CN107803585A - Laser machine and laser processing - Google Patents
Laser machine and laser processing Download PDFInfo
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- CN107803585A CN107803585A CN201710761098.6A CN201710761098A CN107803585A CN 107803585 A CN107803585 A CN 107803585A CN 201710761098 A CN201710761098 A CN 201710761098A CN 107803585 A CN107803585 A CN 107803585A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- Optics & Photonics (AREA)
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Abstract
The present invention provides laser machine and laser processing, laser machine possess：Produce the laser oscillator of the laser of processing；Laser from laser oscillator is irradiated to the processing head of workpiece；The shoot part shot via processing head to the workpiece of illuminated laser；And the image processing part of characteristic quantity is extracted on the basis of the irradiation position of laser from the image of shoot part shooting in order to obtain the information for the machining state for representing workpiece.
Description
Technical field
The present invention relates to laser machine and laser processing.
Background technology
Laser machine is used for the cutting of workpiece, welding etc..In laser machine, from processing quality for improving workpiece etc.
Viewpoint is set out, exist from shooting process in the shooting image of workpiece grasp the technology of machining state (for example, referring to following special
Sharp document 1,2).
The laser machine of patent document 1 (Japanese Unexamined Patent Publication 11-129083 publications) possesses coaxial-observation in processing head
The micro-camera of type.In patent document 1, the image shot according to threshold value to micro-camera carries out binaryzation, and obtains highlighted
The shape of degree part (molten bath).In addition, carrying out pattern match to acquired shape by image processing part, and judge abnormal combustion
Burn.In pattern match, the often capable coordinate of hi-lite is discretely obtained, and is obtained based on these coordinates with weight coefficient
Each sum after multiplication.Should and it be changed by S types (sigmoid) function to collect into a value, if threshold value
Then it is judged as abnormal combustion below.In addition, by carrying out rote learning by neutral net optimize weight coefficient.
The laser machine of patent document 2 (Japanese Unexamined Patent Publication 5-177374 publications) has with laser machining light shaft coaxle
Camera.In patent document 2, shooting image is confirmed by monitor, and it is anti-by being carried out to the result of shooting image
Present to carry out Laser Processing control.In addition, on the picture of monitor, by being operated to cursor line movement with knob, come
The region of measurement object is sandwiched by cursor line, and the distance cursor line is measured.In addition, by by shooting image two-value
Change, part by processing department image and its in addition demarcates, automate manual dimensional measurement.
In the case where pattern match is made as above, the load required for handling is big, such as processing needs be present
For a long time, the cost of processing unit becomes high worry.In addition, measured when the position that cursor line is set on the picture of monitor
In the case of size, arbitrariness be present on the benchmark of measurement, because measurement result is with the choosing in the region of such as measurement object
Select, machine direction etc. changes, therefore worry accurately grasp machining state.
The content of the invention
The present invention is to complete in view of the foregoing, and its object is to provide one kind can accurately grasp processing shape
State and the laser machine and laser processing that its processing load can be reduced.
The laser machine of the present invention possesses：Laser oscillator, produce the laser of processing；Processing head, laser will be come from
The laser of oscillator is irradiated to workpiece；Shoot part, the workpiece of illuminated laser is shot via processing head；And image
Processing unit, in order to obtain represent workpiece machining state information and from shoot part shooting image in the irradiation position of laser
On the basis of extract characteristic quantity.
The laser processing of the present invention, comprising：Produce the laser of processing；Laser is irradiated from processing head to workpiece；Through
The workpiece of illuminated laser is shot by processing head；And in order to obtain the information for the machining state for representing workpiece, from
Characteristic quantity is extracted on the basis of the irradiation position of laser in the image of shooting.
Furthermore it is possible to form as follows：Processing head relatively moves on the direction parallel with workpiece with workpiece, possesses image rotation
Transfer part, above-mentioned image rotation portion make image rotation centered on the irradiation position of laser, so that processing head and workpiece in the picture
The relative movement direction of relative movement turns into reference direction.Furthermore it is possible to form as follows：Possess to the relative of processing head and workpiece
The mobile control unit being controlled, image rotation portion obtain relative movement direction from control unit, and determine the angle for making image rotation
Degree.Furthermore it is possible to form as follows：Possess the binaryzation portion of image binaryzation and carried out the figure of binaryzation from binaryzation portion
As the region determining section in the region of irradiation position of the determination comprising laser, image processing part area based on determined by the determining section of region
Extract characteristic quantity in domain.Furthermore it is possible to form as follows：Possesses the inside that is arranged at processing head and with via the exit wound of bullet pair of processing head
The mode that workpiece is irradiated is come the illuminating optical system that is guided to laser and will be entered via exit wound of bullet from workpiece
Light inside processing head is directed to the photographing optical system of shoot part, and photographing optical system and illuminating optical system share at least
The optical component of a part.In addition, possess along the shared light of optical path direction driving photographing optical system and illuminating optical system
The optical system drive division of department of the Chinese Academy of Sciences's part and adjust shoot part by changing the relative distance of photographing optical system and shoot part
Focus focus adjustment portion, in the case where optical system drive division is driven to optical component, focus adjustment portion adjust
The focus of whole shoot part.In addition, in the case where carrying out the cutting processing of workpiece using laser caused by laser oscillator, adding
Foreman to workpiece to be formed through hole using laser caused by laser oscillator perforation in the state of stopping is handled, afterwards with logical
It is starting point to cross the through hole that perforation processing is formed, and progress makes processing head movement while being cut using laser caused by laser oscillator
The cutting process of workpiece is cut, in the case where entering eleven punch 11 processing, shoot part is shot to above-mentioned workpiece, image processing part root
The irradiation position of laser is obtained according to the Luminance Distribution of the image of shoot part shooting.It can also form as follows：It is also equipped with by figure
Laser progress is above-mentioned as caused by being compared to judge using laser oscillator the characteristic quantity that processing unit extracts and threshold value
The whether appropriate machining state discrimination portion of the machining state of workpiece, be determined as in machining state discrimination portion it is unsuitable in the case of,
Laser oscillator stops the generation of laser, and stops the processing of workpiece.
