CN107765824A - Immersion cooling system - Google Patents
Immersion cooling system Download PDFInfo
- Publication number
- CN107765824A CN107765824A CN201711143239.4A CN201711143239A CN107765824A CN 107765824 A CN107765824 A CN 107765824A CN 201711143239 A CN201711143239 A CN 201711143239A CN 107765824 A CN107765824 A CN 107765824A
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- CN
- China
- Prior art keywords
- cooling system
- plate
- substrate
- immersion cooling
- plate portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of immersion cooling system to include a load plate, a mainboard, one every liquid cover and a cooling component.Mainboard includes a substrate and a heater element.Substrate is stacked at load plate.Heater element is electrically arranged at substrate.Substrate is stacked at every liquid cover, and covers heater element, to be collectively forming a liquid storage space with substrate.Liquid storage space is to an accommodating coolant.Cooling component is located at liquid storage space, and thermally contacts heater element.
Description
Technical field
The present invention is on a kind of cooling system, particularly a kind of miniaturization immersion cooling system for server field
System.
Background technology
It is the cooling bath that building frozen water is led to system mostly in the special immersion cooling system of existing server
In, and it is installed in the temperature that the radiating defecation inside cooling bath can be used to reduce high-temp liquid or steam in cooling bath.However,
In order to reduce the radiating power consumption required for the heating of per unit server, the capacity of current cooling bath is rack size mostly.
That is multiple servers are cooled down with large-scale cooling system, to reducing the average radiating power consumption of individual server.
Existing large-scale immersion cooling system is due to that need to introduce building frozen water, if the computer room of user is not allowed to be easily introduced greatly
Building frozen water, interest of the user to the immersion cooling system using building frozen water will be reduced.If in the cooling bath of identical capacity
The server of negligible amounts is built into, then the average radiating power consumption of single server will carry what situation was got off entirely compared with number of servers
It is high.Therefore for negligible amounts server or can not by building frozen water introduce computer room user just can not use.Such one
Come, how individual other server to be cooled with immersion cooling method independent of building frozen water, and can, will be research and development people
One of member's problem to be solved.
The content of the invention
The invention reside in a kind of immersion cooling system is provided, by independently storage cools down in single server
Liquid, an other server can be cooled again with immersion cooling method to individual other server independent of building frozen water.
Immersion cooling system disclosed in one embodiment of the invention includes a load plate, a mainboard, one every liquid cover and one
Cooling component.Mainboard includes a substrate and an at least heater element.Substrate is stacked at load plate.Heater element is electrically arranged at base
Plate.Substrate is stacked at every liquid cover, and covers heater element, to be collectively forming a liquid storage space with substrate.Liquid storage space is holding
Put a coolant.Cooling component is located at liquid storage space, and thermally contacts heater element.
Immersion cooling system according to above-described embodiment, due to having independent liquid storage in each servomechanism installation
Space, and the coolant to cool independently is stored and is circulated in an other liquid storage space.That is, each servomechanism installation
Only radiated by the coolant in liquid storage space itself.Consequently, it is possible to each servomechanism has independent immersion
Cooling system, the inconvenience for quoting building cold water can be not only saved, can more avoid the actual installation quantity of server less than tank
Maximum shares number and produces the problem of heat radiation power assigned by single server is too high.
The explanation of explanation and implementation below above with respect to present invention to demonstrate and explain the present invention original
Reason, and the claims for providing the present invention are further explained.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the immersion cooling system according to the embodiment of the present invention.
Fig. 2 is the decomposing schematic representation of Fig. 1 immersion cooling system.
Fig. 3 is the diagrammatic cross-section of Fig. 1 immersion cooling system.
Wherein, reference：
1 immersion cooling system
10 load plates
20 mainboards
21 substrates
22 heater elements
30 every liquid cover
31 annular side plates
32 cover plates
321 first plate portions
3211 first faces
3212 second faces
322 second plate portions
3221 first faces
3222 second faces
33 extension boards
40 cooling components
Heat dissipation element in 50
60 outer heat dissipation elements
70 liquid storage spaces
Embodiment
The detailed features and advantage of the narration present invention, its content are enough to make any ability in detail in embodiments below
The technical staff in domain understands the technology contents of the present invention and implemented according to this, and is wanted according to content disclosed in this specification, right
Protection domain and accompanying drawing are asked, any those skilled in the art can be readily understood upon the purpose and advantage of correlation of the invention.Below
Embodiment the viewpoint of the present invention is further described, it is but non-anyways to limit scope of the invention.
Fig. 1 is referred to Fig. 3.Fig. 1 is the schematic perspective view of the immersion cooling system according to the embodiment of the present invention.
