CN107765924B - Touch film, manufacturing method thereof and touch screen - Google Patents

Touch film, manufacturing method thereof and touch screen Download PDF

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Publication number
CN107765924B
CN107765924B CN201711087650.4A CN201711087650A CN107765924B CN 107765924 B CN107765924 B CN 107765924B CN 201711087650 A CN201711087650 A CN 201711087650A CN 107765924 B CN107765924 B CN 107765924B
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China
Prior art keywords
touch
hole
film
circuit board
flexible circuit
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CN201711087650.4A
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Chinese (zh)
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CN107765924A (en
Inventor
邓向春
刘雨芽
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
Original Assignee
Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Priority to CN201711087650.4A priority Critical patent/CN107765924B/en
Publication of CN107765924A publication Critical patent/CN107765924A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

The invention relates to a touch film, a manufacturing method thereof and a touch screen. The touch control film comprises a base material, a touch control assembly and a protective film. The substrate includes relative first surface and the second surface that sets up, set up the first through-hole that runs through first surface and second surface on the substrate, the first surface is located to the touch-control subassembly, the second surface is located to the protection film, second through-hole and breach have been seted up on the protection film, the second through-hole is just to first through-hole, breach and second through-hole intercommunication, wherein, the one end of flexible circuit board is kept away from the one side of substrate from the protection film and is passed second through-hole and first through-hole in proper order after, be connected with the touch-control subassembly electricity, and the flexible circuit board wears to locate the breach. Foretell touch-control film when tearing off the protection film, because set up the breach on the protection film, there is the clearance with the protection film in the breach is worn to establish by the flexible circuit board, like this, can not contact with the flexible circuit board when the protection film is taken off to prevented that the flexible circuit board from being damaged, guaranteed the quality of touch-sensitive screen.

