CN107864595A - Heat pipe for conductive heat dissipation device - Google Patents
Heat pipe for conductive heat dissipation device Download PDFInfo
- Publication number
- CN107864595A CN107864595A CN201711126677.XA CN201711126677A CN107864595A CN 107864595 A CN107864595 A CN 107864595A CN 201711126677 A CN201711126677 A CN 201711126677A CN 107864595 A CN107864595 A CN 107864595A
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- CN
- China
- Prior art keywords
- flow channel
- pair
- plate
- flow
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The invention provides a kind of heat pipe for conductive heat dissipation device, including water inlet pipe, outlet pipe, coldplate and multiple bodys, adjacent first flow and second flow channel are provided with coldplate, first flow and second flow channel sequentially pass through first pair of plate, connecting plate and second pair of plate, one end of microchannel pore is connected by the first opening with second flow channel, the other end of microchannel pore is connected by the second opening with second flow channel, phase-change working substance circulates in the second flow channel and multiple microchannel pores, coolant is flowed into the first flow by the water inlet pipe and flowed out by the outlet pipe, to take away the heat of the phase-change working substance.So, phase-change working substance can only be realized with the coolant in first flow by the outer wall of second flow channel and exchanged heat, and so as to reduce the thermal resistance between phase-change working substance and coolant, increased heat transfer coefficient, improved heat transfer efficiency.The heat of power device can be pulled away in time, so as to ensure that the normal operating temperature of power device.
Description
Technical field
The invention belongs to the technical field of heat management, more particularly to a kind of heat pipe for conductive heat dissipation device.
Background technology
In fields such as electric automobile, industrial electronic, consumer electronics, computer room, data servers, equipment or device are in work
Substantial amounts of heat can be produced when making, if this heat can not scatter away in time, can make the temperature of equipment or environment temperature it is continuous on
Rise, high temperature can seriously affect operation stability and the life-span of equipment, it is therefore desirable to carry out various heat managements so that equipment is suitable
It is operated within the temperature range of conjunction.Heat management includes heat transfer and radiating, and one of which heat transfer unit (HTU) is porous heat pipe.Porous heat
Pipe is a kind of heat-transfer device, is not a kind of heat abstractor, in terms of heat pipe is applied into radiating, it is necessary in the radiating of heat pipe
End is installed by certain heat abstractor.
It is typically to paste heat conductive silica gel in radiating end to be bonded with cooled plate in the prior art, by cold in cooled plate
But the circulation of liquid, the heat of heat pipe is passed.There is larger thermal resistance in this mode so that the efficiency of radiating substantially reduces, and is
Improving radiating efficiency needs to increase the area of cooled plate or increases the flow of liquid.
The content of the invention
The technical problems to be solved by the invention are：Pass through heat conduction for the radiating end and cooled plate of heat pipe in the prior art
Silica gel, which is pasted, has that thermal resistance is big, a kind of low technological deficiency of radiating efficiency, there is provided heat pipe for conductive heat dissipation structure.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of heat pipe for conductive heat dissipation device, including water inlet pipe, go out
Water pipe, coldplate and multiple bodys, adjacent first flow and second flow channel are provided with the coldplate；
The coldplate includes first pair of plate, second pair of plate and connecting plate, the first flow and second flow channel and worn successively
First pair of plate, connecting plate and second pair of plate are crossed, multiple first openings, institute are provided with the downside surface of first pair of plate
State and multiple second openings are provided with the downside surface of second pair of plate, multiple first openings and multiple second openings one
One correspondence, one end insertion first opening of the body, second opening corresponding to the other end insertion of the body；
Formed with multiple microchannel pores in the body, one end of the microchannel pore by the described first opening with it is described
Second flow channel is connected, and the other end of the microchannel pore is connected by the described second opening with the second flow channel, phase-change working substance
Circulated in the second flow channel and multiple microchannel pores, coolant by the water inlet pipe flow into the first flow and by
The outlet pipe outflow, to take away the heat of the phase-change working substance.
