CN107783021A - A kind of test module for the experiment of crimp type IGBT device power cycle - Google Patents
A kind of test module for the experiment of crimp type IGBT device power cycle Download PDFInfo
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- CN107783021A CN107783021A CN201710795463.5A CN201710795463A CN107783021A CN 107783021 A CN107783021 A CN 107783021A CN 201710795463 A CN201710795463 A CN 201710795463A CN 107783021 A CN107783021 A CN 107783021A
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- cooling water
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- top pressure
- test module
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2608—Circuits therefor for testing bipolar transistors
- G01R31/2619—Circuits therefor for testing bipolar transistors for measuring thermal properties thereof
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The present invention provides a kind of test module for the experiment of crimp type IGBT device power cycle, including：Test suite, the test suite include the device under test of multigroup setting that is connected in parallel to each other；Circulation is provided with multigroup cooling water assembly being connected respectively with each device under test, and cooling water channel cools down to coupled device under test respectively described in every group.It is arranged in parallel between multiple device under tests, and it is respectively connected with independent cooling water assembly on each device under test, cooling procedure between multiple device under tests is not interfere with each other, the problem of effectively prevent cooling capacity deficiency caused by being arranged in series between the cooling water of multiple device under tests in the prior art occurs, and can effectively improve testing efficiency.
Description
Technical field
The present invention relates to crimp type IGBT device technical field, and in particular to one kind is followed for crimp type IGBT device power
The test module of ring test.
Background technology
Water-cooling system and test fixture are primarily directed to solder type IGBT devices in the power circulation test platform applied at present
Part design, the radiating of solder type IGBT device one side, installation and wiring are simple.
Compared with solder type device, crimp type IGBT device power consumption is high, and volume is big, and installation crimping requires high therefore multiple
Problems be present when being tested on power circulation test platform in crimp type IGBT device：Original test platform is cooling down
Water route is in being arranged in series, and cooling water flows serially through multiple IGBT devices to be measured, when cooling water flows through the IGBT devices being located behind
During part, water temperature is very high, now to the cooling capacity rapid drawdown of device.
The content of the invention
Therefore, the technical problem to be solved in the present invention is to overcome of the prior art surveys to multiple crimp type IGBT
During examination, the defects of cooling effectiveness is not high.
Therefore, the present invention provides a kind of test module for the experiment of crimp type IGBT device power cycle, including：
Test suite, the test suite include the device under test of multigroup setting that is connected in parallel to each other；
Circulation, which is provided with multigroup cooling water assembly being connected respectively with each device under test, every group
The cooling water channel cools down to coupled device under test respectively.
The test suite includes：Several device under tests being arranged side by side each other along short transverse, it is multiple described to be measured
Device forms device group；Support component, the lower section of the device under test is arranged on, to support the device group；And top pressure
Component, the top of the device under test is arranged on, to being limited above the device group.
It is connected between several described device under tests by alignment pin.
The cooling water assembly includes：Water-filled radiator, both ends of each device under test along short transverse are arranged on,
The water-filled radiator internal flow has cooling water；Cooling water pipe, it is connected with the water-filled radiator, the cooling water pipe
There are water inlet end and water side.
The circulation also includes：Water inlet pipe, the water inlet end of the every cooling water pipe be connected to simultaneously it is described enter
On water pipe；And return pipe, the water side of the cooling water pipe is connected, the cooling water after heating to be exported.
The support component includes：Lower flange；Disk spring, it is arranged between the lower flange and the device group, uses
So that the device group is adjacent on the top pressure component.
The top pressure component includes：Upper flange；Top pressure seat, it is connected at the upper flange axle center, cover is buckled in the device
The top of group；Top pressure guide rod, to be pressurizeed to the top pressure seat, the top pressure seat is set to be pressed on the top of the device group
End；Locking nut, it is arranged between the upper flange and the top pressure guide rod, to limit the motion of the top pressure guide rod.