Description

Touch film, manufacturing method thereof and touch screen
Technical Field
The invention relates to the technical field of touch screens, in particular to a touch film, a manufacturing method thereof and a touch screen.
Background
With the development and popularization of touch technology, touch screens are applied to various intelligent devices, such as mobile phones, tablets, computers and the like. The touch screen comprises a touch film and a flexible circuit board, wherein the touch film mainly comprises a base material and a conducting layer which are arranged in a stacked mode, a through hole for the flexible circuit board to penetrate through is formed in the base material, when the touch film and the flexible circuit board are bound, one end of the flexible circuit board can penetrate through the through hole from the surface, away from the conducting layer, of the base material to be bound with a touch pin of the conducting layer, and therefore the conducting layer is electrically connected with the flexible circuit board.
Generally, a protective film is disposed on a surface of the substrate away from the conductive layer, and the protective film needs to be torn off after the touch screen is manufactured. However, a part of the area of the protective film is covered by the flexible circuit board, and when the protective film is peeled off, the flexible circuit board needs to be lifted to prevent interference with the protective film, but the flexible circuit board is easily damaged or even broken.
Disclosure of Invention
Therefore, it is necessary to provide a touch film capable of effectively protecting a flexible circuit board during film tearing, a manufacturing method thereof, and a touch screen, for solving the problem that the flexible circuit board is easily damaged during film tearing.
A touch film, comprising:
the substrate comprises a first surface and a second surface which are oppositely arranged, and a first through hole which penetrates through the first surface and the second surface is formed in the substrate;
the touch control assembly is arranged on the first surface; and
the protective film is arranged on the second surface, a second through hole and a gap are formed in the protective film, the second through hole is opposite to the first through hole, and the gap is communicated with the second through hole;
one end of the flexible circuit board penetrates through the second through hole and the first through hole in sequence from the surface, far away from the base material, of the protective film and is electrically connected with the touch control assembly, and the flexible circuit board penetrates through the notch.
According to the touch control film, the flexible circuit board penetrates through the second through hole and the first through hole in sequence and then is electrically connected with the touch control assembly, and the notch is formed in the protective film, so that the flexible circuit board is arranged in the notch in a penetrating mode and cannot interfere with the protective film, the protective film cannot be in contact with the flexible circuit board when being removed, the flexible circuit board is prevented from being damaged, and the quality of the touch screen is guaranteed.
In one embodiment, the length of the notch is greater than the width of the flexible circuit board.
In one embodiment, the length of the notch is smaller than the length of the second through hole.
In one embodiment, the touch device includes a first touch layer, a first adhesive layer, a second touch layer and a second adhesive layer stacked on each other, the first touch layer is disposed on the first surface, the first adhesive layer is disposed between the first touch layer and the second touch layer, and the second touch layer is disposed between the first adhesive layer and the second adhesive layer.
In one embodiment, the touch assembly includes a touch layer and an adhesive layer stacked on each other, and the touch layer is disposed on the first surface and includes a first conductive pattern and a second conductive pattern insulated from each other.
A touch screen, comprising:
any of the touch films described above;
the cover plate glass is arranged on one surface, far away from the first surface, of the touch control assembly; and
the flexible circuit board, the one end of flexible circuit board is followed the protection film is kept away from the one side of substrate passes in proper order behind the second through-hole and the first through-hole, with the touch-control subassembly electricity is connected, just flexible circuit board wears to locate the breach.
According to the touch screen, the touch film can prevent the flexible circuit board from being damaged, so that the production yield of the touch screen can be improved.
A manufacturing method of a touch film comprises the following steps:
providing a base material and a protective film, wherein the base material comprises a first surface and a second surface which are oppositely arranged, and the protective film is formed on the second surface;
forming a touch control assembly on the first surface;
forming a first through hole penetrating through the first surface and the second surface on the base material, and forming a second through hole opposite to the first through hole on the protective film; and
and a notch communicated with the second through hole is formed in the protective film.
The manufacturing method of the touch film is simple to operate, only the notch needs to be formed in the protective film to enable the flexible circuit board to penetrate through the notch, the protective film can be conveniently and quickly torn off, the problem that the protective film is interfered with the flexible circuit board does not need to be worried about, and the production efficiency of the touch screen is improved.
In one embodiment, the step of forming a notch in the protective film, the notch communicating with the second through hole, further includes:
cutting the protective film to a cutting depth equal to the thickness of the protective film, and leaving two cutting lines on the protective film, wherein the cutting lines extend from the side wall of the second through hole to the edge of the protective film;
and removing the part, positioned between the two cutting lines, on the protective film.
In one embodiment, the distance between the two cutting lines is larger than the width of the flexible circuit board.
In one embodiment, the step of forming a touch device on the first surface further includes:
forming a first touch layer on the first surface;
arranging a first bonding layer on one surface of the first touch layer, which is far away from the first surface;
providing a second touch layer;
arranging a second bonding layer on one surface of the second touch layer;
and attaching the first adhesive layer to one surface, far away from the second adhesive layer, of the second touch layer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings of the embodiments can be obtained according to the drawings without creative efforts.
FIG. 1 is a bottom view of a touch film according to an embodiment;
FIG. 2 is an exploded view of the touch film shown in FIG. 1;
FIG. 3 is a top view of the touch film shown in FIG. 1;
FIG. 4 is a cross-sectional view of the touch film shown in FIG. 1;
FIG. 5 is a flowchart illustrating a method of fabricating the touch film shown in FIG. 1;
fig. 6 is a flowchart of step S120 in the method for manufacturing a touch film shown in fig. 5;
fig. 7 is a flowchart of step S140 in the method for manufacturing the touch film shown in fig. 5.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 3, a touch screen in an embodiment includes a touch film 10, a flexible circuit board 20, and a cover glass. The flexible circuit board 20 is bonded to the touch film 10 to electrically connect the touch film 10 to other components. The cover glass is disposed on one side of the touch film 10 and is used for protecting the touch film 10.
The touch film 10 includes a substrate 110, a touch device 120 and a protective film 130, the substrate 110 includes a first surface 111 and a second surface 113 disposed opposite to each other, and the substrate 110 is provided with a first through hole 115 penetrating through the first surface 111 and the second surface 113. The touch device 120 is disposed on the first surface 111, and a surface of the touch device 120 away from the first surface 111 is used for disposing a cover glass. The protective film 130 is disposed on the second surface 113, the protective film 130 is formed with a second through hole 131 and a gap 133, the second through hole 131 faces the first through hole 115, and the gap 133 is communicated with the second through hole 131. One end of the flexible circuit board 20 sequentially passes through the second through hole 131 and the first through hole 115 from the surface of the protective film 130 away from the substrate 110, and then is electrically connected to the touch assembly 120, and the flexible circuit board 20 penetrates through the notch 133. In one embodiment, the substrate 110 may be made of transparent glass or transparent Polyethylene terephthalate (PET).
The protective film 130 is adhered to the second surface 113 of the touch control film 10, and when the protective film 130 is torn off, the protective film 130 is provided with the notch 133, so that the flexible circuit board 20 is arranged in the notch 133 in a penetrating manner and cannot interfere with the protective film 130, and thus the protective film 130 cannot be contacted with the flexible circuit board 20 when being torn off, thereby preventing the flexible circuit board 20 from being damaged and ensuring the quality of the touch screen.
In one embodiment, the length of the notch 133 is greater than the width of the flexible circuit board 20. Specifically, in the present embodiment, both ends of the notch 133 are spaced apart from the flexible circuit board 20, and the distance between one end of the notch 133 and the flexible circuit board 20 is equal to the distance between the other end of the notch 133 and the flexible circuit board 20. When the worker removes the protective film 130, the worker can avoid the fingers from scratching the flexible circuit board 20. In other embodiments, the distance between one end of the notch 133 and the flexible circuit board 20 may be smaller than the distance between the other end of the notch 133 and the flexible circuit board 20.