Invention effect
According to the present invention, due to extracting characteristic quantity on the basis of the irradiation position of laser, therefore spy can be objectively extracted
Sign amount, machining state can be accurately grasped, and it can be reduced and handle load.
In addition, possesses the laser machine in above-mentioned image rotation portion due to making image centered on the irradiation position of laser
Rotation, therefore the selected required load of pivot can be reduced.Further, since pivot determines, therefore can prevent
Only characteristic quantity is changed due to the selection of pivot, can accurately grasp machining state.In addition, image rotation
The laser machine that portion obtains relative movement direction from control unit is carried out with for example obtaining the situation in relative movement direction from image
Compare, can accurately obtain relative movement direction, and the load of its processing can be reduced.Further, since using coming from
The relative movement direction of control unit determines the angle for making image rotation, therefore can be determined as the anglec of rotation high-precision
Value, and the load of its processing can be reduced.In addition, possesses the laser machine in above-mentioned binaryzation portion due to from binaryzation
Image zooming-out characteristic quantity, therefore can reduce its processing load.In addition, highlights change in the image being binarized be present
Discrete situation is obtained, but possesses area of the laser machine of above-mentioned region determining section due to determining the irradiation position comprising laser
Domain, therefore can be with high accuracy and the region of the object of underload selective extraction characteristic quantity.In addition, above-mentioned photographing optical system
And illuminating optical system shares the laser machine of at least one of optical component and can suppressed by sharing optical component
The increase of components number, realize and save space, reduce cost etc..In addition, when the drivings such as the focus adjustment by processing laser are total to
During optical component, the focus of shoot part staggers, but because focus adjustment portion is adjusted, thus for processing laser and
Any one of shoot part can optimize focus.Further, since when the perforation processing that processing head stops according to the figure of shooting
The Luminance Distribution of picture obtains the irradiation position of laser, therefore the situation phase of the irradiation position with obtaining laser when processing head moves
Than accurate irradiation position can be obtained.In addition, by being compared whether can determine that machining state to characteristic quantity and threshold value
Suitably, and in the case of unsuitable processing is stopped, the processing so as to suppress useless occurs.
Brief description of the drawings
Fig. 1 is the figure for showing laser machine of the first embodiment.
Fig. 2 is the explanation figure of machining state.
Fig. 3 is the figure for showing image processing part of the first embodiment.
Fig. 4 is the figure for the processing for showing image rotation portion.
Fig. 5 be show binaryzation portion, region determining section, feature amount extraction module processing figure.
Fig. 6 is the flow chart for showing the laser processing that embodiment is related to.
Fig. 7 is the figure for showing laser machine of the second embodiment.
Embodiment
Hereinafter, refer to the attached drawing illustrates to embodiment.In following each figure, using XYZ coordinate system in figure
Direction illustrates.In the XYZ coordinate system, using vertical as Z-direction, using horizontal direction as X-direction, Y-direction.Also,
In all directions (such as X-direction), the direction of arrow is referred to as+side (such as+X sides), its opposite side is referred to as-side (example
Such as-X sides).
[the 1st embodiment]
Fig. 1 is the figure for showing laser machine 1 of the present embodiment.Laser machine 1 possesses processing head 2, processing
Head drive division 3, laser oscillator 4, shoot part 5, image processing part 6 (image processing apparatus), control unit 7, machining state discrimination
Portion 8, storage part 9 and focus adjustment portion 25.Laser machine 1 is implemented cutting to workpiece W for example, by Numerical Control (NC) and added
Work.Each several part of the control unit 7 according to such as Numerical Control program synthesis control laser machine 1.
Processing head 2 has jet pipe 11, and the laser (hereinafter referred to as laser L1 is used in processing) of processing is by forming in jet pipe 11
In the exit wound of bullet through hole of jet pipe 11 (run through) inner side and be irradiated to workpiece W.Processing head 2 can be in X-direction, Y-direction
And relatively moved with workpiece W in all directions of Z-direction.Processing head drive division 3 possesses move portion 12 and optical system
System drive division 13.Processing head drive division 3 is controlled by control unit 7, makes processing head 2 to X-direction, Y-direction and Z using move portion 12
The all directions movement in direction.In addition, processing head drive division 3 is controlled by control unit 7, adjusted using optical system drive division 13 from spray
The focus for the light that pipe 11 irradiates.Laser machine 1 makes processing head 2 relatively be moved relative to workpiece W while from adding
The jet pipe 11 of foreman 2 irradiates processing laser L1 to workpiece W, thus carries out cutting processing.
