CN107735901A - Power combiner and power combiner device with the cooling body being arranged symmetrically - Google Patents
Power combiner and power combiner device with the cooling body being arranged symmetrically Download PDFInfo
- Publication number
- CN107735901A CN107735901A CN201680038790.XA CN201680038790A CN107735901A CN 107735901 A CN107735901 A CN 107735901A CN 201680038790 A CN201680038790 A CN 201680038790A CN 107735901 A CN107735901 A CN 107735901A
- Authority
- CN
- China
- Prior art keywords
- power combiner
- electric conductor
- conductor
- cooling body
- segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
- H01P5/187—Broadside coupled lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/19—Conjugate devices, i.e. devices having at least one port decoupled from one other port of the junction type
- H01P5/22—Hybrid ring junctions
- H01P5/227—90° branch line couplers
Landscapes
- Amplifiers (AREA)
- Plasma Technology (AREA)
- Structure Of Printed Boards (AREA)
- Current-Collector Devices For Electrically Propelled Vehicles (AREA)
Abstract
The present invention relates to a kind of power combiner (10) with cooling body (40).The power combiner (10) has at least one first electric conductor (14) and the second electric conductor (16).First electric conductor (14) and second electric conductor (16) are equidistantly spaced apart with the cooling body (40) as far as possible on the whole.Therefore, first electric conductor (14) and second electric conductor (16) are alternately arranged closer or far from the cooling body (40).Alternatively or additionally, the cooling body (40) can be arranged between first electric conductor (14) and second electric conductor (16).Alternatively or additionally, first electric conductor (14) is divided into parallel conductor segment (14a, 14b, 16a, 16b) as far as possible with second electric conductor (16), wherein, the conductor segment (14a, 14b, 16a, 16b) is so spaced apart with the cooling body (40) so that first electric conductor (14) and second electric conductor (16) are equally spaced with the cooling body (40) as far as possible on the whole.
Description
Technical field
The present invention relates to it is a kind of be used for by frequency more than 1MHz high-frequency signal couple and/or distribution (separation) into more than
The power combiner of 100W power output.A kind of moreover, it relates to power combing with this power combiner
Device device.
Background technology
It is known to polymerize multiple high-frequency signal sources and/or distribution (separation) one using the power combiner with electric conductor
High-frequency signal.
A kind of power combiner as known to the A1 of EP 1 699 107, the power combiner have and the first electric conductor interval
The second electric conductor opened.First electric conductor and the second electrical conductor capacitances and inductively couple.According to EP 1 699 107
A1, in order to improve the inductive couplings between two conductors, the first electric conductor and the second electric conductor can be provided with multiple windings.
Other power combiners are known for example from documents below：The A1 of US 8 044 749 Bl, DE 103 42 611,
US2014/0085019 Al。
Must be sufficiently cool by power combiner.Here, effective cooling can be realized by cooling body.Cooling body should
This is arranged close to electric conductor, so as to realize good radiating.
However, because electric conductor is close to cooling body, so producing parasitic capacitance between cooling body and electric conductor：Electric conductor
Closer to cooling body, although cooling is more effective, parasitic capacitance is also bigger.Parasitic capacitance causes the characteristic of power combiner with not
The method and mode of profit change.
The content of the invention
Therefore, task of the invention is, there is provided a kind of power combiner and a kind of power combiner device, the work(
Rate synthesizer and power combiner device are both by cooling body and with effectively cooling, it may have cooling body is to power combiner
The minimum unfavorable film of power characteristic ring
According to the present invention, the task is by the power combiner of the feature with claim 1 and with claim
The power combiner device of 10 feature solves.Dependent claims illustrate the expansion scheme for meeting purpose.
