CN107833895A - 显示面板及其制造方法、显示装置 - Google Patents

显示面板及其制造方法、显示装置 Download PDF

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CN107833895A
CN107833895A CN201711205655.2A CN201711205655A CN107833895A CN 107833895 A CN107833895 A CN 107833895A CN 201711205655 A CN201711205655 A CN 201711205655A CN 107833895 A CN107833895 A CN 107833895A
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layer
metal routing
insulating barrier
display panel
data wire
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CN107833895B (zh
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王珍
孙建
张寒
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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Abstract

本公开涉及显示领域，提供了一种显示面板，所述显示面板包括阵列基板，所述阵列基板包括显示区及位于所述显示区周围的非显示区，且所述阵列基板包括延伸至所述非显示区的数据线；平坦化层，覆盖所述数据线；金属走线层，设置于所述非显示区的平坦化层上，包括间隔设置的多条金属走线，且所述金属走线与所述数据线对应设置。本公开一方面通过将金属走线设置在数据线层上，可以不占用布线空间，减小了异形处边框；另一方面，本公开的异形处布线结构通过过孔使第一电极和金属走线及数据线耦接，只需一次掩膜工艺，减少了加工工艺，降低了制造成本。

Description

显示面板及其制造方法、显示装置
技术领域
本公开涉及显示领域，特别涉及一种显示面板，显示面板的制造方法及包含显示面板的显示装置。
背景技术
近年来，随着科学技术的发展，显示屏逐渐朝着高屏占比、窄边框的薄型结构发展。同时为了提高显示屏的视觉效果，还会对显示屏的四个角进行倒边或倒圆处理，进行C角、R角、L型或U型等异形设计。
显示屏的中间区域为显示区，四周为边框，通常在四周的边框内布置走线。由于异形设计及走线越来越复杂，因此走线会占用更多的布线空间，导致边框是常规边框的1.2～1.5倍，不利于窄边框显示屏的发展。
鉴于此，本领域迫切需要开发一种能够减小异形处的边框的技术，以提高屏占比。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。
发明内容
本公开的目的在于提供一种显示面板及其制造方法、显示装置，进而至少在一定程度上克服由于相关技术的限制和缺陷而导致的一个或者多个问题。
本公开的其他特性和优点将通过下面的详细描述变得显然，或部分地通过本公开的实践而习得。
根据本公开的第一方面，提供一种显示面板，其特征在于，包括：
阵列基板，所述阵列基板包括显示区及位于所述显示区周围的非显示区，且所述阵列基板包括延伸至所述非显示区的数据线；
平坦化层，覆盖所述数据线；
金属走线层，设置于所述非显示区的平坦化层上，包括间隔设置的多条金属走线，且所述金属走线与所述数据线对应设置。
在本公开示例性实施例中，所述显示面板还包括：
第一绝缘层，覆盖所述金属走线层；
第一电极层，位于所述第一绝缘层上，包括与所述金属走线对应设置的多个第一电极。
在本公开示例性实施例中，所述第一电极层与所述显示区的像素电极同层设置。
在本公开示例性实施例中，所述平坦化层和所述金属走线层之间设置有第二绝缘层。
在本公开示例性实施例中，所述第一电极通过第一过孔耦接至所述金属走线，所述第一过孔设置在所述第一绝缘层中。
在本公开示例性实施例中，所述第一电极通过第二过孔耦接至所述数据线，所述第二过孔设置在所述第一绝缘层、所述第二绝缘层和所述平坦化层中。
根据本公开的第二方面，提供一种显示面板的制造方法，其特征在于，包括：
提供一阵列基板，所述阵列基板包括显示区及位于显示区周围的非显示区，且所述阵列基板包括延伸至所述非显示区的数据线；
在所述数据线上形成平坦化层；
在所述平坦化层上形成一金属走线层，所述金属走线层包括多条间隔排列的金属走线，且所述金属走线与所述数据线对应设置；
在所述金属走线和未被所述金属走线覆盖的平坦化层上形成第一绝缘层；
在所述第一绝缘层上形成包括多个第一电极的第一电极层，且所述第一电极与所述金属走线和所述数据线耦接。
在本公开示例性实施例中，在所述平坦化层和所述金属走线层之间形成第二绝缘层。
在本公开示例性实施例中，在所述第一绝缘层上形成包括多个第一电极的第一电极层，且所述第一电极与所述金属走线和所述数据线耦接，包括：
在所述第一绝缘层上设置一掩膜层；
通过所述掩膜层刻蚀所述第一绝缘层形成第一过孔，刻蚀所述第一绝缘层、所述第二绝缘层和所述平坦化层形成第二过孔；
