CN107760911A - A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof - Google Patents

A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof Download PDF

Info

Publication number
CN107760911A
CN107760911A CN201711013393.XA CN201711013393A CN107760911A CN 107760911 A CN107760911 A CN 107760911A CN 201711013393 A CN201711013393 A CN 201711013393A CN 107760911 A CN107760911 A CN 107760911A
Authority
CN
China
Prior art keywords
minutes
copper
solder
ingot casting
room temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711013393.XA
Other languages
Chinese (zh)
Inventor
董鸿志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI RIYUE ALLOY MATERIALS CO Ltd
Original Assignee
WUXI RIYUE ALLOY MATERIALS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI RIYUE ALLOY MATERIALS CO Ltd filed Critical WUXI RIYUE ALLOY MATERIALS CO Ltd
Priority to CN201711013393.XA priority Critical patent/CN107760911A/en
Publication of CN107760911A publication Critical patent/CN107760911A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • C22C1/03Making non-ferrous alloys by melting using master alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

The invention provides a kind of copper-based anti-oxidant sealing alloy solder, the mass percent of its component and each component is:Ge:11~13%;Si:1~5%;Ni:0.3~0.4%;Co:0.1~0.2%;Ce:0.1~0.2%;B:0.1~0.15%;Nd:0.1~0.15%;Surplus is Cu.The present invention is directed to the defects of acid bronze alloy antioxidant is weak, further improves the antioxygenic property of copper-base alloy tin solder.

