CN107760240A - Crystal-bonding adhesive and preparation method thereof - Google Patents
Crystal-bonding adhesive and preparation method thereof Download PDFInfo
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- CN107760240A CN107760240A CN201710974067.9A CN201710974067A CN107760240A CN 107760240 A CN107760240 A CN 107760240A CN 201710974067 A CN201710974067 A CN 201710974067A CN 107760240 A CN107760240 A CN 107760240A
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- Prior art keywords
- crystal
- bonding adhesive
- epoxy resin
- silver powder
- toughener
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention discloses a kind of crystal-bonding adhesive and preparation method thereof, wherein, the crystal-bonding adhesive contains by weight percentage：Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin 8%~18%；Cationic initiator 0.02%~0.2%；Toughener 2%~8%；Diluent 1%~5%；And silver powder 70%~85%.Technical scheme can provide a kind of die bond material for both having high-adhesive-strength, high heat conduction, high conduction performance, having excellent anti-yellowing property again.
Description
Technical field
The present invention relates to LED encapsulation material technical field, more particularly to a kind of crystal-bonding adhesive and preparation method thereof.
Background technology
At present, heavy-power LED product is due to high reliability request, mainly with high-adhesive-strength, highly conductive, high heat conduction
The epoxy elargol of performance is as die bond material.But due to when heavy-power LED product is applied DIE Temperature it is higher, it is most
Epoxy elargol macula lutea, or even melanism are being occurred after for a period of time by heat ageing, so as to have a strong impact on great power LED production
The optical property of product and life-span.
The content of the invention
The main object of the present invention is to provide a kind of crystal-bonding adhesive, it is desirable to provide it is a kind of both had high-adhesive-strength, high heat conduction,
High conduction performance, there is the die bond material of excellent anti-yellowing property again.
To achieve the above object, crystal-bonding adhesive proposed by the present invention contains by weight percentage：
Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin 8%~18%；
Cationic initiator 0.02%~0.2%；
Toughener 2%~8%；
Diluent 1%~5%；And
Silver powder 70%~85%.
Alternatively, the cycloaliphatic epoxy resin includes 3,4- epoxycyclohexyl-methyls 3,4- epoxycyclohexyls formic acid esters,
Double ((3,4- epoxycyclohexyls) methyl) adipate esters, poly- [(2- Oxyranyles) -1,2- cyclohexanediols] 2- ethyl -2- (hydroxyls
Methyl) double (the 3,4- 7-oxa-bicyclo[4.1.0 first of -1,3- propylene glycols, dicyclopentadiene diepoxide and 1,4 cyclohexane dimethanol
At least one of acid) ester.
Alternatively, the hydrogenated epoxy resin include bisphenol-A epoxy resin, A Hydrogenated Bisphenol A F types epoxy resin and
At least one of A Hydrogenated Bisphenol A S type epoxy resin.
Alternatively, the cationic initiator is that ammonium closes hexafluoro antimonate.
Alternatively, the toughener is that terminal hydroxy group copolyester polyols and/or terminal hydroxy group are copolymerized ethoxylated polyhydric alcohol.
Alternatively, the diluent includes butyl glycidyl ether, octyl glycidyl ether, benzyl glycidyl ether, 1,
At least one of 4- butanediol diglycidyl ethers and tertiary carbonic acid glycidyl ester.
Alternatively, the silver powder is flake silver powder, or is flake silver powder and the mixture of granular silver powder.
Alternatively, the crystal-bonding adhesive also contains by weight percentage：Conductivity accelerator 0.05%~0.3%, the conduction
Accelerator is succinic acid.
The present invention also proposes a kind of preparation method of crystal-bonding adhesive, and the crystal-bonding adhesive contains by weight percentage：
Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin 8%~18%；
Cationic initiator 0.02%~0.2%；
Toughener 2%~8%；
Diluent 1%~5%；And
Silver powder 70%~85%；
The preparation method comprises the following steps：
Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin, cationic initiator are mixed, obtain the first mixing
Thing；
Toughener, diluent and silver powder are sequentially added into first mixture, continues to mix, obtains the die bond
Glue.
