CN107746689A - A kind of preparation method of high heat conduction pressure sensitive adhesive - Google Patents
A kind of preparation method of high heat conduction pressure sensitive adhesive Download PDFInfo
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- CN107746689A CN107746689A CN201710908902.9A CN201710908902A CN107746689A CN 107746689 A CN107746689 A CN 107746689A CN 201710908902 A CN201710908902 A CN 201710908902A CN 107746689 A CN107746689 A CN 107746689A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Abstract
The present invention relates to heat sink material preparing technical field, particularly a kind of preparation method of high heat conduction pressure sensitive adhesive, comprise the following steps：(1) graphene powder and boron nitride powder are well mixed, add heat conduction carbon material, composite heat-conducting filler is obtained after well mixed；(2) the composite heat-conducting filler is modified in wet-treating；(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used.The present invention can more efficiently form heat conduction network, and in the case of addition as few as possible, agglomeration does not occur not only, moreover it is possible to obtain higher heat conductivility.
Description
Technical field
The present invention relates to heat sink material preparing technical field, particularly a kind of preparation method of high heat conduction pressure sensitive adhesive.
Background technology
With the continuous development of modern science and technology, densification, miniaturization trend is presented in electronic product.Due to electronic apparatus
The increase of power, substantial amounts of heat can be produced during use, this proposes higher requirement to heat dissipation problem.Whether have
Heat caused by effect ground removal electronic equipment, directly influence the reliability and service life of product.Heat-conducting glue band is because heat conduction
Insulation and attachment function be integrated and be widely used, it have in the case of free of contamination can Reusability, to quilt after stripping
The features such as maxxaedium is pollution-free.But the thermal conductivity factor of heat-conducting glue is generally relatively low at present, thus how more efficiently to improve and lead
The thermal conductivity factor of hot glue turns into the key solved the problems, such as.
The selection of heat filling, directly influence the heat conductivility that can improve heat-conducting glue.Using leading for high thermal conductivity coefficient
Hot filler, higher thermal conductivity factor can be obtained in the case where addition is less.Graphene is an only carbon atom thickness
The two-dimensional material in honeycomb lattice, have excellent machinery, heat conduction, conductive characteristic.Graphene has high thermal conductivity factor, single
The thermal conductivity factor of layer graphene is up to 5300W/mK, and multi-layer graphene thermal conductivity is also in more than 1500W/mK, and graphite
Alkene has good pliability and extensibility.Boron nitride (BN), also known as white graphite alkene, have a good lubricity, electrical insulating property,
Chemical resistance, particularly its excellent heat conductivility can preferably improve the performance of heat-conducting glue.In the prior art, as specially
Profit number is that CN103642408A discloses one kind using BN as thermal conducting agent heat-conducting double-sided adhesive tape and its preparation technology, and its technical scheme is
BN individually is used as heat filling, and the heat-conducting double-sided adhesive tape heat conductivility of preparation is superior.Also Patent No. CN106422508A
A kind of preparation method of graphite heat conducting double faced adhesive tape is disclosed, its technical scheme is the main superior function for utilizing graphene, as
A kind of filler of high heat conduction prepares bond plies, improves the heat conduction of bond plies to greatest extent under minimal amount of increase
Performance.Graphene and BN are still mainly added separately in patent at present, the two-dimensional material superior to the two heat conductivilitys is answered
With seldom, in particular how more effectively being formed using report, complete thermal conducting path report is few.In addition, how to make inorganic material
The powder of material is more uniformly dispersed in organic system and the problem of a key.
The content of the invention
It is an object of the present invention to overcome the above-mentioned technical problems, and to provide one kind answers two-dimensional material graphene and boron nitride
Match somebody with somebody to improve the preparation method of the high heat conduction pressure sensitive adhesive of the heat conductivility of heat-conducting glue band, the present invention can use up in heat filling addition
In the case of may lacking, the heat conductivility of product is improved to a greater extent.
