CN107770973B - Processing method of printed circuit board - Google Patents
Processing method of printed circuit board Download PDFInfo
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- CN107770973B CN107770973B CN201710961953.8A CN201710961953A CN107770973B CN 107770973 B CN107770973 B CN 107770973B CN 201710961953 A CN201710961953 A CN 201710961953A CN 107770973 B CN107770973 B CN 107770973B
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Abstract
The invention discloses a processing method of a printed circuit board, which comprises the following steps: 1) respectively carrying out cutting, pattern transfer, acid etching, groove milling and browning on the first sub-core plate and the second sub-core plate; 2) respectively performing cutting and groove milling on the first prepreg and the second prepreg; 3) cutting, pattern transfer, acid etching, internal light imaging, local gold plating, film stripping and browning are carried out on the mother core board; 4) and (3) overlapping the first sub-core plate, the first semi-cured sheet, the mother core plate, the second semi-cured sheet and the second sub-core plate from top to bottom, laminating, drilling in the first blind groove and the third blind groove, and drilling in the second blind groove and the fourth blind groove. The method solves the problem that the prior art cannot realize the metallization of the intersecting holes at the bottom of the blind slot, can be realized, is optimized on the basis of the prior process, and has simple process realization and high efficiency.
Description
Technical Field
The invention relates to the field of circuit board processing, in particular to a processing method of a printed circuit board.
Background
The invention discloses a method for manufacturing a High Density Interconnect (HDI) circuit board, which solves the technical problems that how to realize the metallization of intersecting holes in a step groove and the non-metallization of the side wall of the step groove, and protects the metallized holes by filling soft glue in the intersecting holes so as to realize the metallization of the intersecting holes in the step groove.
Disclosure of Invention
The invention aims to provide a processing method of a printed circuit board, which solves the problem that the prior art can not realize the hole metallization of intersecting holes in a step groove of the printed circuit board.
In order to achieve the above object, the present invention provides a method of processing a printed circuit board, the method comprising:
1) respectively carrying out cutting, pattern transfer, acid etching, groove milling and browning on the first sub-core plate and the second sub-core plate, so that a first blind groove and a second blind groove are respectively formed on the first sub-core plate and the second sub-core plate;
2) respectively performing cutting and groove milling on the first prepreg and the second prepreg to respectively form a third blind groove and a fourth blind groove on the first prepreg and the second prepreg;
3) cutting, pattern transfer, acid etching, internal light imaging, local gold plating, film stripping and browning are carried out on the mother core board;
4) the first sub-core plate, the first semi-cured sheet, the mother core plate, the second prepreg and the second sub-core plate are overlapped from top to bottom and laminated, so that the first blind groove and the third blind groove are opposite to each other, the second blind groove and the fourth blind groove are opposite to each other, the first blind groove and the second blind groove are arranged in a staggered mode, then drilling is carried out in the first blind groove and the third blind groove, the through hole sequentially penetrates through the mother core plate, the second prepreg and the second sub-core plate, drilling is carried out in the second blind groove and the fourth blind groove, and the through hole sequentially penetrates through the mother core plate, the first semi-cured sheet and the first sub-core plate.
Preferably, in step 4), the processing method further includes performing hole metallization on the through hole, and then performing outer layer pattern transfer, copper tin plating, secondary pattern transfer, colloidal particle plugging in the through hole, tin stripping, colloidal particle fetching and alkaline etching.
Preferably, routing processing is required to be carried out in the first blind groove, the second blind groove, the third blind groove and the fourth blind groove, and the tolerance of routing processing is controlled within +/-0.1 mm.
Preferably, in step 4), before drilling, the first blind groove, the second blind groove, the third blind groove and the fourth blind groove are leveled by using a backing plate.
Preferably, when the outer layer pattern is transferred, the blind groove needs to be exposed, and thickening treatment needs to be carried out on the circuit and the hole copper.
Preferably, when the secondary pattern transfer is carried out, tin stripping is carried out only in the blind groove area to expose the copper surface, the colloidal particles are taken out, and the tin surface is used for protecting the inner hole of the blind groove to resist etching.
Preferably, the dry film on the board surface is removed before alkaline etching, and then etching is performed.
Through the technical scheme, the invention provides a processing method of a printed circuit board, which comprises the following steps: 1) respectively carrying out cutting, pattern transfer, acid etching, groove milling and browning on the first sub-core plate and the second sub-core plate, so that a first blind groove and a second blind groove are respectively formed on the first sub-core plate and the second sub-core plate; 2) respectively performing cutting and groove milling on the first prepreg and the second prepreg to respectively form a third blind groove and a fourth blind groove on the first prepreg and the second prepreg; 3) cutting, pattern transfer, acid etching, internal light imaging, local gold plating, film stripping and browning are carried out on the mother core board; 4) the first sub-core plate, the first semi-cured sheet, the mother core plate, the second prepreg and the second sub-core plate are overlapped from top to bottom and laminated, so that the first blind groove and the third blind groove are opposite to each other, the second blind groove and the fourth blind groove are opposite to each other, the first blind groove and the second blind groove are arranged in a staggered mode, then drilling is carried out in the first blind groove and the third blind groove, the through hole sequentially penetrates through the mother core plate, the second prepreg and the second sub-core plate, drilling is carried out in the second blind groove and the fourth blind groove, and the through hole sequentially penetrates through the mother core plate, the first semi-cured sheet and the first sub-core plate. The method solves the problem that the prior art cannot realize the metallization of the intersecting holes at the bottom of the blind slot, can be realized, is optimized on the basis of the prior process, and has simple process realization and high efficiency.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a structural view of a printed wiring board obtained by the method for processing a printed wiring board according to the present invention.
Description of the reference numerals
1-first sub-core board 2-second sub-core board
3-first prepreg 4-second prepreg
5-mother core board
Detailed Description
The following describes in detail specific embodiments of the present invention. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The invention provides a processing method of a printed circuit board, which comprises the following steps:
1) respectively carrying out cutting, pattern transfer, acid etching, groove milling and browning on the first sub-core plate 1 and the second sub-core plate 2, so that a first blind groove and a second blind groove are respectively formed on the first sub-core plate 1 and the second sub-core plate 2;
2) respectively cutting and milling the first prepreg 3 and the second prepreg 4 to form a third blind groove and a fourth blind groove on the first prepreg 3 and the second prepreg 4;
3) cutting, pattern transfer, acid etching, internal light imaging, local gold plating, film stripping and browning are carried out on the mother core board 5;
4) the first sub-core plate 1, the first prepreg 3, the mother core plate 5, the second prepreg 4 and the second sub-core plate 2 are overlapped from top to bottom and laminated, so that the first blind groove and the third blind groove are opposite, the second blind groove and the fourth blind groove are opposite, the first blind groove and the second blind groove are staggered, then, drilling is carried out in the first blind groove and the third blind groove, the through holes sequentially penetrate through the mother core plate 5, the second prepreg 4 and the second sub-core plate 2, drilling is carried out in the second blind groove and the fourth blind groove, and the through holes sequentially penetrate through the mother core plate 5, the first prepreg 3 and the first sub-core plate 1.
In a preferred embodiment of the present invention, in order to further improve the quality of the manufactured printed circuit board, in step 4), the processing method further comprises the steps of hole metallization of the through hole, outer layer pattern transfer, copper tin plating, secondary pattern transfer, colloidal particle plugging in the through hole, tin stripping, colloidal particle taking and alkaline etching.
In a preferred embodiment of the present invention, in order to further improve the quality of the manufactured printed circuit board, groove routing processing is required to be performed in the first blind groove, the second blind groove, the third blind groove and the fourth blind groove, and the tolerance of the groove routing processing is controlled within ± 0.1 mm.
In a preferred embodiment of the present invention, in order to avoid the burr of the drilling hole, in step 4), before the drilling is performed, the first blind groove, the second blind groove, the third blind groove and the fourth blind groove need to be leveled by using a backing plate.
In a preferred embodiment of the present invention, in order to further improve the quality of the printed circuit board to be manufactured, the blind via is exposed and the wiring and via copper are thickened during the outer pattern transfer.
In a preferred embodiment of the present invention, in order to further improve the quality of the printed circuit board to be manufactured, during the secondary pattern transfer, the solder stripping is performed to expose only the blind via region, the copper surface is exposed, the colloidal particles are taken out, and the inner hole of the blind via is protected by the tin surface against etching.
In a preferred embodiment of the present invention, in order to further improve the quality of the printed wiring board to be produced, the dry film on the board surface is removed before the alkaline etching, and then the etching is performed.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (5)
1. A processing method of a printed circuit board is characterized by comprising the following steps:
1) respectively carrying out cutting, pattern transfer, acid etching, groove milling and browning on the first core plate (1) and the second core plate (2) so as to respectively form a first blind groove and a second blind groove on the first core plate (1) and the second core plate (2);
2) respectively performing cutting and groove milling on the first prepreg (3) and the second prepreg (4) to respectively form a third blind groove and a fourth blind groove on the first prepreg (3) and the second prepreg (4);
3) cutting, pattern transfer, acid etching, internal light imaging, local gold plating, film stripping and browning are carried out on the mother core plate (5);
4) the method comprises the steps that a first sub-core plate (1), a first semi-cured sheet (3), a mother core plate (5), a second semi-cured sheet (4) and a second sub-core plate (2) are overlapped from top to bottom and laminated, so that a first blind groove is opposite to a third blind groove, a second blind groove is opposite to a fourth blind groove, the first blind groove and the second blind groove are arranged in a staggered mode, then drilling is conducted in the first blind groove and the third blind groove, a through hole penetrates through the mother core plate (5), the second semi-cured sheet (4) and the second sub-core plate (2) in sequence, drilling is conducted in the second blind groove and the fourth blind groove, and the through hole penetrates through the mother core plate (5), the first semi-cured sheet (3) and the first sub-core plate (1) in sequence;
in the step 4), the processing method further comprises the steps of performing hole metallization on the through hole, then performing outer layer pattern transfer, copper and tin plating, secondary pattern transfer, filling colloidal particles in the through hole, removing tin, taking colloidal particles and performing alkaline etching;
and when secondary pattern transfer is carried out, stripping tin only in the exposed blind groove area to expose the copper surface, taking out the colloidal particles, and protecting the inner hole of the blind groove from etching by using the tin surface.
2. The processing method according to claim 1, wherein routing is required in the first blind groove, the second blind groove, the third blind groove and the fourth blind groove, and the tolerance of routing is controlled within ± 0.1 mm.
3. The machining method according to claim 1, wherein in the step 4), before drilling, the first blind groove, the second blind groove, the third blind groove and the fourth blind groove are leveled by using a backing plate.
4. The process of claim 1 wherein the outer pattern is transferred by exposing the blind via to thicken the copper lines and vias.
5. The process of claim 1 wherein the dry film on the surface of the plate is removed prior to the alkaline etching and the etching is carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710961953.8A CN107770973B (en) | 2017-10-17 | 2017-10-17 | Processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710961953.8A CN107770973B (en) | 2017-10-17 | 2017-10-17 | Processing method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107770973A CN107770973A (en) | 2018-03-06 |
| CN107770973B true CN107770973B (en) | 2021-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710961953.8A Active CN107770973B (en) | 2017-10-17 | 2017-10-17 | Processing method of printed circuit board |
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| CN (1) | CN107770973B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465192A (en) * | 2020-04-16 | 2020-07-28 | 四川英创力电子科技股份有限公司 | Processing technology of embedded type embedded component printed board |
| CN112312680B (en) * | 2020-10-29 | 2022-02-22 | 惠州市特创电子科技股份有限公司 | Method for processing metallized half hole of circuit board |
| CN114340224A (en) * | 2021-12-14 | 2022-04-12 | 生益电子股份有限公司 | PCB preparation method and PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369867A (en) * | 2012-04-01 | 2013-10-23 | 北大方正集团有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07288375A (en) * | 1994-04-19 | 1995-10-31 | Murata Mfg Co Ltd | Circuit board |
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- 2017-10-17 CN CN201710961953.8A patent/CN107770973B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369867A (en) * | 2012-04-01 | 2013-10-23 | 北大方正集团有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
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| Publication number | Publication date |
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| CN107770973A (en) | 2018-03-06 |
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