Therefore, passed through according to the task of the present invention for coupling and/or being distributed into high-frequency signal of the frequency more than 1MHz
The power combiner of power output more than 100W solves, wherein, the power combiner has：
A) it is used for the first input end of the first high-frequency signal；
B) it is used for the second input of the second high-frequency signal；
C) output end；
D) balance connection (Ausgleichsanschluss)；
E) the first electric conductor between first input end and output end, wherein, the first electric conductor is substantially with plane
Formula surface electrodeForm construction；
F) the second electric conductor between the second input and balance connection, wherein, the second electric conductor is substantially with flat
Face formula surface electrode form construction, wherein, the second electrical conductor capacitances and inductively coupled with the first electric conductor；
G) cooling body, wherein, more than the 70% of the total surface of the first electric conductor is equal to the second conductance with the distance of cooling body
The total surface of body and the distance of cooling body.
Therefore, according to the present invention task by electric conductor being arranged symmetrically to solve on cooling body.Thus, parasitism is made
Electric capacity is symmetrically distributed onto two conductors so that is generally realized to the obvious more favourable of the power characteristic of power combiner
Influence.
Preferably more than 75%, especially more than 80%, particularly preferred more than the 90% of the total surface of first electric conductor and cooling
The distance of body is equal to the total surface of the second electric conductor and the distance of cooling body.
Constructed according to the power combiner of the present invention preferably in the form of 90 ° of hybrid couplers.It is further preferred that power
Synthesizer can be worked in the form of power splitter.It is particularly preferred that power combiner, which is configured for output, is higher than 100W
Power power splitter.
Preferably, power combiner is configured to couple 1MHz to the high-frequency signal between 200MHz.
It is particularly preferred that power combiner is configured to power of the output higher than 2kW.
In the particularly preferred configuration of power combiner, power combiner is configured to ± 10% frequency of fundamental frequency
Rate generates less than 0.5dB, especially less than 0.3dB, is further preferably no larger than 0.1dB insertion loss in the case of running
It is preferably able to be connected with (especially plasma apparatus form) electrical appliance in the output end of power combiner.It is flat
Weighing apparatus connection is preferably able to (particularly by terminal resistance) and grounding connection.It can be 25 Ω or 50 Ω that terminal resistance, which preferably has,
Reference impedance.Reference impedance is the impedance that power combiner designs on its input or output end.
Cooling body constructs preferably in the form of coldplate.Coldplate can have the through-flow circuit of fluid, especially water pipe.
In order to which the first conductor is effectively inductively coupled relative to the second conductor, the first electric conductor and the second electric conductor
It is preferred that there is n respectively>1 number of turn.
The number of turn of first electric conductor and the second electric conductor is preferably n>2nd, especially n=3, be further preferred that n>3.
First electric conductor and/or the second electric conductor inside winding can have the road for being not parallel to outside winding extension
Section, internally to produce phase equilibrium between winding and outside winding.
If more than the 60% of the total surface of the first electric conductor superimposedly, especially coplanar the total surface with the second electric conductor
Relatively, then further improve the capacitive and inductive coupling of power combiner and device is more symmetrically constructed.
Preferably more than 70%, especially more than 80%, particularly preferred more than the 90% and second of the total surface of first electric conductor
The total surface of electric conductor superimposedly, it is especially coplanarly opposite.
Reference impedance can drop below 50 Ω value.Then the inductance of the first electric conductor and the second electric conductor reduces, because
This, can realize installation on less face.
Preferably, in the case where frequency is more than 1MHz, the reference impedance of first input end and the second input end is 25
Ω。
It is further preferred that in the case where frequency is more than 3MHz, 10MHz, 40MHz, 100MHz or 200MHz, first is defeated
The reference impedance for entering end and the second input end is respectively smaller than 50 Ω, is especially respectively smaller than 25 Ω.
In the preferred embodiment of the present invention, the first electric conductor can have the one the first conductor segments and second
First conductor segment, the second electric conductor can have the one the second conductor segments and the two the second conductor segments, wherein, the two the second lead
More than 70% coplanar ground of body section and superimposedly extend relative to the one the first conductor segment displacements, the two the first conductor segments
More than 70% coplanar ground and superimposedly extend relative to the one the second conductor segment displacements.