Laser oscillator 4 produces such as infrared laser and is used as processing laser L1.In the inside of processing head 2, irradiation is set
Optical system 15, illuminating optical system 15 is by the way that processing caused by laser oscillator 4 is guided to make this with laser L1 to workpiece W
Processing is irradiated with laser L1 by the exit wound of bullet of jet pipe 11 to workpiece W.Illuminating optical system 15 possesses optical fiber 16, collimater
17th, beam splitter 18 and collector lens 19.One end (end of light incident side) of optical fiber 16 is connected with laser oscillator 4,
Its other end (end of light emitting side) is connected with processing head 2.Processing from laser oscillator 4 is with laser L1 via optical fiber 16
It imported into processing head 2.Processing from laser oscillator 4 is irradiated on workpiece W by processing head 2 with laser L1.
Processing from laser oscillator 4 is transformed into directional light or less parallel light by collimater 17 with laser L1.Light beam
Optical splitter 18 is configured in the processing by collimater 17 with position incident laser L1.Beam splitter 18, which has, uses processing
Laser L1 at least a portion reflects and transmits at least a portion of the light (hereinafter referred to as launching light) of the transmitting from workpiece W
Characteristic.Beam splitter 18 is, for example, dichroscope, semi-transparent semi-reflecting lens etc..Beam splitter 18 is with relative to collimater 17
The angle tilt that about 45 ° of optical axis 17a.Beam splitter 18 more more tilts to+Z sides to+X sides.
Collector lens 19 is configured in the processing from beam splitter 18 with position incident laser L1.Pass through collimater
17 processing laser L1 is reflected by beam splitter 18, and light path bends about 90 ° from X-direction to Z-direction (- Z sides), incides
Collector lens 19.The aggregation of collector lens 19 carrys out the processing laser L1 of autocollimator 17.The optical system of processing head drive division 3 is driven
Dynamic portion 13 moves optical axis 19a of the collector lens 19 along collector lens 19, the workpiece thus, it is possible to adjust illuminating optical system 15
The focus of side.
Shoot part 5 is shot via processing head 2 to illuminated processing with laser L1 workpiece W.Shoot part 5 possesses bat
Photographic/optical system 21 and capturing element 22.Shoot part 5 will be launched by processing with laser L1 irradiation from workpiece W side
Light (transmitting light) to processing head 2 is detected via photographing optical system 21 by capturing element 22.Photographing optical system 21 will
Via the exit wound of bullet of the light in the jet pipe 11 of processing head 2 shoot part 5 is directed to from the workpiece W light entered inside processing head 2.
Photographing optical system 21 possesses collector lens 19, beam splitter 18, speculum 23 and imaging len 24.Photographing optical system
21 and illuminating optical system 15 share at least one of optical component.In Fig. 1, photographing optical system 21 and irradiation optics
System 15 shares collector lens 19 and beam splitter 18, can coaxially observe workpiece W with illuminating optical system 15.
Focus adjustment portion 25 is controlled by control unit 7, and the focus of shoot part 5 is adjusted.Specifically, by that will shoot
Optical system 21 and the relative distance of capturing element 22 are altered to the optical path direction of photographing optical system, to adjust capturing element 22
Focus (distance of the imaging point of imaging len 24 and the optical path direction of capturing element).In addition, in order to change it is above-mentioned it is relative away from
From focus adjustment portion 25 moves photographing optical system 21 and at least one party of capturing element 22.Thus, focus adjustment portion 25 can
Only to make the optical component of photographing optical system 21 (imaging len 24) mobile, it can also move only capturing element 22, or
Move both sides.
In addition, occur even if moving collector lens 19 by optical system drive division 13 and the imaging point of imaging len 24
Change, is adjusted to the focus of shoot part 5 by focus adjustment portion 25, also can accurately grasp machining state.In detail
For, in the case where optical system drive division 13 makes collector lens 19 move to adjust processing laser L1 point of irradiation,
Because photographing optical system 21 and illuminating optical system 15 share collector lens 19, thus the imaging point of imaging len 24 there occurs
Change.On the other hand, focus adjustment portion 25 adjusts according to the position of the collector lens 19 changed by optical system drive division 13
The focus of capturing element 22, it is able to maintain that high-precision shooting image.Add therefore, it is possible to accurately carry out laser to workpiece
Work, and also can accurately grasp the machining state of workpiece.
Transmitting light from workpiece W incides beam splitter 18 by collector lens 19.Launch light for example comprising due to
Irradiate light of the processing with laser L1 and from molten metal radiation, because of plasma and caused by light and processing laser L1
The light reflected by workpiece W.At least a portion of transmitting light incides speculum 23 by beam splitter 18.Incide reflection
The transmitting light of mirror 23 is reflected by speculum 23 and incides imaging len 24.The light optically focused of imaging len self-reflection mirror in 24 future 23
To capturing element 22.Workpiece W picture is projected to capturing element 22 by imaging len 24 and collector lens 19.