The technical scheme for solving above-mentioned technical problem is as follows：
A kind of preparation method of high heat conduction pressure sensitive adhesive, comprises the following steps：
(1) composite heat-conducting filler is prepared
Appropriate graphene powder and boron nitride powder is taken to be uniformly mixed in planetary mixer or kneader, then to row
Heat conduction carbon material is added in star stirring or in kneader, it is sufficiently mixed with graphene powder and boron nitride, obtains composite guide
Hot filler；
(2) composite heat-conducting filler is modified
The ethyl acetate solution of addition surface conditioning agent is prepared, composite heat-conducting filler is added thereto, heating reflux reaction,
Filtration washing and drying, smashed to obtain fluffy scattered powder with pulverizer；
(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used
The composite heat-conducting filler after modification that pressure sensitive adhesive obtains with step (2) is uniformly mixed at room temperature, obtained
High heat conduction pressure sensitive adhesive.
Further, the mass fraction that the graphene powder described in step (1) accounts for composite heat-conducting filler is 1~5%, nitrogen
The mass fraction that change boron powder accounts for composite heat-conducting filler is 40~70%, and heat conduction carbon material accounts for the mass fraction of composite heat-conducting filler
For 30~60%.
Further, 10min~2h is stirred at room temperature in the graphene powder in step (1) and boron nitride powder, adds
It is further continued for stirring 10min~2h after heat conduction carbon material, until heat conduction carbon material, graphene powder and boron nitride are sufficiently mixed.
Further, the number of plies of the graphene powder described in step (1) is 1~5 layer, and boron nitride is hexagonal boron nitride,
Particle diameter is 0.1~10 μm, and heat conduction carbon material is the mixture in carbon black, CNT, carbon fiber and graphite.
Further, the described surface conditioning agent in step (2) is silane coupler or polyvinylpyrrolidone, table
The concentration that face inorganic agent is distributed in ethyl acetate solvent is 1~100mg/L, and composite heat-conducting filler with the addition of surface conditioning agent
Ethyl acetate solution in concentration be 1~20mg/mL, heating-up temperature is 77~100 DEG C, and the time of backflow is 2~8h.
Further, the pressure sensitive adhesive described in step (3) is pressure-sensitive acrylate, organic silicon pressure sensitive adhesive or poly- ammonia
Esters pressure sensitive adhesive.
Further, the composite heat-conducting filler after modification that the pressure sensitive adhesive described in step (3) obtains with step (2)
Mass ratio is 3~10：1~5.
The beneficial effects of the present invention are：
The present invention uses carbon black, one-dimensional CNT and the carbon fiber, the graphene of two dimension and boron nitride, three-dimensional of zero dimension
Graphite simultaneously add mode, can more efficiently form heat conduction network, be obtained in the case of addition as few as possible
Higher heat conductivility.The present invention carries out wet method using the ethyl acetate solution that with the addition of surface conditioning agent to heat filling powder
Processing, heating reflux reaction, adds the chance that liquid fully contacts with powder so that powder surface contains abundant organic official
It can roll into a ball, so as to disperse well and infiltrate in pressure sensitive adhesive, not reunite, further increase the thermal conductance of heat-conducting glue
Energy and stability.
Added while graphene and boron nitride, the heat conductivility of pressure sensitive adhesive can be improved, in holding pressure sensitive adhesive gluing inherently
Under property, heat is quickly exported.In addition, by way of adding carbon material, using black body radiation, by heat with infra-red radiation
Form export, improve the heat dispersion of pressure sensitive adhesive.Due to the addition of graphene and boron nitride, the pressure that the inventive method obtains
Quick glue also has anticorrosion antiwear, fire retardation, also has stronger bearing capacity.Preparation technology of the present invention is easily-controllable, production technology letter
It is short, it is adapted to large-scale production.
Embodiment
With reference to embodiment, the present invention is further detailed explanation.
Embodiment 1：
A kind of preparation method of high heat conduction pressure sensitive adhesive, comprises the following steps：
(1) composite heat-conducting filler is prepared
The graphene powder 1g that the number of plies is 1 layer and the hexagonal boron nitride powder 40g that particle diameter is 0.1 μm are taken in planetary mixer
In stir 10min at room temperature, be well mixed, then into planetary mixer add heat conduction carbon material 59g be further continued for stir 10min,
Heat conduction carbon material is the mixture of carbon black, CNT, carbon fiber and graphite, it is filled with graphene powder and boron nitride powder
Divide mixing, obtain composite heat-conducting filler；
(2) wet-treating modification composite heat-conducting filler
The ethyl acetate solution of addition KH550 surface conditioning agents is prepared, concentration 1mg/L, composite heat-conducting filler is added
Wherein, concentration of the composite heat-conducting filler in it with the addition of the ethyl acetate solution of surface conditioning agent is 1mg/mL, and heating is boiled, temperature
Spend for 77~100 DEG C, ethyl acetate steam condensing reflux is into solution, and after reacting 2 hours, filtering, filter cake passes through ethyl acetate
Dried after solvent washing, smashed to obtain fluffy scattered powder with pulverizer；
(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used
By pressure-sensitive acrylate with after modification composite heat-conducting filler according to mass ratio be 3:1 is stirred at room temperature
It is well mixed, obtain high heat conduction pressure sensitive adhesive.
