CN107833907A - A kind of flexible OLED display and glue sealing method - Google Patents
A kind of flexible OLED display and glue sealing method Download PDFInfo
- Publication number
- CN107833907A CN107833907A CN201711167173.2A CN201711167173A CN107833907A CN 107833907 A CN107833907 A CN 107833907A CN 201711167173 A CN201711167173 A CN 201711167173A CN 107833907 A CN107833907 A CN 107833907A
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- sealing
- substrate
- chip
- film
- flexible
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention, which provides a kind of flexible OLED display and glue sealing method, described device, to be included：Flexible substrate substrate, the flexible substrate substrate include viewing area and non-display area, and the non-display area includes the first join domain；Chip on film, corresponding first join domain are arranged at the flexible substrate substrate edges；And connection terminal, between the flexible substrate substrate and the chip on film, it is for electrically connecting to the chip on film and the flexible substrate substrate；Wherein, the chip on film at least covers a part for the non-display area of the flexible substrate substrate, the flexible substrate substrate is additionally provided with the first sealing region and sunk area in overlay area, and first sealing region and the sunk area are set in parallel in the side of first join domain away from the viewing area successively.With solve the problems, such as to cause because of glass cull glass normally can not peel off and connect it is unstable.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of flexible OLED display and glue sealing method.
Background technology
AMOLED has high resolution, and wide viewing angle is big, and response is fast, the features such as self-luminous.In flexible AMOLED connections
(Bonding) in technique, in order to prevent connection terminal to be corroded, manufacture procedure of adhesive, protection connection can be often carried out after Joining Technology
The stability of connection is improved while terminal structure is not corroded.But have for the backsizing of chip on film (COF) connection
Risk, because sealing thickness can not apply very thick, sealing can be caused to touch back-panel glass, backboard glass can be remained in after solidification
On glass, in the laser lift-off of follow-up glass back plate, glass can be caused, which not peel off normally, causes product rejection.
In summary, flexible the OLED Joining Technologies and manufacture procedure of adhesive of prior art, exist causes because of glass cull
Glass can not normal laser lift-off, and connection it is unstable the problem of.
The content of the invention
The present invention provides a kind of flexible OLED display and glue sealing method, it is possible to increase the stability of connection, is avoided that
Sealing residual back-panel glass is connected, so that back-panel glass can normal laser lift-off.
To solve the above problems, technical scheme provided by the invention is as follows：
The present invention provides a kind of flexible OLED display, including：Flexible substrate substrate, the flexible substrate substrate include
For the non-display area of the viewing area and viewing area periphery of display, the non-display area includes the first bonding pad
Domain；
Chip on film, corresponding first join domain are arranged at the predeterminated position of the flexible substrate substrate；And
Connection terminal, between the flexible substrate substrate and the chip on film, and along first join domain
Bearing of trend interval and be arranged in parallel, to be electrically bonded the chip on film and the flexible substrate substrate；
Wherein, the chip on film at least covers a part for the non-display area of the flexible substrate substrate, institute
State flexible substrate substrate and the first sealing region is additionally provided with overlay area and close to the depressed area of first sealing region
Domain, first sealing region and the sunk area are set in parallel in first join domain away from the display successively
The side in region.
According to one preferred embodiment of the present invention, the chip on film corresponds to the relevant position setting of first join domain
There is the second join domain, the relevant position that the chip on film corresponds to first sealing region is provided with the second sealing region,
First sealing region and second sealing region are through the chip on film.
According to one preferred embodiment of the present invention, the connection terminal apart from the flexible substrate substrate covered with the flip
The border of film side is 2mm-3mm.
According to one preferred embodiment of the present invention, first sealing region apart from the flexible substrate substrate covered with described
The border of chip on film side is 1mm-1.5mm.
According to one preferred embodiment of the present invention, the width of first sealing region is 0.5mm-1mm.
According to one preferred embodiment of the present invention, there is 80nm-120nm between the chip on film and the flexible substrate substrate
Gap, to form capillary.
According to one preferred embodiment of the present invention, described device also includes being located at first sealing region and described second
Sealing between sealing region, the sunk area are located at first sealing region away from the viewing area side, to
Store the sealing overflowed.
According to one preferred embodiment of the present invention, the parallel sealing of the sunk area is provided with depression, and the depression is prolonged
Extend the sealing both ends.
