A kind of cold and hot preservation cabinet of semiconductor heat tubular type
Technical field
The present invention relates to a kind of cold and hot preservation cabinet, specifically a kind of cold and hot preservation cabinet of semiconductor heat tubular type.
Background technology
The cold and hot preservation cabinet of tradition is heated using compressor cooling, and noise is very greatly, it is necessary to further change during compressor operating
Enter.
As the technology of semiconductor refrigerating heating module reaches its maturity, semiconductor refrigerating heating module is applied in cold and hot guarantor
Hide in cabinet, reduce its operating noise, be urgent problem to be solved.
The content of the invention
It is an object of the invention to overcome above-mentioned the shortcomings of the prior art, and it is cold and hot to provide a kind of semiconductor heat tubular type
Preservation cabinet, its operating noise is low, and cold and hot preservation effect is good.
The object of the present invention is achieved like this:
A kind of cold and hot preservation cabinet of semiconductor heat tubular type, including the cabinet provided with cavity volume and working chamber, the working chamber pass through
Thermal insulation layer is separated into the first heat exchanging chamber, the second heat exchanging chamber and electric apparatus chamber;First heat exchanging chamber is provided with the air intake connected with cavity volume
Mouth and air outlet, inside are provided with circulate in the wind machine and the first thermal energy heat exchanger;Second heat exchanging chamber is provided with what is be in communication with the outside
Heat emission hole, inside are provided with outer circulation blower fan and the second thermal energy heat exchanger;The control mould being electrically connected to each other is provided with the electric apparatus chamber
Block and semiconductor refrigerating heating module, two operative end surfaces of semiconductor refrigerating heating module respectively with the first thermal energy heat exchanger,
The heating end of second thermal energy heat exchanger contacts against.
First heat exchanging chamber, thermal insulation layer and the second heat exchanging chamber are in Up-Center-Down Structure, and electric apparatus chamber is located at their side, entered
Overbank is connected to the opposite sides of cavity volume respectively for air port and air outlet.
First heat exchanging chamber forms circulate in the wind road, and circulate in the wind machine and the first thermal energy heat exchanger are laterally laid in successively
In it;Second heat exchanging chamber forms outer circulating air duct, and outer circulation blower fan and the second thermal energy heat exchanger are vertically laid in it successively
It is interior;The circulate in the wind machine is located at close to the position of air inlet, and the first thermal energy heat exchanger is close to the position of air outlet, the first heat energy
It is in Up-Center-Down Structure between heat exchanger, semiconductor refrigerating heating module and the second thermal energy heat exchanger, outer circulation blower fan is located at second
On the downside of thermal energy heat exchanger.
The circulate in the wind machine is tubular wine wheel, and outer circulation blower fan is aerofoil fan.
Be additionally provided with assisted heating device in first heat exchanging chamber, its be located at circulate in the wind machine and the first thermal energy heat exchanger it
Between.
The assisted heating device is PTC assisted heating devices.
First thermal energy heat exchanger and the second thermal energy heat exchanger are respectively finned heat exchanger or the heat exchange of heat pipe fin formula
Device, they are arranged in working chamber by heat exchanger pedestal, and semiconductor refrigerating heating module is fixed on two thermal energy heat exchangers
Between.
The bottom of the working chamber is provided with the drip tray being connected with the first radiating fin, the second radiating fin water route.
The cavity volume bottom is provided with water container, and it is connected by the water receiving pipe set in working chamber with drip tray.
Cavity volume folding is corresponded on the cabinet and is connected with cabinet door, the cabinet door is by doorframe and is arranged on doorframe front and rear sides
Glass is formed, and layer glass forms heat-insulation layer.
Beneficial effects of the present invention are as follows:
Cold and hot preservation cabinet is used as refrigeration, heating source using semiconductor refrigerating heating module, by simply switching, you can real
Now freeze, heat, meet that the cold and hot preservation of preservation cabinet uses.
Semiconductor refrigerating heating module will not produce noise when working, and effectively reduce the operating noise of cold and hot preservation cabinet.
Semiconductor refrigerating heating module is exchanged heat by thermal energy heat exchanger, even if the operative end surface of semiconductor refrigerating heating module
Area is smaller, also can be in time heat transfer to cavity volume or the external world, good effect of heat exchange, disclosure satisfy that fast-refrigerating, heating make
With.
Brief description of the drawings
Fig. 1 is the sectional view 1 of one embodiment of the invention.
Fig. 2 is the sectional view 2 of one embodiment of the invention.
Fig. 3 is the sectional view 3 of one embodiment of the invention.
Fig. 4 is the assembling stereogram of the thermal energy heat exchanger of one embodiment of the invention first and the second thermal energy heat exchanger.
Embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
Referring to Fig. 1-Fig. 4, the cold and hot preservation cabinet of this semiconductor heat tubular type, including the cabinet 1 provided with cavity volume 100 and working chamber,
Characterized in that, the working chamber is separated into the first heat exchanging chamber 102, the second heat exchanging chamber 103 and electric apparatus chamber by thermal insulation layer 101
104;First heat exchanging chamber 102 is provided with the air inlet 1021 and air outlet 1022 connected with cavity volume 100, and inside is provided with interior circulation
The thermal energy heat exchanger 32 of blower fan 31 and first;Second heat exchanging chamber 103 is provided with the heat emission hole 1031 being in communication with the outside, and inside is provided with
The thermal energy heat exchanger 42 of outer circulation blower fan 41 and second;The control module 51 being electrically connected to each other and half are provided with the electric apparatus chamber 104
Conductor cooling and warming module 52, two operative end surfaces of semiconductor refrigerating heating module 52 respectively with the first thermal energy heat exchanger 32,
The heating end of second thermal energy heat exchanger 42 contacts against.
Heat caused by semiconductor refrigerating heating module and cold are quickly delivered to cavity volume 100 or outer by thermal energy heat exchanger
In boundary, do not influenceed by semiconductor refrigerating heating module operative end surface area is smaller, good effect of heat exchange can be to Large Copacity cavity volume
100 refrigeration, heat;When semiconductor refrigerating heating module works, extra noise will not be produced, cold and hot guarantor can be greatly reduced
Cabinet operating noise is hidden, user is improved and uses body-sensing, user is more keen to such product, and market prospects are big.
Further, first heat exchanging chamber 102, the heat exchanging chamber 103 of thermal insulation layer 101 and second are in Up-Center-Down Structure, electrical equipment
Chamber 104 is located at their side, and structure closely, helps to reduce machine volume, air inlet 1021 and air outlet 1022 divide
Other overbank is connected to the opposite sides of cavity volume 100, and air intake, air-out effect are good, can be formed in inner chamber 100 in preferably
Circulating current, help raising refrigeration uniformity and refrigeration.
Further, first heat exchanging chamber 102 forms circulate in the wind road, the thermal energy heat exchanger of circulate in the wind machine 31 and first
32 are laterally laid in it successively;Second heat exchanging chamber 103 forms outer circulating air duct, and the heat energy of outer circulation blower fan 41 and second changes
Hot device 42 is vertically laid in it successively;The circulate in the wind machine 31 is located to be changed close to the position of air inlet 1021, the first heat energy
Hot device 32 changes close to the position of air outlet 1022, the first thermal energy heat exchanger 32, the heat energy of semiconductor refrigerating heating module 52 and second
It is in Up-Center-Down Structure between hot device 42, outer circulation blower fan 41 is located at the downside of the second thermal energy heat exchanger 42.The layout type helps contracting
The internal structure of small first heat exchanging chamber 102, the second heat exchanging chamber 103, interior layout is more reasonable, and thermal losses is low, improves heat exchange effect
Fruit, help the preservation effect for improving cold and hot preservation cabinet.
Further, the circulate in the wind machine 31 is tubular wine wheel, and outer circulation blower fan 41 is aerofoil fan.Tubular wine wheel wind
Amount is big, blowing area is wide and noise is low, can help to form the wider array of air-flow of coverage, improves heat transfer effect, helps raising
The preservation effect of cold and hot preservation cabinet, exchanged heat as shown in Fig. 2 aerofoil fan can more be concentrated to blow to the second thermal energy heat exchanger 42.
Further, assisted heating device (not marked in figure) is additionally provided with first heat exchanging chamber 102, it is followed positioned at interior
Between the thermal energy heat exchanger 32 of ring blower fan 31 and first.The assisted heating device is PTC assisted heating devices.During heating, PTC is auxiliary
Help heater to play the purpose of auxiliary heating, quickly to being heated up inside cold and hot preservation cabinet, help and improve cold and hot preservation cabinet
Preservation effect.
Further, the thermal energy heat exchanger 42 of the first thermal energy heat exchanger 32 and second is respectively finned heat exchanger or heat
Pipe finned heat exchanger, they are arranged in working chamber by heat exchanger pedestal 53, and semiconductor refrigerating heating module 52 is consolidated
It is scheduled between two thermal energy heat exchangers, assembling is easy, good effect of heat exchange, and small volume, and manufacturing cost is low, and it is cold and hot to help reduction
The manufacturing cost of preservation cabinet, will not produce turbulent flow and windage is low, improve heat transfer effect, help the preservation effect for improving cold and hot preservation cabinet
Fruit.
Further, the bottom of the working chamber is provided with connects with the first radiating fin 321, the water route of the second radiating fin 421
The drip tray 6 connect, available for caused condensed water when catching condensation.The bottom of cavity volume 100 is provided with water container, and it passes through
The water receiving pipe 61 set in working chamber connects with drip tray 6.
Further, the folding of cavity volume 100 is corresponded on the cabinet 1 and is connected with cabinet door 11, the cabinet door 11 is by doorframe and sets
The glass composition in doorframe front and rear sides is put, layer glass forms heat-insulation layer, heat-insulated, high insulating effect, helps and improve cold and hot guarantor
Hide the preservation effect of cabinet.
Above disclosed is only the preferred embodiments of the present invention, rather than the claim of the present invention is limited with this
Protection domain, according to the equivalent variations made in the scope of the present invention, still belong to the scope that the present invention is protected.