CN107799457B - Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit - Google Patents
Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit Download PDFInfo
- Publication number
- CN107799457B CN107799457B CN201711316870.XA CN201711316870A CN107799457B CN 107799457 B CN107799457 B CN 107799457B CN 201711316870 A CN201711316870 A CN 201711316870A CN 107799457 B CN107799457 B CN 107799457B
- Authority
- CN
- China
- Prior art keywords
- clamp
- components
- fixing
- holes
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005496 eutectics Effects 0.000 title claims abstract description 17
- 238000005245 sintering Methods 0.000 title claims abstract description 16
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000010354 integration Effects 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/8084—Sintering
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a eutectic sintering clamp for realizing high-precision chip loading of a microwave hybrid circuit, which comprises a tube shell, wherein a limiting clamp for placing components is arranged in the tube shell, a fixing clamp is arranged at the upper part of the limiting clamp, a plurality of through holes are formed in the fixing clamp in a penetrating way, pressing blocks capable of being inserted are arranged in the through holes in a matching way, and the pressing blocks are pressed on the components through the through holes. The limiting clamp is used for fixing the position of the component; the pressing block is used for applying certain pressure to the components; the fixing clamp is used for fixing the pressing block; the invention can realize high-precision chip loading, and the chip loading precision reaches +/-50 um; meanwhile, eutectic sintering can be completed for all components in the tube shell at one time, so that the production efficiency is improved, and thermal stress failure of the components caused by multiple high temperature experiences is avoided. The microwave mixed circuit chip package device solves the problems of high-precision chip package of a microwave mixed circuit and improvement of production efficiency, and provides a good solution for high integration and miniaturization of a microwave power tube.
Description
Technical Field
The invention relates to the technical field of eutectic chip loading in a microwave hybrid circuit, in particular to a eutectic sintering clamp for realizing high-precision chip loading of the microwave hybrid circuit.
Background
Microwave hybrid circuits are widely used in communication systems and radar systems. At present, packaging of a microwave hybrid circuit is advanced towards high integration and miniaturization, so that more devices are required to be integrated on a small tube shell or substrate, and at present, a full-automatic chip loader is generally used for loading chips aiming at the condition of supermultiple devices in the microwave hybrid circuit, but the production efficiency is very low, and the full-automatic chip loader can ensure high precision but low production efficiency, so that development of a eutectic sintering clamp capable of realizing high-precision chip loading and improving production efficiency is very important, and becomes a technical problem in the industry.
Disclosure of Invention
In order to overcome the problems, the invention provides a eutectic sintering clamp for realizing high-precision chip loading of a microwave hybrid circuit.
The technical scheme of the invention is to provide a eutectic sintering clamp for realizing high-precision chip loading of a microwave hybrid circuit, which comprises a tube shell and is characterized in that: be provided with the limit clamp that is used for placing components and parts in the tube shell, limit clamp upper portion is provided with mounting fixture, link up on the mounting fixture and be provided with a plurality of through-holes, all match in the through-hole and be provided with can male briquetting, the briquetting passes through the through-hole presses on components and parts.
Further, the shell comprises a base and a connector arranged in the middle of the base, a groove is formed in the connector, and the limit clamp is arranged in the groove.
Further, a plurality of accommodating grooves for accommodating components are formed in the limiting clamp.
Further, the fixing clamp is arranged in the groove and is located at the upper part of the limiting clamp.
Further, the through hole is arranged in a cylindrical shape, and the pressing block is matched and arranged in a cylindrical shape.
Further, the bottom end of the pressing block comprises a conical pressing head.
The beneficial effects of the invention are as follows: the invention is provided with a limit clamp, a fixed clamp and a pressing block, wherein the limit clamp is used for fixing the positions of components (including chips, capacitors, inductors and the like); the pressing block is used for applying certain pressure to the components; the fixing clamp is used for fixing the pressing block; the invention can realize high-precision chip loading, and the chip loading precision reaches +/-50 um; meanwhile, eutectic sintering can be completed for all components in the tube shell at one time, so that the production efficiency is improved, and thermal stress failure of the components caused by multiple high temperature experiences is avoided. The microwave mixed circuit chip package device solves the problems of high-precision chip package of a microwave mixed circuit and improvement of production efficiency, and provides a good solution for high integration and miniaturization of a microwave power tube.
Drawings
FIG. 1 is a schematic side elevational view of the present invention;
FIG. 2 is a schematic top perspective view of a spacing clip of the present invention;
FIG. 3 is a schematic top view of the fixing clip of the present invention;
Fig. 4 is a schematic side view of the compact of the present invention.