Therefore, the two the second conductor segments preferably at least partly extend below the one the first conductor segments, and the two the first lead
Body section preferably at least partly extends below the one the second conductor segments.
Preferably more than 80%, especially more than 90% coplanar ground of the two the second conductor segments and superimposedly relative to the one the first
Conductor segment displacement ground extension, preferably more than 80%, especially more than 90% coplanar ground of the two the first conductor segments and superimposedly relative
Extend in the one the second conductor segment displacements.
It is further preferred that more than the 70% of the one the first conductor segments, especially more than 80%, particularly preferred more than 90% is flat
Row is in the one the second conductor segment extensions, and preferably more than 70%, especially more than 80%, particularly preferred the 90% of the two the second conductor segments
Extend above parallel to the two the first conductor segments.
Cooling body can be arranged between the one the second conductor segments and the two the first conductor segments.It is achieved in power combiner
Especially symmetrical construction.
Power combiner can have air gap between first and second electric conductor.However, it is preferred that power combiner exists
Have dielectric, especially electricity exhausted between the plane formula surface electrode of first electric conductor and the plane formula surface electrode of the second electric conductor
Edge substrate.Thus, it is possible to particularly compact ground and cost-effectively manufacture power combiner.In addition, dielectric, being especially electrically insulated
Substrate avoids the spark discharge (ü berschlag) between electric conductor.
The plane formula surface electrode of first electric conductor and the plane formula surface electrode of the second electric conductor can be directly arranged at
On dielectric, especially on electrically insulating substrate bottom.
The plane formula surface electrode of first electric conductor can at least in part, be especially fully disposed in power combiner
On first dielectric, especially on electrically insulating substrate bottom, the plane formula surface electrode of the second electric conductor can at least in part, it is especially complete
It is arranged in entirely on the second dielectric of power combiner, especially on electrically insulating substrate bottom.
In other configurations of this embodiment, the one the first conductor segments of first surface electrode can be arranged in first
On dielectric, especially dielectric substrate the first master, the two the first conductor segments of first surface electrode can be arranged in second
On dielectric, especially dielectric substrate the first master, wherein, the one the second conductor segments of second surface electrode can be arranged in
On first dielectric, especially electrically insulating substrate bottom the second master, the two the second conductor segments of second surface electrode can arrange
On second dielectric, especially dielectric substrate the second master.
Alternatively or additionally, the first plane formula surface electrode and the second plane formula surface electrode can have with next
A little segment sections：The segment section is alternately situated between on dielectric, especially electrically insulating substrate bottom the first plane master and in electricity
Matter, especially extend on the second plane master opposite with the first plane master at electrically insulating substrate bottom.Above-mentioned first
Master and preferably unique dielectric, especially electrically insulating substrate bottom the master of above-mentioned second master.
Power combiner can have multilayer circuit board, wherein, the multilayer circuit board has the plane formula of the first electric conductor
The plane formula surface electrode of surface electrode and the second electric conductor.
At least one dielectric of multilayer circuit board, especially electrically insulating substrate bottom can have what is be made up of epoxy resin fabric
Circuit board material.Another layer of multilayer circuit board can have polytetrafluoroethylene (PTFE) or the printed conductor carrier material containing polyimides
Material.Thus, anti-electric breakdown strength is significantly improved in the case of reducing manufacturing cost at the same time.
Multilayer circuit board can preferably have horizontal magnification (seitenma β e) in the principal plane of multilayer circuit board, its
In, the first conductor and the second conductor surface electrode extends less than λ/100, especially less than λ/200, wherein, it is defeated that λ is related to first
Enter the frequency for being more than 1MHz, being especially greater than 3MHz, 10MHz, 40MHz, 100MHz or 200MHz of end and the second input end.
Power combiner can be with configuration blender in 90 °.
If 90 ° of blenders are used for into couples high frequency signals source, when the signal of input is with 90 ° of phase shifts, by two
The signal of input merges and is coupled to output end.
