave scheme. In the case of a wireless charging scheme, additional circuitry may also be included, such as coil loops, resonant circuits, rectifiers, etc.

According to one embodiment, the power management module 470 may control the charging and discharging of the battery cells 450. The power management module 470 may measure the consumption current of the battery cell 450 and control the current of the battery cell 450 in response to commands received from the processor 490. The power management module 470 may control the voltage (e.g., 1.8V to 3.3V) of the power port of the camera module driver 485. The power management module 470 may, for example, perform I2C command communications with the processor 490.

According to various embodiments, the camera module 480 may capture still images and record video. The camera module 480 may include one or more image sensors (e.g., front-end or back-end sensors), lenses, ISPs, and/or flash lamps (e.g., LEDs or xenon lamps).

According to one embodiment, the camera module 480 may be subjected to noise (e.g., a magnetic field) generated by a large current of the FPCB 460, thereby causing vibration dithering. The camera module 480 may perform an Auto Focus (AF) function and an Optical Image Stabilization (OIS) function. The camera module 480 may include an AF and OIS coil 482 and an image sensor 484. The AF and OIS coils 482 may generate magnetic flux that allows the camera module 480 to perform AF and OIS functions. The AF and OIS coils 482 may be composed of a plurality of coils. The image sensor 484 may convert an optical image obtained through the camera module 480 into an electrical signal. The camera module 480 may also include a lens, at least one magnet, OIS ball, OIS carrier, AF ball, AF carrier, canister, and the like.

The camera module driver 485 may control the AF and OIS coils 482 to eliminate vibration jitter caused by noise (e.g., magnetic fields) of the camera module 480. The camera module driver 485 may receive a control operating voltage of, for example, 1.8V to 3.3V from the power management module 470. The camera module driver 485 may generate magnetic forces in the AF and OIS coils 482 according to a control operation voltage of 1.8V to 3.3V and control (e.g., fix) the movements of the AF ball and OIS ball.

According to various embodiments, the processor 490 may control the overall operation of the electronic device 400 and signal flow between elements of the electronic device 100, and may perform functions of processing data. The processor 490 may be composed of, for example, a CPU, an AP, and a CP. Processor 490 may be formed of a single-core processor or a multi-core processor, and may be composed of multiple processors.

According to one embodiment, the processor 490 may control the communication circuit 410, the antenna 415, the microphone 420, the acceleration sensor 430, the memory 440, the battery unit 450, the FPCB 460, the power management module 470, the camera module 480, and the camera module driver 485. The processor 490 may perform a function of minimizing vibration jitter generated from the camera module 480 due to noise (e.g., a magnetic field) generated by a current generated when the battery cell 450 is charged and discharged. The processor 490 may perform functions that block electrical effects caused by components having coils in the electronic device 400 (e.g., the camera module 480, the motor 481, and the speaker 483). The processor 490 may analyze the vibration frequency of noise received via the microphone 420 and may perform a function of minimizing noise generation of inactive coils (e.g., AF and OIS coils 482) based on setting information of the memory 440 corresponding to the analyzed range of vibration frequencies. The processor 490 may analyze the orientation of the electronic device 400 received via the acceleration sensor 430 during a telephone call (e.g., TDMA) and may perform a function of minimizing vibration noise generation by inactive coils (e.g., AF and OIS coils 482) based on setting information of the memory 440 corresponding to the analysis result.

Referring to fig. 5, the fpcb 460 and the camera module 480 may be disposed adjacent to each other within a certain distance (e.g., 0.01mm to 4 mm). The closer the distance between the FPCB 460 and the camera module 480, the stronger the effect of magnetic field noise generated in the FPCB 460 on the AF/OIS coil 482 in the camera module 480. The FPCB 460 may also influence the electrode 481 and the speaker 483 depending on a distance from the motor 481 and the speaker 483 each having a coil. However, by configuring the first power line 461 and the second power line 462 of the FPCB 460 in a vertically stacked form, noise generated from the coil-containing assembly (e.g., the camera module 480, the motor 481, the speaker 483, etc.) caused by current generated at the time of charging and discharging the battery cell 450 can be minimized.

Fig. 6 is a side view illustrating a vertical arrangement structure of an FPCB according to various embodiments of the present disclosure.

Fig. 7 is a schematic view illustrating a configuration of an FPCB according to various embodiments of the present disclosure.

Fig. 8 is an exploded perspective view illustrating a configuration of an FPCB according to various embodiments of the present disclosure.