The contact surface of the top pressure guide rod and the top pressure seat is attached by sphere.
The water inlet pipe and the outlet pipe are provided with air bleeding valve.
Matheson and Dresser joint is provided between the water side of the return pipe and the cooling water pipe.
Technical solution of the present invention, have the following advantages that：
1. a kind of test module for the experiment of crimp type IGBT device power cycle provided by the invention, test suite,
The test suite includes the device under test of multigroup setting that is connected in parallel to each other；Simultaneously in circulation be provided with it is multigroup respectively with often
The cooling water assembly that the individual device under test is connected, cooling water channel enters to coupled device under test respectively described in every group
Row cooling.
In the prior art, test platform is in be arranged in series to the water route cooled down, and cooling water flows serially through multiple to be measured
IGBT device, when cooling water flows through the IGBT device being located behind, water temperature is very high, now rapid to the cooling capacity of device
Drop.
Test module provided by the invention, it is arranged in parallel between multiple device under tests, and is all connected with each device under test
There is an independent cooling water assembly, the cooling procedure between multiple device under tests is not interfere with each other, and effectively prevent in the prior art
Occur caused by being arranged in series between the cooling water of multiple device under tests the problem of cooling capacity deficiency, test effect can be effectively improved
Rate.
A kind of 2. test module for the experiment of crimp type IGBT device power cycle provided by the invention, described in several
It is connected between device under test by alignment pin.Ensure that the connective stability of multiple device under tests.
3. a kind of test module for the experiment of crimp type IGBT device power cycle provided by the invention, the recirculated water
System also includes：Water inlet pipe, the water inlet end of the every cooling water pipe are connected on the water inlet pipe simultaneously；And return pipe,
The water side of the cooling water pipe is connected, the cooling water after heating to be exported.
Cooling water is entered in more cooling water pipes simultaneously by water inlet pipe, and the cooling water in cooling water pipe flows after heating
Enter in return pipe and flow out, stably circulation line is formed by water inlet pipe, cooling water pipe and return pipe, effectively ensured cold
The stability of water process.
4. a kind of test module for the experiment of crimp type IGBT device power cycle provided by the invention, the top pressure are led
The contact surface of bar and the top pressure seat is attached by sphere.
Coordinate compared to traditional plane, the mode of mating spherical surfaces can be easily to top pressure guide rod and the axis of top pressure seat
Position is adjusted, and improves the flexibility of position.
5. a kind of test module for the experiment of crimp type IGBT device power cycle provided by the invention, the water inlet pipe
Air bleeding valve is provided with the outlet pipe.
By air bleeding valve, the gas that can prevent from retaining in water inlet pipe and outlet pipe is saved bit by bit in pipeline, causes cooling water
Can not proper flow phenomenon occur.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The required accompanying drawing used is briefly described in embodiment or description of the prior art, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of described test module provided by the invention；
Fig. 2 is the side view of described test module provided by the invention；
Fig. 3 is the structural representation of described test suite provided by the invention；
Description of reference numerals：
1- test suites；2- device under tests；3- support components；31- lower flanges；32- disk springs；33- pallets；4- top pressures
Component；41- upper flanges；42- top pressure seats；43- top pressure guide rods；44- locking nuts；5- alignment pins；6- water-filled radiators；7- is cooled down
Water pipe；8- water inlet pipes；9- return pipes；10- air bleeding valves；11- guide sleeves；12- insulated tension poles.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, merely to
Be easy to the description present invention and simplify description, rather than instruction or imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" the 3rd " is only used for describing purpose, and it is not intended that instruction or hint relative importance.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
As long as in addition, technical characteristic involved in invention described below different embodiments non-structure each other
It is be combined with each other into conflict can.