Present invention additionally comprises a kind of glue sealing method of flexible OLED display, the described method comprises the following steps：
Step S101, one flexible substrate substrate and a chip on film, the first sealing to the flexible substrate substrate are provided
Region and the second sealing region of the chip on film carry out plasma cleaning；
Step S102, after the chip on film is connected on the flexible substrate substrate, in first sealing region
The corresponding dispensing site in side carry out gluing process, the sealing width of the gluing process is 0.5mm~1mm, the sealing
Automatically filled by the dispensing site to whole between first sealing region and second sealing region；
Step S103, the sealing is irradiated using ultraviolet, the sealing is solidified.
According to one preferred embodiment of the present invention, the sealing is solvent-borne type sealing.
Beneficial effects of the present invention are：Compared to existing flexible OLED display and glue sealing method, of the invention is soft
Property OLED display, by sealing and the coplanar setting of connection terminal, is set in parallel in by the way that connection terminal is moved forward 2mm-3mm
Side of the join domain away from viewing area, the i.e. side close to flexible substrate substrate boundaries, the stability of connection is improved, because
Sealing region forms capillarity, so can only be filled automatically to whole sealing region in the dispensing of sealing region side, it is excellent
Change processing procedure；Depression is arranged with parallel close to the side on border along sealing bearing of trend, sunk area can be used for storage to overflow in sealing
The sealing gone out, further prevent that back-panel glass normally laser lift-off can not ask caused by connecting sealing residual back-panel glass
Topic.Wherein, after the completion of gluing process, UV solidifications are carried out to sealing, the anti-water resistance for substantially increasing device is moist stable with product
Property.
Brief description of the drawings
, below will be to embodiment or prior art in order to illustrate more clearly of embodiment or technical scheme of the prior art
The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only some invented
Embodiment, for those of ordinary skill in the art, on the premise of not paying creative work, can also be attached according to these
Figure obtains other accompanying drawings.
Fig. 1 provides a kind of flexible OLED display side view for the present invention；
Fig. 2 provides a kind of flexible OLED display partial enlarged drawing for the present invention；
Fig. 3 is the glue sealing method schematic flow sheet of flexible OLED display provided by the invention；
Fig. 4 is chip on film provided by the invention and the gluing process schematic diagram of flexible substrate substrate；
Fig. 5 is the connection terminal and sealing schematic diagram of the OLED display of prior art.
Embodiment
The explanation of following embodiment is with reference to additional diagram, to illustrate the particular implementation that the present invention can be used to implementation
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used is to illustrate and understand the present invention, and is not used to
The limitation present invention.In figure, the similar unit of structure is represented to identical label.
As shown in figure 5, connection terminal and sealing schematic diagram for the OLED display of prior art, the display dress
Put including：Array base palte 501, cushion 502, oriented film 503；Wherein, it is provided with connection terminal on the array base palte 501
506, the array base palte 501 is connected by the connection terminal 506 with chip on film 505, and the connection terminal 506 abuts institute
The boundary position of array base palte 501 is stated, sealing 504 is located at the side of the array base palte 501, leaned on from the chip on film 505
One end of the nearly array base palte 501, along extending sideways to the position for covering the oriented film 503 for the array base palte 501,
And the thickness minimum of the sealing 504 can only be controlled in 70um or so, connection is unstable, can also cause glass because of glass cull
Can not normal laser lift-off.
The present invention is directed to flexible the OLED Joining Technologies and manufacture procedure of adhesive of prior art, and exist causes because of glass cull
Glass can not be peeled off normally, and the technical problem that connection is unstable, the present embodiment can solve the problem that the defect.