在所述第一过孔和所述第二过孔中填充导电材料，并在所述第一过孔和所述第二过孔上形成所述第一电极层，以使所述第一电极与所述金属走线和所述数据线耦接。
根据本公开的第三方面，提供一种显示装置，其特征在于，包括如上所述的显示面板。
由上述技术方案可知，本公开示例性实施例中的显示面板及其制造方法、显示装置至少具备以下优点和积极效果：
本公开中的显示面板包括阵列基板，阵列基板包括显示区和位于显示区周围的非显示区，且阵列基板包括延伸至非显示区的数据线，在非显示区的平坦化层上设置有间隔排列的金属走线形成的金属走线层，并且金属走线层与阵列基板上的数据线对应设置。在金属走线层上设置有第一电极层，所述第一电极层中的电极通过过孔分别与金属走线和数据线耦接。一方面，通过将金属走线设置在开关阵列的源漏极层和栅极层上，可以不占用布线空间，减小了异形处边框；另一方面，通过过孔使第一电极和金属走线及数据线耦接，只需一次掩膜工艺，减少了加工工艺，降低了制造成本。
本公开应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1示出相关技术中异形处布线截面示意图；
图2示出相关技术中异形处布线平面图；
图3示出本公开示例性实施例中异形处布线截面示意图；
图4示出本公开示例性实施例中异形处布线平面图；
图5示出相关技术中显示区截面示意图；
图6示出本公开示例性实施例中显示区截面示意图；
图7示出本公开示例性实施例中异形处布线截面示意图；
图8示出本公开示例性实施例中显示面板制造方法流程图；
图9示出本公开示例性实施例中显示装置的结构示意图。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的范例；相反，提供这些实施方式使得本公开将更加全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施方式中。在下面的描述中，提供许多具体细节从而给出对本公开的实施方式的充分理解。然而，本领域技术人员将意识到，可以实践本公开的技术方案而省略所述特定细节中的一个或更多，或者可以采用其它的方法、组元、装置、步骤等。在其它情况下，不详细示出或描述公知技术方案以避免喧宾夺主而使得本公开的各方面变得模糊。
本说明书中使用用语“一个”、“一”、“该”和“所述”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等；用语“第一”和“第二”等仅作为标记使用，不是对其对象的数量限制。
此外，附图仅为本公开的示意性图解，并非一定是按比例绘制。图中相同的附图标记表示相同或类似的部分，因而将省略对它们的重复描述。附图中所示的一些方框图是功能实体，不一定必须与物理或逻辑上独立的实体相对应。
图1示出了相关技术中异形处布线的截面示意图，参考图1可知，显示面板异形处从下至上可以依次包括：玻璃基板101、缓冲层102、栅绝缘层103、栅极104、层间介电层105、源漏极层106、平坦化层107和绝缘层108等。同时，图2示出了相关技术中异形处布线的平面图，包括像素区201、紧挨像素区201设置的功能单元202、紧挨功能单元202设置的栅极驱动电路单元203及位于所述栅极驱动电路单元203另一侧的走线204，所述功能单元202可以包括防静电击穿单元、测试端子单元及快速放电单元等，每个功能单元202对应一列像素；每个栅极驱动电路单元203对应一行像素。从图2可以看出，边框的宽度为a，即像素区到最外层走线的距离。
相关技术中的边框必须覆盖功能单元202、栅极驱动电路单元203及走线204，这就使得边框的宽度较宽，无法实现显示屏的高屏占比和窄边框，降低了用户体验。
针对相关技术中存在的问题，本示例实施方式中首先提供了一种显示面板，如图3所示，显示面板300包括阵列基板301和金属走线层302，阵列基板301包括显示区AA和位于显示区AA周围的非显示区，所述阵列基板301非显示区从下至上依次为玻璃基板303、缓冲层304、栅绝缘层305、栅极306、层间介电层307、数据线层308和平坦化层309，在平坦化层309上设置有金属走线层302和第一绝缘层311，所述金属走线层302包括多条间隔排列的金属走线310，并且金属走线310设置在所述数据线层308的上方，与数据线上下对应设置；所述第一绝缘层311覆盖金属走线310及未被金属走线310覆盖的平坦化层309，第一绝缘层311的材料可以是本领域常用的绝缘材料，如SiOx、SiNx等，在此不再一一列举。
本公开中的显示面板，通过在非显示区的栅极层和数据线层上对应设置金属走线层，不占用布线空间，减小了异形处边框。通过测量发现，在增加金属走线层302后，异形处边框减小了10％-30％，实现了高屏占比和窄边框的设计。
图4示出了将金属走线层302设置在非显示区的平坦化层上的平面图，相比于图1所示的相关技术中的异形处布线的平面图，本公开中的金属走线位于功能单元202和栅极驱动电路单元203上，功能单元202和栅极驱动电路单元203可以跳线成金属走线，在器件的上面走线，因此边框只需覆盖功能单元202、栅极驱动电路单元203即可，边框的宽度为b，相较于相关技术，本公开的边框中布线空间大大减小，减少了边框宽度。
在本公开的示例性实施例中，在第一绝缘层311上设置有第一电极层312，所述第一电极层312中的第一电极与显示区AA中的像素电极同层设置，也可与像素电极同时形成，第一电极层312的材料与像素电极的材料可以相同，也可以不同，优选采用相同的电极材料。