Capturing element 22 is, for example, CCD or cmos image sensor, and the picture formed to photographing optical system 21 is clapped
Take the photograph.Multiple pixels of two-dimensional arrangements are provided with capturing element 22, each pixel is provided with the photo detectors such as photodiode.
Capturing element 22 is sequential read out incides photo detector and caused electric charge (signal) in each pixel by light, and by the signal
Be amplified, A/D is changed and is arranged in image format, thus generate the digital number of the image (hereinafter referred to as shooting image) of shooting
According to (hereinafter referred to as captured image data).The captured image data of generation is output to image processing part 6 by capturing element 22.
Image processing part 6 can be communicatedly connected with capturing element 22 by wired or wireless.Image processing part 6 also serves as bat
Take the photograph the control unit of element 22.Image processing part 6 can be communicatedly connected with control unit 7 by wired or wireless, and from control unit 7
Receive the instruction for meaning and performing shooting.Image processing part 6 makes capturing element 22 perform shooting according to the instruction from control unit 7.
Image processing part 6 is in order to obtain the information for the machining state for representing workpiece W, from the image captured by shoot part 5
Characteristic quantity is extracted on the basis of the irradiation position of laser.Image processing part 6 obtains captured image data from capturing element 22, and leads to
Cross and used the image procossing of captured image data to generate the information (characteristic quantity) relevant with machining state.Image processing part 6 from
A part for shooting image captured by shoot part 5 or a part for the image handled shooting image are swashed with processing to use
Characteristic quantity is extracted on the basis of light L1 irradiation position.The image handled shooting image is, for example, Fig. 4, Fig. 5 below
Shown rotation image Im2, binary image Im3, determine image Im4 etc..Each processing on the progress of image processing part 6 is rear
Face reference picture 3 is described in more detail to Fig. 5.The characteristic quantity extracted from shooting image is supplied to control by image processing part 6
Portion 7 processed.
Machining state discrimination portion 8 is for example arranged at control unit 7, obtains the feature provided from image processing part 6 to control unit 7
Amount.The characteristic quantity and threshold value that machining state discrimination portion 8 extracts to image processing part 6 are compared to judge machining state.
Fig. 2 is the explanation figure of machining state.Fig. 2 (A) is appropriate machining state, and Fig. 2 (B) is unsuitable processing
State.Workpiece W, partial melting from the incident processing laser L1 of processing head 2, form cutting groove.Processing head 2 is in workpiece W
Middle processing blowout auxiliary gas around part incident laser L1, molten metal M is due to the auxiliary blown out from processing head 2
Gas and discharged downwards from cutting groove.
As shown in Fig. 2 (A), in the case where machining state is appropriate, molten metal M relative to processing head 2 mobile side
To towards rear side and towards workpiece W flowing underneath.It is unsuitable situation in machining state as shown in Fig. 2 (B)
Under, that molten metal M spreads compared with Fig. 2 (A) and to workpiece W flowing underneath be present.In addition, even if on workpiece
Molten metal (not shown) on W is different also according to machining state, under unsuitable machining state, exist molten metal from
The situation that cutting groove overflows and extended on the workpiecew.(A), the different manifestations of machining state Fig. 2 (B) such as Fig. 2
On the characteristic quantity that image processing part 6 extracts.Above-mentioned machining state discrimination portion 8 by by characteristic quantity compared with threshold value,
Such as judge whether machining state is appropriate.
In addition, machining state discrimination portion 8 can according to the value of characteristic quantity by machining state be appropriate rank either not
Appropriate rank is distinguished as stage of more than three to evaluate.For example, machining state discrimination portion 8 can be to machining state with " most
It is good ", " appropriate ", " inappropriate " three phases evaluate.In addition, machining state can be appropriate by machining state discrimination portion 8
Rank is such as 1,2,3 ... quantize expression.
Fig. 3 is the figure for showing image processing part of the present embodiment (image processing apparatus).Image processing part 6 possesses
Image rotation portion 31, binaryzation portion 32, region determining section 33 and feature amount extraction module 34.In the following description, suitably
Reference picture 4 and Fig. 5.Fig. 4 is the figure for the processing for showing image rotation portion.Fig. 5 is to show binaryzation portion, region determining section, spy
The figure of the processing of sign amount extraction unit.
As shown in figure 3, position (irradiation position) of the image processing part 6 using the illuminated processing laser L1 in workpiece W
Information carry out image procossing.Irradiation position is the position at processing laser L1 center.Irradiation position in shooting image
The position of centre of gravity of the processing e.g. appeared before one's eyes in shooting image laser L1 light intensity distributions.Such irradiation position is for example
It can obtain as follows：Relatively moved workpiece W and processing head 2, irradiate processing from processing head 2 makes workpiece with laser L1
W is melted, and capturing element 22 is shot in this condition, is obtained according to the Luminance Distribution of the shooting image.Irradiation position obtains
Taking can be in the brightness of the image after being shot when forming perforation (through hole) when cutting processing starts according to shoot part to workpiece
Distribution obtains irradiation position by image processing part.In addition, laser machine 1 carry out workpiece cutting processing in the case of,
After processing head 2 forms perforation (through hole) with laser L1 by processing in the state of stopping on workpiece (perforation processing), one
While make the movement of processing head 2 while being cut (cutting process) to workpiece with laser L1 using processing to perforate for starting point.