The present invention proves by substantial amounts of theoretical analysis and test, finds：The anti-yellowing property of crystal-bonding adhesive is poor with its group
Aromatic group and amine groups in point have direct contact, therefore, crystal-bonding adhesive of the invention, with cycloaliphatic epoxy resin
And/or hydrogenated epoxy resin, using cationic initiator as curing agent, may be such that the important set in crystal-bonding adhesive as base material
Point --- base material and curing agent, aromatic group and amine groups are not contained, i.e., evade in raw material selection and in course of reaction
The introducing of chromophore, adds lustre to so that crystal-bonding adhesive is non-aging when by heat ageing, so as to greatly promote in crystal-bonding adhesive
The anti-yellowing property of crystal-bonding adhesive.Also, the reasonable cooperation of diluent and toughener does not improve the viscous of crystal-bonding adhesive only effectively
Intensity is connect, and also reduces the viscosity of crystal-bonding adhesive, so as to be advantageous to that the silver powder of high content is added into its component, in this way, can
So that the conductive capability and the capacity of heat transmission of crystal-bonding adhesive increase substantially.
To sum up, technical scheme, which provides one kind, both has high-adhesive-strength, high heat conduction, high conduction performance, again
Die bond material with excellent anti-yellowing property, is suitable for heavy-power LED product package application, so as to efficiently solve big work(
Light decay problem after rate LED product long-term work, lift optical property and the life-span of heavy-power LED product.
In addition, the crystal-bonding adhesive of the present invention also using terminal hydroxy group copolyester polyols and/or terminal hydroxy group be copolymerized ethoxylated polyhydric alcohol as
Toughener, it does not contain aromatic group and amine groups, has evaded so as to further in raw material selection and in course of reaction solid
The introducing of chromophore in brilliant glue, improve the anti-yellowing property of crystal-bonding adhesive.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only the part of the embodiment of the present invention, rather than whole embodiments.It is general based on the embodiment in the present invention, this area
The every other embodiment that logical technical staff is obtained under the premise of creative work is not made, belong to what the present invention protected
Scope.
In addition, the technical scheme between each embodiment can be combined with each other, but must be with ordinary skill
Personnel can be implemented as basis, and this technical side is will be understood that when the combination appearance of technical scheme is conflicting or can not realize
The combination of case is not present, also not within the protection domain of application claims.
The present invention proposes a kind of crystal-bonding adhesive.
The crystal-bonding adhesive contains by weight percentage：
Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin 8%~18%；
Cationic initiator 0.02%~0.2%；
Toughener 2%~8%；
Diluent 1%~5%；And
Silver powder 70%~85%.
The present invention proves by substantial amounts of theoretical analysis and test, finds：The anti-yellowing property of crystal-bonding adhesive is poor with its group
Aromatic group and amine groups in point have direct contact, therefore, crystal-bonding adhesive of the invention, with cycloaliphatic epoxy resin
And/or hydrogenated epoxy resin, using cationic initiator as curing agent, may be such that the important set in crystal-bonding adhesive as base material
Point --- base material and curing agent, aromatic group and amine groups are not contained, i.e., evade in raw material selection and in course of reaction
The introducing of chromophore, adds lustre to so that crystal-bonding adhesive is non-aging when by heat ageing, so as to greatly promote in crystal-bonding adhesive
The anti-yellowing property of crystal-bonding adhesive.Also, the reasonable cooperation of diluent and toughener does not improve the viscous of crystal-bonding adhesive only effectively
Intensity is connect, and also reduces the viscosity of crystal-bonding adhesive, so as to be advantageous to that the silver powder of high content is added into its component, in this way, can
So that the conductive capability and the capacity of heat transmission of crystal-bonding adhesive increase substantially.