Fig. 9A, 9B, 9C, 9D, and 9E are side views illustrating examples of vertical arrangement structures of the FPCB according to various embodiments of the present disclosure.

Referring to fig. 6 to 8 and 9A to 9E, the FPCB 460 according to various embodiments has the following structure: the first layer 10 having the first power line 461 and the second layer 20 having the second power line 462 are vertically stacked. The first power line 461 and the second power line 462 having different current directions generate magnetic fields.

For example, assuming that the center of the first power line (+461) is the center axis in the X-Z plane, the magnetic field strength of the FPCB 460 at (r, 0) can be determined as shown in equation 1.

In equation 1, B represents the strength of the magnetic field, a ₁ Represents a straight line distance, b, from the center of the first power line (+, 461) to the camera module 480 ₁ Representing the linear distance from the center of the second power line (-, 462) to the camera module 480. The current (I) may be 2.2A as the average current of TDMA.

When the FPCB 460 has a stacked structure as shown in fig. 6, the strength (B) of the magnetic field may be obtained according to equation 1.

That is, when the related conditions are as shown in equation 2 below, the magnetic field strength of the FPCB 460 having the stacked structure in the X-Z plane as shown in fig. 8 can be obtained.

For example, the magnetic field strength of the FPCB 460 in the X-axis can be obtained by equation 3.

In addition, the magnetic field strength of the FPCB 460 in the Z-axis can be obtained by equation 4.

The magnetic field of the FPCB 460 having the vertically aligned structure has a strength of zero obtained by equations 3 and 4. Accordingly, when the FPCB 460 is constructed in a stacked form, noise due to a magnetic field can be minimized.

Referring to fig. 6 to 8 and 9A to 9E, the FPCB 460 according to various embodiments may be a cable, and the first layer 10 and the second layer 20 may be designed to have a vertical arrangement structure. The first layer 10 may include a first power line 461 and the second layer 20 may include a second power line 462. The first power line 461 and the second power line 462 may extend in the same direction. The first layer 10 and the second layer 20 may be disposed adjacent and parallel to each other.

The vertical stack structure FPCB 460 configured to have the first power line 461 and the second power line 462 according to various embodiments may eliminate a magnetic field caused by a current generated when the battery is charged and discharged, thereby removing a magnetic field generated from the coil-containing assembly (e.g., the camera module 480, the motor 481, and the speaker 483). That is, even if any coil-containing assembly is disposed near the side of the FPCB 460, the stacked structure of the FPCB 460 can eliminate noise due to a magnetic field and minimize vibration jitter generated from the camera module 480.

According to various embodiments, the first power line 461 may be disposed on the second power line 462. Alternatively, the second power line 462 may be provided on the first power line 461. The first power line 461 provided on the second power line 462 may be inclined in a first direction (e.g., right) or a second direction (e.g., left) from a vertical axis of the second power line 462. Similarly, the second power line 462 provided on the first power line 461 may be inclined in the first direction or the second direction from the vertical axis of the first power line 461.

According to various embodiments, as shown in fig. 9A and 9B, an FPCB 460 in which a first power line 461 is disposed on a second power line 462 may be disposed adjacent to a camera module 480 having a coil (e.g., an AF/OIS coil 482). As also shown in fig. 9C, the FPCB 460 in which the second power line 462 is disposed on the first power line 461 may be disposed adjacent to the camera module 480 having a coil (e.g., AF/OIS coil 482). As also shown in fig. 9D, an FPCB 460 in which a first power line 461 is disposed on a second power line 462 to be inclined in a second direction (e.g., left) from a vertical axis of the second power line 462 may be disposed adjacent to a camera module 480 having a coil (e.g., AF/OIS coil 482). As also shown in fig. 9E, an FPCB 460 in which a first power line 461 is disposed on a second power line 462 to be inclined in a first direction (e.g., right) from a vertical axis of the second power line 462 may be disposed adjacent to a camera module 480 having a coil (e.g., AF/OIS coil 482).

Referring to fig. 9A to 9E, the vertical stack structure FPCB 460 configured to have the first power line 461 and the second power line 462 may eliminate a magnetic field caused by a current generated when the battery is charged and discharged, so that noise caused by the magnetic field may be removed even if disposed near a coil-containing assembly (e.g., the camera module 480, the motor 481, and the speaker 483).

According to an embodiment, each of the first layer 10 and the second layer 20 may include a connection unit 463, a flexible unit 465, and a Protection Circuit Module (PCM) unit 469.

