CN107828080A - A kind of preparation method of copper nano-wire compounded latex conductive sponge - Google Patents

A kind of preparation method of copper nano-wire compounded latex conductive sponge Download PDF

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Publication number
CN107828080A
CN107828080A CN201711094895.XA CN201711094895A CN107828080A CN 107828080 A CN107828080 A CN 107828080A CN 201711094895 A CN201711094895 A CN 201711094895A CN 107828080 A CN107828080 A CN 107828080A
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CN
China
Prior art keywords
latex
copper nano
copper
wire
conducting resinl
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Pending
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CN201711094895.XA
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Chinese (zh)
Inventor
张旺
尹振星
柴华
余自洪
韩景
朴元哲
刁国旺
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Yangzhou University
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Yangzhou University
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Priority to CN201711094895.XA priority Critical patent/CN107828080A/en
Publication of CN107828080A publication Critical patent/CN107828080A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/36After-treatment
    • C08J9/40Impregnation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2307/00Characterised by the use of natural rubber
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/085Copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements

Abstract

A kind of preparation method of copper nano-wire compounded latex conductive sponge, belongs to functional high polymer material field, prepares copper nano-wire conducting resinl first, then the frothed latex of surface treatment is immersed in copper nano-wire conducting resinl, last vacuum drying treatment.The inventive method simplicity is easy to industrialized production, and the conductive energy of conductive frothed latex that it is prepared is good, and resistivity is low, and resilience is high.