Alternatively, first pair of plate, second pair of plate and connecting plate are integrally formed.
Alternatively, formed with the multiple fluid channels separated by multiple barriers in the first flow.
Alternatively, multiple barriers be arranged in parallel, and multiple fluid channels are vertical with the second flow channel.
Alternatively, the first flow is arranged on the outside of the second flow channel.
Alternatively, the water inlet pipe is arranged on the one end of first pair of backboard from the connecting plate, and the outlet pipe is set
One end close to the water inlet pipe on the one end of second pair of backboard from the connecting plate, first pair of plate is put to be provided with
For closing the first baffle of the second flow channel, it is provided with second pair of plate close to one end of the outlet pipe for sealing
Close the second baffle of the second flow channel.
Alternatively, the body includes the first vertical section, the second vertical section and is arranged on first vertical section and second
Horizontal segment between vertical section, first vertical section are plugged in first opening, and second vertical section is plugged on institute
State in the second opening.
Alternatively, first opening is the first step trough, and First terrace is formed on the inwall of first step trough,
First step trough is communicated to the second flow channel, the first vertical section sealing be plugged in first step trough and with
The First terrace abuts；
Second opening be the second step trough, formation second step face on the second step trough inwall, described second
Step trough is communicated to the second flow channel, and the second vertical section sealing is plugged in second step trough and with described second
Step surface abuts.
Alternatively, the horizontal segment of multiple bodys is concordantly set.
Alternatively, it is provided with the downside of the connecting plate and fills post, the post that fills connects with the second flow channel, described
Post is filled after the completion of the phase-change working substance fills from outer closures.
Heat pipe for conductive heat dissipation device provided in an embodiment of the present invention, adjacent first flow and second are provided with coldplate
Runner, first flow and second flow channel sequentially pass through first pair of plate, connecting plate and second pair of plate, and one end of microchannel pore passes through
One opening is connected with second flow channel, and the other end of microchannel pore is connected by the second opening with second flow channel, and phase-change working substance is in institute
State in second flow channel and multiple microchannel pores and circulate, coolant flows into the first flow and by described by the water inlet pipe
Outlet pipe flows out, to take away the heat of the phase-change working substance.So, phase-change working substance only can be with by the outer wall of second flow channel
Coolant in one runner realizes heat exchange, so as to reduce the thermal resistance between phase-change working substance and coolant, increases heat transfer coefficient,
Improve heat transfer efficiency.The heat liquid band that can be cooled in time for the power device that phase-change working substance absorbs is walked, so as to ensure that
The normal operating temperature of power device, extends its service life.
Brief description of the drawings
Fig. 1 is the schematic perspective view for the heat pipe for conductive heat dissipation device that one embodiment of the invention provides；
Fig. 2 is the schematic diagram of its coldplate of the heat pipe for conductive heat dissipation device of one embodiment of the invention offer；
Fig. 3 is the schematic diagram of its body of the heat pipe for conductive heat dissipation device of one embodiment of the invention offer；
Fig. 4 is the schematic cross-section of its body of the heat pipe for conductive heat dissipation device of one embodiment of the invention offer；
Fig. 5 is the schematic diagram (another visual angle) of its coldplate of the heat pipe for conductive heat dissipation device of one embodiment of the invention offer；
Fig. 6 is the enlarged drawing at a in Fig. 5；
Fig. 7 is the enlarged drawing at b in Fig. 5.
Reference in specification is as follows：
1st, water inlet pipe；
2nd, outlet pipe；
3rd, coldplate；31st, first flow；311st, barrier；312nd, fluid channel；32nd, second flow channel；33rd, first pair of plate；332、
First step trough；333rd, First terrace；34th, second pair of plate；342nd, the second step trough；343rd, second step face；35th, connect
Plate；351st, post is filled；36th, second baffle；
4th, body；41st, microchannel pore；42nd, the first vertical section；43rd, the second vertical section；44th, horizontal segment.