To sum up, technical scheme, which provides one kind, both has high-adhesive-strength, high heat conduction, high conduction performance, again
Die bond material with excellent anti-yellowing property, is suitable for heavy-power LED product package application, so as to efficiently solve big work(
Light decay problem after rate LED product long-term work, lift optical property and the life-span of heavy-power LED product.
Specifically, the cycloaliphatic epoxy resin includes 3,4- epoxycyclohexyl-methyls 3,4- epoxycyclohexyls formic acid esters,
Double ((3,4- epoxycyclohexyls) methyl) adipate esters, poly- [(2- Oxyranyles) -1,2- cyclohexanediols] 2- ethyl -2- (hydroxyls
Methyl) double (the 3,4- 7-oxa-bicyclo[4.1.0 first of -1,3- propylene glycols, dicyclopentadiene diepoxide and 1,4 cyclohexane dimethanol
At least one of acid) ester.
It is double that the hydrogenated epoxy resin includes bisphenol-A epoxy resin, A Hydrogenated Bisphenol A F types epoxy resin and hydrogenation
At least one of phenol S type epoxy resin.
It should be noted that the cooperation of the cycloaliphatic epoxy resin and diluent of low viscosity can be in optimum range further
The viscosity of crystal-bonding adhesive is reduced, so as to be advantageous to add the silver powder of higher amount so that the electric conductivity and heat conductivility of crystal-bonding adhesive
Further lifted.
The cationic initiator is that ammonium closes hexafluoro antimonate.
The toughener is that terminal hydroxy group copolyester polyols and/or terminal hydroxy group are copolymerized ethoxylated polyhydric alcohol.
It should be noted that the crystal-bonding adhesive of the present invention is also more with terminal hydroxy group copolyester polyols and/or terminal hydroxy group copolyether
First alcohol is as toughener, and it does not contain aromatic group and amine groups, so as to further in raw material selection and in course of reaction
Evade the introducing of chromophore in crystal-bonding adhesive, improve the anti-yellowing property of crystal-bonding adhesive.
In addition, the introducing of chromophore (aromatic group and amine groups) has not only further been evaded in the selection of toughener,
The anti-yellowing property of crystal-bonding adhesive is improved, but also significantly enhances intensity and shock resistance after die bond adhesive curing.It is preferred that
Ground, the relative molecular mass of the toughener are not less than 1000.
Also, the diluent include butyl glycidyl ether, octyl glycidyl ether, benzyl glycidyl ether, Isosorbide-5-Nitrae-
At least one of butanediol diglycidyl ether and tertiary carbonic acid glycidyl ester.
It should be understood that in the component of crystal-bonding adhesive diluent addition, can play a part of being diluted crystal-bonding adhesive, from
And when being advantageous to be stirred in crystal-bonding adhesive preparation process each component it is scattered, improve the distributing homogeneity of each component in crystal-bonding adhesive
With the uniformity of reaction, the operating characteristics of crystal-bonding adhesive is improved.
The silver powder is flake silver powder, or is flake silver powder and the mixture of granular silver powder.In this way, it may be such that crystal-bonding adhesive
Conductive capability after solidification is further lifted.Preferably, the particle size range of the silver powder is 10 μm~20 μm.
Further, the crystal-bonding adhesive also contains by weight percentage：Conductivity accelerator 0.05%~0.3%, it is described to lead
Electric accelerator is succinic acid.It should be noted that the addition of conductivity accelerator, can effectively reduce powder particle surface insulating barrier
Thickness so that the Tunneling Phenomenon of electronics is more prone to occur, and so as to effectively reduce the specific insulation of crystal-bonding adhesive, improves
Its electric conductivity.
The present invention also proposes a kind of preparation method of foregoing crystal-bonding adhesive, comprises the following steps：
The component of crystal-bonding adhesive is prepared according to foregoing percentage by weight；
Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin, cationic initiator are stirred, mixed, obtains first
Mixture；
Toughener, diluent, conductivity accelerator and silver powder are sequentially added into first mixture, continues to stir, mix
It is bonded to uniformly, obtains the crystal-bonding adhesive；
The crystal-bonding adhesive is subjected to vacuum removal bubble processing.