In the FPCB 460, the connection unit 463 may be connected to a PCB in the electronic device 400, and the PCM unit 469 may be connected to the battery cell 450. The flexible unit 465 may form a power signal pattern.

The connection unit 463 may have a board-to-board connector 464 at a certain position (e.g., rear side) to connect to a PCB in the electronic device 400.

The flexible unit 465 having a power signal pattern may be formed of a first portion 466 and a second portion 467. One end of the first portion 466 is bent and connected to the connection unit 463. One end of the second portion 467 is connected to the other end of the first portion 466. Also, the other end of the second portion 467 is bent and connected to the PCM block 469. Since the second portion 467 of the flexible unit 465 is disposed a distance (e.g., 4 mm) apart from the camera module 480, the first power line 461 and the second power line 462 may be disposed at left and right parallel positions on one plane. Similarly, since the connection unit 463 is spaced apart from the camera module 480 by a certain distance (e.g., 4 mm), the first power line 461 and the second power line 462 may be disposed at left and right parallel positions on one plane.

One end of the PCM block 469 may be connected to the other end of the second portion 467 of the flexible block 465 and then extend in a straight line. PCM block 469 may be connected to battery cell 450 to control the charging and discharging of battery cell 450.

Referring to fig. 7 and 8, the connection unit 463 is spaced apart from the camera module 480 by a distance (e.g., 4 mm), so the connection unit 463 fitted in each of the first and second layers 10 and 20 may allow the first and second power lines 461 and 462 to be disposed at left and right parallel positions. Similarly, since the second portion 467 of the flexible unit 465 is spaced apart from the camera module 480 by a distance (e.g., 4 mm), the second portion 467 of the flexible unit 465 fitted in each of the first layer 10 and the second layer 20 may allow the first power line 461 and the second power line 462 to be disposed at left and right parallel positions.

According to one embodiment, when the battery unit 450 is installed in the electronic device 400, the flexible unit 465 may need to have sufficient flexibility to resist possible bending forces. For this, when the first and second layers 10 and 20 are stacked, a removed portion may be provided on the second portion 467 of the flexible unit 465 fitted in each of the first and second layers 10 and 20. Thus, flexibility can be obtained.

Fig. 10 is a flowchart illustrating a noise control method of an electronic device according to various embodiments of the present disclosure.

At operation 510, the electronic device 400 may execute a call application with another electronic device via TDMA communication. Although TDMA communications are illustratively described in one embodiment, other communication types may be further or alternatively available.

At operation 520, the electronic device 400 may measure the current of the battery cell 450 through the power management module 470 and monitor the power level received from the base station while the call application is running.

At operation 530, the processor 490 of the electronic device 400 may compare the current of the battery cell 450 measured at operation 520 with a threshold value of the noise generation condition. That is, the processor 490 may determine whether the measured current of the battery cell 450 exceeds a threshold.

If it is determined at operation 530 that the measured current of the battery cell 450 exceeds the threshold, the processor 490 of the electronic device 400 may reduce the current of the battery cell 450 at operation 535 by adjusting the power, i.e., to a specification-allowed limit.

In operation 540, the electronic apparatus 400 may detect the orientation of the electronic apparatus 400 through the acceleration sensor 430.

In operation 550, the processor 490 of the electronic device 400 may determine a compensation value for vibration noise of the camera module 480 based on the orientation of the electronic device 400. In this operation, based on the setting information stored in the memory, the processor 490 may determine a first vibration compensation value for the AF/OIS coil 482 in the camera module 480 and a second vibration compensation value for the vibration frequency and amplitude of the camera module 480 according to the orientation of the electronic device 400.

At operation 560, the processor 490 of the electronic device 400 may output a voltage capable of controlling the camera module driver 485 through the voltage management module 470 based on the compensation value determined at operation 550. Then, the camera module driver 485 may receive a control voltage of, for example, 1.8V to 3.3V through the power management module 470 and control the AF and OIS coils 482 to eliminate vibration jitter due to noise of the camera module 480.

Fig. 11 is a diagram illustrating a change in current value and vibration noise according to power levels according to various embodiments of the present disclosure.

Referring to fig. 11 and table 1 below, as the current (I) flowing in the battery cell 450 becomes stronger, the intensity of vibration noise increases. Accordingly, it can be predicted that the magnetic field strength caused by the FPCB 460 increases in proportion to the increase of the current (I).