Fig. 2 is the decomposing schematic representation of Fig. 1 immersion cooling system.Fig. 3 is the diagrammatic cross-section of Fig. 1 immersion cooling system.This
The immersion cooling system 1 of embodiment is miniaturization immersion cooling system for server unit, including a load plate 10, one
Mainboard 20, one is every 50 and one outer heat dissipation element 60 of heat dissipation element in liquid cover 30, a cooling component 40, one.
Mainboard 20 includes a substrate 21 and a heater element 22.Substrate 21 is stacked at load plate 10.Heater element 22 is electronics
Element, such as a central processing unit and electrically it is arranged at substrate 21.
Include an annular side plate 31, a cover plate 32 and an extension board 33 every liquid cover 30.Annular side plate 31 is stacked at substrate 21.
Extension board 33 protrudes from the outside of annular side plate 31.Cover plate 32 includes connected one first plate portion 321 and one second plate portion 322.
First plate portion 321 has relative the first face 3211 and the second face 3212.Second plate portion has the first relative face 3221 and
Two faces 3222.First plate portion 321 of cover plate 32 is covered in the top of extension board 33, and the second plate portion 322 of cover plate 32 is covered in annular
The top of side plate 31, and the first face 3211,3221 is made towards substrate 21, and make the second plate portion 322, annular side plate 31 and substrate 21 common
With formation liquid storage space 70.Liquid storage space 70 houses coolant, and coolant can be the cooling of the tools such as deionized water or oil and electric insulation
The liquid of effect.Consequently, it is possible to which each server unit has independent immersion cooling system, it is big can not only to save introducing
The inconvenience of building cold water, the actual installation quantity of server can be more avoided to share number less than the maximum of tank and produce single server
Heat radiation power it is too high the problem of.
In the present embodiment, cooling component 40 is a passive type cooling component, and passive type cooling component described herein is
Gas after being vaporized with coolant drives coolant flow, and then the cooling component of cooling-down effect as power source.
In other embodiments, cooling component may include fan or pump used by immersion cooling system, to carry out band by fan or pump
The active cooling component of dynamic coolant flow.
Interior heat dissipation element 50 is arranged at the first face 3221 of the second plate portion 322, and it is fin-like.Outer heat dissipation element 60 is set
In the second face 3212 of the first plate portion 321 and the second face 3222 of the second plate portion 322, it stretches out for sheet, and shape is like fin.
Specifically, interior heat dissipation element 50 is extended from the first face 3221 of the second plate portion 322 to liquid storage space 70, this interior heat dissipation element 50
Heat exchange will be carried out with the dielectric liquid liquid in groove or steam, thereby by the used heat that electronic component is sent by being moved to inside cell body
Outside groove.And outer heat dissipation element 60 is then outside by the second face 3212 of the first plate portion 321 and the second face 3222 of the second plate portion 322
Extension, for by heat derives cell body in groove.Consequently, it is possible to server is not only able to be cooled by cooling component 40,
The area of dissipation of each servomechanism installation can more be increased by interior heat dissipation element 50, outer heat dissipation element 60, and then preferably dissipated
Thermal effect.
Immersion cooling system 1 in the present embodiment is applicable to 2U servers, but the present invention is not limited thereto.
In other embodiment, immersion cooling system can also be other height.
In addition, in the present embodiment, outer heat dissipation element 60 is by the second face 3212 of the first plate portion 321 and the second plate portion
The outer heat dissipation element 60 that 322 the second face 3222 stretches out.In other embodiments, outer heat dissipation element 60 can also only be set
It is placed in the second face 3212 of the first plate portion 321 or is only arranged at the second face 3222 of the second plate portion 322.
Furthermore the structure that in the present embodiment, cover plate 32 is formed in one with interior heat dissipation element 50 and outer heat dissipation element 60.
In other embodiments, interior heat dissipation element and outer heat dissipation element can be independent components, and be arranged on cover plate.Except this it
Outside, in other embodiments, cover plate and annular side plate can also be integrally formed structures.
According to the immersion cooling system of above-described embodiment, due to having independent liquid storage space in each servomechanism installation,
And the coolant to cool independently is stored and is circulated in an other liquid storage space.That is, the heat of each servomechanism installation
Amount is only radiated by the coolant in the liquid storage space of itself.Consequently, it is possible to each servomechanism has independent cooling
System, the inconvenience for introducing building cold water can be not only saved, can more avoid the actual installation quantity of server from being less than the maximum of tank
Share number and produce the problem of heat radiation power assigned by single server is too high.
Further, since the surfaces externally and internally of cover plate is respectively provided with inside and outside heat dissipation element, consequently, it is possible to which servomechanism installation not only may be used
Radiated by submerging liquid-cooled cooling component, can more increase the radiating surface of each servomechanism installation by inside and outside heat dissipation element
Product, and then more preferable radiating effect.