Description

A kind of preparation method of copper nano-wire compounded latex conductive sponge
Technical field
The invention belongs to Functional polymer materials technology field, more particularly to nano composite material to apply in frothed latex Technology.
Background technology
Current wearable electronic product or robot device generally require a variety of highly conductive sponge materials of flexibility and are arranged on Its device inside, so as to play conductive, antistatic and reduce electromagnetic radiation and other effects.It is general to select when producing conductive sponge Polyurethane, silicon rubber etc. are used as matrix material, often do not possess excellent rebound performance, while the green environmental protection of material is also owed It is good.
Frothed latex possesses high resilience, good is saturating as a kind of sponge product using natural rubber as primary raw material The advantages that gas, green non-pollution, it is the conductive sponge base material that a kind of great market uses potentiality.
Copper nano-wire has superior electrical conductivity and relatively low manufacturing cost as flexible conducting material of new generation.At present Conductive sponge processing method be to be required for greatly from the complicated carbonization of the higher silver-based material of some costs or synthesis technique Technique.
The content of the invention
The problem of in order to overcome above prior art to exist, the present invention propose a kind of copper nano-wire compound adhesive of convenient production The preparation method of newborn conductive sponge.
The present invention comprises the following steps:
1)Copper chloride, ethylene glycol, oleyl amine and carbon dust are mixed into laggard water-filling thermal response, reaction is cooled to room temperature after terminating, negated Solid phase should be taken into the solution centrifugal of generation, then be mixed with dispersion solvent, obtain copper nano-wire conducting resinl.
2)Taken out after frothed latex is soaked in ethanol water, through the dry frothed latex that must be surface-treated.The leaching Bubble process can remove the impurity on sponge, and make its surface active, help to strengthen adhesion of the conducting resinl on sponge.
3)Immersion:It is vacuum dried by the frothed latex copper of the surface treatment after the immersion of nano wire conducting resinl, obtain copper Nano wire compounded latex conductive sponge.In the immersion process copper nano-wire conducting resinl can well into the hole of sponge, and Equably adsorb on its surface, then by vacuum drying, the solvent in conducting resinl is rapidly removed, so as in sponge surface Form stable conductive layer.Copper nano-wire can form network structure on sponge simultaneously, when conductive sponge stretching or compressing Shi Yiran can keep stable electric conductivity.
In order to expand the scope of application of frothed latex, novel sponge product is researched and developed, the present invention passes through copper nano-wire compound adhesive The electric conductivity of nano material is combined by newborn conductive sponge technology with the good rebound performance of sponge, has both been dropped from copper-based material Low production cost and can makes material obtain excellent electric conductivity, using copper nano-wire compounded latex made from the inventive method Conductive sponge conducts electricity very well, and resistivity is low,.This method remains the preferable resilience of sponge, and step simplicity is easy to industry Metaplasia is produced, it helps meets the market demand.
Further, present invention step 1 described above)In, the copper chloride, ethylene glycol, oleyl amine, carbon dust and dispersion solvent Mixing quality ratio be 1~5: 80: 0.1~0.5: 0.1~1: 10~50, and the mixing quality of copper chloride and oleyl amine ratio be 10: 1.Contribute to form the copper nano-wire of stable dispersion using aforementioned proportion, the addition of carbon dust helps to improve the anti-oxidant of conducting resinl Ability, ethylene glycol can prevent the reunion of nano material as reducing agent.Oleyl amine can adjust the shape of copper nanometer in the reaction Looks size, only it just can guarantee that material has good conductive capability under the proportioning.
Preferably, the step 1)In, the copper chloride, ethylene glycol, the mixing quality ratio of oleyl amine and carbon dust are 1: 80: 0.1∶0.5.Use this method that length can be made as 0.5~50 μm, a diameter of 10~100 nm copper nano-wire conducting resinls.
The step 1)In, the dispersion solvent is ethanol, hexamethylene or isopropanol.The dispersant helps to improve conduction The dispersiveness of nano material in glue, and prevent its reunion.
The carbon dust is electrically conductive graphite, CNT or graphene.Help to improve the copper nano-wire in conducting resinl in sea Adhesive capacity on silk floss, and its antioxygenic property can be improved.
The hydro-thermal reaction is carried out under the conditions of 150~200 DEG C.Stable copper nanometer can be formed in the temperature range Line.
Copper nano-wire, the addition of carbon dust help to improve the oxidation resistance of conducting resinl, and ethylene glycol is as reducing agent.And can To prevent the reunion of nano material.
It is highly preferred that the hydro-thermal reaction is carried out under the conditions of 180 DEG C.
The step 2)In, the time that frothed latex soaks in ethanol solution is the min of 30min ± 10.In the time Section, immersion process can fully remove the impurity on sponge, and make its surface active, help to strengthen conducting resinl on sponge Adhesion.
The step 3)In, it is by the time that the copper nano-wire conducting resinl is soaked in the frothed latex of surface treatment 30min±10 min.In the period, conducting resinl can be adsorbed fully on sponge.
The step 3)In, the vacuum drying temperature is 60 DEG C, can rapidly remove the solvent in conducting resinl.
Embodiment
First, the preparation technology of copper nano-wire compounded latex conductive sponge:
1st, copper nano-wire conducting resinl is prepared:
1 kg copper chlorides, 80 kg ethylene glycol, 0.1 kg oleyl amines, 0.5 kg carbon dusts are weighed respectively(Electrically conductive graphite, CNT or Graphene).
Above-mentioned raw materials are put into hydrothermal reaction kettle, are stirred under room temperature condition, when temperature then being risen into 180 DEG C, Insulation, carries out hydro-thermal reaction 5 hours.
Question response liquid is cooled to room temperature, and reaction solution is centrifuged(The r/min of rotating speed 200~2000), reaction dissolvent is removed, is taken Obtain solid phase.
By above-mentioned solid phase and 50 kg dispersion solvents(Ethanol, hexamethylene or isopropanol)It is well mixed, length is produced as 0.5 ~50 μm, a diameter of 10~100 nm copper nano-wire conducting resinls.
2nd, frothed latex is surface-treated:
Take the 1 L ethanol waters that 0.5 kg frothed latexes are dipped into(Wherein the mass percent of ethanol is 98 %)In, pass through After 0.5 hour, take out the frothed latex soaked and dried at 60 DEG C, produce the frothed latex of surface treatment.
Weight/mass percentage composition in parent latex sponge used above shared by natural rubber is 1~90%.
3rd, soak:
The frothed latex of surface treatment is soaked in copper nano-wire conducting resinl, soak time is 0.5 hour.
4th, drying process:
Frothed latex after step 3 immersion treatment is dried, condition is:60 DEG C, vacuum drying 5 hours, produce finished product.
2nd, properties of product:
The finished product obtained by more than carries out analysis of experiments, and continuous item performance data is as follows:
Sheet resistance is less than 50 ohm, resilience 85~95%.
It can be seen that:The conductive sea of copper nano-wire compounded latex that resistivity is low, resilience is high can be obtained using the inventive method Continuous product.