TABLE 1

Fig. 12 is a diagram illustrating voltage control according to an orientation of an electronic device according to various embodiments of the present disclosure.

In operation 540 described above, the electronic apparatus 400 may detect the orientation of the electronic apparatus 400 changed by the user through the acceleration sensor 430. Based on this orientation of the electronic device 400, the power management module 470 may output a voltage for controlling the camera module driver 485. The camera module driver 485 may include an AF driver and an OIS driver.

The operation 540 of detecting the orientation of the electronic device 400 by the acceleration sensor 430 may include detecting a gravitational direction of the AF/OIS coil 482 in the camera module 480 and detecting the orientation of the electronic device 400 relative to the up, down, left, and right directions. The direction of the magnetic field may be preset based on the positions of the FPCB 460 and the camera module 480. The AF/OIS coil 482 may be fixedly disposed in a direction opposite to the magnetic field to minimize the influence of the magnetic field, and the strength of the magnetic field may be controlled via voltages as shown in fig. 11. For example, an AF carrier (e.g., including a ball) and an OIS carrier (e.g., including a ball) both provided in the camera module 480 may be affected by gravity, although lightweight. The gravity direction and the magnetic field direction may be changed according to the layout design of the camera module 480 and the FPCB 460.

Referring to fig. 12, when a user places the electronic device 400 with the camera module 480 in an upward direction, the direction of the magnetic field is orthogonal to the direction of gravity. In this case, the operation voltage of the camera module driver 485 (including, for example, OIS driver and AF driver) is controlled to 2.6V.

Further, when the user places the electronic device 400 with the camera module 480 in a downward direction, the direction of the magnetic field is orthogonal to the direction of gravity. In this case, the operation voltage of the camera module driver 485 (including, for example, OIS driver and AF driver) is controlled to 2.6V.

Further, when the user places the electronic device 400 with the camera module 480 in the left direction, the direction of the magnetic field is opposite to the direction of gravity. In this case, the operation voltage of the camera module driver 485 (including, for example, OIS driver and AF driver) is controlled to 3.3V.

Further, when the user places the electronic device 400 with the camera module 480 in the right direction, the direction of the magnetic field is the same as the direction of gravity. In this case, the operation voltage of the camera module driver 485 (including, for example, OIS driver and AF driver) is controlled to 1.8V.

Fig. 13 is a diagram illustrating an operating state in a camera module depending on an operating voltage applied from a power management module to a camera module driver according to various embodiments of the present disclosure.

Referring to fig. 13, when a control voltage (e.g., 1.8V to 3.3V) is applied from the power management module 470 to the camera module driver 485, the positions of the AF ball and OIS ball included in the camera module 480 may be changed from a floating state to a fixed state by the magnetic fields of the AF coil and OIS coil. For example, when the AF ball and OIS ball change from a floating state to a fixed state, the lens of the camera module 480 may move up, down, left, or right due to the movement of the balls. The floating state may be a first fixed state in which the movements of the AF ball and OIS ball are fixed by the magnetic forces of magnets (magnet #1 and magnet # 2) fixed in the camera module 480. Due to the strong magnetic field generated in the FPCB 460, the AF ball and OIS ball may move toward the AF coil and OIS coil. That is, the first fixed state may be changed to the second fixed state. Repetition of the first fixed state and the second fixed state may cause vibration jitter. Further, two or more AF balls and two or more OIS balls may be provided in the AF carrier and OIS carrier, respectively. In this case, different and complex vibration jitters may occur.

When the balls (e.g., AF balls and OIS balls) included in the camera module 480 are fixed, the influence of the current of the FPCB 460 on the magnetic field may be reduced, and thus the ball movement caused by the magnetic field may be reduced. That is, by controlling the voltage (e.g., 1.8V to 3.3V) applied from the power management module 470 to the camera module driver 485, the spherical state between the floating state and the fixed state can be controlled.

Fig. 14 is a flowchart illustrating another noise control method of an electronic device according to various example embodiments of the present disclosure.

At operation 610, the electronic device 400 may execute a predetermined application. For example, the predetermined application program may be a call application required for a telephone call between the electronic device 400 and another electronic device. In the present embodiment, TDMA communication is described as an example of a plurality of applications because in TDMA communication, repeated changes in magnetic field occur due to repeated current changes and cause regular movements of balls (e.g., AF balls and OIS balls).

At operation 620, when the call application is running, the electronic device 400 may measure the current of the battery unit 450 through the power management module 470 and monitor the power level received from the base station.