In this way, can be prepared it is a kind of with high-adhesive-strength, high heat conduction, high conduction performance while with excellent
The die bond material of anti-yellowing property.
Crystal-bonding adhesive of the present invention and preparation method thereof is specifically described below by way of specific embodiment.
Embodiment 1
Following components is prepared according to corresponding percentage by weight：
Cycloaliphatic epoxy resin CEL2021P 8.6%
Cationic initiator 0.1%
Tertiary carbonic acid glycidyl ester 3%
Terminal hydroxy group copolyester polyols 3%
Succinic acid 0.3%
Silver powder 85%
According to the preparation method of foregoing crystal-bonding adhesive, after above component is sufficiently mixed, it is conductive that color inhibition epoxy resin is made
Glue.Its horizontal shear force is 21.6MPa, and specific insulation is 1.8 × 10-5Ω cm, thermal conductivity 5.6W/mK, viscosity are
24120cP, thixotropic index 6.2.
Embodiment 2
Following components is prepared according to corresponding percentage by weight：
Cycloaliphatic epoxy resin CEL2021P 18%
Cationic initiator 0.2%
Tertiary carbonic acid glycidyl ester 5%
Terminal hydroxy group copolyester polyols 2.5%
Succinic acid 0.3%
Silver powder 74%
According to the preparation method of foregoing crystal-bonding adhesive, after above component is sufficiently mixed, it is conductive that color inhibition epoxy resin is made
Glue.Its horizontal shear force is 25.4MPa, and specific insulation is 6.2 × 10-5Ω cm, thermal conductivity 2.8W/mK, viscosity are
13200cP, thixotropic index 6.1.
Embodiment 3
Following components is prepared according to corresponding percentage by weight：
Cycloaliphatic epoxy resin CEL2021P 17%
Cationic initiator 0.1%
Tertiary carbonic acid glycidyl ester 2.8%
Terminal hydroxy group copolyester polyols 8%
Succinic acid 0.1%
Silver powder 72%
According to the preparation method of foregoing crystal-bonding adhesive, after above component is sufficiently mixed, it is conductive that color inhibition epoxy resin is made
Glue.Its horizontal shear force is 28.5MPa, and specific insulation is 8.5 × 10-5Ω cm, thermal conductivity 2.4W/mK, viscosity are
15600cP, thixotropic index 5.8.
The crystal-bonding adhesive (color inhibition epoxide resin conductive adhesive) of above-described embodiment one to embodiment three is tested, test knot
Fruit is as shown in table 1：
Table 1
It can be seen that by embodiment 1-3：It is different that combination property can obtain by the ratio and dosage that adjust various components
Crystal-bonding adhesive product.Also,
Before solidification, outward appearance is grey, and between 13200cP~24120cP, thixotropic index (flows viscosity at 25 DEG C
The ratio for motion/dynamic viscosity that body measures under low shear rate and high-rate of shear respectively) 5.8 0.5rpm/5rpm~
Between 6.2 0.5rpm/5rpm, density is in 3.4g/cm3~4.8g/cm3Between, meet the requirement of crystal-bonding adhesive standard.
After solidification, thermal conductivity is above 2.0W/ (mK), i.e. this hair between 2.4W/ (mK)~5.6W/ (mK)
Bright crystal-bonding adhesive has excellent heat conductivility, available for the encapsulation of high-power LED chip, and realizes its quick heat radiating.
Specific insulation is 1.8 × 10-5Ω cm~8.5 × 10-5Between Ω cm, 9 × 10 are below-5Ω cm, i.e.,
Crystal-bonding adhesive of the present invention has excellent electric conductivity.
Horizontal shear strength is above 21MPa between 21.6MPa~28.5MPa, i.e., crystal-bonding adhesive of the present invention has excellent
Adhesive strength.