Claims (10)

1. a kind of preparation method of copper nano-wire compounded latex conductive sponge, it is characterised in that comprise the following steps:
1)Copper chloride, ethylene glycol, oleyl amine and carbon dust are mixed into laggard water-filling thermal response, reaction is cooled to room temperature after terminating, negated Solid phase should be taken into the solution centrifugal of generation, then be mixed with dispersion solvent, obtain copper nano-wire conducting resinl;
2)Taken out after frothed latex is soaked in ethanol water, through the dry frothed latex that must be surface-treated;
3)Immersion:It is vacuum dried by the frothed latex of the surface treatment after the immersion of copper nano-wire conducting resinl, obtain copper nanometer Line compounded latex conductive sponge.
2. according to the method for claim 1, it is characterised in that:The step 1)In, the copper chloride, ethylene glycol, oleyl amine, Carbon dust and the mixing quality of dispersion solvent ratio are 1~5: 80: 0.1~0.5: 0.1~1: 10~50, and copper chloride and oleyl amine is mixed It is 10: 1 to close mass ratio.
3. according to the method for claim 2, it is characterised in that:The step 1)In, the copper chloride, ethylene glycol, oleyl amine Mixing quality ratio with carbon dust is 1: 80: 0.1: 0.5.
4. according to the method described in claim 1 or 2 or 3, it is characterised in that:The step 1)In, the dispersion solvent is second Alcohol, hexamethylene or isopropanol.
5. according to the method for claim 1, it is characterised in that:The carbon dust is electrically conductive graphite, CNT or graphite Alkene.
6. according to the method for claim 1, it is characterised in that:The hydro-thermal reaction is carried out under the conditions of 150~200 DEG C.
7. according to the method for claim 6, it is characterised in that:The hydro-thermal reaction is carried out under the conditions of 180 DEG C.
8. according to the method for claim 1, it is characterised in that:The step 2)In, frothed latex soaks in ethanol solution The time of bubble is the min of 30min ± 10.
9. according to the method for claim 1, it is characterised in that:The step 3)In, the copper nano-wire conducting resinl is soaked It is the min of 30min ± 10 to steep the time in the frothed latex of surface treatment.
10. the method according to claim 1 or 9, it is characterised in that:The step 3)In, the vacuum drying temperature For 60 DEG C.
CN201711094895.XA 2017-11-09 2017-11-09 A kind of preparation method of copper nano-wire compounded latex conductive sponge Pending CN107828080A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110087446A (en) * 2019-05-23 2019-08-02 延边大学 A method of conducting foam is prepared using copper nano-wire/carbon nano-composite material
CN111875841A (en) * 2020-07-17 2020-11-03 扬州大学 Preparation method of conductive latex sponge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103106950A (en) * 2013-01-10 2013-05-15 中国航空工业集团公司北京航空材料研究院 Conductive foam and preparation method thereof
CN105001622A (en) * 2015-07-29 2015-10-28 国家纳米科学中心 Negative-Poisson ratio multifunctional sponge and preparation method thereof
CN105976896A (en) * 2016-05-11 2016-09-28 中国科学院深圳先进技术研究院 Flexible conductor and preparation method thereof
CN107052358A (en) * 2016-12-14 2017-08-18 中国科学技术大学 A kind of preparation method of copper nano-wire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103106950A (en) * 2013-01-10 2013-05-15 中国航空工业集团公司北京航空材料研究院 Conductive foam and preparation method thereof
CN105001622A (en) * 2015-07-29 2015-10-28 国家纳米科学中心 Negative-Poisson ratio multifunctional sponge and preparation method thereof
CN105976896A (en) * 2016-05-11 2016-09-28 中国科学院深圳先进技术研究院 Flexible conductor and preparation method thereof
CN107052358A (en) * 2016-12-14 2017-08-18 中国科学技术大学 A kind of preparation method of copper nano-wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110087446A (en) * 2019-05-23 2019-08-02 延边大学 A method of conducting foam is prepared using copper nano-wire/carbon nano-composite material
CN110087446B (en) * 2019-05-23 2020-06-05 延边大学 Method for preparing conductive foam by using copper nanowire and carbon nanocomposite
CN111875841A (en) * 2020-07-17 2020-11-03 扬州大学 Preparation method of conductive latex sponge
CN111875841B (en) * 2020-07-17 2022-09-23 扬州大学 Preparation method of conductive latex sponge

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