Embodiment 2
A kind of preparation method of high heat conduction pressure sensitive adhesive, comprises the following steps：
(1) composite heat-conducting filler is prepared
The graphene powder 5g that the number of plies is 5 layers and the hexagonal boron nitride powder 65g that particle diameter is 10 μm are taken in planetary mixer
In stir 2h at room temperature, be well mixed, then into planetary mixer add heat conduction carbon material 30g be further continued for stir 2h, heat conduction carbon
Material is the mixture of carbon black, CNT, carbon fiber and graphite, makes it fully mixed with graphene powder and boron nitride powder
Close, obtain composite heat-conducting filler；
(2) wet-treating modification composite heat-conducting filler
Prepare the ethyl acetate solution of addition polyvinylpyrrolidone surface conditioning agent, concentration 100mg/L, by composite guide
Hot filler is added thereto, and concentration of the composite heat-conducting filler in it with the addition of the ethyl acetate solution of surface conditioning agent is 20mg/mL,
Heating is boiled, and temperature is 77~100 DEG C, and ethyl acetate steam condensing reflux is into solution, after reacting 8 hours, filtering, and filter cake warp
Dried after the washing of peracetic acid ethyl ester solvent, smashed to obtain fluffy scattered powder with pulverizer；
(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used
By organic silicon pressure sensitive adhesive with after modification composite heat-conducting filler according to mass ratio be 10:1 is stirred at room temperature
It is well mixed, obtain high heat conduction pressure sensitive adhesive.
Embodiment 3
A kind of preparation method of high heat conduction pressure sensitive adhesive, comprises the following steps：
(1) composite heat-conducting filler is prepared
The graphene powder 2g that the number of plies is 3 layers and the hexagonal boron nitride powder 50g that particle diameter is 5 μm are taken in planetary mixer
1h is stirred at room temperature, is well mixed, then is added heat conduction carbon material 48g into planetary mixer and be further continued for stirring 1h, heat conduction carbon materials
Expect for the mixture of carbon black, CNT, carbon fiber and graphite, to make it be sufficiently mixed with graphene powder and boron nitride powder,
Obtain composite heat-conducting filler；
(2) wet-treating modification composite heat-conducting filler
Prepare the ethyl acetate solution of addition polyvinylpyrrolidone surface conditioning agent, concentration 50mg/L, by composite guide
Hot filler is added thereto, and concentration of the composite heat-conducting filler in it with the addition of the ethyl acetate solution of surface conditioning agent is 10mg/mL,
Heating is boiled, and temperature is 77~100 DEG C, and ethyl acetate steam condensing reflux is into solution, after reacting 5 hours, filtering, and filter cake warp
Dried after the washing of peracetic acid ethyl ester solvent, smashed to obtain fluffy scattered powder with pulverizer；
(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used
By polyurethanes pressure sensitive adhesive with after modification composite heat-conducting filler according to mass ratio be 7:4 be stirred at room temperature it is mixed
Close uniformly, obtain high heat conduction pressure sensitive adhesive.
