CN107778842A - A kind of special weather-resistant pu composite of circuit board - Google Patents

A kind of special weather-resistant pu composite of circuit board Download PDF

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Publication number
CN107778842A
CN107778842A CN201711090252.8A CN201711090252A CN107778842A CN 107778842 A CN107778842 A CN 107778842A CN 201711090252 A CN201711090252 A CN 201711090252A CN 107778842 A CN107778842 A CN 107778842A
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parts
composite
circuit board
resistant
special weather
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李长峰
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ANHUI RUIFA COMPOSITES MANUFACTURING Co Ltd
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ANHUI RUIFA COMPOSITES MANUFACTURING Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/02—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonates or saturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
    • C08G18/3897—Low-molecular-weight compounds having heteroatoms other than oxygen containing heteroatoms other than oxygen, halogens, nitrogen, sulfur, phosphorus or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
    • C08G18/4269—Lactones
    • C08G18/4277—Caprolactone and/or substituted caprolactone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/6576—Compounds of group C08G18/69
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C08G18/698—Mixtures with compounds of group C08G18/40
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a kind of special weather-resistant pu composite of circuit board, its raw material includes by weight：23 48 parts of polycaprolactone diols, 10 28 parts of end hydroxy butadiene, polyadipate 1,2 pairs of 10 28 parts of (methylol) carborane esters, 45 100 parts of IPDI, 10 15 parts of dimethythiotoluene diamine, 3 10 parts of mutual-amido two polyaniline, 2,18 parts of 4 dimethyl, 2,4 pentanediol, 29 parts of modified filler, 1 4.8 parts of galapectite, 2 10 parts of basalt fibre, 0.5 1.8 parts of catalyst, 0.1 0.3 parts of N (4 aniiinophenyl) maleimide, 13 parts of γ glycidyl ether oxygen propyls trimethyl silane.The special weather-resistant pu composite of circuit board proposed by the present invention, it has excellent heat resistance and resistance to ag(e)ing, and intensity is high, service life length.

