CN107858501B - A kind of workpiece surface laser-impact technique removing residual stress hole - Google Patents

A kind of workpiece surface laser-impact technique removing residual stress hole Download PDF

Info

Publication number
CN107858501B
CN107858501B CN201711292041.2A CN201711292041A CN107858501B CN 107858501 B CN107858501 B CN 107858501B CN 201711292041 A CN201711292041 A CN 201711292041A CN 107858501 B CN107858501 B CN 107858501B
Authority
CN
China
Prior art keywords
laser
micro
texture
impact
workpiece surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711292041.2A
Other languages
Chinese (zh)
Other versions
CN107858501A (en
Inventor
曹宇鹏
施卫东
王恒
花国然
陈浩天
蒋苏州
陈怡平
马剑军
朱娟
朱珉睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong University
Original Assignee
Nantong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nantong University filed Critical Nantong University
Priority to CN201711292041.2A priority Critical patent/CN107858501B/en
Publication of CN107858501A publication Critical patent/CN107858501A/en
Application granted granted Critical
Publication of CN107858501B publication Critical patent/CN107858501B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D11/00Process control or regulation for heat treatments
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/053Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with zinc as the next major constituent
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to the workpiece surface laser-impact techniques in removal residual stress hole, micro- texture laser parameter is optimized, the hole array formed using the micro- texture of laser, achieve the purpose that discharge residual stress, meanwhile the aperture that micro- texture is formed plays blocking effect in rarefaction wave communication process, prevents surface convergence wave from reaching spot center, residual stress hole can not be formed, ensures that surface rarefaction wave is converged without normal direction spot center in workpiece surface monitoring using PDVF piezoelectric transducer.In addition, laser impact intensified laser parameter is converted to the laser parameter using deionized water as restraint layer by the present invention, this technique is industrially used on a large scale.The laser impact intensified processing that workpiece surface is carried out using the method for the present invention is not necessarily to high overlapping rate, can directly eliminate residual stress hole, not only improve processing efficiency reduces processing cost simultaneously without changing light spot shape.