In one embodiment, the length of the notch 133 is less than the length of the second through hole 131, and the second through hole 131 is in a T-shape in communication with the notch 133.
Referring to fig. 4, in one embodiment, the touch device 120 includes a first touch layer 121, a first adhesive layer 123, a second touch layer 125 and a second adhesive layer 127, which are stacked, the first touch layer 121 is disposed on the first surface 111, the first adhesive layer 123 is disposed between the first touch layer 121 and the second touch layer 125, and the second touch layer 125 is disposed between the first adhesive layer 123 and the second adhesive layer 127. The flexible circuit board 20 is respectively bonded to the pins of the first touch layer 121 and the pins of the second touch layer 125. The touch film 10 in this embodiment has a single-sided double-layer structure, and the cover glass is attached to the second adhesive layer 127. In one embodiment, the first adhesive layer 123 and the second adhesive layer 127 are both optically transparent adhesive, so that the light transmittance of the touch film 10 and the display effect of the touch screen are not affected.
In one embodiment, the touch device 120 includes a touch layer and an adhesive layer, which are stacked and disposed on the first surface 111, and include a first conductive pattern and a second conductive pattern that are insulated from each other. The flexible circuit board 20 is respectively bound with the pins corresponding to the first conductive patterns and the pins corresponding to the second conductive patterns. The touch film 10 in this embodiment is a single-sided single-layer structure, and the cover glass is attached to the adhesive layer. In one embodiment, the adhesive layer is an optically clear adhesive. In one embodiment, the first conductive pattern and the second conductive pattern may be formed by exposing, developing and etching a transparent conductive material such as Indium Tin Oxide (ITO).
Referring to fig. 5, a method for manufacturing a touch film 10 according to an embodiment includes the following steps:
step S110: providing a substrate 110 and a protective film 130, wherein the substrate 110 includes a first surface 111 and a second surface 113 oppositely disposed, and the protective film 130 is formed on the second surface 113, specifically, the protective film 130 is adhered on the second surface 113.
Step S120: a touch device 120 is formed on the first surface 111.
Specifically, for the touch film with a single-sided double-layer structure, referring to fig. 6, the step S120 further includes the following steps:
step S121: a first touch layer 121 is formed on the first surface 111. The first touch layer 121 is formed by an exposure-development-etching process.
Step S123: the first adhesive layer 123 is disposed on a surface of the first touch layer 121 away from the first surface 111.
Step S125: a second touch layer 125 is provided, and the second touch layer 125 is formed on the transparent glass substrate or the PET substrate by an exposure-development-etching process.
Step S127: a second adhesive layer 127 is disposed on one surface of the second touch layer 125.
Step S129: the first adhesive layer 123 and one side of the second touch layer 125 far from the second adhesive layer 127 are attached.
It should be noted that the order between step S123 and step S125 may be reversed, and the order between step S129 and step S127 may be reversed. In addition, the second touch layer 125 can also be directly formed on the second adhesive layer 127, and the transparent glass substrate or the PET substrate is omitted.
For a single-sided single-layer touch film, a touch layer is directly formed on the substrate 110 by a yellow light process, and an adhesive layer is attached to the touch layer.
Step S130: a first through hole 115 is opened in the substrate 110 to penetrate the first surface 111 and the second surface 113, and a second through hole 131 is opened in the protective film 130 to face the first through hole 115. The first through hole 115 and the second through hole 131 are formed by one-time punching process, and both the first through hole 115 and the second through hole 131 are rectangular holes.
Step S140: the protective film 130 is provided with a notch 133 communicating with the second through hole 131.
Specifically, referring to fig. 7, step S140 further includes the steps of:
step S141: the protective film 130 is cut to a depth equal to the thickness of the protective film 130, and two cutting lines are left on the protective film 130, the cutting lines extending from the sidewall of the second through hole 131 to the edge of the protective film 130. In the present embodiment, the cutting lines are two parallel vertical lines, and the distance between the two cutting lines is greater than the width of the flexible circuit board 20. In other embodiments, the cutting line may be a diagonal line or an arc line.
Step S143: the portion of the protective film 130 between the two cutting lines is removed. The worker can directly pull the cut part by hand, and can separate the cut part by means of tools such as easy-to-tear tape and the like.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A touch film for bonding with a flexible circuit board, comprising:
the substrate comprises a first surface and a second surface which are oppositely arranged, and a first through hole which penetrates through the first surface and the second surface is formed in the substrate;
the touch control assembly is arranged on the first surface; and
the protective film is arranged on the second surface, a second through hole and a notch are formed in the protective film, the second through hole is right opposite to the first through hole, the notch is communicated with the second through hole, and the length of the notch is larger than the width of the flexible circuit board;
one end of the flexible circuit board penetrates through the second through hole and the first through hole in sequence from the surface, far away from the base material, of the protective film and is electrically connected with the touch control assembly, and the flexible circuit board penetrates through the notch.
2. The touch film of claim 1, wherein the notch has a length less than a length of the second through hole.
3. The touch film of claim 1, wherein the touch assembly comprises a first touch layer, a first adhesive layer, a second touch layer and a second adhesive layer, the first touch layer is disposed on the first surface, the first adhesive layer is disposed between the first touch layer and the second touch layer, and the second touch layer is disposed between the first adhesive layer and the second adhesive layer.
4. The touch film of claim 1, wherein the touch assembly comprises a touch layer and an adhesive layer stacked on each other, and the touch layer is disposed on the first surface and includes a first conductive pattern and a second conductive pattern insulated from each other.
5. A touch screen, comprising:
the touch film according to any one of claims 1 to 4;
the cover plate glass is arranged on one surface, far away from the first surface, of the touch control assembly; and
the flexible circuit board, the one end of flexible circuit board is followed the protection film is kept away from the one side of substrate passes in proper order behind the second through-hole and the first through-hole, with the touch-control subassembly electricity is connected, just flexible circuit board wears to locate the breach.
6. A manufacturing method of a touch film, wherein the touch film is used for being bound with a flexible circuit board, and the manufacturing method is characterized by comprising the following steps:
providing a base material and a protective film, wherein the base material comprises a first surface and a second surface which are oppositely arranged, and the protective film is formed on the second surface;
forming a touch control assembly on the first surface;
forming a first through hole penetrating through the first surface and the second surface on the base material, and forming a second through hole opposite to the first through hole on the protective film; and
and a notch communicated with the second through hole is formed in the protective film, and the length of the notch is greater than the width of the flexible circuit board.
7. The method for manufacturing a touch film according to claim 6, wherein the step of forming a notch in the protective film, the notch being in communication with the second through hole, further comprises:
and cutting the protective film, wherein the cutting depth is equal to the thickness of the protective film, two cutting lines are left on the protective film, and the cutting lines extend from the side wall of the second through hole to the edge of the protective film.
8. The method for manufacturing a touch film according to claim 7, wherein the step of forming a notch in the protective film, the notch being in communication with the second through hole, further comprises:
and removing the part, positioned between the two cutting lines, on the protective film.
9. The method of manufacturing a touch film according to claim 7, wherein a distance between two cutting lines is greater than a width of the flexible circuit board.
10. The method of manufacturing a touch film according to claim 6, wherein the step of forming a touch element on the first surface further comprises:
forming a first touch layer on the first surface;
arranging a first bonding layer on one surface of the first touch layer, which is far away from the first surface;
providing a second touch layer;
arranging a second bonding layer on one surface of the second touch layer;
and attaching the first adhesive layer to one surface, far away from the second adhesive layer, of the second touch layer.
CN201711087650.4A 2017-11-07 2017-11-07 Touch film, manufacturing method thereof and touch screen Active CN107765924B (en)