在本公开的示例性实施例中，为了防止在溅射形成金属膜层302的时候，平坦化层309受热释放气体，污染溅射腔体，优选地在所述平坦化层309和金属走线层302之间形成第二绝缘层313，所述第二绝缘层313可以覆盖暴露在外的平坦化层309。第二绝缘层313采用的材料和第一绝缘层311采用的材料可以相同也可以不同。所述第二绝缘层313并不是必须的，当平坦化层309所采用的材料在受热时无气体释放，也可以不设置第二绝缘层313。
进一步的，本公开中的第一电极层312分别通过第一过孔V1和第二过孔V2与金属走线层302和数据线层308耦接，所述第一过孔V1设置在第一绝缘层311中，所述第二过孔V2设置在第一绝缘层311和平坦化层309中或设置在第一绝缘层311、第二绝缘层313和平坦化层309中。在第一绝缘层311上设置掩膜层，掩膜层可以通过本领域常用的方法形成，例如可以采用旋涂法、喷涂、溅射等方法形成，本公开对此不做具体限定，通过掩膜层刻蚀第一绝缘层311，在第一绝缘层311形成第一过孔V1，同时在第一绝缘层311、第二绝缘层313及平坦化层309中刻蚀形成第二过孔V2。
图5示出了相关技术中显示区AA的结构示意图，如图5所示，显示区500从下至上包括：玻璃基板501、遮光层502、缓冲层503、多晶层504、栅绝缘层505、栅极层506、层间介电层507、源漏极层508、平坦化层509、公共电极层510、第一绝缘层511和像素电极层512，所示源漏极穿过层间介电层507、栅绝缘层505与多晶层504电连接，所示像素电极层512穿过第一绝缘层511和平坦化层509与源漏极层508电连接。
本领域中，显示区和非显示区通常在同一阵列基板上形成，为了提高制造效率，可以同时在阵列基板显示区的源漏极层和非显示区的数据线层上同时形成平坦化层509和第二绝缘层512，然后再在显示区的第二绝缘层上形成公共电极层510(如图6所示)，在非显示区的第二绝缘层313上形成金属走线层302(如图7所示)。
图8示出了本公开中显示面板制造的具体流程，包括：
S1：提供一阵列基板，所述阵列基板包括显示区及位于显示区周围的非显示区，且所述阵列基板包括延伸至所述非显示区的数据线；
所述数据线与显示区的源漏电极同时形成，可以采用与源漏电极相同或不同的材料形成，为了提高制造效率，优选采用相同的材料形成所述数据线和所述源漏电极，所述材料为本领域常用的金属或金属合金，如Au、Ag、Cu等，本公开对此不做具体限定。
S2：在所述数据线上形成平坦化层；
所述平坦化层通过在所述数据线和未被数据线覆盖的层间介电层上通过溅射、涂覆等工艺形成一介质层，然后采用化学机械平坦化工艺处理所述介质层形成平坦化层。所述平坦化层的材料为本领域常用的介质材料，在此不再赘述。
S3：在所述平坦化层上形成一金属走线层，所述金属走线层包括多条间隔排列金属走线，且所述金属走线与所述数据线对应设置；
所述金属走线可以采用本领域常用的金属或金属合金，在此不再赘述。金属走线形成在数据线层上方，与所述数据线上下对应设置，以减小布线空间，进而减小异形处边框的宽度。
S4：在所述金属走线和未被所述金属走线覆盖的平坦化层上形成第一绝缘层；
第一绝缘层可以采用SiNx、SiOx等材料形成，当然也可以采用本领域常用的其它绝缘材料，本公开对此不做具体限定。所述第一绝缘层用于防止金属走线和后续制作的第一电极接触，对器件性能产生影响。
S5：在所述第一绝缘层上形成包括多个第一电极的第一电极层，且所述第一电极与所述金属走线和所述数据线耦接。
本公开通过将金属走线设置在数据线层上方，减小了布线空间，进而减小了异形处边框的宽度。
在本公开示例性实施例中，在步骤S2之前，可以先在平坦化层上形成第二绝缘层，然后再在非显示区的所述第二绝缘层上形成金属走线层，在显示区的第二绝缘层上形成公共电极层，通过形成第二绝缘层覆盖平坦化层，防止在溅射金属走线时，平坦化层受热释放气体，污染溅射腔室。
进一步的，步骤S4具体包括以下流程：
P1：在所述第一绝缘层上设置一掩膜层；
P2：通过所述掩膜层刻蚀所述第一绝缘层形成第一过孔，刻蚀所述第一绝缘层、所述第二绝缘层和所述平坦化层形成第二过孔；
P3：在第一过孔和第二过孔中填充导电材料，并在第一过孔和第二过孔上形成所述第一电极层，以使所述第一电极与所述金属走线和所述数据线耦接。
导电材料与第一电极层的材料可以相同也可以不同，可以采用本领域常用的金属材料或金属合金材料形成，本公开对导电材料和第一电极层的材料不做具体限定。
填充导电材料和形成第一电极层可以同时进行，也可以分步进行，优选采用相同导电材料同时填充过孔并形成第一电极层，具体的可以是，当形成第一过孔和第二过孔后，去除掩膜层，向过孔内填充电极材料并在第一绝缘层上形成覆盖第一过孔和第二过孔的第一电极层。
本示例性实施例中还提供了一种显示装置，如图9所示，所述显示装置900包括显示面板901。所述显示面板901为本公开中的显示面板，所述显示装置900可以是电子纸、OLED显示器、手机、平板电脑、电视机、笔记本电脑、数码相框、导航仪等具有显示功能的产品或部件。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由所附的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限。