Description

A kind of workpiece surface laser-impact technique removing residual stress hole
Technical field
The present invention relates to the workpiece surface laser-impact techniques in removal residual stress hole, belong to technical field of laser processing.
Background technique
The application is the divisional application application No. is CN2016108809174.
Laser impact intensified (Laser Shocking Peening, LSP) technology, also referred to as Laser Peening Technology.Laser punching Hitting reinforcing is using high power density (GW/cm2Magnitude), the laser of short pulse (10-30ns magnitude) by restraint layer irradiate in When energy-absorbing layer coated by metal surface, coating absorbs laser energy and gasifies rapidly and be formed substantially simultaneously a large amount of intensive High temperature (710K), high pressure (> 1GPa) plasma.Restraint layer can effectively enhance the pressure of laser blast wave and extend it and continue Time, plasma explosion is hindered, enhancing laser energy coupling significantly improves the strengthening effect of laser-impact.
The micro- texturing process in surface is proved to can be effectively improved at present material surface friction and wear behavior and bearing capacity A kind of means.In recent years, it is obtained in process for modifying surface by processing a series of micrographics array in friction pair More and more concerns.Also, it is found in mimetic bio-membrane probe process, the wear-resistant degree on surface is not and its smooth degree It is directly proportional, there is the surface of certain matte finish that there is better abrasion resistance instead.
It is laser impact intensified to be widely used in improving aero engine turbine blades residual stress and fatigue strength, logical Often in situation, the spot center of laser is the maximum region of residual compressive stress, but with the increase of laser intensity, original equal double The residual stress phenomenon of axis distribution disappears, and becomes the phenomenon that a kind of maximum residual stress does not appear in spot center, this Phenomenon is referred to as " residual stress hole ", is mainly shown as that center of impact region residual compressive stress lacks." residual stress hole " shows The appearance of elephant causes laser impact intensified spot center compression to lack, or even forms tensile stress, and hot spot is made to form biggish answer Force gradient easily causes the workpiece after laser impact intensified to crack in actual production and application, serious to reduce the longevity Life.
Gauss circle hot spot is changed to uniformly square hot spot by " optics binary diffraction " method, can effectively inhibit " remaining The formation in stress hole ", the more uniform residual compressive stress layer of formation, but the surface maximum residual stress value that square hot spot is formed A degree of reduction, simultaneous processing higher cost can all be occurred by influencing layer depth with plasticity.Or it is carried out using circular light spot Overlap joint, can just reduce the influence in residual stress hole frequently with 70% overlapping rate.
Summary of the invention
It is an object of the invention to: overcome the defect of the above-mentioned prior art, proposes a kind of workpiece for removing residual stress hole Surface laser impact technique can determine ideal micro- texture laser-impact technique by this method, make plate using the technique Material avoids the phenomenon that generating " residual stress hole " after laser impact intensified.
In order to achieve the above object, a kind of workpiece surface laser-impact work removing residual stress hole proposed by the present invention Skill, it is characterised in that steps are as follows:
Step 1 carries out laser micro- texture processing in workpiece surface, the laser energy that micro- texture uses for P0(here with The fuel factor of laser is processed, and using optical fiber laser, uses weak laser), micro- texture density is B, the laser energy of micro- texture The range for measuring P0 is P1-P2;
Step 2, using K9 glass as restraint layer to the processed workpiece surface of the micro- texture of laser carry out laser-impact it is strong Change, the laser impact intensified laser energy P3(is processed here with the mechanics effect of high-power laser induced shock waves, made With pulse laser, light laser is used), which may make untreated workpiece surface residual stress hole occur;Make simultaneously Workpiece surface dynamic strain detection is carried out with PVDF piezoelectric transducer, it is ensured that surface rarefaction wave is converged without normal direction spot center;
If step 3, PVDF piezoelectric transducer can't detect rarefaction wave, reduce micro- texture density, repeats step 1-2, directly To detecting rarefaction wave;If PVDF piezoelectric transducer detects rarefaction wave, increase micro- texture density, repeats step 1-2, until It can't detect rarefaction wave;Corresponding micro- texture density is handled as the micro- texture of corresponding laser when just can't detect rarefaction wave The micro- texture density of minimum feasible under laser energy;
The laser energy P0 of the micro- texture processing of step 4, adjustment laser, and step 1-3 is repeated, final obtain is swashed by micro- texture Several data pair that light energy and the micro- texture density of corresponding minimum feasible are constituted, select micro- texture hole depth moderate, micro- texture The smallest data pair of density, the laser energy of micro- texture as implementation and micro- texture density;