Embodiment
In order that technical problem solved by the invention, technical scheme and beneficial effect are more clearly understood, below in conjunction with
Drawings and Examples, the present invention is described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
As shown in Figures 1 to 7, the heat pipe for conductive heat dissipation device that one embodiment of the invention provides, including water inlet pipe 1, water outlet
Pipe 2, coldplate 3 and multiple bodys 4, adjacent first flow 31 and second flow channel 32 are provided with the coldplate 3, it is described cold
But plate 3 includes first pair of plate, 33, second pairs of plates 34 and connecting plate 35, the first flow 31 and second flow channel 32 sequentially pass through institute
First pair of plate 33, connecting plate 35 and second pair of plate 34 are stated, being provided with multiple first on the downside surface of first pair of plate 33 opens
Mouthful, multiple second openings are provided with the downside surface of second pair of plate 34, one end insertion described first of the body 4 is opened
Mouthful, second opening corresponding to the other end insertion of the body 4.As shown in figure 4, formed with multiple micro- in the body 4
Access opening 41, one end of the microchannel pore 41 are connected by the described first opening with the second flow channel 32, the microchannel
The other end in hole 41 is connected with the second flow channel 32 by the described second opening, and phase-change working substance is in the second flow channel 32 and more
Circulated in the individual microchannel pore 41, coolant is flowed into the first flow 31 by the water inlet pipe 1 and flowed by the outlet pipe 2
Go out, to take away the heat of the phase-change working substance.
Above-mentioned phase-change working substance is a kind of phase-change material, and it has low boiling, the characteristic of the high coefficient of heat transfer, to pass through vaporization
The heat of absorbed power device, and by liquidation exothermic reaction, the heat of power device is quickly exported.The phase-change working substance is selected from
Ethylene glycol, acetone, methanol, refrigerant (R134a, R410A etc.), the mixture of one or more of which in ammonia.Coolant is
Water or anti-icing fluid etc..
In one embodiment, described first pair of plate, 33, second pairs of plates 34 and connecting plate 35 are integrally formed.
In some other embodiment, described first pair of plate, 33, second pairs of plates 34 and connecting plate 35 can also be individually into
After type, it is integrally connected by the way of welding.
In one embodiment, as shown in Fig. 2 forming the fluid channel separated by multiple barriers 311 in the first flow 31
312, multiple barriers 311 be arranged in parallel, and multiple fluid channels 312 are vertical with the second flow channel 32.Multiple miniflows
The setting in road 312 reduces the temperature difference of coolant in first flow 31, makes the temperature of the coolant in the first flow 31
Reach unanimity, so as to reduce the heat transfer of coolant itself, increase the heat transfer coefficient between coolant and phase-change working substance,
Improve heat transfer efficiency.
In one embodiment, the first flow 31 is arranged on the outside of the second flow channel 32, so as to make coolant
The heat of the phase-change working substance of absorption can be shed in time, and so, the heat of phase-change working substance is outwardly passed step by step by coolant
Pass, so as to enhancing heat transfer, improve heat transfer efficiency.
However, in some other embodiment, the second flow channel 32 is arranged on the outside of the first flow 31, this
When, when power device contacts with the first flow 31, a part for the heat of power device is directly taken away by coolant, and one
Taken away again by coolant after being absorbed by phase-change working substance part.
As shown in figure 1, the water inlet pipe 1 is arranged on one end that first pair of plate 33 deviates from the connecting plate 35, it is described
Outlet pipe 2 is arranged on one end that second pair of plate 34 deviates from the connecting plate 35, goes out on first pair of plate 33 described in
One end of water pipe 2 be provided with for close the second flow channel 32 first baffle (not shown in figure, structure and second baffle phase
Seemingly), the second gear for closing the second flow channel 32 is provided with second pair of plate 34 close to one end of the outlet pipe 2
Plate 36, so as to make to form the phase-change working substance space of closing in the second flow channel 32.So, the water inlet pipe 1 and it is described go out
Water pipe 2 can be connected directly with the coldplate 3, eliminate the connection water inlet pipe 1 and the outlet pipe 2 and the coldplate
3 middle device, make structure compacter.