If 90 ° of blenders are used to distribute (separation) high-frequency signal source, the signal for being applied to an input is equal
Two output ends are assigned to evenly, wherein, two the allocated signals are with 90 ° of phase shifts.
First and second electric conductors can have identical inductance L respectivelyk., may be due to the size of coupler
One and second produces electric capacity C between electric conductork。
For 90 ° of blenders, inductance LkWith electric capacity CkIt can design as follows：
LK=Z0/(2πf)
CK=1/ (2 π fZ0)
Wherein, Z0It is reference impedance, f is the frequency that 90 ° of blenders are designed for.
In addition, the power combiner device with power combiner described above is also passed through according to the task of the present invention
To solve, wherein, power combiner device have be connected to the first high-frequency signal source at first input end, to be connected to second defeated
Enter the second high-frequency signal source at end and the electrical appliance particular to output.
First high-frequency signal source and the second high-frequency signal source are preferably in the form of high frequency transistor amplifier, especially with frequency
The form construction of the high frequency transistor amplifier of agile.It is particularly preferred that two high-frequency signal sources are configured to identical.
Electrical appliance constructs preferably in the form of plasma apparatus.
In the configuration of present invention further optimization, cooling body (particularly by balance resistance) with balance connection and/or
Grounding connection.
Brief description of the drawings
Other features and advantages of the present invention from next in the detailed description of multiple embodiments of the present invention, from right
Drawn in it is required that and according to the accompanying drawing for the material particular for showing the present invention.
Feature shown in accompanying drawing is so shown so that can be become apparent from according to the feature of the present invention visible.Each spy
Sign can be implemented separately or be realized in the case of variant of the invention scheme in the form of multiple any combination.
Accompanying drawing is shown：
Fig. 1 shows the top view of the first power combiner；
Fig. 2 shows the perspective view of another power combiner；
Fig. 3 a show the top view of the power combiner device with another power combiner；
Fig. 3 b show the phantom of the power combiner in Fig. 3 a.
Embodiment
Fig. 1 shows power combiner 10.Power combiner 10 have for the first high-frequency signal first input end 12a with
And the second input 32 for the second high-frequency signal.First input end 12a is connected with the first electric conductor 14.Second input 32
It is connected with the second electric conductor 16.Electric conductor 14,16 inductive and capacitive couplings each other.Arranged between electric conductor 14,16
There are dielectric, especially electrically insulating substrate bottom 18.
More precisely, power combiner 10 is in the current situation by the circuit with dielectric, especially dielectric substrate 18
Plate is formed, wherein, the first layer that can be conductive is disposed with dielectric, especially electrically insulating substrate bottom the first plane master
20, the second layer 22 that can be conductive is disposed with dielectric, especially electrically insulating substrate bottom 18 the second plane master, this second
Layer that can be conductive extends in parallel relative to the first layer that can be conductive.
First electric conductor 14 and the second electric conductor 16 are capable of conduction in the first layer 20 and second that can be conductive respectively
Layer 22 in range selector and alternately construct.In Fig. 1, it is only capable of finding out electric conductor 14,16 in the first layer 20 that can be conductive
The section of formation.In Fig. 1, the second layer 22 for being capable of conduction can be led by dielectric, especially electrically insulating substrate bottom 18 and first
The layer 22 of electricity is covered.
First electric conductor 14 and the second electric conductor 16 are substantially constructed in the form of surface electrode respectively.Surface electrode
There are following some segment sections respectively, the segment section alternately dielectric, especially electrically insulating substrate bottom 18 top and under
Fang Yanshen.Segment section 24a, 24c of first electric conductor 14 in Fig. 1 visible first can be conductive layer 20 in extend.First
Segment section 24b, 24d of electric conductor 14 extend in the second layer 22 that can be conductive.In addition, segment section 26a, 26c are in the second energy
Extend in enough conductive layers 22, segment section 26b, 26d extend in the first layer 20 that can be conductive.Here, the first electric conductor 14
Segment section 24a-d surface electrode be respectively relative to the segment section 26a-d of the second electric conductor 16 superimposedly and coplanarly extend.
