CN107808921A - A kind of LED display module, manufacture method and its method for packing - Google Patents
A kind of LED display module, manufacture method and its method for packing Download PDFInfo
- Publication number
- CN107808921A CN107808921A CN201711023582.5A CN201711023582A CN107808921A CN 107808921 A CN107808921 A CN 107808921A CN 201711023582 A CN201711023582 A CN 201711023582A CN 107808921 A CN107808921 A CN 107808921A
- Authority
- CN
- China
- Prior art keywords
- led display
- led
- display module
- luminescence
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000012856 packing Methods 0.000 title claims description 5
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 238000004020 luminiscence type Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000001259 photo etching Methods 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 238000004528 spin coating Methods 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 210000004276 hyalin Anatomy 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a kind of LED display module and its manufacture method, the LED display module includes：Substrate, at least two LED display units, at least one negative or positive electrode power supply and control unit altogether, wherein LED display unit is set on the substrate, and the LED display unit includes at least seven luminescence units.Negative pole or positive pole in the luminescence unit electrically connect with the power circuit.Control unit is used to control the power supply to power or power off for the luminescence unit.It can be seen that the LED display module that this programme provides, multiple display units are packaged together, it can effectively reduce the size of LED display module, and each display unit can be with independent control, it is possible to increase the display brightness of integral LED.
Description
Technical field
The present invention relates to LED technology field, more specifically to a kind of LED display module, manufacture method and its encapsulation
Method.
Background technology
Light emitting diode (LED) is by its low in energy consumption, small volume, reliability height, long lifespan and reacts the advantages that fast, extensively
It is general to be applied to instrument and meter, computer, automobile, electronic toy, communicate, automatically control, the field such as military affairs.
Because the requirement of some environmental conditions is, it is necessary to the display screen of high brightness, inventor has found, current display device by
It is formed on chip size size and encapsulates the precision of end equipment, small volume can not be produced and high-resolution digital-scroll technique is set
Standby, i.e. the volume of the higher LED display of present intensity is larger.
Therefore, how a kind of LED display chips are provided, can meet that brightness is high and small volume be those skilled in the art urgently
A big technical barrier to be solved.
The content of the invention
In view of this, the invention provides a kind of LED display chips, high brightness can be provided, and can reduces display screen chi
It is very little.
To achieve the above object, the present invention provides following technical scheme：
A kind of LED display module, including：
Substrate；
At least two LED display units, set on the substrate, it is luminous that the LED display unit includes at least seven
Unit；
At least one negative or positive electrode power supply altogether, negative pole or positive pole in the luminescence unit are electrically connected with the power circuit
Connect；
Control unit, for controlling the power supply to be powered for the luminescence unit or powering off.
Optionally, including：
The LED display unit includes 16 luminescence units, and 16 luminescence units are carried out according to preset pattern
Arrangement, the LED luminescence units include LED chip.
Optionally, including：
Described control unit includes LED drive chip and single-chip microcomputer.
Optionally, including：
The luminescence unit is fixed on the substrate by elargol.
A kind of preparation method of LED display module, including：
Epitaxial wafer is provided；
Surface coating, photoetching and developing process are carried out to the epitaxial wafer, obtain having the LED of predetermined pattern to show core
Piece；
Cleaning is performed etching to the LED display chips；
By spin coating proceeding, the region that etching is removed is filled by way of spin coating photoresist, photoetching, development not to be had
The photosensitive polyimide of conduction property, make LED display chips exposed outside；
High-temperature baking is carried out, is solidified the polyimides；
The LED chip being cured is cleaned, passes through gluing negtive photoresist, photoetching, development on the LED chip surface
Technique, electrode and lead areas are made in each described LED chip；
Lead and back electrode, and the region for leading to pad in each display unit by the lead is deposited；
Cut to form LED display module according to predetermined number.
A kind of method for packing of LED display chips, including：
LED display module is fixed on the supporting plate with connection line using elargol, so that the connection line is straight
Connect and electrically connected with control module；
Back electrode by elargol be connected on support one extremely on, side that the pad of LED chip front electrode passes through bonding wire
Formula be connected on support it is another extremely on；
LED display module, support, control module encapsulation is integral.