Step 5, measurement carry out laser impact intensified rear sample loading area using K9 glass as restraint layer, with laser energy P3 Edge slides depth;
Step 6, using deionized water as restraint layer, laser impact intensified laser parameter is adjusted, so that trying after laser-impact Sliding depth in sample loading area edge is approximately equal to the sliding of the sample loading area edge in step 5 depth;
Step 7 prepares micro- texture in workpiece surface with the impact laser of the micro- texture density and respective strengths that filter out, so Afterwards using deionized water as restraint layer, workpiece surface is carried out with the laser parameter after adjusting laser impact intensified, uses the technique Method can eliminate the laser impact intensified residual stress hole for causing workpiece surface to generate.
In order to achieve the above object, the present invention also has the feature that
1, in step 1, the range of micro- texture laser (pulse) energy P0 is 0.2mj-1mJ, and the spot size of laser is 1 μm, micro- texture pit distance range are as follows: 0-140 μm.
2, the workpiece surface is polished into mirror surface in advance.
3, by the three-dimensional appearance of the three-dimensional micro- sem observation material of the super depth of field of Japanese Keyemce VHX 1000c, sample is determined Loading area edge slides depth.
4, in step 5, the sample loading area edge for measuring acquisition slides depth as H1, in step 6, uses laser energy P4 carries out laser impact intensified, wherein P1 < P4 < P3, sample loading area after measuring using deionized water as restraint layer laser-impact It is H2 that edge, which slides depth, and laser energy is selected to carry out reinforcing punching for the laser of P4 '=P1+0.618* (P4-P1) if H2 > H1 Experiment is hit, the laser of laser energy P4 '=P4+0.618* (P3-P4) is selected to carry out intensifying impact experiment if H2 < H1;Laser Sample loading area edge slides depth H 2 ' after impact, constantly regulate and rushes the energy that grade strengthens laser, until H2 ' ≈ H1.
5, after the completion of step 6, laser-impact region residual stress is measured, adjusting intensifying impact is adjusted if being unevenly distributed Laser parameter, until surface residual stress is evenly distributed.
The principle of the invention is as follows:
After laser blast wave loads material surface, shock wave will form the longitudinal wave of Propagation and sparse in material internal Wave, and then will form rarefaction wave on the surface of the material, and propagate around.Hot spot boundary can regard the wave source of rarefaction wave as, sparse Wave is propagated around by hot spot boundary, and a part to center convergence, propagate outward by another part.It is by dilute for residual stress hole Into centre convergence and thin plate sample, roundtrip cooperatively forms laser blast wave rarefaction wave in the sample.It is knitted using laser is micro- The hole array being configured to achievees the purpose that release residual stress, meanwhile, the aperture that micro- texture is formed is propagated in surface rarefaction wave Blocking effect is played in the process, makes rarefaction wave that can not converge to spot center, can not form residual stress hole.For sheet member, The shock wave for reaching the back side is absorbed with the close impedance of material intrinsic frequency by overleaf increasing.
The laser impact intensified processing that workpiece surface is carried out using the method for the present invention, without changing light spot shape, without height Overlapping rate can directly eliminate residual stress hole, and not only improve processing efficiency reduces processing cost simultaneously.
Detailed description of the invention
The present invention will be further described below with reference to the drawings.
Fig. 1-a is the micro- texture close-up view of the present embodiment workpiece surface.
Fig. 1-b is the micro- texture list blind hole figure of the present embodiment workpiece surface.
Fig. 2-a is the waveform diagram for detecting rarefaction wave.
Fig. 2-b is the waveform diagram that rarefaction wave is not detected.
Fig. 3-a is the maximum remaining distribution of principal stress figure of workpiece surface.
Fig. 3-b is distribution of principal stress figure more than workpiece surface Minimum Residual.
Fig. 3-c is workpiece surface remnants principal direction of stress angular distribution.
Fig. 4-a is the close-up view after the present embodiment workpiece surface is laser impact intensified.
Fig. 4-b is single blind hole figure after the present embodiment workpiece surface is laser impact intensified.
Specific embodiment
The present invention will be further described in the following with reference to the drawings and specific embodiments.
A kind of workpiece surface laser-impact technique for removing residual stress hole of the present embodiment, it is characterised in that steps are as follows:
Step 1 carries out the micro- texture processing of laser (here with sharp workpiece surface (workpiece surface is polished into mirror surface in advance) The fuel factor of light is processed, and using optical fiber laser, uses weak laser), impact laser energy is P0, and micro- texture density is B, The range for impacting laser energy P0 is P1-P2.Preferably, the range for impacting laser energy P0 is 0.2mj-1mj, impacts laser Spot size is 1 μm, micro- texture pit distance range are as follows: 0-140 μm.In this example, 7050 aluminum alloy materials are selected, with pulse Energy is the laser of 0.2mj(power 5W), and spot size is 1 μm, and micro- texture pit distance carries out the preparations of micro- texture for 5 μm, After the micro- texture processing of laser, micro- texture overall picture under microscope is shown in Fig. 1-a, and micro- texture list blind hole under microscope is shown in Fig. 1-b.
Step 2, using K9 glass as restraint layer to the processed workpiece surface of the micro- texture of laser carry out laser-impact it is strong Change (being processed here with the mechanics effect of high-power laser induced shock waves, using pulse laser, use light laser), it is described Laser impact intensified laser energy P3 may make untreated workpiece surface residual stress hole occur;It is pressed simultaneously using PVDF Electric transducer carries out the detection of workpiece surface dynamic strain.
If step 3, PVDF piezoelectric transducer can't detect rarefaction wave, reduce micro- texture density, repeats step 1-2, directly To detecting rarefaction wave;If PVDF piezoelectric transducer detects rarefaction wave, increase micro- texture density, repeats step 1-2, until It can't detect rarefaction wave;Corresponding micro- texture density is handled as the micro- texture of corresponding laser when just can't detect rarefaction wave The micro- texture density of minimum feasible under laser energy.As shown in Fig. 2-a, for the waveform diagram for detecting rarefaction wave.Fig. 2-b is not examine Measure the waveform diagram of rarefaction wave.
The laser energy P0 of the micro- texture processing of step 4, adjustment laser, and step 1-3 is repeated, final obtain is swashed by micro- texture Several data pair that light energy and the micro- texture density of corresponding minimum feasible are constituted, it is moderate (for specific to select micro- texture hole depth A kind of material for, micro- texture blind hole depth has a suitable range, can be obtained by the method for experiment, can also be with Obtained by searching for pertinent literature), micro- the smallest data pair of texture density, impact laser energy and micro- texture as implementation Density.
Step 5, measurement carry out laser impact intensified rear sample loading area using K9 glass as restraint layer, with laser energy P3 Edge slides depth.In this example, the three-dimensional shaped of the three-dimensional micro- sem observation material of the super depth of field of Japanese Keyemce VHX 1000c is used Looks determine that sample loading area edge slides depth.In this step, the sample loading area edge sliding depth for measuring acquisition is H1。
Step 6, using deionized water as restraint layer, adjust intensifying impact laser parameter so that after laser-impact sample load Edges of regions sliding depth is approximately equal to the sliding of the sample loading area edge in step 5 depth.The preferred specific practice of this step It is: is carried out using laser energy P4 laser impact intensified, wherein P1 < P4 < P3, measurement is rushed by restraint layer laser of deionized water Hitting rear sample loading area edge sliding depth is H2, selects laser energy for P4 '=P1+0.618* (P4-P1) if H2 > H1 Laser carry out intensifying impact experiment, select the laser of laser energy P4 '=P4+0.618* (P3-P4) to carry out if H2 < H1 Intensifying impact experiment;Sample loading area edge slides depth H 2 ' after laser-impact, constantly regulate and rushes the energy that grade strengthens laser Amount, until H2 ' ≈ H1.After the completion of step 6, laser-impact region residual stress is measured, it is strong that adjusting is adjusted if being unevenly distributed Change impact laser parameter, until surface residual stress is evenly distributed.As Fig. 3-a show the maximum remaining principal stress point of workpiece surface Butut, Fig. 3-b are distribution of principal stress figure more than workpiece surface Minimum Residual, and Fig. 3-c is the distribution of workpiece surface remnants principal stress direction angle Figure.As we know from the figure: its maximum remaining principal stress of sample is compression, and the fluctuation of principal stress direction angle curve is big, principal stress side Stress is not easy to dispersion to concentrate.
Step 7 prepares micro- texture in workpiece surface with the impact laser of the micro- texture density and respective strengths that filter out, so Afterwards using deionized water as restraint layer, laser impact intensified, workpiece table is carried out to workpiece surface with the intensifying impact laser after adjusting Face remnants principal stress is the compression being evenly distributed, and " residual stress hole " phenomenon is not present.
For different materials, optimal technological parameter be will be different.For 7050 aerolites, in laser power For 5W, spot diameter is 1 μm, and pit distance is 110 μm, obtains ideal residual compressive stress.
In addition to the implementation, the present invention can also have other embodiments.It is all to use equivalent substitution or equivalent transformation shape At technical solution, fall within the scope of protection required by the present invention.