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CN111324243A (en) * 2018-12-13 2020-06-23 南昌欧菲触控科技有限公司 Manufacturing method of touch screen, touch screen and intelligent terminal
CN112068344B (en) * 2020-09-14 2022-02-22 武汉华星光电半导体显示技术有限公司 Display device and preparation method thereof

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CN102270059A (en) * 2011-06-21 2011-12-07 信利半导体有限公司 Method for bonding touch screen to display screen
TWI464499B (en) * 2012-02-24 2014-12-11 Au Optronics Corp Backlight module and display device using the same
CN102929428A (en) * 2012-09-29 2013-02-13 黄石瑞视光电技术股份有限公司 Method for processing touch screen indium tin oxide (ITO) film with high-temperature protective film
JPWO2015098424A1 (en) * 2013-12-26 2017-03-23 昭和電工株式会社 Temporary protection method for substrate including wiring formed of transparent conductive film
CN203870588U (en) * 2014-04-02 2014-10-08 宝宸(厦门)光学科技有限公司 Touch panel
CN105786230B (en) * 2014-12-23 2019-08-13 宸鸿科技(厦门)有限公司 Touch panel and its manufacturing method
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CN106793485A (en) * 2016-11-17 2017-05-31 上海摩软通讯技术有限公司 A kind of printed circuit board (PCB) and preparation method thereof
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