Compared with prior art, technical scheme provided by the present invention has advantages below：
The invention provides a kind of LED display module, including：It is substrate, at least two LED display units, at least one common
Negative or positive electrode power supply and control unit, wherein LED display unit are set on the substrate, and the LED display unit
Including at least seven luminescence units.Negative pole or positive pole in the luminescence unit electrically connect with the power circuit.Control unit
For controlling the power supply to be powered for the luminescence unit or powering off.It can be seen that the LED display module that this programme provides, will be multiple
Display unit is packaged together, and can effectively reduce the size of LED display module, and each display unit can be controlled independently
System, it is possible to increase the display brightness of integral LED.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of structural representation for LED display module that the present embodiment provides；
Fig. 2 is a kind of Making programme schematic diagram for LED display module that the present embodiment provides；
Fig. 3 is a kind of encapsulation schematic flow sheet for LED display module that the present embodiment provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Referring to Fig. 1, Fig. 1 is a kind of structural representation for LED display module that the present embodiment provides, including：Substrate 11,
At least two LED display units 12, at least one negative or positive electrode power supply 13 and control unit altogether.
Wherein, at least two LED display units are set on the substrate, and the LED display unit includes at least seven
Luminescence unit.Negative pole or positive pole in the luminescence unit electrically connect with the power circuit.Control unit is described for controlling
Power supply is that the luminescence unit is powered or powered off.
Specifically, the LED display unit can include 16 luminescence units, 16 luminescence units are according to pre-
If figure is arranged, the LED luminescence units include LED chip.
Optionally, described control unit includes LED drive chip and single-chip microcomputer.
Optionally, the luminescence unit is fixed on the substrate by elargol.
Specifically, this embodiment provides a kind of preparation method of LED display module, as shown in Fig. 2 including step：
S21, provide epitaxial wafer；
S22, surface coating, photoetching and developing process are carried out to the epitaxial wafer, obtain having the LED of predetermined pattern to show
Show chip；
S23, cleaning is performed etching to the LED display chips；
S24, by spin coating proceeding, the region removed will be etched and filled not by way of spin coating photoresist, photoetching, development
The photosensitive polyimide of conductive matter, make LED display chips exposed outside；
S25, high-temperature baking is carried out, solidified the polyimides；
S26, the LED chip being cured cleaned, the LED chip surface by gluing negtive photoresist, photoetching,
Developing process, electrode and lead areas are made in each described LED chip；
S27, evaporation lead and back electrode, and the area for being led to pad in each display unit by the lead
Domain；
S28, according to predetermined number cut to form LED display module.
Illustrated with specific implementation, it is as follows:
A) first, AlGaInP-LED epitaxial wafers are cleaned, dried.
B) it is and then special in AlGaInP-LED epitaxial wafers surface coating, photoetching, development, having for obtaining needing to remain
The single led display chip very designed, every 18 LED display chips form a display unit, and ten display units are formed
One display module.
C) further, by wet method or the method for dry etching, the epitaxial layer beyond LED display chips region is etched
Totally.
D) further, by the method for spin coating, the region that removes will be etched and pass through spin coating photoresist, photoetching, development
Mode fills the photosensitive polyimide without conduction property, makes LED display chips exposed outside, while polyimides can be with
Play the effect of being dielectrically separated from.
E) further, by high-temperature baking, solidified polyimides, further improve the reliabilities such as insulation.
F) further, the chip being cured is cleaned, dried, pass through gluing negtive photoresist, photoetching, aobvious in chip surface
The mode of shadow, electrode and lead areas are made on each LED display chip.
G) further, in a manner of electron beam evaporation plating, metal electrode and connecting line are in the lead of one on evaporation, and incite somebody to action
Pad is led to by the region that each display unit thinks by lead, the metal electrode can form good ohm with chip
Contact.