In summary, crystal-bonding adhesive of the present invention and preparation method thereof provides a kind of both with high-adhesive-strength, high heat conduction, height
Electric conductivity, there is the die bond material of excellent anti-yellowing property again.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every at this
Under the inventive concept of invention, the equivalent structure transformation made using present specification, or directly/other are used in indirectly
Related technical field is included in the scope of patent protection of the present invention.
Claims (9)
1. a kind of crystal-bonding adhesive, it is characterised in that the crystal-bonding adhesive contains by weight percentage：
Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin 8%~18%；
Cationic initiator 0.02%~0.2%；
Toughener 2%~8%；
Diluent 1%~5%；And
Silver powder 70%~85%.
2. crystal-bonding adhesive as claimed in claim 1, it is characterised in that the cycloaliphatic epoxy resin includes 3,4- epoxycyclohexyls
Methyl 3,4- epoxycyclohexyls formic acid esters, double ((3,4- epoxycyclohexyls) methyl) adipate esters, it is poly- [(2- Oxyranyles)-
1,2- cyclohexanediols] 2- ethyls -2- (methylol) -1,3- propylene glycols, dicyclopentadiene diepoxide and 1,4- hexamethylenes
At least one of double (3,4- 7-oxa-bicyclo[4.1.0s formic acid) esters of dimethanol.
3. crystal-bonding adhesive as claimed in claim 1, it is characterised in that the hydrogenated epoxy resin includes hydrogenated bisphenol A type epoxy
At least one of resin, A Hydrogenated Bisphenol A F types epoxy resin and A Hydrogenated Bisphenol A S type epoxy resin.
4. crystal-bonding adhesive as claimed in claim 1, it is characterised in that the cationic initiator is that ammonium closes hexafluoro antimonate.
5. crystal-bonding adhesive as claimed in claim 1, it is characterised in that the toughener be terminal hydroxy group copolyester polyols and/or
Terminal hydroxy group is copolymerized ethoxylated polyhydric alcohol.
6. crystal-bonding adhesive as claimed in claim 1, it is characterised in that the diluent includes butyl glycidyl ether, octyl group contracts
At least one in water glycerin ether, benzyl glycidyl ether, 1,4- butanediol diglycidyl ethers and tertiary carbonic acid glycidyl ester
Kind.
7. crystal-bonding adhesive as claimed in claim 1, it is characterised in that the silver powder is flake silver powder, or for flake silver powder and
The mixture of granular silver powder.
8. such as the crystal-bonding adhesive any one of claim 1-7, it is characterised in that the crystal-bonding adhesive also contains by weight percentage
Have：Conductivity accelerator 0.05%~0.3%, the conductivity accelerator are succinic acid.
9. the preparation method of the crystal-bonding adhesive of claim 1, it is characterised in that comprise the following steps：
Cycloaliphatic epoxy resin and/or hydrogenated epoxy resin, cationic initiator are mixed, obtain the first mixture；
Toughener, diluent and silver powder are sequentially added into first mixture, continues to mix, obtains the crystal-bonding adhesive.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710974067.9A CN107760240A (en) | 2017-10-18 | 2017-10-18 | Crystal-bonding adhesive and preparation method thereof |
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| CN201710974067.9A CN107760240A (en) | 2017-10-18 | 2017-10-18 | Crystal-bonding adhesive and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111117539A (en) * | 2019-12-16 | 2020-05-08 | 苏州瑞力博新材科技有限公司 | High-adhesion low-contact-resistance conductive adhesive and heterojunction laminated solar module prepared from same |
| CN117165236A (en) * | 2023-10-30 | 2023-12-05 | 空净视界智能科技有限公司 | Insulating die bond adhesive for LED and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111117539A (en) * | 2019-12-16 | 2020-05-08 | 苏州瑞力博新材科技有限公司 | High-adhesion low-contact-resistance conductive adhesive and heterojunction laminated solar module prepared from same |
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| CN117165236B (en) * | 2023-10-30 | 2024-04-12 | 空净视界智能科技有限公司 | Insulating die bond adhesive for LED and preparation method thereof |
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