Here, the conversion of layer 22 that can be conductive from the first layer 20 to the second that can be conductive is realized by bridge 28a-f.
This, bridge 28a-c guides the first electric conductor 14 between layer 20,22 that can be conductive, and bridge 28d-f draws between layer that can be conductive
Lead the second electric conductor 16.
First electric conductor 14 terminates in its end opposite with first input end 12a at output end 30.Second electricity
Conductor 16 terminates in its end opposite with the second input 32 at balance connection 12b.
The layer 20,22 and dielectric, the circuit that especially electrically insulating substrate bottom 18 is formed by being capable of conduction that will be shown in Fig. 1
Plate is arranged on the cooling body (not shown) of power combiner 10.Due to symmetrically prolonging on dielectric, especially electrically insulating substrate bottom 18
The first and second electric conductors 14,16 stretched, here, between the first electric conductor 14 and cooling body or the second electric conductor 16 with it is cold
But very symmetrical parasitic capacitance is formed between body.Thus, the Charge Transport Properties of power combiner 10 are only by minimum degree
Influence.
Fig. 2 shows another power combiner 10.Power combiner 10 has the multilayer electricity being made up of multiple circuit board 36a-d
Road plate 34.First circuit board 36a has the first dielectric, especially electrically insulating substrate bottom 38a, and second circuit board 36b has the second electricity
Medium, especially electrically insulating substrate bottom 38b, tertiary circuit plate 36c have the 3rd dielectric, especially electrically insulating substrate bottom 38c, the 4th circuit
Plate 36d has the 4th dielectric, especially electrically insulating substrate bottom 38d.
Power combiner 10 has first input end 12a and the second input 32.First input end 12a passes through the first electricity
Conductor 14 is connected with output end 30.Second input 32 passes through the second electric conductor 16 and balance connection 12b connections.
In the present embodiment, not only the first electric conductor 14 but also the second electric conductor 16 is respectively classified into two circuits：First
Electric conductor 14 has the one the first conductor segment 14a and the two the first conductor segment 14b, and the second electric conductor 16 has the one the second to lead
Body section 16a and the two the second conductor segment 16b.
Power combiner 10 has cooling body 40, and the cooling body is symmetrically spaced out relative to electric conductor 14,16.Current
In the case of, the two the first conductor segment 14b arrange close to cooling body 40 herein, and the one the first conductor segment 14a are away from the cloth of cooling body 40
Put, and the one the second conductor segment 16a arrange close to cooling body 40, the two the second conductor segment 16b arrange away from cooling body 40.Cooling
Body 40 is connected with ground connection 42.
Fig. 3 a show the power combiner device 44 with another power combiner 10.First in power combiner 10 is defeated
Enter to hold 12a to be connected with the first high-frequency signal source 46a, the second high-frequency signal is connected with the second input 32 of power combiner 10
Source 46b.First input end 12a is connected by the first electric conductor 14 with being connected with the output end 30 of electrical appliance 48.Second input
32 are connected 12b connections by the second electric conductor 16 with the balance being connected to by terminal resistance 31 at ground potential.
Power combiner 10 has dielectric, especially electrically insulating substrate bottom 18.First electric conductor 14 is branched off into the one the first
Conductor segment 14a and the two the first conductor segment 14b.Second electric conductor 16 is branched off into the one the second conductor segment 16a and the two the second
Conductor segment 16b.The one the first conductor segment 14a and the one the second conductor segment 16a are directed to dielectric, especially dielectric substrate 18
The first master on.By the two the first conductor segment 14b and the two the second conductor segment 16b be directed to it is dielectric, be especially electrically insulated
On second master of substrate 18.
First electric conductor 14 and the second electric conductor 16 describe internal winding or outside winding.Here, internal winding has not
Parallel to the section 50 of outside winding extension so that internally produce phase equilibrium between winding and outside winding.
