CN107742668A - 易更换的led - Google Patents

易更换的led Download PDF

Info

Publication number
CN107742668A
CN107742668A CN201710926489.9A CN201710926489A CN107742668A CN 107742668 A CN107742668 A CN 107742668A CN 201710926489 A CN201710926489 A CN 201710926489A CN 107742668 A CN107742668 A CN 107742668A
Authority
CN
China
Prior art keywords
substrate
chip
sealing
integument
fluorescence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710926489.9A
Other languages
English (en)
Inventor
谭瑞银
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710926489.9A priority Critical patent/CN107742668A/zh
Publication of CN107742668A publication Critical patent/CN107742668A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种易更换的LED，包括封胶、荧光包裹层、基板、芯片，所述多个并排的芯片固定在基板同侧，基板固定芯片的一侧通过灌装的方式设置封胶，所述封胶及基板外侧设有荧光包裹层，所述封胶及基板可快速从荧光包裹层内抽出，便于更换基板上的芯片。其结构设计简单，LED芯片可快速更换，提高了产品的使用寿命，满足市场使用需求，有利于产品推广。

Description

易更换的LED
技术领域
本发明属于照明技术领域，具体涉及一种易更换的LED。
背景技术
传统的易更换的LED荧光粉封装是在LED蓝宝石芯片固定在支架或基板上以后，以一定比例的LED荧光粉和灌封胶混合均匀后封在蓝宝石芯片上，具体包括点胶或喷涂方式，以实现蓝宝石芯片通电后经过荧光粉的激发，发出不同颜色。这种结构的易更换的LED其存在的问题是，晶片易损坏，且无法及时更换，严重影响了产品的使用寿命。
发明内容
本发明的目的是提出一种易更换的LED，克服了现有技术的上述不足，其结构设计简单，LED芯片可快速更换，提高了产品的使用寿命，满足市场使用需求，有利于产品推广。
为了达到上述设计目的，本发明采用的技术方案如下：
一种易更换的LED，包括封胶、荧光包裹层、基板、芯片，所述多个并排的芯片固定在基板同侧，基板固定芯片的一侧通过灌装的方式设置封胶，所述封胶及基板外侧设有荧光包裹层，所述封胶及基板可快速从荧光包裹层内抽出，便于更换基板上的芯片。
优选地，所述封胶外壁与荧光包裹层内壁为间隙配合方式固定。
优选地，所述芯片两侧的电极线穿过基板，并设置在基板后侧的凹槽内，所述相邻两芯片的相对的电极线延伸到基板后侧的同一个凹槽内，并通过焊接的方式固定。
本发明所述的易更换的LED的有益效果是：其结构设计简单，LED芯片可快速更换，提高了产品的使用寿命，满足市场使用需求，有利于产品推广。
附图说明
图1是本发明所述的易更换的LED的截面图；
图2是本发明所述的易更换的LED的一段结构的剖视图。
具体实施方式
下面对本发明的最佳实施方案作进一步的详细的描述。
如图1-2所示，本发明实施方案中，所述易更换的LED，包括封胶1、荧光包裹层2、基板3、芯片4、电极线5、凹槽6，所述多个并排的芯片4固定在基板3同侧，基板3固定芯片4的一侧通过灌装的方式设置封胶1，所述封胶1及基板3外侧设有荧光包裹层2，所述封胶1及基板3可快速从荧光包裹层2内抽出，便于更换基板3上的芯片4，有利于提高产品的使用寿命。
进一步实施中，更优选地技术方案是，所述封胶1外壁与荧光包裹层2内壁为间隙配合方式固定，方便封胶1及基板3从荧光包裹层2内抽出。
进一步实施中，更优选地技术方案是，芯片4两侧的电极线5穿过基板3，并设置在基板3后侧的凹槽6内，所述相邻两芯片4的相对的电极线5延伸到基板3后侧的同一个凹槽6内，并通过焊接的方式固定。
以上内容是结合具体的优选实施方式对本发明所做的进一步详细说明，便于该技术领域的技术人员能理解和应用本发明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下还可以做出若干简单推演或替换，而不必经过创造性的劳动。因此，本领域技术人员根据本发明的揭示，对本发明做出的简单改进都应该在本发明的保护范围之内。

Claims (3)