In addition, the irradiation position in shooting image can for example be set in the smooth surface of Fig. 1 capturing element 22 with into
As the position that the optical axis 24a of lens 24 (photographing optical system 21) is intersecting.In addition, processing head 2 is passed through with laser L1 with processing
The mode at the center of exit wound of bullet is set, and the irradiation position in shooting image can be set in shooting image and exit wound of bullet
The suitable position in center.The information of irradiation position is for example stored in Fig. 1 storage part 9, and control unit 7 is read from storage part 9 to be irradiated
The information of position, and the information of irradiation position is supplied to image processing part 6.In addition, the information of irradiation position can be by image
The storage part (not shown) of processing unit 6 is stored, in this case, control unit 7 can not provide irradiation position to image processing part 6
The information put.
Image rotation portion 31 makes image rotation centered on the irradiation position of laser, so that processing head 2 and work in the picture
The relative movement direction of part W relative movements turns into reference direction.Relative movement direction is and the cutting groove as caused by Laser Processing
(machine direction) parallel direction.Relative movement of the control unit 7 to processing head 2 and workpiece W is controlled, and maintains relative shifting
The information in dynamic direction.Image rotation portion 31 obtains the information in relative movement direction from control unit 7, and determines the angle for making image rotation
Degree.
In Fig. 4, reference direction is predetermined direction, such as in shooting image Im1 is the direction of pixel arrangement
(such as horizontal scan direction, vertical scanning direction).In addition, the irradiation position in relative movement direction and shooting image Im1
LP is known according to the information (reference picture 3) provided from control unit 7.The unit vector in the calculating benchmark direction of image rotation portion 31 with
Relatively move the inner product of the unit vector in direction, and calculating benchmark direction and relative movement direction angulation (anglec of rotation).
The angle (anglec of rotation) that above-mentioned result of calculation is determined as rotating shooting image Im1 by image rotation portion 31.Then, image revolves
Transfer part 31 makes shooting image Im1 rotate the above-mentioned anglec of rotation centered on irradiation position LP, and thus generation is as shown in Fig. 4 (B)
Rotation image Im2.
As shown in figure 3, the data for rotating image are supplied to binaryzation portion 32 by image rotation portion 31.Binaryzation portion 32 will scheme
As binaryzation, and the data of the image (hereinafter referred to as binary image) as its result by binaryzation are supplied to region
Determining section 33.Pixel value is picture more than threshold value compared with threshold value by binaryzation portion 32 by each pixel value of rotation image
Element is represented that the pixel that pixel value is less than to threshold value is represented by " black ", generates binary image by " white ".Such binaryzation
Image has that the region of " white " of island is discretely showed.
For example, the binary image Im3 of Fig. 5 (A) includes region AR1~AR4 of island.In binary image Im3,
Region AR1~AR4 is the region of " white " respectively, and other regions are " black ".Fig. 3 region determining section 33 is from binary picture
As Im3 determines and (selection, determined, extraction) (hereinafter referred to as to determine area with the irradiation position LP of laser region AR1 comprising processing
Domain).The information for determining region AR1 is supplied to feature amount extraction module 34 by region determining section 33.Determine region AR1 information for example
It is that will determine data of the region AR2~AR4 beyond the AR1 of region by the determination image after " black " displacement.
The extracted region characteristic quantity that Fig. 3 feature amount extraction module 34 is determined based on region determining section 33.For example, characteristic quantity carries
Portion 34 is taken from determination region AR1 extraction characteristic quantities.That is, it is the region for the object for extracting characteristic quantity to determine region AR1.Characteristic quantity carries
Portion 34 is taken to extract the size of determination region AR1 shown in such as Fig. 5 (B) as characteristic quantity.In Figure 5, " width " is
The direction vertical with " relative movement direction ", equivalent to the width of cutting groove.Feature amount extraction module 34 is it is determined that image Im4
In for example set on the basis of the irradiation position LP of processing laser the relative movement direction and width of (such as origin)
Coordinate system, extraction determine region AR1 various sizes.
For example, size X1 (length), the width of the determination region AR1 on the extraction relative movement of feature amount extraction module 34 direction
The size Y1 (width) of determination region AR1 on direction.In addition, feature amount extraction module 34 relative movement direction on relative to photograph
Penetrate the size X2 (length) of the part (head H D) of position LP extraction front sides.In addition, feature amount extraction module 34 extracts head H D
Width on size Y2.In addition, feature amount extraction module 34 is drawn up in relative movement side from the chi for determining region AR1
Very little X1 subtracts the size after head H D size X2.