In a preferred embodiment, as shown in figure 4, the body 4 includes the first vertical section 42, the second vertical section 43 and set
The horizontal segment 44 between the vertical section 43 of the first vertical section 42 and second is put, first vertical section 42 is plugged on described
In one opening, second vertical section 43 is plugged in second opening.
In one embodiment, as shown in Figures 5 to 7, first opening is the first step trough 332, first ladder
Forming First terrace 333 on the inwall of groove 332, first step trough 332 is communicated to the second flow channel 32, and described first
The sealing of vertical section 42 is plugged in first step trough 332 and abutted with the First terrace 333, and second opening is
Second step trough 342, second step face 343 is formed on the inwall of the second step trough 342, second step trough 342 connects
To the second flow channel 32, the sealing of the second vertical section 43 be plugged in second step trough 342 and with described second
Terrace 343 abuts.The horizontal segment 44 of multiple bodys 4 is concordantly set, to form the accommodation space of power device.
When above-mentioned heat pipe for conductive heat dissipation device is used cooperatively with power device, the horizontal segment 44 is hot junction, described the
One vertical section 42 and the second vertical section 43 are cold end, and power device contacts with the horizontal segment 44, and the phase-change working substance absorbs work(
The heat of rate device undergoes phase transition (liquid is changed into gaseous state), and the phase-change working substance after phase transformation reduces by the horizontal segment due to its density
44 rise to the second flow channel 32 through first vertical section 42 flowing, or vertical through described second by the horizontal segment 44
The flowing of section 43 rises to the second flow channel 32.So, the phase-change working substance after vaporization in the second flow channel 32 with described the
Heat exchange occurs for the coolant in one runner 31, so that the heat of the phase-change working substance after vaporization is pulled away.Heat occurs with coolant
The phase-change working substance of exchange is become by gaseous state turns to liquid, and drops back into the horizontal segment 44, again the heat of absorbed power device,
Self-loopa of the phase-change working substance between cold end and hot junction is realized according to this.The heat pipe for conductive heat dissipation device of the present embodiment, not only dissipates
Hot area increase, but also because the presence of two sections of cold ends (the first vertical section 42, the second vertical section 43) is so that phase-change working substance
Also it is improved in the flow rate of the phase-change working substance closing space, so that heat exchange efficiency greatly improves.
In a preferred embodiment, as shown in figure 4, the microchannel pore 41 is dentation, dentalation can be described micro-
In the case that the aperture of access opening 41 does not increase, the contact area of increase phase-change working substance and the microchannel pore 41, further carry
Rise heat conduction efficiency.On the other hand, the dentalation of the madial wall of the microchannel pore 41 is similar to capillary structure so that described
Microchannel pore 41 forms similar pore, and the phase-change working substance be advantageous to after liquefaction is vertical by first vertical section 42 and second
Section 43 is back to the horizontal segment 44, to form circulation.
Above-mentioned heat pipe for conductive heat dissipation device, phase-change working substance flow in multiple microchannel pores 41 and second flow channel 32
It is dynamic, so, the space of phase-change working substance circulation is increased, phase-change working substance and the heat exchange area of coolant are added, so as to increase
Heat exchange efficiency.
As shown in figure 1, the downside of the connecting plate 35, which is provided with, fills post 351, the post 351 that fills leads to the connection
Road connects, described to fill post 351 after the completion of the phase-change working substance fills from outer closures.