H) further, by grinding substrate, epitaxial wafer is thinned to certain thickness, after cleaning, with the side of electron beam evaporation plating
The upper back electrode of formula evaporation.
I) further, using ten display units as a module, by cutting, testing, sliver, sub-elect it is excellent
LED display module, complete the making of LED display module.
, it is necessary to be packaged to it after LED chip is prepared for, therefore the present embodiment additionally provides a kind of LED and shows core
The method for packing of piece, as shown in figure 3, including step：
S31, LED display module is fixed on the supporting plate with connection line using elargol, so that the connecting line
Road directly electrically connects with control module；
S32, back electrode by elargol be connected on support one extremely on, the pad of LED chip front electrode passes through bonding wire
Mode be connected on support it is another extremely on；
S33, LED display module, support, control module encapsulated it is integral.
Specifically, citing illustrates, it is as follows：
A) LED display module is fixed on the supporting plate with connection line using elargol, connection line directly with control
Molding block is attached；
B) back electrode by elargol be connected on support one extremely on, the pad of chip front side electrode is by way of bonding wire
Be connected on support it is another extremely on；
C) further, LED display module, supporting plate, control module are encapsulated integrally, and installed additional on display module
One hyaline test, you can with as a kind of high-brightness LED display device.
Preferably, the size for the LED display module that the present embodiment provides is not more than 3.0X15.0mm.
In summary, the invention provides a kind of LED display module and its manufacture method, the LED display module to include：Base
Plate, at least two LED display units, at least one negative or positive electrode power supply and control unit, wherein LED display unit altogether are set
Put on the substrate, and the LED display unit includes at least seven luminescence units.Negative pole in the luminescence unit or just
Pole electrically connects with the power circuit.Control unit is used to control the power supply to power or power off for the luminescence unit.It can be seen that
The LED display module that this programme provides, multiple display units are packaged together, can effectively reduce LED display module
Size, and each display unit can be with independent control, it is possible to increase the display brightness of integral LED.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.To the upper of the disclosed embodiments
State bright, professional and technical personnel in the field is realized or using the present invention.A variety of modifications to these embodiments are to ability
It will be apparent for the professional and technical personnel in domain, generic principles defined herein can not depart from the present invention's
In the case of spirit or scope, realize in other embodiments.Therefore, the present invention be not intended to be limited to it is shown in this article these
Embodiment, and it is to fit to the most wide scope consistent with principles disclosed herein and features of novelty.
Claims (6)
- A kind of 1. LED display module, it is characterised in that including：Substrate；At least two LED display units, set on the substrate, the LED display unit includes at least seven luminescence units；At least one negative or positive electrode power supply altogether, negative pole or positive pole in the luminescence unit electrically connect with the power circuit；Control unit, for controlling the power supply to be powered for the luminescence unit or powering off.
- 2. LED display module according to claim 1, it is characterised in that including：The LED display unit includes 16 luminescence units, and 16 luminescence units are arranged according to preset pattern, The LED luminescence units include LED chip.
- 3. LED display module according to claim 1, it is characterised in that including：Described control unit includes LED drive chip and single-chip microcomputer.
- 4. LED display module according to claim 1, it is characterised in that including：The luminescence unit is fixed on the substrate by elargol.
- A kind of 5. preparation method of LED display module, it is characterised in that including：Epitaxial wafer is provided；Surface coating, photoetching and developing process are carried out to the epitaxial wafer, obtain the LED display chips with predetermined pattern；Cleaning is performed etching to the LED display chips；By spin coating proceeding, the region removed will be etched and filled by way of spin coating photoresist, photoetching, development without conduction The photosensitive polyimide of property, make LED display chips exposed outside；High-temperature baking is carried out, is solidified the polyimides；The LED chip being cured is cleaned, passes through gluing negtive photoresist, photoetching, development work on the LED chip surface Skill, electrode and lead areas are made in each described LED chip；Lead and back electrode, and the region for leading to pad in each display unit by the lead is deposited；Cut to form LED display module according to predetermined number.