In addition, feature amount extraction module 34 used the four fundamental rules of the size of determination region AR1 described above each several part
Computing, its result of calculation is set to characteristic quantity.Arithmetic can be only carry out and, it is poor, accumulate and business in the computing of one,
Can also be carry out and, it is poor, accumulate and business in more than two computings.For example, feature amount extraction module 34 is for determining region
AR1 each several part calculate the size in relative movement direction and the size of width and, it is poor, accumulate and at least one work of business
The amount of being characterized.In addition, feature amount extraction module 34 can be come so that the size for determining region AR1 each several part to be set to the function of variable
Calculate characteristic quantity.The function can be linear function or nonlinear function.
In addition, instead of from the image being binarized and from extracted region characteristic quantity determined by region determining section 33, it is special
Sign amount extraction unit 34 can be before being binarized image zooming-out characteristic quantity.For example, feature amount extraction module 34 can be from by two
The image ((B) of reference picture 4) of value region based on determined by region determining section 33 determines that the image of characteristic quantity should be extracted
Scope, extract characteristic quantity from above-mentioned determined scope in the image before being binarized.
As shown in figure 3, the characteristic quantity extracted is supplied to control unit 7, machining state discrimination portion 8 by feature amount extraction module 34
By being compared to judge machining state to this feature amount and threshold value.The project of above-mentioned characteristic quantity is can be distinguished as example
The mode of appropriate machining state and unsuitable machining state shown in Fig. 2 and suitably selected, can be one, can also
It is two or more.In addition, laser machine 1 can not possess machining state discrimination portion 8.For example, feature amount extraction module 34 is by spy
Sign amount is shown in display part etc., and operator can consider shown characteristic quantity in light of actual conditions to judge machining state.In addition, substitution judges to add
The quality of work state, laser machine 1 can adjust processing conditions by using feedback control of characteristic quantity etc..
Then, the composition based on above-mentioned laser machine 1 illustrates to the laser processing that embodiment is related to.
Fig. 6 is the flow chart for showing the laser processing that embodiment is related to.Here with the machining state in laser processing
Illustrated centered on decision method.In addition, for the appropriate reference picture 1 of each several part of laser machine 1, for image procossing
The appropriate reference picture 3 of each several part in portion 6.
Fig. 1 shoot part 5 enters in the state of processing laser L1 has been irradiated from processing head 2 via processing head 2 to workpiece W
Row shooting.In step sl, image processing part 6 carries out image as the pre-treatment of the shooting image to being shot by shoot part 5
Cut, noise eliminate.For example, image processing part 6 cuts the central portion of shooting image, and the image to cutting out passes through intermediate value
Wave filter etc. carries out noise elimination, and by the image procossing later of the image after processing.
In step s 2, image processing part 6 obtains processing laser L1 irradiation position and relative movement direction.Example
Such as, image processing part 6 obtains the information of irradiation position from control unit 7 and relatively moves the information in direction.In step s3, scheme
As the image rotation portion 31 of processing unit 6 uses the information of the irradiation position obtained in step S2 and the information in relative movement direction
Make image rotation (reference picture 4) centered on irradiation position.In step s 4, the binaryzation portion 32 of image processing part 6 is to image
Image after the processing of rotating part 31 carries out binaryzation ((A) of reference picture 5).In step s 5, the region of image processing part 6 determines
Portion 33 is determined comprising photograph using the information of the irradiation position obtained in step s 2 from binary image Im3 ((A) of reference picture 5)
Penetrate position LP determination region AR1.
In step s 6, AR1 extraction characteristic quantities in region are determined determined by feature amount extraction module 34 from region determining section 33
((B) of reference picture 5).For example, the extraction of feature amount extraction module 34 determines the size of region AR1 each several part, enforcement of going forward side by side is used
The arithmetic for the size extracted.Feature amount extraction module 34 will determine the size and above-mentioned four of region AR1 each several part
Then at least a portion of the result of computing is set to characteristic quantity.In the step s 7, the machining state discrimination portion 8 of control unit 7 will be in step
The characteristic quantity that feature amount extraction module 34 is extracted in rapid S6 judges machining state compared with threshold value.Control unit 7 for example using
Step S7 result of determination performs Laser Processing to adjust processing conditions with the processing conditions after adjustment.In addition, control unit 7
Can be without the feedback control (adjustment of processing conditions) for the result of determination for having used step S7, such as from above-mentioned step S1
Processing to step S7 can be used as inspection to carry out.In this case, the feelings of unsuitable processing ought be determined as in the step s 7
Under condition, laser oscillator 4 stops producing processing laser L1, and laser machine 1 stops processing.
In addition, the order from step S3 to step S5 processing can be changed suitably.For example, binaryzation portion 32 is to revolving
Image before turning carries out binary conversion treatment, and image rotation portion 31 can make the image rotation being binarized.In addition, region determines
Portion 33 determines region according to the image being binarized before rotation, and the region that image rotation portion 31 can make to be determined is revolved
Turn.In addition, image processing part 6 can not possess image rotation portion 31, feature amount extraction module 34 can be from the image being not rotated
Extract characteristic quantity.In addition, image processing part 6 can not possess binaryzation portion 32, can not also possess region determining section 33.Separately
Outside, in the present embodiment, machining state discrimination portion 8 is arranged on control unit 7, but can also be arranged on beyond control unit 7
Partly (such as image processing part 6).