Description

A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof
Technical field
The present invention relates to the seal, sealing materials technical field of radio tube in vacuum electronic industry, more particularly, to a kind of copper Anti-oxidant multicomponent alloy seal, sealing materials of base and preparation method thereof.
Background technology
With the critical role that encapsulation technology occupies in modernization vacuum electronic field, excellent seal, sealing materials are selected It is more aobvious most important.In electrovacuum sealing-in field, the connecting material being related to includes metal and metal, metal and ceramics etc..Pass The seal, sealing materials silver-based solder of system has the wetting property and decay resistance that mechanical property is good, high because of it, in radio tube It is widely used in sealing-in industry.As the demand to silver-base solder is increasing, silver is used as precious metal material, and price is swift and violent Increase, the cost for directly resulting in solder greatly increases.Therefore, it is a kind of comprehensive in radio tube industry increasingly with keen competition Conjunction performance is good, the low active demand for having become existing market without silver-colored sealing-in solder of cost.
Acid bronze alloy steam forces down, and elevated temperature strength is good, and the wetability between various metals is good, can be used as various metals connection Material.Copper germanium alloy is because it has high-melting-point feature, by high-temperature stage welding of the more use in sublevel welding.Due to Copper germanium alloy is easy to the characteristics of oxidation, can not can not meet current requirement.
The content of the invention
In view of the above-mentioned problems existing in the prior art, this application provides a kind of copper-based anti-oxidant sealing alloy solder and its Preparation method.The present invention is directed to the defects of acid bronze alloy antioxidant is weak, further improves the inoxidizability of copper-base alloy tin solder Energy.Technical scheme is as follows:
The mass percent of a kind of copper-based anti-oxidant sealing alloy solder, its component and each component is:Ge:11~13%; Si:1~5%;Ni:0.3~0.4%;Co:0.1~0.2%;Ce:0.1~0.2%;B:0.1~0.15%;Nd:0.1~ 0.15%;Surplus is Cu.
The preparation method of described copper-based anti-oxidant sealing alloy solder, specific preparation process are as follows:
(1) Ge, Co, Ni raw material are put into melting in vacuum melting furnace and prepare germanium cobalt nickel intermediate alloy;
(2) intermediate alloy prepared in step (1) and Cu, Si, Ce, B, Nd raw material are together put into smelting furnace and melted Refining;
(3) after vacuum reaches 0.06~0.2Pa in smelting furnace, then 1200~1350 DEG C will be heated in stove, be incubated 20~25 minutes, it is completely melt after forming alloy molten liquid, fused solution is cast in shaper, circulating water temperature to room Wen Hou, shaper is gone to take out out of vacuum drying oven, obtains processing the ingot casting needed for this welding material;
(4) the ingot casting solution treatment at 550~650 DEG C that will be obtained in step (3), 45~50 minutes are incubated, rapid water It is cooled to room temperature, then Ageing Treatment 30~35 minutes at 400~450 DEG C again;
(5) the advanced driving of the ingot casting obtained in step (4) is shelled, to ream the dirty and oxide layer on ingot casting surface, then Cold rolling is carried out, controlled rolling passage is at 30~35 times, and when reaching 3~5mm to thickness, clot is put into annealing furnace, temperature 450~550 DEG C are arranged on, 30~40 minutes is incubated, then naturally cools to room temperature;
(6) band obtained in step (5) is continued into cold rolling, controlled rolling passage is rolled down to thickness as 1.2 at 6~8 times After~1.8mm, clot is put into annealing furnace, and temperature setting is incubated 20~30 minutes, then natural cooling at 450~520 DEG C To room temperature;
(7) after being 0.08~0.15mm by the band obtained in step (6) continuation finish rolling to thickness, punching press after sub-cut band Go out required solder products with varying degrees.
The present invention is beneficial to be had technical effect that:
The present invention is equipped with suitable refining, casting, deformation technique, obtained copper-based solder by the optimization to each element Weld strength more improve, and there is excellent inoxidizability.Inoxidizability height can greatly improve the shelf-life of solder, and And solder is set to preserve higher sealing property in sealing-in.
Embodiment
With reference to embodiment, the present invention is specifically described.The quality of each raw material components used in embodiment 1~3 As shown in table 1, unit kg.
Table 1
Embodiment 1
The preparation method for the copper-based anti-oxidant sealing alloy solder that the applicant provides is as follows:
(1) Ge, Co, Ni raw material are put into melting in vacuum melting furnace and prepare germanium cobalt nickel intermediate alloy;
(2) intermediate alloy prepared in step (1) and Cu, Si, Ce, B, Nd raw material are together put into smelting furnace and melted Refining;
(3) after vacuum reaches 0.06Pa in smelting furnace, then 1200 DEG C will be heated in stove, be incubated 20 minutes, completely After fusing forms alloy molten liquid, fused solution is cast in shaper, after circulating water temperature to room temperature, by shaper Go to take out out of vacuum drying oven, obtain processing the ingot casting needed for this welding material;
(4) the ingot casting solution treatment at 550 DEG C that will be obtained in step (3), 50 minutes being incubated, rapid water is cooled to room temperature, Then Ageing Treatment 35 minutes at 400 DEG C again;
(5) the advanced driving of the ingot casting obtained in step (4) is shelled, to ream the dirty and oxide layer on ingot casting surface, then Cold rolling is carried out, controlled rolling passage is at 30 times, and when reaching 5mm to thickness, clot is put into annealing furnace, and temperature setting exists 450 DEG C, 40 minutes are incubated, then naturally cools to room temperature;
(6) band obtained in step (5) is continued into cold rolling, for controlled rolling passage at 6 times, it is 1.8mm to be rolled down to thickness Afterwards, clot is put into annealing furnace, and temperature setting is incubated 30 minutes, then naturally cools to room temperature at 450 DEG C;
(7) after being 0.08mm by the band obtained in step (6) continuation finish rolling to thickness, stamp out after sub-cut band required Solder products with varying degrees.
Embodiment 2
The preparation method for the copper-based anti-oxidant sealing alloy solder that the applicant provides is as follows:
(1) Ge, Co, Ni raw material are put into melting in vacuum melting furnace and prepare germanium cobalt nickel intermediate alloy;
(2) intermediate alloy prepared in step (1) and Cu, Si, Ce, B, Nd raw material are together put into smelting furnace and melted Refining;
(3) after vacuum reaches 0.1Pa in smelting furnace, then 1300 DEG C will be heated in stove, be incubated 22 minutes, it is completely molten Change form alloy molten liquid after, by fused solution cast shaper in, after circulating water temperature to room temperature, by shaper from Go to take out in vacuum drying oven, obtain processing the ingot casting needed for this welding material;
(4) the ingot casting solution treatment at 600 DEG C that will be obtained in step (3), 48 minutes being incubated, rapid water is cooled to room temperature, Then Ageing Treatment 32 minutes at 420 DEG C again;
(5) the advanced driving of the ingot casting obtained in step (4) is shelled, to ream the dirty and oxide layer on ingot casting surface, then Cold rolling is carried out, controlled rolling passage is at 33 times, and when reaching 4mm to thickness, clot is put into annealing furnace, and temperature setting exists 500 DEG C, 35 minutes are incubated, then naturally cools to room temperature;
(6) band obtained in step (5) is continued into cold rolling, for controlled rolling passage at 7 times, it is 1.4mm to be rolled down to thickness Afterwards, clot is put into annealing furnace, and temperature setting is incubated 25 minutes, then naturally cools to room temperature at 500 DEG C;
(7) after being 0.1mm by the band obtained in step (6) continuation finish rolling to thickness, stamp out after sub-cut band required Solder products with varying degrees.
Embodiment 3
The preparation method for the copper-based anti-oxidant sealing alloy solder that the applicant provides is as follows:
(1) Ge, Co, Ni raw material are put into melting in vacuum melting furnace and prepare germanium cobalt nickel intermediate alloy;
(2) intermediate alloy prepared in step (1) and Cu, Si, Ce, B, Nd raw material are together put into smelting furnace and melted Refining;
(3) after vacuum reaches 0.2Pa in smelting furnace, then 1350 DEG C will be heated in stove, be incubated 25 minutes, it is completely molten Change form alloy molten liquid after, by fused solution cast shaper in, after circulating water temperature to room temperature, by shaper from Go to take out in vacuum drying oven, obtain processing the ingot casting needed for this welding material;
(4) the ingot casting solution treatment at 650 DEG C that will be obtained in step (3), 45 minutes being incubated, rapid water is cooled to room temperature, Then Ageing Treatment 30 minutes at 450 DEG C again;
(5) the advanced driving of the ingot casting obtained in step (4) is shelled, to ream the dirty and oxide layer on ingot casting surface, then Cold rolling is carried out, controlled rolling passage is at 35 times, and when reaching 3mm to thickness, clot is put into annealing furnace, and temperature setting exists 550 DEG C, 30 minutes are incubated, then naturally cools to room temperature;
(6) band obtained in step (5) is continued into cold rolling, for controlled rolling passage at 8 times, it is 1.2mm to be rolled down to thickness Afterwards, clot is put into annealing furnace, and temperature setting is incubated 20 minutes, then naturally cools to room temperature at 520 DEG C;
(7) after being 0.15mm by the band obtained in step (6) continuation finish rolling to thickness, stamp out after sub-cut band required Solder products with varying degrees.
Test case:
The solder test data that embodiment 1~3 is prepared is as shown in table 2, table 3;By the three of CN201610874171.6 Individual embodiment contrasts respectively as comparative example 1~3.
(1) sealing temperature and weld strength of solder, as shown in table 2.
Table 2
Performance Sealing temperature (DEG C) Weld strength (KN/cm2)
Embodiment 1 770~800 6.8
Embodiment 2 780~800 6.6
Embodiment 3 790~810 7.1
Comparative example 1 820~930 5.8
Comparative example 2 850~930 5.6
Comparative example 3 870~900 5.1
(2) by solder natural exposing 90 days in air, by observing solder surface color, judge that alloy welds The inoxidizability of material, as a result as shown in table 3.
Table 3
Performance Sealing temperature
Embodiment 1 It is non-discolouring
Embodiment 2 It is non-discolouring
Embodiment 3 It is non-discolouring
Comparative example 1 Black
Comparative example 2 Black
Comparative example 3 Black