Detailed Description
The invention is further described in connection with the following embodiments in order to make the technical means, the creation features, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 to 4, the eutectic sintering clamp for realizing high-precision chip loading of a microwave hybrid circuit of the invention comprises a pipe shell 1, wherein a limiting clamp 2 for placing components is arranged in the pipe shell 1, a plurality of accommodating grooves 21 are arranged on the limiting clamp 2 and used for placing the components, a fixing clamp 3 is arranged at the upper part of the limiting clamp 2, a plurality of through holes 31 are arranged on the fixing clamp 3 in a penetrating way, the through holes 31 are arranged in a cylindrical shape, pressing blocks 4 capable of being inserted are arranged in the through holes 31 in a matching way, the pressing blocks 4 are arranged in a cylindrical shape in a matching way, the bottom end of each pressing block 4 comprises a conical pressing head 41, the pressing blocks 4 extend into the fixing clamp 3 through the through holes 31, and the pressing heads 41 are pressed on the components.
The pipe shell 1 comprises a base 11 and a connector 12 arranged in the middle of the base 11, a groove 13 is formed in the connector 12, the limiting clamp 2 is arranged in the groove 13, and the fixing clamp 3 is arranged in the groove 13 and is positioned on the upper portion of the limiting clamp 2.
The invention is provided with a limit clamp 2, a fixed clamp 3 and a pressing block 4, wherein the limit clamp 2 is used for fixing the positions of components (including chips, capacitors, inductors and the like); the pressing block 4 is used for applying certain pressure to the components; a fixing jig 3 for fixing the pressing block 4; the invention can realize high-precision chip loading, and the chip loading precision reaches +/-50 um; meanwhile, eutectic sintering can be completed for all components in the pipe shell 1 at one time, so that the production efficiency is improved, and thermal stress failure of the components caused by multiple high temperature experiences is avoided. The microwave mixed circuit chip package device solves the problems of high-precision chip package of a microwave mixed circuit and improvement of production efficiency, and provides a good solution for high integration and miniaturization of a microwave power tube.
In actual operation, the limiting clamp 2 is firstly placed in the tube shell 1, and then all components are sequentially placed in the accommodating groove 21 of the limiting clamp 2 according to an assembly drawing; then, the fixing clamp 3 is placed in the tube shell 1, and the pressing block 4 is pressed on the component through the through hole 31 of the fixing clamp 3 to complete the clamping work of the component.
The above example is only one embodiment of the present invention, which is described in detail and is not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (3)
1. The utility model provides a eutectic sintering anchor clamps for realizing microwave hybrid circuit high accuracy dress piece, its characterized in that includes the tube shell: a limiting clamp for placing components is arranged in the tube shell, a fixing clamp is arranged at the upper part of the limiting clamp, a plurality of through holes are formed in the fixing clamp in a penetrating mode, pressing blocks capable of being inserted are arranged in the through holes in a matching mode, and the pressing blocks are pressed on the components through the through holes;
The shell comprises a base and a connector arranged in the middle of the base, a groove is formed in the connector, and the limit clamp is arranged in the groove; the limiting clamp is provided with a plurality of accommodating grooves for accommodating components;
The bottom of the pressing block comprises a conical pressing head, and the pressing head presses the components.
2. The eutectic sintering clamp for realizing high-precision chip mounting of a microwave hybrid circuit according to claim 1, wherein the eutectic sintering clamp is characterized in that: the fixed clamp is arranged in the groove and is positioned on the upper part of the limit clamp.