Embodiment 4
A kind of preparation method of high heat conduction pressure sensitive adhesive, comprises the following steps：
(1) composite heat-conducting filler is prepared
The graphene powder 3g that the number of plies is 4 layers and the hexagonal boron nitride powder 60g that particle diameter is 1 μm are taken in planetary mixer
1.5h is stirred at room temperature, is well mixed, then is added heat conduction carbon material 39g into planetary mixer and be further continued for stirring 1h, heat conduction carbon
Material is the mixture of carbon black, CNT, carbon fiber and graphite, makes it fully mixed with graphene powder and boron nitride powder
Close, obtain composite heat-conducting filler；
(2) wet-treating modification composite heat-conducting filler
The ethyl acetate solution of addition KH570 surface conditioning agents is prepared, concentration 10mg/L, composite heat-conducting filler is added
Wherein, concentration of the composite heat-conducting filler in it with the addition of the ethyl acetate solution of surface conditioning agent is 15mg/mL, and heating is boiled,
Temperature is 77~100 DEG C, and ethyl acetate steam condensing reflux is into solution, and after reacting 6 hours, filtering, filter cake is through peracetic acid second
Dried after ester solvent washing, smashed to obtain fluffy scattered powder with pulverizer；
(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used
By pressure-sensitive acrylate with after modification composite heat-conducting filler according to mass ratio be 4:3 are stirred at room temperature
It is well mixed, obtain high heat conduction pressure sensitive adhesive.
Embodiment 5
A kind of preparation method of high heat conduction pressure sensitive adhesive, comprises the following steps：
(1) composite heat-conducting filler is prepared
The graphene powder 5g that the number of plies is 2 layers and the hexagonal boron nitride powder 50g that particle diameter is 1 μm are taken in planetary mixer
30min is stirred at room temperature, is well mixed, then is added heat conduction carbon material 45g into planetary mixer and be further continued for stirring 1h, heat conduction carbon
Material is the mixture of carbon black, CNT, carbon fiber and graphite, makes it fully mixed with graphene powder and boron nitride powder
Close, obtain composite heat-conducting filler；
(2) wet-treating modification composite heat-conducting filler
The ethyl acetate solution of addition KH560 surface conditioning agents is prepared, concentration 90mg/L, composite heat-conducting filler is added
Wherein, concentration of the composite heat-conducting filler in it with the addition of the ethyl acetate solution of surface conditioning agent is 15mg/mL, and heating is boiled,
Temperature is 77~100 DEG C, and ethyl acetate steam condensing reflux is into solution, and after reacting 4 hours, filtering, filter cake is through peracetic acid second
Dried after ester solvent washing, smashed to obtain fluffy scattered powder with pulverizer；
(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used
By pressure-sensitive acrylate with after modification composite heat-conducting filler according to mass ratio be 3:5 are stirred at room temperature
It is well mixed, obtain high heat conduction pressure sensitive adhesive.
By Claims 1 to 5 according to the characteristics such as each standard detection thermal conductivity factor, density, viscosity, confining force, specific test
Data are as shown in the table：
In addition, based on embodiment 5, composite heat-conducting filler and step (2) that step (1) is obtained obtain through overly moist
Method processing modified composite heat-conducting filler pressure sensitive adhesive is modified with identical quality addition respectively after heat conduction system
Number see the table below shown：
As seen from the above table：The viscosity characteristicses and stability of high heat conduction pressure sensitive adhesive prepared by the present invention can be kept well
The intrinsic characteristic of original pressure sensitive adhesive, and thermal conductivity factor improves a lot.
It is described above, be only presently preferred embodiments of the present invention, any formal limitation not done to the present invention, it is every according to
Any simply modification, the equivalent variations made in technical spirit according to the present invention to above example, each fall within the guarantor of the present invention
Within the scope of shield.
Claims (7)
1. a kind of preparation method of high heat conduction pressure sensitive adhesive, it is characterised in that comprise the following steps：
(1) composite heat-conducting filler is prepared
Take appropriate graphene powder and boron nitride powder to be uniformly mixed in planetary mixer or kneader, then stirred to planet
Addition heat conduction carbon material in machine or kneader is mixed, it is sufficiently mixed with graphene powder and boron nitride powder, obtains composite guide
Hot filler；
(2) wet-treating modification composite heat-conducting filler
The ethyl acetate solution of addition surface conditioning agent is prepared, composite heat-conducting filler is added thereto, heating is boiled, ethyl acetate
Steam condensing reflux is into solution, and after reacting a few hours, filtering, filter cake is dried after ethyl acetate solvent washs, with crushing
Machine is smashed to obtain fluffy scattered powder；
(3) the filler modified pressure sensitive adhesive of composite heat-conducting of modified is used
The composite heat-conducting filler after modification that pressure sensitive adhesive obtains with step (2) is uniformly mixed at room temperature, height is obtained and leads
Hot pressure sensitive adhesive.