As shown in figure 1, the present invention provides a kind of flexible OLED display side view, the flexible OLED display bag
Include：Opposite substrate 101, oriented film 102, it is arranged at the surface of opposite substrate 101；Cushion 103, it is arranged at the oriented film
102 surfaces；Flexible substrate substrate 104, it is oppositely arranged with the opposite substrate 101；The flexible substrate substrate 104 with it is described right
To being additionally provided with OLED luminescent layers between substrate 101；Backlight 105 is additionally provided with the flexible substrate substrate 104；Touch surface
Plate 106 is arranged in the backlight 105；Polaroid 108, the polaroid 108 are additionally provided with the contact panel 106
It is be bonded by one layer of bonding agent 107 with the contact panel 106；The flexible substrate substrate 104 includes the display for showing
The non-display area in region and viewing area periphery, the non-display area includes the first join domain, along described first
The bearing of trend interval of join domain and it is arranged with connection terminal 110 in parallel；Chip on film 109, corresponding first bonding pad
Domain is arranged at the predeterminated position of the flexible substrate substrate 104, and the predeterminated position is the circuit of the flexible substrate substrate 104
Lead areas；The connection terminal 110 is between the flexible substrate substrate 104 and the chip on film 109, to electrical
Connect the chip on film 109 and the flexible substrate substrate 104.Wherein, the chip on film 109 at least covers the flexibility
A part for the non-display area of underlay substrate 104, the flexible substrate substrate 104 are additionally provided with first in overlay area
Sealing region and the sunk area close to first sealing region, first sealing region and the sunk area are equal
It is set in parallel in the side of first join domain away from the viewing area.First sealing region is forming sealing
111, the sealing 111 runs through between the chip on film 109 and the flexible substrate substrate 104, and along sealing direction
The chip on film 109, the bearing of trend of parallel first sealing region of the sealing 111, the sealing 111 and the company
There is gap in connecting terminal 110, the sealing 111 can effectively make the connection terminal 110 completely cut off steam, protect the connection terminal
110 by environmental damage.
Specifically, the thickness of the oriented film 102 of the flexible OLED display is 15~20um, the cushion 103
Thickness be 2~3um, the thickness of the flexible substrate substrate 104 is 5um, and the thickness of the backlight 105 is 0.21um, institute
The thickness for stating contact panel 106 is 4um, and the thickness of the bonding agent 107 is 50um, and the thickness of the polaroid 108 is 67um.
As shown in Fig. 2 provide a kind of flexible OLED display partial enlarged drawing, flexible substrate substrate bag for the present invention
Include：First gate insulation layer 206；Second gate insulation layer 205, second gate insulation layer 205 are arranged on first gate insulation layer
On 206；Between insulating barrier 204, it is described between insulating barrier 204 be arranged on second gate insulation layer 205；Planarization layer 208, it is described
Planarization layer 208 be arranged at it is described between on insulating barrier 204；Wherein, insulated between the planarization layer 208 is covered described in a part
Layer 204, connection terminal 207 is provided with the non-covered part of the planarization layer 208, the connection terminal 207 is through described
Second gate insulation layer 205 and it is described between insulating barrier 204, and insulating barrier 204 extends a part between described.Chip on film
201 are attached by the connection terminal 207 and the flexible substrate substrate.The position of the chip on film 201 is located at institute
The predeterminated position of flexible substrate substrate is stated, exists with the flexible substrate substrate and partly overlaps, the lap is positioned at described
The non-display area of flexible substrate substrate has the side of circuit lead.
Wherein, the connection terminal 207 is apart from side of the flexible substrate substrate covered with the side of chip on film 201
Boundary is 2mm-3mm.The flexible substrate substrate has the first join domain, first join domain in the non-display area
Inside it is provided with along the bearing of trend interval of first join domain and multiple connection terminals 207 for being disposed in parallel relation to one another.
The relevant position of corresponding first join domain of the chip on film 201 is provided with the second join domain, the chip on film
201 second join domain towards and be right against first join domain of the flexible substrate substrate and be attached work
Skill processing procedure.After the completion of the Joining Technology, have 80nm-120nm's between the chip on film 201 and the flexible substrate substrate
Gap, the gap are preferably 100nm.The flexible substrate substrate is additionally provided with by the region that the chip on film 201 covers
First sealing region, first sealing region are set in parallel in one of first join domain away from the viewing area
There is gap in side, first sealing region, first sealing region is apart from the flexible liner with first join domain
Border of the substrate covered with the side of chip on film 201 is 1mm-1.5mm, wherein, the width of first sealing region
For 0.5mm-1mm.The relevant position of corresponding first sealing region of the chip on film 201 is provided with the second sealing region,
The length of second sealing region and first sealing region is through the chip on film 201.