- A kind of 6. method for packing of LED display module, it is characterised in that including：LED display module is fixed on the supporting plate with connection line using elargol so that the connection line directly with Control module electrically connects；Back electrode by elargol be connected on support one extremely on, the pad of LED chip front electrode is connected by way of bonding wire Be connected on support it is another extremely on；LED display module, support, control module encapsulation is integral.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711023582.5A CN107808921A (en) | 2017-10-27 | 2017-10-27 | A kind of LED display module, manufacture method and its method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711023582.5A CN107808921A (en) | 2017-10-27 | 2017-10-27 | A kind of LED display module, manufacture method and its method for packing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107808921A true CN107808921A (en) | 2018-03-16 |
Family
ID=61582872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711023582.5A Pending CN107808921A (en) | 2017-10-27 | 2017-10-27 | A kind of LED display module, manufacture method and its method for packing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107808921A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121638A (en) * | 2011-01-14 | 2011-07-13 | 深圳市联诚发科技有限公司 | LED lamp and manufacturing method thereof and corresponding LED display |
| CN103594054A (en) * | 2012-08-17 | 2014-02-19 | 聚积科技股份有限公司 | Display structure and display |
| CN105895652A (en) * | 2015-02-17 | 2016-08-24 | 新世纪光电股份有限公司 | High-Voltage Light Emitting Diode And Manufacturing Method Thereof |
-
2017
- 2017-10-27 CN CN201711023582.5A patent/CN107808921A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121638A (en) * | 2011-01-14 | 2011-07-13 | 深圳市联诚发科技有限公司 | LED lamp and manufacturing method thereof and corresponding LED display |
| CN103594054A (en) * | 2012-08-17 | 2014-02-19 | 聚积科技股份有限公司 | Display structure and display |
| CN105895652A (en) * | 2015-02-17 | 2016-08-24 | 新世纪光电股份有限公司 | High-Voltage Light Emitting Diode And Manufacturing Method Thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7683539B2 (en) | Light emitting device package and method for manufacturing the same | |
| US20110285284A1 (en) | Light Emitting Device Using AC and Manufacturing Method of the Same | |
| CN102610735B (en) | Light-emitting device with thermoelectric separated structure and manufacturing method of light-emitting device | |
| CN101958389A (en) | LED surface mounting structure for silicon substrate integrated with functional circuits and packaging method thereof | |
| KR20100094246A (en) | Light emitting device package and method for fabricating the same | |
| TW201212303A (en) | LED packaging structure and packaging method thereof | |
| TWI536617B (en) | Light emitting diode lightbar and method for manufacturing the same | |
| JP2002009349A (en) | Surface emission led and its manufacturing method | |
| US8358054B2 (en) | Light emitting device package | |
| CN201904368U (en) | LED (light emitting diode) surface-mounting package structure based on silicon substrate integrated with functional circuit | |
| CN103618042A (en) | Semiconductor light-emitting diode chip | |
| KR101363980B1 (en) | Optical module and manufacturing method thereof | |
| KR101448165B1 (en) | COM or COB type LED module with individual metal bonding circuit pattern and array to compose series-parallel connection structure | |
| CN107808921A (en) | A kind of LED display module, manufacture method and its method for packing | |
| CN103606545B (en) | LED flexible board light source module and manufacturing method thereof | |
| CN203589085U (en) | Semiconductor LED chip | |
| CN202150488U (en) | Mounting structure used for LED wafers | |
| CN207719202U (en) | Thin-film LED cascaded structure | |
| CN103606609B (en) | A kind of manufacture method of light-emitting diodes pipe electrode | |
| CN102903821A (en) | Wafer-level packaging structure and manufacturing method thereof | |
| CN203377265U (en) | LED packaging structure | |
| CN201966250U (en) | LED (Light Emitting Diode) light emitting module with favorable heat radiation | |
| CN202140813U (en) | Integrally-packaged LED (light emitting diode) light source | |
| CN110473865A (en) | A kind of energy-saving LED lighting apparatus and its manufacturing method | |
| CN206135199U (en) | Novel C chamber semiconductor laser is penetrated to mount single shot |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180316 |