Claims (6)

1. a kind of workpiece surface laser-impact technique for removing residual stress hole, it is characterised in that steps are as follows:
Step 1 carries out the micro- texture processing of laser in workpiece surface, and for P0, micro- texture density is the laser energy that micro- texture uses The range of B, micro- texture laser energy P0 are 0.2mj-1mJ, and the spot size of laser is 1 μm, micro- texture pit distance range are as follows: 0-140μm;
Step 2, using K9 glass as restraint layer to the processed workpiece surface of the micro- texture of laser carry out laser impact intensified, institute Laser impact intensified laser energy P3 is stated, which may make untreated workpiece surface residual stress hole occur;Simultaneously The detection of workpiece surface dynamic strain is carried out using PVDF piezoelectric transducer;
If step 3, the PVDF piezoelectric transducer pasted on surface can't detect rarefaction wave, reduce micro- texture density, repeats to walk Rapid 1-2, until detecting rarefaction wave;If PVDF piezoelectric transducer detects rarefaction wave, increase micro- texture density, repeats step 1-2, until can't detect rarefaction wave;Corresponding micro- texture density is micro- as corresponding laser when just can't detect rarefaction wave Texture handles the micro- texture density of minimum feasible under laser energy;
The laser energy P0 of the micro- texture processing of step 4, adjustment laser, and step 1-3 is repeated, it is final to obtain by micro- texture laser energy Several data pair that amount and the micro- texture density of corresponding minimum feasible are constituted, select micro- texture hole depth moderate, micro- texture density The smallest data pair, the laser energy of micro- texture as implementation and micro- texture density;
Step 5, measurement carry out laser impact intensified rear sample loading area edge using K9 glass as restraint layer, with laser energy P3 Slide depth;In step 5, the sample loading area edge sliding depth for measuring acquisition is H1;
It is step 6, laser impact intensified with laser energy P4 is carried out, wherein P1 < P4 < P3 is measured using deionized water as restraint layer Sample loading area edge sliding depth is H2 after laser-impact, selects laser energy for P4 '=P1+0.618* if H2 > H1 (P4-P1) laser carries out intensifying impact experiment, and swashing for laser energy P4 '=P4+0.618* (P3-P4) is selected if H2 < H1 Light carries out intensifying impact experiment;Sample loading area edge slides depth H 2 ' after laser-impact, constantly regulate and rushes grade reinforcing laser Energy, until H2 ' ≈ H1;
Step 7 prepares micro- texture in workpiece surface with the laser of the micro- texture density and corresponding energy that filter out, then with go from Sub- water is restraint layer, is carried out with the laser parameter after adjusting to workpiece surface laser impact intensified.
2. the workpiece surface laser-impact technique in removal residual stress hole according to claim 1, it is characterised in that: described Workpiece surface is polished into mirror surface in advance.
3. the workpiece surface laser-impact technique in removal residual stress hole according to claim 1, it is characterised in that: by The three-dimensional appearance of the Japanese three-dimensional micro- sem observation material of the super depth of field of Keyemce VHX 1000c, determines that sample loading area edge is sliding Move depth.
4. the workpiece surface laser-impact technique in removal residual stress hole according to claim 1, it is characterised in that: step After the completion of 6, laser-impact region residual stress is measured, is adjusted if being unevenly distributed and adjusts intensifying impact laser parameter, until Surface residual stress is evenly distributed.
5. the workpiece surface laser-impact technique in removal residual stress hole according to claim 1, it is characterised in that: step In 1, workpiece surface is heat-treated using optical fiber laser, prepares the micro- texture in surface.
6. the workpiece surface laser-impact technique in removal residual stress hole according to claim 1, it is characterised in that: step It is laser impact intensified to workpiece surface progress using the mechanics effect of the high-power laser induced shock waves of pulse laser in 2.
CN201711292041.2A 2016-10-09 2016-10-09 A kind of workpiece surface laser-impact technique removing residual stress hole Active CN107858501B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711292041.2A CN107858501B (en) 2016-10-09 2016-10-09 A kind of workpiece surface laser-impact technique removing residual stress hole

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610880917.4A CN106435158B (en) 2016-10-09 2016-10-09 The workpiece surface laser-impact technique in residual stress hole is removed using the micro- texture in surface
CN201711292041.2A CN107858501B (en) 2016-10-09 2016-10-09 A kind of workpiece surface laser-impact technique removing residual stress hole

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201610880917.4A Division CN106435158B (en) 2016-10-09 2016-10-09 The workpiece surface laser-impact technique in residual stress hole is removed using the micro- texture in surface