Described device also includes the sealing 202 between first sealing region and second sealing region,
The sealing 202 is through the chip on film 201.It is parallel close to the sealing 202 at the edge of the flexible substrate substrate
Be provided with sunk area, the sunk area is located at first sealing region away from the viewing area side, to deposit
Store up the sealing 202 overflowed.The sunk area is provided with depression, and the depression may extend to the both ends of sealing 202, prevents
Only the sealing 202 is overflowed and influences the display device.Wherein, the depression or multiple, the setting of interval or dislocation
In the sunk area, the shape of the depression can be the other shapes such as rectangular recess, circle.
The present invention also provides a kind of glue sealing method of flexible OLED display, as shown in figure 3, being provided by the invention soft
The glue sealing method schematic flow sheet of property OLED display, the described method comprises the following steps：
Step S101, one flexible substrate substrate and a chip on film, the first sealing to the flexible substrate substrate are provided
Region and the second sealing region of the chip on film carry out plasma cleaning；
Step S102, after the chip on film is connected on the flexible substrate substrate, in first sealing region
The corresponding dispensing site in side carry out gluing process, the sealing width of the gluing process is 0.5mm~1mm, the sealing
Automatically filled by the dispensing site to whole between first sealing region and second sealing region；
Step S103, the sealing is irradiated using ultraviolet, the sealing is solidified.
Specifically, as shown in figure 4, illustrating for the gluing process of chip on film provided by the invention and flexible substrate substrate
Figure, flexible substrate substrate 401 include viewing area 402 and non-display area 403, and one end of the flexible substrate substrate 401 leads to
Connection terminal 408 is crossed to be connected with chip on film 405, wherein, the chip on film 405 is also mounted with chip 406；In the flip
After film 405 is connected with the flexible substrate substrate 401, between the chip on film 405 and the flexible substrate substrate 401 also
Gap be present, the gap is about 100nm, and thus the gap location forms capillary.In the connection terminal 408 away from institute
The side of viewing area 402 is stated, i.e., described connection terminal 408 is close to the border side of flexible substrate substrate 401, parallel to institute
The bearing of trend for stating connection terminal 408 is provided with sealing region 407, and the sealing region 407 includes being located at the flexible substrate
First sealing region of substrate 401, and the second envelope positioned at the chip on film 405 towards the flexible substrate substrate side
Glue region.The sealing region 407 exists with the connection terminal 408 to be spaced, and dispensing site 404 is located at first adhesive area
The one end in domain, after the chip on film 405 connection, gluing process, the dispensing site are carried out at the dispensing site 404
404 width range is in 0.5~1mm, i.e., the sealing width of described gluing process is 0.5mm~1mm, due to the chip on film
Capillary is formed between 405 and the flexible substrate substrate 401, the sealing can be because the capillary be automatically by the dispensing
Site 404 is filled to the other end of the sealing region 407, that is, is filled to whole first sealing region and second envelope
Between glue region, so as to complete sealing operation.After the completion of the sealing is solidified using UV, so as to strengthen anti-water resistance it is moist and
The stability of product.Simultaneously when product falls from eminence, this technique can also will not fall off the chip on film 405, because
This enhances anti-drop.
Wherein, can be before the chip on film 405 connects to first adhesive area in order to strengthen the capillarity
Domain carries out plasma cleaning with second sealing region, so as to improve first sealing region and second sealing region
Wettability of the surface.The used sealing preferred solvent sealing simultaneously, first sealing region and described the can be strengthened
The wetability of two sealing regions and the mobility of the sealing, reach the purpose for strengthening the capillarity.
Compared to existing flexible OLED display and glue sealing method, flexible OLED display of the invention pass through by
Connection terminal reach 2mm-3mm, by sealing and the coplanar setting of connection terminal, is set in parallel in join domain away from viewing area
Side, i.e. the side close to flexible substrate substrate boundaries improves the stability of connection, showed because sealing region forms capillary
As so can only be filled automatically to whole sealing region in the dispensing of sealing region side, optimizing processing procedure；In sealing close to border
Side be arranged with depression in parallel along sealing bearing of trend, sunk area can be used for the sealing that storage is overflowed, further the company of preventing
Connect sealing residual back-panel glass caused by glass fail the problem of.Wherein, after the completion of gluing process, UV is carried out to sealing and consolidated
Change, substantially increase device anti-water resistance is moist and product stability.
In summary, although the present invention is disclosed above with preferred embodiment, above preferred embodiment simultaneously is not used to limit
The system present invention, one of ordinary skill in the art, without departing from the spirit and scope of the present invention, it can make various changes and profit
Decorations, therefore protection scope of the present invention is defined by the scope that claim defines.