Description

A kind of special weather-resistant pu composite of circuit board
Technical field
The present invention relates to circuit board material technical field, more particularly to a kind of special weather-resistant pu composite wood of circuit board Material.
Background technology
Polyurethane not only possesses high-tension, high-tensile strength and the tough characteristic of brilliance, and is ripe environment-friendly materials, mesh It is preceding to be widely used in the fields such as electronic apparatus, automobile, articles for daily use.As the requirement on the market for electronic product has gently Quantify, trend toward miniaturization, wherein have high heat-resisting requirement again to electrical and electronic component and automobile electronics, but polyurethane Heat resistance is poor, easy to aging in use, mechanical properties decrease is obvious under long-term hot conditions in circuit board, significantly Reduce the service life of circuit board.
The content of the invention
Based on technical problem existing for background technology, it is compound that the present invention proposes a kind of special weather-resistant pu of circuit board Material, it has excellent heat resistance and resistance to ag(e)ing, and intensity is high, service life length.
The special weather-resistant pu composite of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly- Caprolactone dihydric alcohol 23-48 parts, end hydroxy butadiene 10-28 parts, double (methylol) the carborane ester 10- of polyadipate -1,2- 28 parts, IPDI 45-100 parts, dimethythiotoluene diamine 10-15 parts, mutual-amido two polyaniline 3-10 parts, 2, 4- dimethyl -2,4-PD 1-8 parts, modified filler 2-9 parts, galapectite 1-4.8 parts, basalt fibre 2-10 parts, catalyst 0.5-1.8 parts, N- (4- aniiinophenyls) maleimide 0.1-0.3 parts, γ-glycidyl ether oxygen propyl trimethyl silane 1- 3 parts.
Preferably, the modified filler is prepared according to following technique：By γ-(methacryloxy) propyl group front three TMOS and benzoyl peroxide are well mixed, and are added in PLA in the then input double screw extruder that stirs and are carried out Reactive extrursion, then add in chloroform, add in ethanol and precipitate after drying, filter, be dried to obtain intermediate；By intermediate Add in ethanol, be stirring evenly and then adding into oxalic acid, nano-calcium carbonate and nano silicon, the stirring reaction 3- at 55-65 DEG C 5h, reaction terminate after through filtering, washing, being dried to obtain the modified filler.
Preferably, in the preparation process of modified filler, the weight of γ-(methacryloxy) propyl trimethoxy silicane Measure the 1.5-2.5% of the weight for PLA.
Preferably, in the preparation process of modified filler, intermediate, nano-calcium carbonate, the weight ratio of nano silicon For 2-10：30-50：45-70.
Preferably, double screw extruder each section of temperature setting from head is respectively 155-160 DEG C, 165-170 DEG C, 160- 165℃、155-160℃、145-150℃。
Preferably, the galapectite is the galapectite of load N- isopropyls-N '-diphenyl-para-phenylene diamine.
Preferably, the catalyst is salicylic acid, 1,2- methylimidazoles, 2,2- dual-morpholinyl diethyl ethers, octanoic acid Asia One or more kinds of mixtures in tin.
The special weather-resistant pu composite of circuit board of the present invention, it is gathered with polycaprolactone diols, terminal hydroxy group Double (methylol) the carborane esters of butadiene, polyadipate -1,2- and IPDI are raw material, are keeping polyurethane Assign composite excellent heat resistance, intensity and resistance to ag(e)ing while cryogenic property；The preparation of preferred embodiment modified filler During, first using γ-(methacryloxy) propyl trimethoxy silicane and PLA as raw material, by controlling reaction Condition, γ-(methacryloxy) propyl trimethoxy silicane and PLA is set to have been obtained middle there occurs graft reaction Thing, after intermediate is mixed with nano-calcium carbonate and nano silicon, intermediate is to nano-calcium carbonate and nano silicon Modified, improve the surface nature of nano-calcium carbonate and nano silicon, obtained modified filler, be added into body In system, it is uniformly dispersed in system, it is strong with the adhesion of matrix, significantly improve tensile strength, the bending strength of composite And impact strength；In mutual-amido two polyaniline addition system, it can be acted on γ-glycidyl ether oxygen propyl trimethyl silane, with N- (4- aniiinophenyls) maleimide and galapectite, basalt fibre significantly improve the ageing-resistant of composite after coordinating Property.
Embodiment
Below, technical scheme is described in detail by specific embodiment.
Embodiment 1
The special weather-resistant pu composite of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly- Double 28 parts of (methylol) the carborane esters of 48 parts of caprolactone dihydric alcohol, 10 parts of end hydroxy butadiene, polyadipate -1,2-, different Buddhist 45 parts of that ketone diisocyanate, 15 parts of dimethythiotoluene diamine, 3 parts of mutual-amido two polyaniline, 2,4- dimethyl -2,4-PD 8 parts, 9 parts of modified filler, 1 part of galapectite, 10 parts of basalt fibre, 0.5 part of catalyst, N- (4- aniiinophenyls) maleimide 0.3 part of amine, γ -1 part of glycidyl ether oxygen propyl trimethyl silane.
Embodiment 2
The special weather-resistant pu composite of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly- Double 10 parts of (methylol) the carborane esters of 23 parts of caprolactone dihydric alcohol, 28 parts of end hydroxy butadiene, polyadipate -1,2-, different Buddhist You are 100 parts of ketone diisocyanate, 10 parts of dimethythiotoluene diamine, 10 parts of mutual-amido two polyaniline, 2,4- dimethyl -2,4- penta 2 1 part of alcohol, 2 parts of modified filler, 4.8 parts of galapectite, 2 parts of basalt fibre, 1.8 parts of catalyst, N- (4- aniiinophenyls) Malaysia 0.1 part of acid imide, γ -3 parts of glycidyl ether oxygen propyl trimethyl silane.
Embodiment 3
The special weather-resistant pu composite of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly- Double 26 parts of (methylol) the carborane esters of 43 parts of caprolactone dihydric alcohol, 17 parts of end hydroxy butadiene, polyadipate -1,2-, different Buddhist You are 60 parts of ketone diisocyanate, 13.8 parts of dimethythiotoluene diamine, 4.8 parts of mutual-amido two polyaniline, 2,4- dimethyl -2,4- penta 6.9 parts of glycol, 4 parts of modified filler, 4.3 parts of galapectite, 5 parts of basalt fibre, 1.3 parts of salicylic acid, N- (4- aniiinophenyls) 0.12 part of maleimide, γ -2.7 parts of glycidyl ether oxygen propyl trimethyl silane；
Wherein, the modified filler is prepared according to following technique：By γ-(methacryloxy) propyl group trimethoxy Base silane and benzoyl peroxide are well mixed, and are added in PLA in the then input double screw extruder that stirs and are carried out instead It should extrude, wherein, the weight of γ-(methacryloxy) propyl trimethoxy silicane is the 1.5% of the weight of PLA, double Screw extruder each section of temperature setting from head is respectively 155 DEG C, 170 DEG C, 160 DEG C, 160 DEG C, 145 DEG C, then adds three In chloromethanes, add in ethanol and precipitate after drying, filter, be dried to obtain intermediate；Intermediate is added in ethanol, stirred Oxalic acid, nano-calcium carbonate and nano silicon are added afterwards, wherein, intermediate, nano-calcium carbonate, the weight of nano silicon Than for 10：30：70, the stirring reaction 3h at 65 DEG C, reaction terminate after through filtering, washing, being dried to obtain the modified filler；
The galapectite is the galapectite of load N- isopropyls-N '-diphenyl-para-phenylene diamine.
Embodiment 4
The special weather-resistant pu composite of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly- Double 15 parts of (methylol) the carborane esters of 25 parts of caprolactone dihydric alcohol, 23 parts of end hydroxy butadiene, polyadipate -1,2-, different Buddhist 87 parts of that ketone diisocyanate, 12 parts of dimethythiotoluene diamine, 9 parts of mutual-amido two polyaniline, 2,4- dimethyl -2,4-PD 2 parts, 8.2 parts of modified filler, 1.7 parts of galapectite, 8.6 parts of basalt fibre, 0.9 part of DMIZ 1,2 dimethylimidazole, N- (4- anilino-s Phenyl) 0.26 part of maleimide, γ -1.7 parts of glycidyl ether oxygen propyl trimethyl silane；
Wherein, the modified filler is prepared according to following technique：By γ-(methacryloxy) propyl group trimethoxy Base silane and benzoyl peroxide are well mixed, and are added in PLA in the then input double screw extruder that stirs and are carried out instead It should extrude, wherein, the weight of γ-(methacryloxy) propyl trimethoxy silicane is the 2.5% of the weight of PLA, double Screw extruder each section of temperature setting from head is respectively 160 DEG C, 165 DEG C, 165 DEG C, 155 DEG C, 150 DEG C, then adds three In chloromethanes, add in ethanol and precipitate after drying, filter, be dried to obtain intermediate；Intermediate is added in ethanol, stirred Oxalic acid, nano-calcium carbonate and nano silicon are added afterwards, wherein, intermediate, nano-calcium carbonate, the weight of nano silicon Than for 2：50：45, the stirring reaction 5h at 55 DEG C, reaction terminate after through filtering, washing, being dried to obtain the modified filler；
The galapectite is the galapectite of load N- isopropyls-N '-diphenyl-para-phenylene diamine.
Embodiment 5
The special weather-resistant pu composite of a kind of circuit board proposed by the present invention, its raw material include by weight：It is poly- Double 22 parts of (methylol) the carborane esters of 45 parts of caprolactone dihydric alcohol, 21 parts of end hydroxy butadiene, polyadipate -1,2-, different Buddhist 87 parts of that ketone diisocyanate, 12 parts of dimethythiotoluene diamine, 7 parts of mutual-amido two polyaniline, 2,4- dimethyl -2,4-PD 6 parts, 5 parts of modified filler, 3 parts of galapectite, 7 parts of basalt fibre, 1.3 parts of catalyst, N- (4- aniiinophenyls) maleimide 0.18 part of amine, γ -2 parts of glycidyl ether oxygen propyl trimethyl silane；
Wherein, the modified filler is prepared according to following technique：By γ-(methacryloxy) propyl group trimethoxy Base silane and benzoyl peroxide are well mixed, and are added in PLA in the then input double screw extruder that stirs and are carried out instead It should extrude, wherein, the weight of γ-(methacryloxy) propyl trimethoxy silicane is the 2% of the weight of PLA, double spiral shells Bar extruder each section of temperature setting from head is respectively 158 DEG C, 166 DEG C, 162 DEG C, 158 DEG C, 147 DEG C, then adds trichlorine In methane, add in ethanol and precipitate after drying, filter, be dried to obtain intermediate；Intermediate is added in ethanol, after stirring Oxalic acid, nano-calcium carbonate and nano silicon are added, wherein, intermediate, nano-calcium carbonate, the weight ratio of nano silicon For 7：40：63, the stirring reaction 4h at 60 DEG C, reaction terminate after through filtering, washing, being dried to obtain the modified filler；
The galapectite is the galapectite of load N- isopropyls-N '-diphenyl-para-phenylene diamine；
The catalyst is mixed in salicylic acid, DMIZ 1,2 dimethylimidazole, 2,2- dual-morpholinyl diethyl ethers, stannous octoate Compound, and the weight ratio of salicylic acid, 1,2- methylimidazoles, 2,2- dual-morpholinyl diethyl ethers, stannous octoate is 4：6：3：1.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto, Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.

Claims (7)

1. a kind of special weather-resistant pu composite of circuit board, it is characterised in that its raw material includes by weight：Gather in oneself Ester dihydric alcohol 23-48 parts, end hydroxy butadiene 10-28 parts, double (methylol) carborane ester 10-28 parts of polyadipate -1,2-, IPDI 45-100 parts, dimethythiotoluene diamine 10-15 parts, mutual-amido two polyaniline 3-10 parts, 2,4- bis- Methyl -2,4-PD 1-8 parts, modified filler 2-9 parts, galapectite 1-4.8 parts, basalt fibre 2-10 parts, catalyst 0.5- 1.8 parts, N- (4- aniiinophenyls) maleimide 0.1-0.3 parts, γ-glycidyl ether oxygen propyl trimethyl silane 1-3 parts.
2. the special weather-resistant pu composite of circuit board according to claim 1, it is characterised in that the modified filler Prepared according to following technique：γ-(methacryloxy) propyl trimethoxy silicane and benzoyl peroxide are mixed Uniformly, add in PLA to stir and then put into double screw extruder and carry out reactive extrursion, then add chloroform In, add in ethanol and precipitate after drying, filter, be dried to obtain intermediate；Intermediate is added in ethanol, is stirring evenly and then adding into Oxalic acid, nano-calcium carbonate and nano silicon, the stirring reaction 3-5h at 55-65 DEG C, reaction terminate after through filtering, washing, It is dried to obtain the modified filler.
3. the special weather-resistant pu composite of circuit board according to claim 2, it is characterised in that in modified filler In preparation process, the weight of γ-(methacryloxy) propyl trimethoxy silicane is the 1.5- of the weight of PLA 2.5%.
4. the special weather-resistant pu composite of the circuit board according to Claims 2 or 3, it is characterised in that filled out in modification In the preparation process of material, intermediate, nano-calcium carbonate, the weight ratio of nano silicon are 2-10：30-50：45-70.
5. according to the special weather-resistant pu composite of circuit board any one of claim 2-4, it is characterised in that double Screw extruder each section of temperature setting from head is respectively 155-160 DEG C, 165-170 DEG C, 160-165 DEG C, 155-160 DEG C, 145-150℃。
6. according to the special weather-resistant pu composite of circuit board any one of claim 1-5, it is characterised in that institute State galapectite of the galapectite for load N- isopropyls-N '-diphenyl-para-phenylene diamine.
7. according to the special weather-resistant pu composite of circuit board any one of claim 1-6, it is characterised in that institute Catalyst is stated as the one or more in salicylic acid, DMIZ 1,2 dimethylimidazole, 2,2- dual-morpholinyl diethyl ethers, stannous octoate Mixture.
CN201711090252.8A 2017-11-08 2017-11-08 A kind of special weather-resistant pu composite of circuit board Withdrawn CN107778842A (en)

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Cited By (1)

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CN109134822A (en) * 2018-07-24 2019-01-04 大连中海达科技有限公司 It is a kind of can ultraviolet light cross-linking thermoplastic polyurethane elastomer synthetic method

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