Claims (2)

1. a kind of copper-based anti-oxidant sealing alloy solder, it is characterised in that its component and the mass percent of each component are:Ge:11 ~13%;Si:1~5%;Ni:0.3~0.4%;Co:0.1~0.2%;Ce:0.1~0.2%;B:0.1~0.15%;Nd: 0.1~0.15%;Surplus is Cu.
2. the preparation method of the copper-based anti-oxidant sealing alloy solder described in a kind of claim 1, it is characterised in that specific to prepare Step is as follows:
(1) Ge, Co, Ni raw material are put into melting in vacuum melting furnace and prepare germanium cobalt nickel intermediate alloy;
(2) intermediate alloy prepared in step (1) and Cu, Si, Ce, B, Nd raw material are together put into melting in smelting furnace;
(3) after vacuum reaches 0.06~0.2Pa in smelting furnace, then 1200~1350 DEG C will be heated in stove, insulation 20~ 25 minutes, it is completely melt after forming alloy molten liquid, fused solution is cast in shaper, circulating water temperature to room temperature Afterwards, shaper is gone to take out out of vacuum drying oven, obtains processing the ingot casting needed for this welding material;
(4) the ingot casting solution treatment at 550~650 DEG C that will be obtained in step (3), 45~50 minutes are incubated, rapid water is cooled to Room temperature, then Ageing Treatment 30~35 minutes at 400~450 DEG C again;
(5) the advanced driving of the ingot casting obtained in step (4) is shelled, to ream the dirty and oxide layer on ingot casting surface, then carried out Cold rolling, controlled rolling passage is at 30~35 times, and when reaching 3~5mm to thickness, clot is put into annealing furnace, temperature setting At 450~550 DEG C, 30~40 minutes are incubated, then naturally cools to room temperature;
(6) band obtained in step (5) is continued into cold rolling, controlled rolling passage at 6~8 times, be rolled down to thickness for 1.2~ After 1.8mm, clot is put into annealing furnace, and temperature setting is incubated 20~30 minutes, then naturally cooled at 450~520 DEG C Room temperature;
(7) after being 0.08~0.15mm by the band obtained in step (6) continuation finish rolling to thickness, institute is stamped out after sub-cut band The solder products with varying degrees needed.
CN201711013393.XA 2017-10-26 2017-10-26 A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof Pending CN107760911A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711013393.XA CN107760911A (en) 2017-10-26 2017-10-26 A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711013393.XA CN107760911A (en) 2017-10-26 2017-10-26 A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof

Publications (1)

Publication Number Publication Date
CN107760911A true CN107760911A (en) 2018-03-06

Family

ID=61271791

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711013393.XA Pending CN107760911A (en) 2017-10-26 2017-10-26 A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof

Country Status (1)

Country Link
CN (1) CN107760911A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109175785A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of vacuum seal solder alloy
CN109175783A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of quaternary alloy solder
CN111299901A (en) * 2019-12-12 2020-06-19 郑州机械研究所有限公司 Brazing alloy, brazing filler metal, preparation method and application of brazing filler metal and prepared brazing product

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106222478A (en) * 2016-08-23 2016-12-14 无锡日月合金材料有限公司 A kind of ternary-alloy sealing material and preparation method thereof
CN106381415A (en) * 2016-09-30 2017-02-08 无锡日月合金材料有限公司 Copper-based silver-free sealing alloy material and preparation method thereof
CN106435325A (en) * 2016-10-10 2017-02-22 无锡日月合金材料有限公司 Multielement alloy sealing material and preparation method thereof
CN106467941A (en) * 2016-09-30 2017-03-01 无锡日月合金材料有限公司 A kind of radio tube sealing-in low silver multicomponent alloy material and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106222478A (en) * 2016-08-23 2016-12-14 无锡日月合金材料有限公司 A kind of ternary-alloy sealing material and preparation method thereof
CN106381415A (en) * 2016-09-30 2017-02-08 无锡日月合金材料有限公司 Copper-based silver-free sealing alloy material and preparation method thereof
CN106467941A (en) * 2016-09-30 2017-03-01 无锡日月合金材料有限公司 A kind of radio tube sealing-in low silver multicomponent alloy material and preparation method thereof
CN106435325A (en) * 2016-10-10 2017-02-22 无锡日月合金材料有限公司 Multielement alloy sealing material and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109175785A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of vacuum seal solder alloy
CN109175783A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of quaternary alloy solder
CN111299901A (en) * 2019-12-12 2020-06-19 郑州机械研究所有限公司 Brazing alloy, brazing filler metal, preparation method and application of brazing filler metal and prepared brazing product

Similar Documents

Publication Publication Date Title
CN102862003A (en) Silver-free copper based solder and preparation method thereof
CN103112211B (en) High-sag-resistance composite brazing aluminum foil and preparation method thereof
CN107760911A (en) A kind of copper-based anti-oxidant sealing alloy solder and preparation method thereof
CN104907723B (en) Carry the medicine core silver solder of increasing tougheness alloy
CN106435325B (en) A kind of multicomponent alloy seal, sealing materials and preparation method thereof
CN105452500A (en) Copper alloy, copper alloy thin sheet and copper alloy manufacturing method
CN106381415A (en) Copper-based silver-free sealing alloy material and preparation method thereof
CN106077996A (en) Active heat resisting copper base solder for aluminium bronze/rustless steel soldering and preparation method thereof
CN107429328A (en) Heat dissipation element copper alloy plate and heat dissipation element
CN106222478B (en) A kind of ternary-alloy sealing material and preparation method thereof
CN102808104B (en) Quaternary alloy sealing material
CN101130220A (en) Solder without cadmium and silver
CN103170760B (en) A kind of electrovacuum solder and preparation method
CN103014406B (en) Multicomponent alloy material for sealing microwave oven magnetron
CN110238559A (en) A kind of novel quaternary alloy solder and preparation method thereof
CN102319966B (en) Brazing filler metal for braze welding of titanium and titanium alloy, preparation method and braze welding method
CN104561638B (en) A kind of Al2O3The preparation method of dispersed and strengthened copper-based composite material
CN102626838B (en) Silver-based cadmium-free medium temperature brazing filler metal and preparation method thereof
CN103014404B (en) Alloy material for sealing microwave magnetron and preparation method thereof
CN109175783A (en) A kind of quaternary alloy solder
CN103789570A (en) High-strength heat-resisting micro-alloyed copper pipe and preparation method thereof
CN105033500B (en) Silver-less solder and preparation method without excessive phenomenon when a kind of welding copper and copper alloy
CN111468718B (en) Silver copper oxide sheet-shaped electric contact and preparation method thereof
CN107838576A (en) A kind of microwave magnetron sealing alloy solder
CN110195169A (en) A kind of copper-based anti-oxidant medium temperature alloy sealing solder

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180306