At operation 630, the processor 490 of the electronic device 400 may compare the current of the battery cell 450 measured at operation 620 with a threshold value of the noise generation condition. That is, the processor 490 may determine whether the measured current of the battery cell 450 exceeds a threshold.

If it is determined at operation 630 that the measured current of the battery cell 450 exceeds the threshold, the processor 490 of the electronic device 400 may reduce the current of the battery cell 450 by adjusting the power level to a specification-allowed limit at operation 635.

In operation 640, the electronic device 400 may record vibration noise of the camera module 480 caused by the current of the FPCB 460 through the microphone 420 adjacent to the camera module 480. The processor 490 of the electronic device 400 may analyze the frequency and amplitude of the vibration noise by fourier transforming the vibration noise recorded by the microphone 420.

At operation 650, the processor 490 of the electronic device 400 may determine a compensation value for the recorded vibration noise of the camera module 480. In this operation, based on the setting information stored in the memory, the processor 490 may determine a first vibration compensation value for the AF/OIS coil 482 in the camera module 480 and a second vibration compensation value for the vibration frequency and amplitude of the camera module 480 according to the orientation of the electronic device 400.

In operation 660, the processor 490 of the electronic device 400 may output a voltage capable of controlling the camera module driver 485 through the power management module 470 based on the compensation value determined in operation 650.

At operation 670, the processor 490 of the electronic device 400 may determine whether vibration noise is within a given range through the control voltage of operation 660. If the vibration noise is within the given range, the process ends. If the vibration noise exceeds a given range, the above operations 640 to 660 may be performed again.

Referring to fig. 15 and 13, in the audible frequency band, the spectrum of vibration noise may be divided into a low frequency band and a high frequency band. For example, in a low frequency band (420 to 800 Hz), vibration noise may be generated due to collision between a shield can included in the camera module 480 and an AF carrier (e.g., including a ball). In the high frequency band (2 to 4.4 KHz), vibration noise may be generated due to collisions between lenses included in the camera module 480 and OIS carriers (e.g., including balls).

Accordingly, the operating voltage of the camera module driver 485 for controlling the camera module 480 may be defined as shown in table 2 below.

TABLE 2

As shown in table 2, since one of the vibration noise sources in the low frequency band is the AF carrier, the power management module 470 may control the voltage of the camera module driver (AF) to 3.3V, and may also control the voltage of the camera module driver (OIS) to 1.8V. This may reduce the current consumption of the electronic device 400.

Further, since one of the vibration noise sources in the high frequency band is the OIS carrier, the power management module 470 may control the voltage of the camera module driver (OIS) to 3.3V, and may also control the voltage of the camera module driver (AF) to 1.8V, so as to reduce the current consumption of the electronic apparatus 400.

While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising:

a cable including a first layer forming a first power line and a second layer forming a second power line,

wherein the first layer and the second layer are arranged in a vertically stacked configuration,

wherein the cable eliminates a magnetic field generated by a current when charging and discharging a battery cell of the electronic device, and eliminates noise caused by a magnetic field generated by a coil-containing assembly of the electronic device,

wherein the first power line and the second power line are disposed adjacent to the coil-containing assembly within a distance of 0.01mm to 4mm, the coil-containing assembly including a camera module, and

wherein the camera module comprises an autofocus AF coil and an optical image stabilization OIS coil, the AF coil and the OIS coil being disposed in a direction opposite to the magnetic field.

2. The electronic device of claim 1, wherein the coil-containing assembly comprises a vibrating element between a coil and a magnet.

3. The electronic device of claim 1, wherein the first power line is disposed on the second power line and is inclined in a first direction or a second direction from a vertical axis of the second power line.

4. The electronic device of claim 1, wherein the coil-containing assembly is at least one of a camera module, a motor, or a speaker, all disposed in the electronic device.

5. The electronic device according to claim 1, wherein one end of the cable is connected to the battery unit and the other end is connected to a printed circuit board equipped in the electronic device.

6. The electronic device of claim 5, wherein the cable comprises a connection unit, a flexible unit, and a protection circuit module PCM unit.

7. The electronic device defined in claim 6 wherein the flexible unit has a first portion and a second portion, one end of the first portion being bent and connected to the connection unit and one end of the second portion being connected to the other end of the first portion.

8. The electronic device of claim 1, wherein the cable includes a connection unit, a flexible unit, and a protection circuit module PCM unit in each of the first layer and the second layer.