Claims (10)

1.一种显示面板，其特征在于，包括：
阵列基板，所述阵列基板包括显示区及位于所述显示区周围的非显示区，且所述阵列基板包括延伸至所述非显示区的数据线；
平坦化层，覆盖所述数据线；
金属走线层，设置于所述非显示区的平坦化层上，包括间隔设置的多条金属走线，且所述金属走线与所述数据线对应设置。
2.根据权利要求1所述的显示面板，其特征在于，所述显示面板还包括：
第一绝缘层，覆盖所述金属走线层；
第一电极层，位于所述第一绝缘层上，包括与所述金属走线对应设置的多个第一电极。
3.根据权利要求1所述的显示面板，其特征在于，所述第一电极层与所述显示区的像素电极同层设置。
4.根据权利要求1所述的显示面板，其特征在于，所述平坦化层和所述金属走线层之间设置有第二绝缘层。
5.根据权利要求3或4所述的显示面板，其特征在于，所述第一电极通过第一过孔耦接至所述金属走线，所述第一过孔设置在所述第一绝缘层中。
6.根据权利要求5所述的显示面板，其特征在于，所述第一电极通过第二过孔耦接至所述数据线，所述第二过孔设置在所述第一绝缘层、所述第二绝缘层和所述平坦化层中。
7.一种显示面板的制造方法，其特征在于，包括：
提供一阵列基板，所述阵列基板包括显示区及位于显示区周围的非显示区，且所述阵列基板包括延伸至所述非显示区的数据线；
在所述数据线上形成平坦化层；
在所述平坦化层上形成一金属走线层，所述金属走线层包括多条间隔排列的金属走线，且所述金属走线与所述数据线对应设置；
在所述金属走线和未被所述金属走线覆盖的平坦化层上形成第一绝缘层；
在所述第一绝缘层上形成包括多个第一电极的第一电极层，且所述第一电极与所述金属走线和所述数据线耦接。
8.根据权利要求7所述的一种显示面板的制造方法，其特征在于，在所述平坦化层和所述金属走线层之间形成第二绝缘层。
9.根据权利要求8所述的显示面板的制造方法，其特征在于，在所述第一绝缘层上形成包括多个第一电极的第一电极层，且所述第一电极与所述金属走线和所述数据线耦接，包括：
在所述第一绝缘层上设置一掩膜层；
通过所述掩膜层刻蚀所述第一绝缘层形成第一过孔，刻蚀所述第一绝缘层、所述第二绝缘层和所述平坦化层形成第二过孔；
在所述第一过孔和所述第二过孔中填充导电材料，并在所述第一过孔和所述第二过孔上形成所述第一电极层，以使所述第一电极与所述金属走线和所述数据线耦接。
10.一种显示装置，其特征在于，包括如权利要求1-6任一项所述的显示面板。
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