Embodiment 1
The present embodiment provides a kind of test module for the experiment of crimp type IGBT device power cycle, including：Test group
Part 1, the test suite 1 include the device under test 2 of multigroup setting that is connected in parallel to each other；Circulation be provided with it is multigroup respectively with often
The cooling water assembly that the individual device under test 2 is connected, cooling water channel described in every group is respectively to coupled device under test 2
Cooled down.
In the prior art, test platform is in be arranged in series to the water route cooled down, and cooling water flows serially through multiple to be measured
IGBT device, when cooling water flows through the IGBT device being located behind, water temperature is very high, now rapid to the cooling capacity of device
Drop.
The test module that the present embodiment provides, it is arranged in parallel between multiple device under tests 2, and on each device under test 2
It is connected with independent cooling water assembly, the cooling procedure between multiple device under tests 2 is not interfere with each other, and effectively prevent existing skill
Occur caused by being arranged in series in art between the cooling water of multiple device under tests 2 the problem of cooling capacity deficiency, can effectively improve
Testing efficiency.
In the present embodiment, the water inlet end of the every cooling water pipe 7 is connected on the water inlet pipe 8 simultaneously；Return pipe 9 connects
The water side of the cooling water pipe 7 is connect, the cooling water after heating to be exported.Meanwhile the water inlet pipe 8 and institute
State outlet pipe and be provided with air bleeding valve 10, the gas that can prevent from retaining in water inlet pipe 8 and outlet pipe is saved bit by bit in pipeline, caused cold
But water can not proper flow phenomenon occur.
In the present embodiment, Matheson and Dresser joint is provided between the water side of the return pipe 9 and the cooling water pipe 7.It is anti-to miss
Head can be water-tight after extraction with fast insert-pull, improves the stability in use of test suite 1.
Specifically, the cooling water assembly includes：Water-filled radiator 6, each device under test 2 is arranged on along height side
To both ends, the internal flow of water-filled radiator 6 has cooling water；Cooling water pipe 7, it is connected with the water-filled radiator 6, institute
Stating cooling water pipe 7 has water inlet end and water side.
In the present embodiment, the test suite 1 includes：Several device under tests 2 being arranged side by side each other along short transverse,
It is connected between several described device under tests 2 by alignment pin 5.Multiple device under tests 2 form device group；Support component 3,
The lower section of the device under test 2 is arranged on, to support the device group；And top pressure component 4, it is arranged on the device to be measured
The top of part 2, to being limited above the device group.
Specifically, the support component 3 includes：Lower flange 31；Disk spring 32, be arranged on the lower flange 31 with it is described
Between device group, to make the device group be adjacent on the top pressure component 4.It is provided with simultaneously in lower flange 31 with apparatus assembly
Pallet 33.
In the present embodiment, the top pressure component 4 includes：Upper flange 41；Top pressure seat 42, it is connected to the axle center of upper flange 41
Place, cover are buckled in the top of the device group；Top pressure guide rod 43, to be pressurizeed to the top pressure seat 42, make the top pressure seat
42 are pressed on the top of the device group；Locking nut, it is arranged between the upper flange 41 and the top pressure guide rod 43, to
Limit the motion of the top pressure guide rod 43.
Guide sleeve 11 is equipped with the center of the upper flange 41, the top pressure guide rod 43 is located in guide sleeve 11, is led to
Cross the kinetic stability that guide sleeve 11 improves top pressure guide rod 43.
In the present embodiment, it is attached between upper flange 41 and lower flange 31 by insulated tension pole 12, it is ensured that structure
Stability.
In the present embodiment, the contact surface of the top pressure guide rod 43 and the top pressure seat 42 is attached by sphere.Compare
Coordinate in traditional plane, the mode of mating spherical surfaces can be carried out easily to the axial location of top pressure guide rod 43 and top pressure seat 42
Adjustment, improves the flexibility of position.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (10)
- A kind of 1. test module for the experiment of crimp type IGBT device power cycle, it is characterised in that including：Test suite (1), the test suite (1) include the device under test (2) of multigroup setting that is connected in parallel to each other；Circulation, it which is provided with multigroup cooling water assembly being connected respectively with each device under test (2), every group of institute Cooling water channel is stated respectively to cool down coupled device under test (2).