Publications (2)

Publication Number Publication Date
CN107858501A CN107858501A (en) 2018-03-30
CN107858501B true CN107858501B (en) 2019-02-12

Family

ID=58172407

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610880917.4A Active CN106435158B (en) 2016-10-09 2016-10-09 The workpiece surface laser-impact technique in residual stress hole is removed using the micro- texture in surface
CN201711292041.2A Active CN107858501B (en) 2016-10-09 2016-10-09 A kind of workpiece surface laser-impact technique removing residual stress hole

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201610880917.4A Active CN106435158B (en) 2016-10-09 2016-10-09 The workpiece surface laser-impact technique in residual stress hole is removed using the micro- texture in surface

Country Status (1)

Country Link
CN (2) CN106435158B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107742011B (en) * 2017-09-26 2020-12-11 南京航空航天大学 Design method of impeller blade drag reduction micro-texture
CN108085631B (en) * 2017-11-14 2019-10-08 上海交通大学 A kind of surface treatment method of medical titanium alloy screw
CN110361121B (en) * 2018-04-09 2020-12-25 中国科学院沈阳自动化研究所 Accurate prediction method for laser shock peening induced residual stress field
CN110026686B (en) * 2019-05-28 2021-07-02 广东工业大学 Laser impact method, device and equipment
CN111074061B (en) * 2020-01-07 2021-07-23 山东大学 Uniform surface strengthening method based on laser shock wave
CN112501425B (en) * 2020-11-27 2021-08-27 山东大学 Laser surface strengthening method with inverse Gaussian distribution shock wave intensity
CN113122702B (en) * 2021-03-25 2022-03-01 山东大学 Double-physical-effect pulse laser impact method based on physical properties of variable liquid restraint layer
CN113523708B (en) * 2021-08-24 2022-08-23 南通大学 Method and device for repairing tooth surface micro-contact fatigue damage
CN114295731B (en) * 2021-12-28 2023-02-21 杭州电子科技大学 Method for measuring subsurface defect depth based on laser excitation longitudinal wave
CN114486032B (en) * 2021-12-31 2023-07-28 中国航空制造技术研究院 Corner laser shock peening residual stress analysis method
CN115821027A (en) * 2022-10-25 2023-03-21 北京翔博科技股份有限公司 Method, device and equipment for eliminating residual stress based on laser ultrasound

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995025821A1 (en) * 1994-03-22 1995-09-28 Battelle Memorial Institute Reducing edge effects of laser shock peening
US5932120A (en) * 1997-12-18 1999-08-03 General Electric Company Laser shock peening using low energy laser
US6852179B1 (en) * 2000-06-09 2005-02-08 Lsp Technologies Inc. Method of modifying a workpiece following laser shock processing
JP2002030378A (en) * 2000-07-17 2002-01-31 Sumitomo Special Metals Co Ltd Method for producing iron-based permanent magnet alloy by control of crystallization heat generating temperature
CN101759139B (en) * 2009-12-10 2013-06-12 江苏大学 Surface modification processing method and device of MEMS microcomponent
KR20130059337A (en) * 2010-03-30 2013-06-05 아이엠알에이 아메리카, 인코포레이티드. Laser-based material processing apparatus and methods
US20120255923A1 (en) * 2011-04-08 2012-10-11 Douglas Johnson Modular display and storage tray system
CN102409157A (en) * 2011-11-21 2012-04-11 江苏大学 Intensifying method by hollow laser
US20130133804A1 (en) * 2011-11-29 2013-05-30 Samy Laroussi Mzabi Texturing of a reinforcing cord for a pneumatic tire
CN103060528A (en) * 2013-01-14 2013-04-24 温州大学 Laser compound strengthening technology
CN103060796A (en) * 2013-01-14 2013-04-24 温州大学 Method for repairing and strengthening gear through laser compound microtexture
CN103111752A (en) * 2013-01-14 2013-05-22 温州大学 Method and device for forming micro-texture in composite mode on inner surface of cylinder sleeve through laser
CN103614541B (en) * 2013-10-31 2015-08-19 中国科学院宁波材料技术与工程研究所 For laser impact intensified device and the laser impact intensified treatment process of workpiece surface
CN104046769B (en) * 2014-06-09 2016-05-25 江苏大学 In a kind of laser blast wave strengthening, reduce method and the device of surface roughness
CN105002349B (en) * 2015-07-21 2017-05-03 江苏大学 Method for conducting variable-light-spot multilayer staggered laser shock homogeneous enhancement on blades
CN105177273B (en) * 2015-09-30 2017-07-18 江苏大学 A kind of laser shock peening method for improving crucial important component fatigue strength
CN105648201A (en) * 2016-03-24 2016-06-08 江苏大学 Method for improving repairing effect of self-repairing material through laser shock waves