1.一种易更换的LED，其特征在于：包括封胶、荧光包裹层、基板、芯片，所述多个并排的芯片固定在基板同侧，基板固定芯片的一侧通过灌装的方式设置封胶，所述封胶及基板外侧设有荧光包裹层，所述封胶及基板可快速从荧光包裹层内抽出，便于更换基板上的芯片。
2.根据权利要求1所述的易更换的LED，其特征在于：所述封胶外壁与荧光包裹层内壁为间隙配合方式固定。
3.根据权利要求2所述的易更换的LED，其特征在于：所述芯片两侧的电极线穿过基板，并设置在基板后侧的凹槽内，所述相邻两芯片的相对的电极线延伸到基板后侧的同一个凹槽内，并通过焊接的方式固定。
CN201710926489.9A 2017-10-07 2017-10-07 易更换的led Pending CN107742668A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710926489.9A CN107742668A (zh) 2017-10-07 2017-10-07 易更换的led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710926489.9A CN107742668A (zh) 2017-10-07 2017-10-07 易更换的led

Publications (1)

Publication Number Publication Date
CN107742668A true CN107742668A (zh) 2018-02-27

Family

ID=61236588

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710926489.9A Pending CN107742668A (zh) 2017-10-07 2017-10-07 易更换的led

Country Status (1)

Country Link
CN (1) CN107742668A (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104218139A (zh) * 2014-08-20 2014-12-17 深圳市晶台股份有限公司 一种全新的led封装结构
CN104235658A (zh) * 2014-10-17 2014-12-24 上海新凯元照明科技有限公司 柱型led灯泡
CN104300073A (zh) * 2014-11-04 2015-01-21 常州晶玺照明有限公司 一种基于紫光芯片的360°全周式发光led灯丝
CN104916764A (zh) * 2015-06-15 2015-09-16 刘海兵 一种led灯芯
CN204879608U (zh) * 2015-09-07 2015-12-16 惠州市英吉尔光电科技有限公司 分体式远程激发led发光体
CN205606201U (zh) * 2016-01-28 2016-09-28 李安格 一种新型led灯丝

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104218139A (zh) * 2014-08-20 2014-12-17 深圳市晶台股份有限公司 一种全新的led封装结构
CN104235658A (zh) * 2014-10-17 2014-12-24 上海新凯元照明科技有限公司 柱型led灯泡
CN104300073A (zh) * 2014-11-04 2015-01-21 常州晶玺照明有限公司 一种基于紫光芯片的360°全周式发光led灯丝
CN104916764A (zh) * 2015-06-15 2015-09-16 刘海兵 一种led灯芯
CN204879608U (zh) * 2015-09-07 2015-12-16 惠州市英吉尔光电科技有限公司 分体式远程激发led发光体
CN205606201U (zh) * 2016-01-28 2016-09-28 李安格 一种新型led灯丝

Similar Documents

Publication Publication Date Title
CN203218260U (zh) 双芯片发光二极管
CN206301841U (zh) 一种具有防水功能的led引线框架
CN208538852U (zh) 一种led芯片的封装产品
CN107742668A (zh) 易更换的led
CN204905298U (zh) 一种led集成模顶光源
CN203481270U (zh) Led封装结构
CN202957289U (zh) 光源模块
CN107591395A (zh) 简易led
CN101877375A (zh) 一种高显色性白光led
CN203927510U (zh) 一种远程激发技术结构led光源
CN205960028U (zh) 芯片级封装发光装置
CN201893374U (zh) 一种集成式led光源散热装置
CN206271700U (zh) 一种基于蓝、绿光led芯片的远程量子点led器件
CN203932052U (zh) 点胶式360°发光灯丝
CN204857086U (zh) 一种自发性白光led数码管
CN104992636A (zh) 一种自发性白光led数码管及其生产工艺
CN205609561U (zh) 一种具有倒梯形台结构的大功率led多芯片光源模组
CN204629167U (zh) 一种带防爆膜的led灯泡
CN205609570U (zh) 一种具有倒锥形台结构的大功率led多芯片光源模组
CN202855735U (zh) 双光谱led芯片
CN203707170U (zh) 线型led透明支架
CN204729946U (zh) 白光led灯泡
CN203288591U (zh) 一种蓝绿基白光led
CN203631596U (zh) 一种新型rgb 全彩发光二极管
CN203434189U (zh) 绿芯片加红荧光粉的条状高强度led封装结构

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180227