- 2. test module according to claim 1, it is characterised in that the test suite (1) includes：Several device under tests being arranged side by side each other along short transverse (2), multiple device under tests (2) form device group；Support component (3), the lower section of the device under test (2) is arranged on, to support the device group；AndTop pressure component (4), the top of the device under test (2) is arranged on, to being limited above the device group.
- 3. test module according to claim 2, it is characterised in that by fixed between several described device under tests (2) Position pin (5) is connected.
- 4. the test module according to Claims 2 or 3, it is characterised in that the cooling water assembly includes：Water-filled radiator (6), it is arranged on both ends of each device under test (2) along short transverse, the water-filled radiator (6) Internal flow has cooling water；Cooling water pipe (7), it is connected with the water-filled radiator (6), the cooling water pipe (7) has water inlet end and water side.
- 5. test module according to claim 4, it is characterised in that the circulation also includes：Water inlet pipe (8), the water inlet end of the every cooling water pipe (7) are connected on the water inlet pipe (8) simultaneously；AndReturn pipe (9), the water side of the cooling water pipe (7) is connected, the cooling water after heating to be exported.
- 6. test module according to claim 2, it is characterised in that the support component (3) includes：Lower flange (31)；Disk spring (32), it is arranged between the lower flange (31) and the device group, be adjacent to the device group On the top pressure component (4).
- 7. test module according to claim 2, it is characterised in that the top pressure component (4) includes：Upper flange (41)；Top pressure seat (42), it is connected at the upper flange (41) axle center, cover is buckled in the top of the device group；Top pressure guide rod (43), to be pressurizeed to the top pressure seat (42), the top pressure seat (42) is set to be pressed on the device The top of group；Locking nut (44), it is arranged between the upper flange (41) and the top pressure guide rod (43), to limit the top pressure The motion of guide rod (43).
- 8. test module according to claim 7, it is characterised in that the top pressure guide rod (43) and the top pressure seat (42) Contact surface be attached by sphere.
- 9. test module according to claim 4, it is characterised in that the water inlet pipe (8) and the outlet pipe are provided with Air bleeding valve (10).
- 10. test module according to claim 5, it is characterised in that the return pipe (9) and the cooling water pipe (7) Water side between be provided with Matheson and Dresser joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710795463.5A CN107783021A (en) | 2017-09-06 | 2017-09-06 | A kind of test module for the experiment of crimp type IGBT device power cycle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710795463.5A CN107783021A (en) | 2017-09-06 | 2017-09-06 | A kind of test module for the experiment of crimp type IGBT device power cycle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107783021A true CN107783021A (en) | 2018-03-09 |
Family
ID=61437576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710795463.5A Pending CN107783021A (en) | 2017-09-06 | 2017-09-06 | A kind of test module for the experiment of crimp type IGBT device power cycle |
Country Status (1)
| Country | Link |
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| CN (1) | CN107783021A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108387831A (en) * | 2018-06-04 | 2018-08-10 | 华北电力大学 | A kind of power cycle pilot system of 3000A semiconductor devices |
| CN108549004A (en) * | 2018-07-03 | 2018-09-18 | 北京智创骏驰电气科技有限公司 | A kind of device testing apparatus |
| CN108646163A (en) * | 2018-06-22 | 2018-10-12 | 华北电力大学 | A kind of power circulation test system of semiconductor devices |