2. the preparation method of high heat conduction pressure sensitive adhesive according to claim 1, it is characterised in that the stone described in step (1)
The mass fraction that black alkene powder accounts for composite heat-conducting filler is 1~5%, and the mass fraction that boron nitride powder accounts for composite heat-conducting filler is
40~70%, the mass fraction that heat conduction carbon material accounts for composite heat-conducting filler is 30~60%.
3. the preparation method of high heat conduction pressure sensitive adhesive according to claim 1, it is characterised in that the graphene in step (1)
10min~2h is stirred at room temperature in powder and boron nitride powder, adds heat conduction carbon material and is further continued for stirring 10min~2h afterwards,
Until heat conduction carbon material, graphene powder and boron nitride are sufficiently mixed.
4. the preparation method of high heat conduction pressure sensitive adhesive according to claim 1, it is characterised in that the stone described in step (1)
The number of plies of black alkene powder is 1~5 layer, and boron nitride is hexagonal boron nitride, and particle diameter is 0.1~10 μm, and heat conduction carbon material is carbon black, carbon
The mixture of nanotube, carbon fiber and graphite.
5. the preparation method of high heat conduction pressure sensitive adhesive according to claim 1, it is characterised in that described in step (2)
Surface conditioning agent is silane coupler or polyvinylpyrrolidone, and surface conditioning agent is distributed to the concentration in ethyl acetate solvent
For 1~100mg/L, concentration of the composite heat-conducting filler in it with the addition of the ethyl acetate solution of surface conditioning agent is 1~20mg/
ML, heating-up temperature are 77~100 DEG C, and the time of backflow is 2~8h.
6. the preparation method of high heat conduction pressure sensitive adhesive according to claim 1, it is characterised in that the pressure described in step (3)
Quick glue is pressure-sensitive acrylate, organic silicon pressure sensitive adhesive or polyurethanes pressure sensitive adhesive.
7. the preparation method of high heat conduction pressure sensitive adhesive according to claim 1, it is characterised in that the pressure described in step (3)
The mass ratio for the composite heat-conducting filler after modification that quick glue obtains with step (2) is 3~10：1~5.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108641658A (en) * | 2018-04-28 | 2018-10-12 | 东莞市新懿电子材料技术有限公司 | A kind of solid filler glue and its preparation method and application |
| CN109439236A (en) * | 2018-11-30 | 2019-03-08 | 中国科学院金属研究所 | A kind of thermoconductive glue of containing graphene and its preparation method and application |
| CN111187582A (en) * | 2020-03-17 | 2020-05-22 | 苏州世华新材料科技股份有限公司 | Insulating heat-conducting adhesive material and preparation method thereof |
| CN111662688A (en) * | 2020-07-01 | 2020-09-15 | 桂林电子科技大学 | Boron nitride/graphene double-heat-conduction-base aerogel composite phase-change material and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106433508A (en) * | 2016-10-18 | 2017-02-22 | 德阳烯碳科技有限公司 | Preparation method of graphene heat conduction double-sided adhesive tape |
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2017
- 2017-09-29 CN CN201710908902.9A patent/CN107746689A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106433508A (en) * | 2016-10-18 | 2017-02-22 | 德阳烯碳科技有限公司 | Preparation method of graphene heat conduction double-sided adhesive tape |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108641658A (en) * | 2018-04-28 | 2018-10-12 | 东莞市新懿电子材料技术有限公司 | A kind of solid filler glue and its preparation method and application |
| CN109439236A (en) * | 2018-11-30 | 2019-03-08 | 中国科学院金属研究所 | A kind of thermoconductive glue of containing graphene and its preparation method and application |
| CN111187582A (en) * | 2020-03-17 | 2020-05-22 | 苏州世华新材料科技股份有限公司 | Insulating heat-conducting adhesive material and preparation method thereof |
| CN111662688A (en) * | 2020-07-01 | 2020-09-15 | 桂林电子科技大学 | Boron nitride/graphene double-heat-conduction-base aerogel composite phase-change material and preparation method thereof |
| CN111662688B (en) * | 2020-07-01 | 2022-02-08 | 桂林电子科技大学 | Boron nitride/graphene double-heat-conduction-base aerogel composite phase-change material and preparation method thereof |
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Application publication date: 20180302 |