Claims (10)
- A kind of 1. flexible OLED display, it is characterised in that including：Flexible substrate substrate, the flexible substrate substrate include peripheral for the viewing area and the viewing area that show non- Viewing area, the non-display area include the first join domain；Chip on film, corresponding first join domain are arranged at the predeterminated position of the flexible substrate substrate；AndConnection terminal, between the flexible substrate substrate and the chip on film, and prolonging along first join domain Stretch direction interval and be arranged in parallel, to be electrically bonded the chip on film and the flexible substrate substrate；Wherein, the chip on film at least covers a part for the non-display area of the flexible substrate substrate, described soft Property underlay substrate be additionally provided with overlay area the first sealing region and close to first sealing region sunk area, institute State the first sealing region and the sunk area is set in parallel in first join domain away from the viewing area successively Side.
- 2. flexible OLED display according to claim 1, it is characterised in that the chip on film corresponds to described first The relevant position of join domain is provided with the second join domain, and the chip on film corresponds to the corresponding positions of first sealing region Install and be equipped with the second sealing region, first sealing region and second sealing region are through the chip on film.
- 3. flexible OLED display according to claim 1, it is characterised in that the connection terminal is apart from the flexibility Border of the underlay substrate covered with the chip on film side is 2mm-3mm.
- 4. flexible OLED display according to claim 1, it is characterised in that described in the first sealing region distance Border of the flexible substrate substrate covered with the chip on film side is 1mm-1.5mm.
- 5. flexible OLED display according to claim 4, it is characterised in that the width of first sealing region is 0.5mm-1mm。
- 6. flexible OLED display according to claim 1, it is characterised in that the chip on film and the flexible liner There is 80nm-120nm gap between substrate, to form capillary.
- 7. flexible OLED display according to claim 6, it is characterised in that described device is also included positioned at described the Sealing between one sealing region and second sealing region, it is remote that the sunk area is located at first sealing region The viewing area side, to store the sealing of spilling.
- 8. flexible OLED display according to claim 7, it is characterised in that the parallel sealing of the sunk area Depression is provided with, the depression extends to the sealing both ends.
- 9. a kind of glue sealing method of flexible OLED display as claimed in claim 1, it is characterised in that including following step Suddenly：Step S101, a flexible substrate substrate and a chip on film are provided, to the first sealing region of the flexible substrate substrate Plasma cleaning is carried out with the second sealing region of the chip on film；Step S102, after the chip on film is connected on the flexible substrate substrate, the one of first sealing region The corresponding dispensing site in side carries out gluing process, and the sealing width of the gluing process is 0.5mm~1mm, and the sealing is automatic Filled by the dispensing site to whole between first sealing region and second sealing region；Step S103, the sealing is irradiated using ultraviolet, the sealing is solidified.
- 10. glue sealing method according to claim 9, it is characterised in that the sealing is solvent-borne type sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711167173.2A CN107833907B (en) | 2017-11-21 | 2017-11-21 | Flexible OLED display device and glue sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711167173.2A CN107833907B (en) | 2017-11-21 | 2017-11-21 | Flexible OLED display device and glue sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107833907A true CN107833907A (en) | 2018-03-23 |
| CN107833907B CN107833907B (en) | 2020-05-12 |
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ID=61653040
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711167173.2A Active CN107833907B (en) | 2017-11-21 | 2017-11-21 | Flexible OLED display device and glue sealing method |
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| CN109229964A (en) * | 2018-08-23 | 2019-01-18 | 合肥京东方光电科技有限公司 | A kind of protecting band and display panel |
| WO2019184768A1 (en) * | 2018-03-26 | 2019-10-03 | 北京齐碳科技有限公司 | Separable type conductive contact structure and preparation method therefor |
| WO2019192029A1 (en) * | 2018-04-03 | 2019-10-10 | 惠州市华星光电技术有限公司 | Display device and manufacturing method therefor |
| US10522610B2 (en) | 2018-04-03 | 2019-12-31 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Display device with hemispherical particles on chip-on-film surface, and manufacturing method thereof |
| CN111987132A (en) * | 2020-09-02 | 2020-11-24 | 山东傲晟智能科技有限公司 | Display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107833907B (en) | 2020-05-12 |
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