The heat pipe for conductive heat dissipation device that above-described embodiment provides, adjacent first flow and second are provided with coldplate
Road, first flow and second flow channel sequentially pass through first pair of plate, connecting plate and second pair of plate, one end of microchannel pore and pass through first
Opening is connected with second flow channel, and the other end of microchannel pore is connected by the second opening with second flow channel, and phase-change working substance is described
Circulated in second flow channel and multiple microchannel pores, coolant by the water inlet pipe flow into the first flow and by it is described go out
Water pipe flows out, to take away the heat of the phase-change working substance.So, phase-change working substance only can be with first by the outer wall of second flow channel
Coolant in runner realizes heat exchange, so as to reduce the thermal resistance between phase-change working substance and coolant, increases heat transfer coefficient, carries
High heat transfer efficiency.The heat liquid band that can be cooled in time for the power device that phase-change working substance absorbs is walked, so as to ensure that work(
The normal operating temperature of rate device, extends its service life.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of heat pipe for conductive heat dissipation device, it is characterised in that described including water inlet pipe, outlet pipe, coldplate and multiple bodys
Adjacent first flow and second flow channel are provided with coldplate；
The coldplate includes first pair of plate, second pair of plate and connecting plate, and the first flow and second flow channel sequentially pass through institute
First pair of plate, connecting plate and second pair of plate are stated, is provided with multiple first openings on the downside surface of first pair of plate, described the
It is provided with multiple second openings on the downside surface of two pairs of plates, multiple first openings and multiple second openings one a pair
Should, one end insertion first opening of the body, second opening corresponding to the other end insertion of the body；
Pass through the described first opening and described second formed with multiple microchannel pores, one end of the microchannel pore in the body
Flow passage, the other end of the microchannel pore are connected by the described second opening with the second flow channel, and phase-change working substance is in institute
State in second flow channel and multiple microchannel pores and circulate, coolant flows into the first flow and by described by the water inlet pipe
Outlet pipe flows out, to take away the heat of the phase-change working substance.
2. heat pipe for conductive heat dissipation device as claimed in claim 1, it is characterised in that first pair of plate, second pair of plate and company
Fishplate bar is integrally formed.
3. heat pipe for conductive heat dissipation device as claimed in claim 1, it is characterised in that formed with by multiple in the first flow
Multiple fluid channels that barrier separates.
4. heat pipe for conductive heat dissipation device as claimed in claim 3, it is characterised in that multiple barriers be arranged in parallel, and more
The individual fluid channel is vertical with the second flow channel.
5. heat pipe for conductive heat dissipation device as claimed in claim 1, it is characterised in that the first flow is arranged on described second
The outside of runner.
6. heat pipe for conductive heat dissipation device as claimed in claim 1, it is characterised in that the water inlet pipe is arranged on described first pair
For backboard from one end of the connecting plate, the outlet pipe is arranged on the one end of second pair of backboard from the connecting plate, described
One end of the water inlet pipe is provided with first baffle for closing the second flow channel on first pair of plate, described second pair
One end of the close outlet pipe is provided with the second baffle for closing the second flow channel on plate.
7. heat pipe for conductive heat dissipation device as claimed in claim 1, it is characterised in that the body includes the first vertical section, the
Two vertical sections and the horizontal segment being arranged between first vertical section and the second vertical section, first vertical section are plugged on institute
State in the first opening, second vertical section is plugged in second opening.
8. heat pipe for conductive heat dissipation device as claimed in claim 7, it is characterised in that first opening is the first step trough,
First terrace is formed on the inwall of first step trough, first step trough is communicated to the second flow channel, and described the
The sealing of one vertical section is plugged in first step trough and abutted with the First terrace；
Second opening is the second step trough, and second step face, second ladder are formed on the second step trough inwall
Groove is communicated to the second flow channel, the second vertical section sealing be plugged in second step trough and with the second step
Face abuts.
9. heat pipe for conductive heat dissipation device as claimed in claim 7, it is characterised in that the horizontal segment of multiple bodys is put down
It is neat to set.