3. The eutectic sintering clamp for realizing high-precision chip mounting of a microwave hybrid circuit according to claim 1, wherein the eutectic sintering clamp is characterized in that: the through hole is arranged to be cylindrical, and the pressing block is matched to be cylindrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316870.XA CN107799457B (en) | 2017-12-12 | 2017-12-12 | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711316870.XA CN107799457B (en) | 2017-12-12 | 2017-12-12 | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107799457A CN107799457A (en) | 2018-03-13 |
| CN107799457B true CN107799457B (en) | 2024-05-24 |
Family
ID=61537703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711316870.XA Active CN107799457B (en) | 2017-12-12 | 2017-12-12 | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107799457B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326857B (en) * | 2018-10-29 | 2020-10-09 | 摩比天线技术（深圳）有限公司 | Cavity filter assembly process |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202003965U (en) * | 2011-02-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Rejects cutting-off fixture |
| CN102931123A (en) * | 2011-08-12 | 2013-02-13 | 英飞凌科技股份有限公司 | Fixing semiconductor die in dry and pressure supported assembly processes |
| CN202855725U (en) * | 2012-07-23 | 2013-04-03 | 深圳市祥承业科技开发有限公司 | Eutectic machine ceramic support clamp |
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN204720420U (en) * | 2015-06-30 | 2015-10-21 | 西安机电研究所 | Heavy radiator for thyristors fixture |
| CN205194681U (en) * | 2015-11-16 | 2016-04-27 | 桐乡市中辰化纤有限公司 | Silk car chip supporter |
| CN105789071A (en) * | 2016-03-29 | 2016-07-20 | 中国电子科技集团公司第二十九研究所 | Device used for realizing microwave chip eutectic pressurization and pressurization method |
| CN207558775U (en) * | 2017-12-12 | 2018-06-29 | 江苏博普电子科技有限责任公司 | A kind of eutectic sintering fixture for being used to implement microwave hybrid circuit high-precision load |
-
2017
- 2017-12-12 CN CN201711316870.XA patent/CN107799457B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202003965U (en) * | 2011-02-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Rejects cutting-off fixture |
| CN102931123A (en) * | 2011-08-12 | 2013-02-13 | 英飞凌科技股份有限公司 | Fixing semiconductor die in dry and pressure supported assembly processes |
| CN202855725U (en) * | 2012-07-23 | 2013-04-03 | 深圳市祥承业科技开发有限公司 | Eutectic machine ceramic support clamp |
| CN104966987A (en) * | 2015-06-27 | 2015-10-07 | 山东华光光电子有限公司 | Semiconductor laser multi-chip sintering clamp and sintering method |
| CN204720420U (en) * | 2015-06-30 | 2015-10-21 | 西安机电研究所 | Heavy radiator for thyristors fixture |
| CN205194681U (en) * | 2015-11-16 | 2016-04-27 | 桐乡市中辰化纤有限公司 | Silk car chip supporter |
| CN105789071A (en) * | 2016-03-29 | 2016-07-20 | 中国电子科技集团公司第二十九研究所 | Device used for realizing microwave chip eutectic pressurization and pressurization method |
| CN207558775U (en) * | 2017-12-12 | 2018-06-29 | 江苏博普电子科技有限责任公司 | A kind of eutectic sintering fixture for being used to implement microwave hybrid circuit high-precision load |
Non-Patent Citations (1)
| Title |
|---|
| 焙烧多功能机组双联夹具的结构及常见问题分析;黄得梅;;有色矿冶(第01期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107799457A (en) | 2018-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209746090U (en) | Test socket for use in case of no stress on upper surface of chip | |
| CN107799457B (en) | Eutectic sintering clamp for realizing high-precision chip loading of microwave hybrid circuit | |
| CN107186119B (en) | SOP type paster pin changes DIP pin device | |
| KR20080031270A (en) | Folded frame carrier for mosfet bga | |
| CN111885850B (en) | Connecting and assembling method for F-shaped packaged power tube | |
| CN102528357B (en) | Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head | |
| CN203912363U (en) | Reflow soldering fixing device | |
| CN106862408A (en) | A kind of multi-functional die device | |
| CN218333725U (en) | Bonding tool of semiconductor module | |
| CN105376956B (en) | A kind of assembly method of circuit board | |
| CN201438165U (en) | Fixture used for impact test of metal casing encapsulated hybrid integrated device | |
| CN207558775U (en) | A kind of eutectic sintering fixture for being used to implement microwave hybrid circuit high-precision load | |
| CN103325712B (en) | IGBT module welded encapsulation servicing unit and system | |
| CN211605117U (en) | Positioning fixture combination suitable for high-power hybrid integrated circuit chip | |
| CN108008276B (en) | Test auxiliary device for multi-channel transistor array | |
| CN210690751U (en) | Microwave PCB circuit test tool structure | |
| CN104752237A (en) | SCR (silicon controlled rectifier) encapsulation method and mold | |
| CN201498509U (en) | Loading clamp of small-size SMD product | |
| CN207038503U (en) | A kind of ltcc substrate component eutectic sinters multi-functional clamp | |
| CN111511122A (en) | Clamping soldering paste coating device and method for bottom pin-free packaged device | |
| CN110640252A (en) | Welding fixing device of circuit pin header and base plate | |
| CN202587625U (en) | Attachment welding jig | |
| CN204992224U (en) | Automatic rectangular electric connector of plug and welding position device of printed wiring board | |
| CN107196172A (en) | A kind of forced connector precision positioning compression bonding apparatus | |
| CN210060252U (en) | Novel pressure welding plate for fixing lead frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |