CN107779152A - Pre- impregnation composition epoxy resin, diamond dotted insulating paper and their preparation method - Google Patents
Pre- impregnation composition epoxy resin, diamond dotted insulating paper and their preparation method Download PDFInfo
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- CN107779152A CN107779152A CN201711098668.4A CN201711098668A CN107779152A CN 107779152 A CN107779152 A CN 107779152A CN 201711098668 A CN201711098668 A CN 201711098668A CN 107779152 A CN107779152 A CN 107779152A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Insulating Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
The embodiment of the invention discloses a kind of pre- impregnation composition epoxy resin, diamond dotted insulating paper and their preparation method.A kind of pre- impregnation composition epoxy resin, its raw material prepared include：Epoxy resin, latent curing agent, accelerator and solvent；Wherein, solvent includes first kind solvent, the second class solvent and the 3rd class solvent, first kind solvent is the one or more in acetone, ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene, second class solvent is N, N dimethylformamides, the 3rd class solvent are the one or more in acetone, ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene.By the above-mentioned means, the pre- impregnation of the embodiment of the present invention is adapted to the transfer of applying glue anilox roll with composition epoxy resin, and storage cycle is longer under normal temperature.
Description
Technical field
The present embodiments relate to electrical insulating material field, more particularly to a kind of pre- impregnation epoxy composite
Thing, diamond dotted insulating paper and their preparation method.
Background technology
Epoxy resin has good physics, chemical property, and its surface to metal and nonmetallic materials has excellent
Adhesive strength, dielectric properties are good, and deformation retract rate is small, and good stability of the dimension, pliability is preferable, to most of solvent-stable,
Thus it is widely used in the fields such as adhesives, electronic material, composite.
The coil windings interlayer of transformer increases distance by using insulating materials, to ensure excellent electric property.
The insulating materials that existing market is used has diamond dotted brown paper, diamond dotted aramid paper, a kind of diamond dotted DMD (polyesters
Film nonwoven polyester fabric composite flexible material), diamond dotted polyester film etc., its preparation method is by by insulating materials
Uniformly glue material in the insulation of rule is formed after the gluing of certain composition epoxy resin.
Because the performance of the insulation sized paper depends greatly on the performance of composition epoxy resin, therefore ring
Application and development of the quality good or not, cost height of epoxy resin composition for the sized paper that insulate are significant.
The content of the invention
The embodiment of the present invention is mainly solving the technical problems that provide a kind of pre- impregnation composition epoxy resin, water chestnut lattice
Gluing machine and their preparation method, pre- impregnation are adapted to the transfer of applying glue anilox roll with the viscosity of composition epoxy resin,
And storage cycle is longer under normal temperature.
In order to solve the above technical problems, the technical scheme that the embodiment of the present invention uses is：First aspect, there is provided one
The pre- impregnation composition epoxy resin of kind, its raw material prepared include：
Epoxy resin, latent curing agent, accelerator and solvent；
Wherein, solvent includes first kind solvent, the second class solvent and the 3rd class solvent, first kind solvent be selected from acetone,
One or more in ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene, the second class solvent are N, N- dimethyl formyls
Amine, the 3rd class solvent are the one or more in acetone, ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene；
The mass ratio of epoxy resin and first kind solvent is 50:50~70；
The mass ratio of latent curing agent and the second class solvent is 1:3~5；
The quality sum of epoxy resin and first kind solvent, the matter with latent curing agent, accelerator and the second class solvent
Sum is measured, the ratio of the two is 100:5~25；
The quality of 3rd class solvent, the quality sum with epoxy resin and first kind solvent, the ratio of the two are 10~15:
100。
Alternatively, epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy resin
Kind is a variety of.
Alternatively, latent curing agent is spread out selected from dicyandiamide, modified soluble dicyandiamide, diaminodiphenylsulfone, ureas
One or more in biology, imidazole curing agent.
Alternatively, accelerator is the one or more in carbamide derivative, improvement imidazoles, fatty organic amine.
Second aspect, the embodiment of the present invention also provide a kind of system of pre- impregnation composition epoxy resin as described above
Preparation Method, comprise the following steps：
(a) by epoxy resin and first kind solvent according to 50:50~70 mass ratio stirs, and forms component A；
(b) by latent curing agent and the second class solvent according to 1:3~5 mass ratio stirs, then plus promotion
Agent, form component B；
(c) by component A and component B according to 100:5~25 mass ratio is well mixed, and is diluted, is obtained plus the 3rd class solvent
To pre- impregnation composition epoxy resin, wherein, the 3rd class solvent and component A mass ratio are 10~15:100.
Alternatively, in step (c) component A, component B and the 3rd class solvent 15~35 DEG C, stir 30~60min article
After being well mixed under part, the viscosity of obtained pre- impregnation composition epoxy resin is 200~1000mPa ﹒ s.
The third aspect, the embodiment of the present invention also provide a kind of modified insulating paper, and the modification insulating paper is a kind of cellulose
Paper, be modified to be formed by aromatic polyamide fibre, specifically, by cellulose pulp and aromatic polyamide fibre by netted bonding and
Into.
Fourth aspect, the embodiment of the present invention also provide a kind of diamond dotted insulating paper, including insulating paper and coated in insulation
Pre- impregnation composition epoxy resin on paper, pre- impregnation are pre- impregnation epoxy as described above with composition epoxy resin
Resin combination.
Alternatively, insulating paper is modified insulating paper as described above
5th aspect, the embodiment of the present invention also provide a kind of preparation method of diamond dotted insulating paper, including following step
Suddenly：
The pre- impregnation composition epoxy resin as discussed prepared is launched into glue groove, reticulate pattern will be glued
Roller rotates in glue groove；
The upper and lower surface of insulating paper is glued by being glued anilox roll, pre- impregnation is transferred to composition epoxy resin
Insulating paper surface, after drying process, cooling technique, winding obtains diamond dotted insulating paper on insulating paper surface.
Alternatively, be glued the surface of anilox roll by laser engraving into water chestnut trellis shape, the length of sides of water chestnut lattice for 9.5 ±
0.1mm, the distance between water chestnut lattice and water chestnut lattice are 6.4 ± 0.1mm, and water chestnut lattice are with roll shaft face into 25 °~45 °；
The resin added for being glued anilox roll is 10~20g/m2。
Alternatively, drying process, cooling technique are passed through in insulating paper surface, including：
After the one side of insulating paper carries out first time applying glue, dried through first time, the drying tunnel dried for the first time is 4 sections, is often saved
Temperature be 75~80~85~90 DEG C, wherein, the temperature often saved allows the tolerance for having ± 5 DEG C；
Then the another side of insulating paper carries out second of applying glue again, is dried through second, and second of drying tunnel dried is 7
Section, the temperature often saved is 45~55~65~75~80~85~90 DEG C, wherein, the temperature often saved allows the public affairs for having ± 5 DEG C
Difference；
Cooling technique is carried out again, and the temperature of cooling technique is 15~20 DEG C.
The beneficial effect of the embodiment of the present invention is：The situation of prior art is different from, the pre- impregnation of the embodiment of the present invention is used
Composition epoxy resin, its raw material prepared include：Epoxy resin, latent curing agent, accelerator and solvent；Wherein, it is molten
Agent includes first kind solvent, the second class solvent and the 3rd class solvent, and the viscosity of the pre- impregnation composition epoxy resin is 200
~1000mPa ﹒ s, it is adapted to the transfer of applying glue anilox roll, and storage cycle is longer under normal temperature.
Specific embodiment
In order that the purpose of the present invention, method scheme and advantage are more clearly understood, with reference to embodiments, to this hair
It is bright to be further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, and do not have to
It is of the invention in limiting.
Term "and/or" used in this specification includes the arbitrary and institute of one or more related Listed Items
Some combinations.In addition, as long as technical characteristic involved in invention described below different embodiments is each other not
Conflict can is formed to be combined with each other.
In a first aspect, the embodiment of the present invention provides a kind of pre- impregnation composition epoxy resin, its raw material bag prepared
Include：Epoxy resin, latent curing agent, accelerator and solvent.
Alternatively, epoxy resin is one in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy resin
Kind is a variety of.Wherein, the epoxide equivalent of epoxy resin is 185~1250；In some preferred embodiments, epoxy resin
Epoxide equivalent is 213~833.
Alternatively, latent curing agent is spread out selected from dicyandiamide, modified soluble dicyandiamide, diaminodiphenylsulfone, ureas
One or more in biology, imidazole curing agent；In some preferred embodiments, latent curing agent is modified soluble
Dicyandiamide and/or diaminodiphenylsulfone.
Alternatively, accelerator is the one or more in carbamide derivative, improvement imidazoles, acid anhydrides, fatty amines；
In some preferred embodiments, accelerator is modified imidazole and/or carbamide derivative.
Solvent includes first kind solvent, the second class solvent and the 3rd class solvent, wherein, first kind solvent be selected from acetone,
One or more in ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene, the second class solvent are N, N- dimethyl formyls
Amine, the 3rd class solvent are the one or more in acetone, ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene, the
A kind of solvent and the 3rd class solvent can be with identical or differ.In some preferred embodiments, first kind solvent is acetone
And/or ethyl acetate, the 3rd class solvent are acetone and/or ethyl acetate,
In the above-described embodiments, the mass ratio of epoxy resin and first kind solvent is 50:50~70, latent curing agent
Mass ratio with the second class solvent is 1:3~5.
The quality sum of epoxy resin and first kind solvent, the matter with latent curing agent, accelerator and the second class solvent
Sum is measured, the ratio of the two is 100:5~25.
The quality of 3rd class solvent, the quality sum with epoxy resin and first kind solvent, the ratio of the two are 10~15:
100。
Wherein, the addition of accelerator prepares the normal of pre- impregnation composition epoxy resin using those skilled in the art
Addition is advised, in the present embodiment, the mass ratio of accelerator and latent curing agent is 1:5~20.
The viscosity of the pre- impregnation composition epoxy resin of the present embodiment is 200~1000mPa ﹒ s, is adapted to applying glue reticulate pattern
The transfer of roller, pre- impregnation is attached on insulating paper with composition epoxy resin, and can kept at normal temperatures 3~6 months,
Storage cycle is longer.
Second aspect, the embodiment of the present invention also provide the preparation method of above-mentioned pre- impregnation composition epoxy resin, including
Following steps：
(a) by epoxy resin and first kind solvent according to 50:50~70 mass ratio stirs, and forms component A；
(b) by latent curing agent and the second class solvent according to 1:3~5 mass ratio stirs, then plus promotion
Agent, form component B；
(c) by component A and component B according to 100:5~25 mass ratio is well mixed, along with the 3rd class solvent dilutes,
Pre- impregnation composition epoxy resin is obtained, wherein, the 3rd class solvent and the component A mass ratio are 10~15:100.
Alternatively, in step (c) component A, component B and the 3rd class solvent 15~35 DEG C, stir 30~60min article
After being well mixed under part, the viscosity of obtained pre- impregnation composition epoxy resin is 200~1000mPa ﹒ s, at normal temperatures may be used
To be kept for 3~6 months.
The third aspect, the embodiment of the present invention also provide a kind of modified insulating paper, and the modification insulating paper is a kind of cellulose
Paper, it is modified to be formed by aromatic polyamide fibre, specifically, by the cellulose pulp with high-quality electric property and gathers fragrant acyl
Amine fiber forms by netted bonding, with current cellulose paper, such as brown paper and heat modification brown paper, compares, mechanicalness
Energy, electric property greatly improve, and insulation life is longer.
The density of the modification insulating paper is 0.9~1.1g/cc, 70~175N/cm of tensile strength (MD=longitudinal directions) and 17~
42N/cm (XD=is horizontal), elongation percentage 2.2~2.8% (MD) and 6.9~9.5% (XD).
Fourth aspect, the embodiment of the present invention also provide a kind of diamond dotted insulating paper, including insulating paper and coated in insulation
Pre- impregnation composition epoxy resin on paper, wherein, pre- impregnation is above-mentioned pre- impregnation epoxy with composition epoxy resin
Resin combination.
Alternatively, insulating paper is above-mentioned modification insulating paper, and mechanical performance, electric property are more excellent.
Alternatively, pre- impregnation is with two sides of the composition epoxy resin coated in insulating paper.
The diamond dotted insulating paper of the present embodiment is pollution-free, there is normal temperature not glue, high temperature self-adhesion, applied to transformation
It is good with transformer oil compatibility during the coil windings of device, the bonding of winding neighboring layers can be made to add winding into an entirety
Insulating reliability.
5th aspect, the embodiment of the present invention also provide the preparation method of above-mentioned diamond dotted insulating paper, including following step
Suddenly：
The above-mentioned pre- impregnation composition epoxy resin prepared is launched into glue groove, by applying glue anilox roll in glue groove
Middle rotation, the water chestnut grid cave of anilox roll is glued in rotation process can be saturated with pre- impregnation composition epoxy resin, then pass through applying glue
Anilox roll is glued to the upper and lower surface of insulating paper, pre- impregnation is transferred to insulating paper surface with composition epoxy resin, is insulated
After drying process, cooling technique, winding obtains diamond dotted insulating paper on paper surface.
Alternatively, be glued the surface of anilox roll by laser engraving into water chestnut trellis shape, the length of sides of water chestnut lattice for 9.5 ±
0.1mm, the distance between water chestnut lattice and water chestnut lattice are 6.4 ± 0.1mm, water chestnut lattice with roll shaft face into 25 °~45 °, the applying glue anilox roll
Resin added is 10~20g/m2.In a preferred embodiment, water chestnut lattice and roll shaft face are at 45 °.
Wherein, insulating paper surface specifically includes by drying process, cooling technique：
After the one side of insulating paper carries out first time applying glue, dried through first time, the drying tunnel dried for the first time is 4 sections, is often saved
Temperature be 75~80~85~90 DEG C, wherein, the temperature often saved allows the tolerance for having ± 5 DEG C；
Then the another side of insulating paper carries out second of applying glue again, is dried through second, and second of drying tunnel dried is 7
Section, the temperature often saved is 45~55~65~75~80~85~90 DEG C, wherein, the temperature often saved allows the public affairs for having ± 5 DEG C
Difference；
Cooling technique is carried out again, and the temperature of cooling technique is 15~20 DEG C.
This preparation method cure cycle is short, energy-conservation, and the thickness of the glue for the diamond dotted insulating paper being prepared is per face
0.005~0.01mm, glue amount is per 5~10g/m of face2.Diamond dotted insulating paper is consolidated under 92 DEG C/90min condition of cure
Change, be incubated at 100 DEG C 30~60min progress cohesive force tests after the completion of solidification, cohesive force can reach 650Kpa with
On.
Diamond dotted insulating paper carries out temperature rise curing molding after bag superimposing thread circle, makes the neighboring layers structure of winding reliable
Into certain fixed cell, the bonding strength of epoxy glue can prevent the displacement of each layer of winding, ensure that the machine of material for low bonding
Tool electrical property reliability.There is certain gap space the part not glued, can strengthen the radiating effect of diamond dotted insulating paper,
The immersion of oil and other discharges are ensure that, corona and partial discharge is effectively avoided, ensure that the safety of insulation system.
Below by way of specific embodiment and comparative example to the present embodiments relate to pre- impregnation epoxy resin group
Compound and diamond dotted insulating paper illustrate.
Embodiment 1
(a) by liquid bisphenol A (epoxide equivalent=185~250) epoxy resin and solid bisphenol A epoxy resin, (epoxy is worked as
Amount=550~1000) according to quality parts ratio 5：45 mixing, the acetone solution of 50 parts of quality is then added, forms component A；
(b) by the soluble dicyandiamide of latent curing agent-modification and polar solvent N,N-dimethylformamide according to 1:3
Mass ratio stir, then plus accelerator 2-methylimidazole, accelerator dosage is the 25% of modified soluble dicyandiamide
(mass fraction), form B component；
(c) by component A, component B, acetone in mass ratio 100：5：10 are well mixed at 35 DEG C, stir 60min, obtain
Pre- impregnation with the viscosity of composition epoxy resin be 400mPa ﹒ s, the viscosity is adapted to the transfer for being glued anilox roll.
Embodiment 2
The pre- impregnation composition epoxy resin that embodiment 1 is prepared is launched into glue groove, using two applying glue reticulate patterns
Roller rotates in glue groove, wherein, the size length of side of applying glue anilox roll water chestnut lattice is 9.5 ± 0.1mm, between the water chestnut lattice of engraving away from
From being 6.4 ± 0.1mm, water chestnut lattice and roll shaft face are at 45 °, and the mesh number for being glued anilox roll is 45 mesh.
The water chestnut grid cave of anilox roll is glued in rotation process can be saturated with pre- impregnation composition epoxy resin, insulating paper warp
When crossing applying glue anilox roll, the pre- impregnation composition epoxy resin in water chestnut lattice can be transferred to insulating paper surface, insulating paper surface
After drying process, cooling technique, winding obtains diamond dotted insulating paper.
In the present embodiment, drying process is after the one side of insulating paper carries out first time applying glue, to be dried through first time, first
The drying tunnel of secondary drying is 4 sections, and the temperature often saved is 70~80~80~85 DEG C；Then the another side of insulating paper carries out second again
Secondary applying glue, dried through second, second of drying tunnel dried is 7 sections, and the temperature often saved is 40~50~60~65~75~80
~85 DEG C, then cooling technique is carried out, the temperature of cooling technique is 15~20 DEG C, and finally winding obtains diamond dotted insulating paper.
The diamond dotted insulating paper is solidified under 92 DEG C/90min condition of cure, will at 100 DEG C after the completion of solidification
It is incubated 30~60min and carries out cohesive force test, cohesive force 670Kpa.
Embodiment 3
(a) by liquid bisphenol F (epoxide equivalent=160~185) epoxy resin and solid bisphenol A epoxy resin, (epoxy is worked as
Amount=800~1200) according to quality parts ratio 2：48 mixing, the ethyl acetate dissolving of 50 parts of quality is then added, forms A groups
Point；
(b) by latent curing agent-dicyandiamide and polar solvent N,N-dimethylformamide according to 1:4 mass ratio stirs
Mix uniformly, then plus accelerant N-acetyl imidazole, accelerator dosage is 15% (mass fraction) of dicyandiamide, forms B groups
Point；
(c) by component A, component B, acetone in mass ratio 100：7：15 are well mixed at 35 DEG C, stir 60min, obtain
Pre- impregnation with the viscosity of composition epoxy resin be 350mPa ﹒ s, the viscosity is adapted to the transfer for being glued anilox roll.
Embodiment 4
The pre- impregnation composition epoxy resin that embodiment 3 is prepared is launched into glue groove, using two applying glue reticulate patterns
Roller rotates in glue groove, wherein, the size length of side of applying glue anilox roll water chestnut lattice is 9.5 ± 0.1mm, between the water chestnut lattice of engraving away from
From being 6.4 ± 0.1mm, water chestnut lattice and roll shaft face are at 45 °, and the mesh number for being glued anilox roll is 75 mesh.
The water chestnut grid cave of anilox roll is glued in rotation process can be saturated with pre- impregnation composition epoxy resin, insulating paper warp
When crossing applying glue anilox roll, the pre- impregnation composition epoxy resin in water chestnut lattice can be transferred to insulating paper surface, insulating paper surface
After drying process, cooling technique, winding obtains diamond dotted insulating paper.
In the present embodiment, drying process is after the one side of insulating paper carries out first time applying glue, to be dried through first time, first
The drying tunnel of secondary drying is 4 sections, and the temperature often saved is 75~75~80~80 DEG C；Then the another side of insulating paper carries out second again
Secondary applying glue, dried through second, second of drying tunnel dried is 7 sections, and the temperature often saved is 45~50~55~60~70~85
~85 DEG C, then cooling technique is carried out, the temperature of cooling technique is 15~20 DEG C, and finally winding obtains diamond dotted insulating paper.
The diamond dotted insulating paper is solidified under 92 DEG C/90min condition of cure, will at 100 DEG C after the completion of solidification
It is incubated 30~60min and carries out cohesive force test, cohesive force 700Kpa.
Embodiment 5
(a) by liquid bisphenol F (epoxide equivalent=160~185) epoxy resin and solid phenol-formaldehyde epoxy resin, (epoxy is worked as
Amount=200~600) according to quality parts ratio 3：47 mixing, the ethyl acetate dissolving of 50 parts of quality is then added, forms A groups
Point；
(b) by latent curing agent-dicyandiamide and polar solvent N,N-dimethylformamide according to 1:5 mass ratio stirs
Mix uniformly, then plus ureas diphenylguanidine yhard UR200, accelerator dosage is 5% (mass fraction) of dicyandiamide, is formed
B component；
(c) by component A, component B, acetone in mass ratio 100：20：15 are well mixed at 25 DEG C, stir 45min, obtain
To pre- impregnation with the viscosity of composition epoxy resin be 550mPa ﹒ s, the viscosity is adapted to the transfer for being glued anilox roll.
Embodiment 6
The pre- impregnation composition epoxy resin that embodiment 5 is prepared is launched into glue groove, using two applying glue reticulate patterns
Roller rotates in glue groove, wherein, the size length of side of applying glue anilox roll water chestnut lattice is 9.5 ± 0.1mm, between the water chestnut lattice of engraving away from
From being 6.4 ± 0.1mm, water chestnut lattice and roll shaft face are at 45 °, and the mesh number for being glued anilox roll is 55 mesh.
The water chestnut grid cave of anilox roll is glued in rotation process can be saturated with pre- impregnation composition epoxy resin, insulating paper warp
When crossing applying glue anilox roll, the pre- impregnation composition epoxy resin in water chestnut lattice can be transferred to insulating paper surface, insulating paper surface
After drying process, cooling technique, winding obtains diamond dotted insulating paper.
In the present embodiment, drying process is after the one side of insulating paper carries out first time applying glue, to be dried through first time, first
The drying tunnel of secondary drying is 4 sections, and the temperature often saved is 70~75~80~85 DEG C；Then the another side of insulating paper carries out second again
Secondary applying glue, dried through second, second of drying tunnel dried is 7 sections, and the temperature often saved is 45~50~50~55~65~75
~85 DEG C, then cooling technique is carried out, the temperature of cooling technique is 15~20 DEG C, and finally winding obtains diamond dotted insulating paper.
The diamond dotted insulating paper is solidified under 92 DEG C/90min condition of cure, will at 100 DEG C after the completion of solidification
It is incubated 30~60min and carries out cohesive force test, cohesive force 750Kpa.
Embodiments of the invention are the foregoing is only, not thereby limit the scope of the present invention, it is every to be said using the present invention
The equivalent structure or equivalent flow conversion that bright book content is made, or other related technical areas are directly or indirectly used in,
Similarly include within the scope of the present invention.
Claims (10)
1. a kind of pre- impregnation composition epoxy resin, it is characterised in that its raw material prepared includes：
Epoxy resin, latent curing agent, accelerator and solvent；
Wherein, the solvent includes first kind solvent, the second class solvent and the 3rd class solvent, and the first kind solvent is to be selected from third
One or more in ketone, ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene, the second class solvent are N, N- diformazans
Base formamide, the 3rd class solvent are one kind in acetone, ethyl acetate, methyl acetate, butanone, toluene, dimethylbenzene
It is or a variety of；
The mass ratio of the epoxy resin and the first kind solvent is 50:50~70；
The mass ratio of the latent curing agent and the second class solvent is 1:3~5；
The quality sum of the epoxy resin and the first kind solvent, with the latent curing agent, the accelerator and institute
The quality sum of the second class solvent is stated, the ratio of the two is 100:5~25；
The quality of the 3rd class solvent, the quality sum with the epoxy resin and the first kind solvent, the ratio of the two are
10~15:100.
2. pre- impregnation composition epoxy resin according to claim 1, it is characterised in that
The epoxy resin is the one or more in bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy resin.
3. pre- impregnation composition epoxy resin according to claim 1, it is characterised in that
The latent curing agent is selected from dicyandiamide, modified soluble dicyandiamide, diaminodiphenylsulfone, carbamide derivative, miaow
One or more in azoles curing agent.
4. pre- impregnation composition epoxy resin according to claim 1, it is characterised in that
The accelerator is the one or more in carbamide derivative, improvement imidazoles, fatty organic amine.
5. a kind of preparation method of pre- impregnation composition epoxy resin as described in claim any one of 1-4, its feature exist
In comprising the following steps：
(a) by the epoxy resin and the first kind solvent according to 50:50~70 mass ratio stirs, and forms component A；
(b) by the latent curing agent and the second class solvent according to 1:3~5 mass ratio stirs, and then adds
The accelerator, form component B；
(c) by the component A and the component B according to 100:5~25 mass ratio is well mixed, plus the 3rd class solvent
Dilution, obtains pre- impregnation composition epoxy resin, wherein, the 3rd class solvent and component A mass ratio for 10~
15:100。
6. preparation method according to claim 5, it is characterised in that
Component A described in the step (c), the component B and the 3rd class solvent are in 15~35 DEG C, 30~60min of stirring
Under conditions of be well mixed after, the viscosity of obtained pre- impregnation composition epoxy resin is 200~1000mPa ﹒ s.
7. a kind of diamond dotted insulating paper, including insulating paper and coated in the pre- impregnation epoxy composite on the insulating paper
Thing, it is characterised in that the pre- impregnation is with the pre- impregnation epoxy described in composition epoxy resin is claim any one of 1-4
Resin combination.
8. a kind of preparation method of diamond dotted insulating paper, it is characterised in that comprise the following steps：
The pre- impregnation composition epoxy resin as described in claim any one of 1-4 prepared is launched into glue groove, will
Applying glue anilox roll rotates in glue groove；
The upper and lower surface of insulating paper is glued by the applying glue anilox roll, the pre- impregnation is shifted with composition epoxy resin
To the insulating paper surface, after drying process, cooling technique, winding obtains diamond dotted insulating paper on insulating paper surface.
9. preparation method according to claim 8, it is characterised in that
By laser engraving into water chestnut trellis shape, the length of sides of water chestnut lattice be 9.5 ± 0.1mm on the surface of the applying glue anilox roll, water chestnut lattice and
The distance between water chestnut lattice are 6.4 ± 0.1mm, and water chestnut lattice are with roll shaft face into 25 °~45 °；
The resin added of the applying glue anilox roll is 10~20g/m2。
10. preparation method according to claim 8, it is characterised in that the insulating paper surface is by drying process, cooling
Technique, including：
After the one side of the insulating paper carries out first time applying glue, to be dried through first time, the drying tunnel that the first time is dried is 4 sections,
The temperature often saved is 75~80~85~90 DEG C, wherein, the temperature often saved allows the tolerance for having ± 5 DEG C；
Then the another side of the insulating paper carries out second of applying glue again, is dried through second, second of drying tunnel dried
For 7 sections, the temperature often saved is 45~55~65~75~80~85~90 DEG C, wherein, the temperature often saved allows the public affairs for having ± 5 DEG C
Difference；
Cooling technique is carried out again, and the temperature of the cooling technique is 15~20 DEG C.
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