10. heat pipe for conductive heat dissipation device as claimed in claim 1, it is characterised in that be provided with and fill on the downside of the connecting plate
Post is filled, the post that fills connects with the second flow channel, and the post that fills seals after the completion of the phase-change working substance fills from outside
Close.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711126677.XA CN107864595A (en) | 2017-11-15 | 2017-11-15 | Heat pipe for conductive heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711126677.XA CN107864595A (en) | 2017-11-15 | 2017-11-15 | Heat pipe for conductive heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107864595A true CN107864595A (en) | 2018-03-30 |
Family
ID=61701895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711126677.XA Pending CN107864595A (en) | 2017-11-15 | 2017-11-15 | Heat pipe for conductive heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107864595A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220217871A1 (en) * | 2019-12-30 | 2022-07-07 | Gm Cruise Holdings Llc | Embedded and immersed heat pipes in automated driving system computers |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200959709Y (en) * | 2006-09-27 | 2007-10-10 | 中国科学院工程热物理研究所 | Capillary microchannel phase-variable heat-combined cooler of single-phase microchannel convection |
| CN201590985U (en) * | 2010-01-25 | 2010-09-22 | 中兴通讯股份有限公司 | Liquid cooling plate |
| EP2267478A2 (en) * | 2009-06-23 | 2010-12-29 | Xerox Corporation | System and method for preparing conductive structures using radiation curable phase change gel inks |
| CN102646651A (en) * | 2011-02-18 | 2012-08-22 | 奇鋐科技股份有限公司 | Thin hot plate structure |
| CN106643245A (en) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | Multi-channel parallel heat pipe radiator |
| CN206564248U (en) * | 2017-03-07 | 2017-10-17 | 深圳市迈安热控科技有限公司 | Power device heat abstractor and power device radiating module |
| CN207399748U (en) * | 2017-11-15 | 2018-05-22 | 深圳市迈安热控科技有限公司 | Heat pipe for conductive heat dissipation device |
-
2017
- 2017-11-15 CN CN201711126677.XA patent/CN107864595A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200959709Y (en) * | 2006-09-27 | 2007-10-10 | 中国科学院工程热物理研究所 | Capillary microchannel phase-variable heat-combined cooler of single-phase microchannel convection |
| EP2267478A2 (en) * | 2009-06-23 | 2010-12-29 | Xerox Corporation | System and method for preparing conductive structures using radiation curable phase change gel inks |
| CN201590985U (en) * | 2010-01-25 | 2010-09-22 | 中兴通讯股份有限公司 | Liquid cooling plate |
| CN102646651A (en) * | 2011-02-18 | 2012-08-22 | 奇鋐科技股份有限公司 | Thin hot plate structure |
| CN106643245A (en) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | Multi-channel parallel heat pipe radiator |
| CN206564248U (en) * | 2017-03-07 | 2017-10-17 | 深圳市迈安热控科技有限公司 | Power device heat abstractor and power device radiating module |
| CN207399748U (en) * | 2017-11-15 | 2018-05-22 | 深圳市迈安热控科技有限公司 | Heat pipe for conductive heat dissipation device |
Non-Patent Citations (2)
| Title |
|---|
| PRAMOD CHAMARTHY: "Theoretical evaluation and experimental investigation of microencapsulated phase change materials (MPCM) in electronics cooling applications", 2009 25TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, pages 239 - 244 * |
| 周云龙: "基于两相流的微通道冷却技术研究进展及展望", 热能动力工程, vol. 31, no. 7, pages 1 - 4 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220217871A1 (en) * | 2019-12-30 | 2022-07-07 | Gm Cruise Holdings Llc | Embedded and immersed heat pipes in automated driving system computers |
| US11737244B2 (en) * | 2019-12-30 | 2023-08-22 | Gm Cruise Holdings Llc | Embedded and immersed heat pipes in automated driving system computers |
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