Also Published As

Publication number Publication date
CN107858501A (en) 2018-03-30
CN106435158B (en) 2017-12-15
CN106435158A (en) 2017-02-22

Similar Documents

Publication Publication Date Title
CN107858501B (en) A kind of workpiece surface laser-impact technique removing residual stress hole
CN102199690A (en) Laser plasma shock wave surface nanocrystallization method for polycrystal metal material
CN103409758B (en) Pump shells and blade microcrack laser reinforcing life-prolonging method
CN107253148A (en) A kind of combined method that gradient nano structure is formed on metal works top layer
CN110438425B (en) Strengthening method for optimally combining laser shock strengthening and shot peening strengthening
Zhou et al. Effects of warm laser peening at elevated temperature on the low-cycle fatigue behavior of Ti6Al4V alloy
CN102123828B (en) Method for ultrasound shot-blasting of turbomachine parts
CN102409157A (en) Intensifying method by hollow laser
Dai et al. Effect of laser spot size on the residual stress field of pure Al treated by laser shock processing: Simulations
Zhan et al. Surface layer characteristics of S30432 austenite stainless steel after shot peening
CN107419088A (en) A kind of laser peening shaping methods of Integral Wing Panel part milling unstability
CN110016629A (en) A kind of wet blasting surface modifying method suitable for titanium alloy
CN111962058A (en) Method and device for implanting nano diamond particles on surface of alloy steel at high temperature
CN110129698A (en) A kind of wet blasting surface modifying treatment suitable for nickel base superalloy
CN113718246A (en) Maritime work platform pile leg laser composite repairing method capable of eliminating cladding layer interface
CN107236859B (en) It is a kind of obtain optimum surface quality laser peening parameter modeling and computational methods
CN106467933A (en) A kind of laser shock peening method based on gradient crystal grain
Zhao et al. Fracture characteristics of fully pearlitic steel wire in tension and torsion
Mano et al. Microstructured surface layer induced by shot peening and its effect on fatigue strength
CN101591758B (en) Method for prolonging gamma TiAl three-point flexural fatigue life
CN108994738A (en) Double ball blast surface strengthening technologies
CN103343189A (en) Method for combinatorially reinforcing thick plate through laser shock
Zhang et al. Monitoring for damage in two-dimensional pre-stress scratching of SiC ceramics
CN102747215A (en) Experimental apparatus for laser shock processing of brittle material
Lu et al. Formation mechanism of residual stress field induced by surface strengthening process

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB03 Change of inventor or designer information

Inventor after: Cao Yupeng

Inventor after: Zhu Minrui

Inventor after: Shi Weidong

Inventor after: Wang Heng

Inventor after: Hua Guoran

Inventor after: Chen Haotian

Inventor after: Jiang Suzhou

Inventor after: Chen Yiping

Inventor after: Ma Jianjun

Inventor after: Zhu Juan

Inventor before: Cao Yupeng

Inventor before: Jiang Suzhou

Inventor before: Wang Heng

Inventor before: Chen Haotian

Inventor before: Hua Guoran

Inventor before: Chen Yiping

Inventor before: Ma Jianjun

Inventor before: Zhu Juan

Inventor before: Zhu Minrui

CB03 Change of inventor or designer information
GR01 Patent grant
GR01 Patent grant