| CN108802590A (en) * | 2018-06-22 | 2018-11-13 | 华北电力大学 | A kind of the power circulation test method and test system of semiconductor devices |
| CN109030878A (en) * | 2018-07-23 | 2018-12-18 | 全球能源互联网研究院有限公司 | A kind of test module of hydraulic installalion structure and its composition |
| CN109521347A (en) * | 2018-10-28 | 2019-03-26 | 北京工业大学 | The synchronous pwm power circulation experiment device of multiple automotive grade IGBT modules |
| CN111239576A (en) * | 2018-11-29 | 2020-06-05 | 株洲中车时代电气股份有限公司 | Constant power cycle test circuit and method based on power loss linear control |
| CN113391183A (en) * | 2021-08-17 | 2021-09-14 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor device temperature characteristic measuring instrument |
| CN114295923A (en) * | 2021-12-22 | 2022-04-08 | 上海临港电力电子研究有限公司 | Testing device and application method of power module |
| CN117148083A (en) * | 2023-06-15 | 2023-12-01 | 杭州高裕电子科技股份有限公司 | SIC power cycle test method |
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| CN104795348A (en) * | 2015-04-29 | 2015-07-22 | 国网智能电网研究院 | High-power crimping type IGBT encapsulation module fixture |
| CN106706963A (en) * | 2015-07-28 | 2017-05-24 | 国网智能电网研究院 | Large power compression type IGBT package module press mounting test clamp |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108387831A (en) * | 2018-06-04 | 2018-08-10 | 华北电力大学 | A kind of power cycle pilot system of 3000A semiconductor devices |
| CN108387831B (en) * | 2018-06-04 | 2024-01-26 | 华北电力大学 | Power cycle test system of 3000A semiconductor device |
| CN108646163A (en) * | 2018-06-22 | 2018-10-12 | 华北电力大学 | A kind of power circulation test system of semiconductor devices |
| CN108802590A (en) * | 2018-06-22 | 2018-11-13 | 华北电力大学 | A kind of the power circulation test method and test system of semiconductor devices |
| CN108646163B (en) * | 2018-06-22 | 2019-08-06 | 华北电力大学 | A kind of power circulation test system of semiconductor devices |
| CN108802590B (en) * | 2018-06-22 | 2019-09-03 | 华北电力大学 | A kind of the power circulation test method and test macro of semiconductor devices |
| CN108549004A (en) * | 2018-07-03 | 2018-09-18 | 北京智创骏驰电气科技有限公司 | A kind of device testing apparatus |
| CN109030878A (en) * | 2018-07-23 | 2018-12-18 | 全球能源互联网研究院有限公司 | A kind of test module of hydraulic installalion structure and its composition |
| CN109521347B (en) * | 2018-10-28 | 2021-11-26 | 北京工业大学 | Synchronous PWM power cycle experimental device for multiple automobile-level IGBT modules |
| CN109521347A (en) * | 2018-10-28 | 2019-03-26 | 北京工业大学 | The synchronous pwm power circulation experiment device of multiple automotive grade IGBT modules |
| CN111239576B (en) * | 2018-11-29 | 2021-08-10 | 株洲中车时代半导体有限公司 | Constant power cycle test circuit and method based on power loss linear control |
| CN111239576A (en) * | 2018-11-29 | 2020-06-05 | 株洲中车时代电气股份有限公司 | Constant power cycle test circuit and method based on power loss linear control |
| CN113391183A (en) * | 2021-08-17 | 2021-09-14 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor device temperature characteristic measuring instrument |
| CN113391183B (en) * | 2021-08-17 | 2021-11-19 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor device temperature characteristic measuring instrument |
| CN114295923A (en) * | 2021-12-22 | 2022-04-08 | 上海临港电力电子研究有限公司 | Testing device and application method of power module |
| CN114295923B (en) * | 2021-12-22 | 2023-06-16 | 上海临港电力电子研究有限公司 | Testing device and application method of power module |
| CN117148083A (en) * | 2023-06-15 | 2023-12-01 | 杭州高裕电子科技股份有限公司 | SIC power cycle test method |
| CN117148083B (en) * | 2023-06-15 | 2024-03-08 | 杭州高裕电子科技股份有限公司 | SIC power cycle test method |
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Application publication date: 20180309 |
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