Certainly, the present invention can also have other various embodiments, ripe in the case of without departing substantially from spirit of the invention and its essence
Know those skilled in the art when can be made according to the present invention it is various it is corresponding change and deformation, but these corresponding change and become
Shape should all belong to the protection domain of appended claims of the invention.
Claims (10)
- A kind of 1. immersion cooling system, it is characterised in that including：One load plate；One mainboard, including a substrate and an at least heater element, the substrate are stacked at the load plate, and at least a heater element is electrical for this It is arranged at the substrate；One every liquid cover, is stacked at the substrate, and covers an at least heater element, to be collectively forming liquid storage sky with the substrate Between, the liquid storage space is to an accommodating coolant；AndOne cooling component, positioned at the liquid storage space, and thermally contact in an at least heater element.
- 2. immersion cooling system according to claim 1 a, it is characterised in that annular side plate and one should be included every liquid cover Cover plate, the annular side plate are stacked at the substrate, and the cover plate is arranged at the annular side plate, to make the substrate, the annular side plate and be somebody's turn to do Cover plate is collectively forming the liquid storage space.
- 3. immersion cooling system according to claim 2, it is characterised in that the cover plate is integrated into the annular side plate The structure of type.
- 4. immersion cooling system according to claim 2 a, it is characterised in that extension should be further comprised every liquid cover Plate, the extension board protrude from the outside of the annular side plate, and the cover plate includes connected one first plate portion and one second plate portion, the lid First plate portion of plate is covered in above the extension board, and second plate portion of the cover plate is covered in above the annular side plate, so that should First plate portion of substrate, the annular side plate and the cover plate forms the liquid storage space.
- 5. immersion cooling system according to claim 4, it is characterised in that first plate portion respectively has with second plate portion There are relative one first face and one second face, two first faces further comprise towards the substrate, the liquid-cooled servomechanism installation Heat dissipation element in one, the interior heat dissipation element are arranged at first face of second plate portion.
- 6. immersion cooling system according to claim 5, it is characterised in that first plate portion respectively has with second plate portion There are relative one first face and one second face, two first faces further comprise towards the substrate, the liquid-cooled servomechanism installation One outer heat dissipation element, the outer heat dissipation element are arranged at second face of first plate portion and second face of second plate portion.
- 7. immersion cooling system according to claim 6, it is characterised in that the cover plate, the interior heat dissipation element and this is outer The structure that heat dissipation element is formed in one.
- 8. immersion cooling system according to claim 1, it is characterised in that the cooling component is passive type cooling group Part.
- 9. immersion cooling system according to claim 1, it is characterised in that the cooling component is active cooling group Part.
- 10. immersion cooling system according to claim 1, it is characterised in that the height of the immersion cooling system is 2U。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711143239.4A CN107765824A (en) | 2017-11-17 | 2017-11-17 | Immersion cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711143239.4A CN107765824A (en) | 2017-11-17 | 2017-11-17 | Immersion cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107765824A true CN107765824A (en) | 2018-03-06 |
Family
ID=61279731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711143239.4A Pending CN107765824A (en) | 2017-11-17 | 2017-11-17 | Immersion cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107765824A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1928483A (en) * | 2005-09-07 | 2007-03-14 | 鸿富锦精密工业（深圳）有限公司 | Hot pipe |
| CN101184381A (en) * | 2006-11-14 | 2008-05-21 | 诺亚公司 | Case with phase-change heat radiator |
| US20140123492A1 (en) * | 2012-11-08 | 2014-05-08 | International Business Machines Corporation | Pump-enhanced, sub-cooling of immersion-cooling fluid |
| US20170127565A1 (en) * | 2015-10-29 | 2017-05-04 | International Business Machines Corporation | Drawer-level immersion-cooling with hinged, liquid-cooled heat sink |
-
2017
- 2017-11-17 CN CN201711143239.4A patent/CN107765824A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1928483A (en) * | 2005-09-07 | 2007-03-14 | 鸿富锦精密工业（深圳）有限公司 | Hot pipe |
| CN101184381A (en) * | 2006-11-14 | 2008-05-21 | 诺亚公司 | Case with phase-change heat radiator |
| US20140123492A1 (en) * | 2012-11-08 | 2014-05-08 | International Business Machines Corporation | Pump-enhanced, sub-cooling of immersion-cooling fluid |
| US20140124174A1 (en) * | 2012-11-08 | 2014-05-08 | International Business Machines Corporation | Pump-enhanced, sub-cooling of immersion-cooling fluid |
| US20170127565A1 (en) * | 2015-10-29 | 2017-05-04 | International Business Machines Corporation | Drawer-level immersion-cooling with hinged, liquid-cooled heat sink |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180306 |
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| WD01 | Invention patent application deemed withdrawn after publication |