[the 2nd embodiment]
The 2nd embodiment is illustrated using Fig. 7.In the present embodiment, it is pair same with above-mentioned embodiment
Form mark identical symbol and omit or simplify its explanation.In the present embodiment, laser machine 1 possesses lighting source
41 and lamp optical system 42.Lighting source 41 send wavelength and processing by the use of the different light (such as visible ray) of laser L1 as
Illumination light L2.Lamp optical system 42 is arranged at the inside of processing head 2.Lamp optical system 42 will be caused by lighting source 41
Illumination light L2 is guided towards workpiece W, and workpiece W is irradiated from there through the exit wound of bullet of jet pipe 11.
Lamp optical system 42 includes collimater 43, semi-transparent semi-reflecting lens 44, beam splitter 18 and collector lens 19.This
In, lamp optical system 42 shares beam splitter 18 and collector lens 19 with illuminating optical system 15, and saturating via optically focused
Mirror 19 carries out indirect illumination.The optical axis of the optical axis of the light emitting side of lamp optical system 42 and the emitting side of illuminating optical system 15
It is coaxial, illumination light L2 with processing laser L1 identicals light path (a part of light path shared with processing laser L1) by shining
It is mapped on workpiece W.
Collimater 43 is configured from the incident illumination light L2 of lighting source 41 position.Collimater 43 will come from lighting source 41
Illumination light L2 be converted into directional light or close to directional light.By the object's position of the focus of lamp optical system 42 and workpiece
In the case of matching, collimater 43 is for example configured to the position consistency of its focus and lighting source 41.Semi-transparent semi-reflecting lens 44 are matched somebody with somebody
Put in position incident the illumination light L2 by collimater 43.Semi-transparent semi-reflecting lens 44 are that have to make an illumination light L2 part anti-
The reflection and transmission part of the characteristic penetrate, transmitted a part.
Reflected by the illumination light L2 of collimater 43 part by semi-transparent semi-reflecting lens 44, light path from X-direction to Z-direction (-
Z sides) about 90 ° of bending, and incide beam splitter 18.Collector lens 19 is configured from the incident illumination light L2 of beam splitter 18
Position.Collector lens 19 assembles the laser L1 of the processing from beam splitter 18.Using illumination light L2 irradiation from work
The transmitting light of part W radiation with launching light identical light path as caused by the processing laser L1 being illustrated in Figure 1 by shooting
It is imaged in element 22.Shoot part 5 is shot in the state of illumination light L2 is irradiated to workpiece W to workpiece W.Image processing part 6
The image procossing such as rim detection is carried out for the shooting image, thus detects the edge of cutting groove, and by along the side of cutting groove
To be defined as relatively move direction.In the present embodiment, instead of receiving the information in relative movement direction, image from control unit 7
The image rotation portion 31 (reference picture 3) of processing unit 6 makes image rotation using the relative movement direction determined in above-mentioned processing.
In the above-described embodiment, control unit 7 is for example comprising computer system.Control unit 7 reads and is stored in storage
The program in portion 9, and perform various processing according to the program.The program is mounted at the image of the computer of laser machine
Program is managed, the laser machine possesses the laser oscillator for the laser for producing processing, by the laser from laser oscillator
The processing head that is irradiated via processing head to workpiece and via processing head the workpiece of illuminated laser is shot
Shoot part, the program make computer perform following handle：In order to obtain the information for the machining state for representing workpiece, clapped from shoot part
The image taken the photograph extracts characteristic quantity on the basis of the irradiation position of laser.The image processing program can be recorded to computer can
The storage medium of reading provides.
In the above-described embodiment, image processing apparatus (image processing part 6) is the image procossing dress of laser machine
Put, the laser machine possesses the laser oscillator for the laser for producing processing, irradiates the laser from laser oscillator
Processing head and the shoot part that is shot via processing head to the workpiece of illuminated laser to workpiece, image procossing dress
The information for obtaining the machining state for representing workpiece has been set to, has been carried from the image of shoot part shooting on the basis of the irradiation position of laser
Take characteristic quantity.
In addition, the technical scope of the present invention is not limited to the mode illustrated in above-mentioned embodiment etc..Above-mentioned
More than 1 of the key element illustrated in embodiment etc. omits sometimes.Also, the key element energy illustrated in above-mentioned embodiment etc.
It is enough appropriately combined.Also, as long as decree allows, and quotes the disclosures of all documents conduct quoted in above-mentioned embodiment etc.
A part described herein.
Claims (9)
1. a kind of laser machine, possesses：
Laser oscillator, produce the laser of processing；
Processing head, the above-mentioned laser from above-mentioned laser oscillator is irradiated to workpiece；
Shoot part, the above-mentioned workpiece of illuminated above-mentioned laser is shot via above-mentioned processing head；And
Image processing part, in order to obtain the information for the machining state for representing above-mentioned workpiece, from the image of above-mentioned shoot part shooting
Characteristic quantity is extracted on the basis of the irradiation position of above-mentioned laser.
2. laser machine as claimed in claim 1, wherein,
Above-mentioned processing head relatively moves on the direction parallel with above-mentioned workpiece with above-mentioned workpiece,
Above-mentioned laser machine possesses image rotation portion, and above-mentioned image rotation portion is made centered on the irradiation position of above-mentioned laser
Image rotation is stated, so that above-mentioned processing head and the relative movement direction of above-mentioned workpiece relative movement turn into benchmark in above-mentioned image
Direction.
3. laser machine as claimed in claim 2, wherein,
Above-mentioned laser machine possesses control unit, and relative movement of the control unit to above-mentioned processing head and above-mentioned workpiece is controlled
System,
Above-mentioned image rotation portion obtains above-mentioned relative movement direction from above-mentioned control unit, and determines the angle for making above-mentioned image rotation
Degree.
4. laser machine as claimed any one in claims 1 to 3, wherein,
Above-mentioned laser machine possesses：
Binaryzation portion, by above-mentioned image binaryzation；And
Region determining section, the above-mentioned image that binaryzation has been carried out from above-mentioned binaryzation portion determine the irradiation position for including above-mentioned laser
Region,
Above-mentioned image processing part above-mentioned zone based on determined by above-mentioned zone determining section extracts features described above amount.
5. the laser machine as any one of Claims 1-4, wherein,
Above-mentioned laser machine possesses：
Illuminating optical system, is arranged at the inside of above-mentioned processing head, and with via the exit wound of bullet of above-mentioned processing head to above-mentioned workpiece
The mode being irradiated guides to above-mentioned laser；And
Photographing optical system, the light entered via above-mentioned exit wound of bullet from above-mentioned workpiece inside processing head is directed to above-mentioned shooting
Portion,
Above-mentioned photographing optical system and above-mentioned illuminating optical system share at least one of optical component.
6. laser machine as claimed in claim 5, wherein,
Above-mentioned laser machine possesses：
Optical system drive division, shared along the optical path direction above-mentioned photographing optical system of driving and above-mentioned illuminating optical system
Optical component；And
Focus adjustment portion, above-mentioned shoot part is adjusted by changing the relative distance of above-mentioned photographing optical system and above-mentioned shoot part
Focus,
In the case where above-mentioned optical system drive division is driven to above-mentioned optical component, in above-mentioned focus adjustment portion adjustment
State the focus of shoot part.
7. the laser machine as any one of claim 1 to 6, wherein,
In the case where carrying out the cutting processing of above-mentioned workpiece using laser caused by above-mentioned laser oscillator,
Using laser caused by above-mentioned laser oscillator above-mentioned workpiece to be formed in the state of the stopping of above-mentioned processing head logical
The perforation processing in hole, afterwards using the through hole formed by the perforation processing as starting point, carry out while making above-mentioned processing head movement one
The cutting process of lateral dominance above-mentioned workpiece of laser cutting caused by above-mentioned laser oscillator,
In the case where carrying out above-mentioned perforation processing, above-mentioned shoot part is shot to above-mentioned workpiece, above-mentioned image processing part root
The irradiation position of above-mentioned laser is obtained according to the Luminance Distribution of the image of above-mentioned shoot part shooting.
8. the laser machine as any one of claim 1 to 7, wherein,
Above-mentioned laser machine is also equipped with machining state discrimination portion, and the machining state discrimination portion to above-mentioned image processing part by carrying
The characteristic quantity of taking-up judges adding using the above-mentioned workpiece of laser progress caused by above-mentioned laser oscillator compared with threshold value
Whether work state is appropriate,
Be determined as in above-mentioned machining state discrimination portion it is unsuitable in the case of, above-mentioned laser oscillator stops the generation of laser, from
And stop the processing of above-mentioned workpiece.
9. a kind of laser processing, comprising：
Produce the laser of processing；
Above-mentioned laser is irradiated from processing head to workpiece；
The above-mentioned workpiece of illuminated above-mentioned laser is shot via above-mentioned processing head；And
In order to obtain the information for the machining state for representing above-mentioned workpiece, with the irradiation position of above-mentioned laser from the image of above-mentioned shooting
It is set to benchmark extraction characteristic quantity.
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| JP2016174399A JP6801312B2 (en) | 2016-09-07 | 2016-09-07 | Laser machining machine and laser machining method |
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| CN110355462A (en) * | 2018-03-26 | 2019-10-22 | 发那科株式会社 | Processing conditions adjusts device and machine learning device |
| CN111901569A (en) * | 2020-08-11 | 2020-11-06 | 上海柏楚电子科技股份有限公司 | Monitoring processing method, device, equipment and medium for dynamically tracking cutting head |
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| CN113233189A (en) * | 2020-05-27 | 2021-08-10 | 上野精机株式会社 | Part transfer device |
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| JP6810973B2 (en) * | 2019-03-28 | 2021-01-13 | 前田工業株式会社 | Laser welding control device |
| JP7357463B2 (en) | 2019-05-08 | 2023-10-06 | 株式会社東芝 | Judgment device, judgment system, welding system, judgment method, program, and storage medium |
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| CN107803585B (en) | 2021-06-25 |
| JP6801312B2 (en) | 2020-12-16 |
| JP2018039028A (en) | 2018-03-15 |
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