The one the first conductor segment 14a and the two the first conductor segment 14b and the one the second conductor segment 16a are led with the two the second
Polymerizations of the body section 16b in output end 30 or balance connection 12b region is previously in the region of reference 14b, 16b
Separation is similarly carried out, therefore is not shown in fig. 3 a.
Fig. 3 b schematically show the cut-away section of the power combiner device according to Fig. 3 a.It can be seen that by Fig. 3 b, second
First conductor segment 14b superimposedly extends relative to the one the second conductor segment 16a as far as possible, and the two the second conductor segment 16b are as far as possible relative
Superimposedly extend in the one the first conductor segment 14a.Be disposed between conductor segment 14a, 16a and conductor segment 14b, 16b dielectric,
Especially electrically insulating substrate bottom 18.
The two the first conductor segment 14b and the two the second conductor segment 16b connect with dielectric, and the dielectric can especially construct
Into the plate 52 for being capable of heat conduction.The plate 52 for being capable of heat conduction is placed into cooling body 40.Electric conductor 14,16 phases it can be seen from Fig. 3 b
It is equally spaced on the whole for cooling body 40.
Usually, it is particularly possible to which this dielectric for being constructed to be permeable to the plate 52 of heat conduction can also be according to Fig. 1's or Fig. 2
It is arranged in the case of device between cooling body 40 and printed conductor or printed conductor segment section towards cooling body.The dielectric
Multiple functions can be met.First, the dielectric be used for printed conductor or printed conductor segment section relative to generally with ground connection
() connection cooling body 40 current potential electric insulation.Furthermore, it is possible to printing is led by dielectric thickness and dielectric property
The electric capacity of definition between line or printed conductor segment section is adjusted.Therefore, the undesirable higher-order of oscillation can be resisted.This
Outside, the electrical loss of power combiner 10 can be adjusted by material property, particular by dielectric fissipation factor.It is former
On then, first assumes to be probably that alap loss should be optimal.In fact, in the present apparatus, especially in plasma
In the case of the electrical appliance of apparatus-form advantageously, power combiner 10 has predetermined loss, to prevent high-frequency
Starting of oscillation (Aufschwingen) under reflection.This predetermined loss should be less than the work(that power combiner 10 is coupled or distributed
The 10% of rate.In addition, dielectric has advantages below：In the case of no compulsory air flow, power combiner 10 can
Only to be connected by the heat with cooling body 40 and sufficiently cool.
Power combiner 10 can construct on common circuit board together with the miscellaneous part of amplifier.This can be notable
The cost of this amplifier-power combiner-component is reduced, while significantly reduces the interference and coupling as caused by external disturbance fields.
Power combiner 10 can be arranged in metal shell individually or together with the miscellaneous part of amplifier.This can be with
Further reduce the interference and coupling as caused by external disturbance fields.
In the case of all accompanying drawings of general view, the present invention relates to a kind of power combiner 10 with cooling body 40.Power
Synthesizer 10 has at least one electric conductor 16 of first electric conductor 14 and second.First electric conductor 14 and the second electric conductor 16 exist
Generally as far as possible be equally spaced with cooling body 40, therefore, the first electric conductor 14 and the second electric conductor 15 it is alternately close or
Arranged away from cooling body 40.Alternatively or additionally, cooling body 40 can be arranged in the first electric conductor 14 and the second electric conductor 16
Between.Alternatively or additionally, the first electric conductor 14 and the second electric conductor 16 be divided into as far as possible parallel conductor segment 14a, 14b,
16a, 16b, wherein, conductor segment 14a, 14b, 16a, 16b are so spaced apart with cooling body 40 so that the first electric conductor 14 and second
Electric conductor 16 is equally spaced with cooling body 40 as far as possible on the whole.
Claims (14)
1. a kind of power combiner (10), it is used to high-frequency signal of the frequency more than 1MHz is coupled and/or be distributed into be more than
100W power output, wherein, the power combiner (10) has following：
A) it is used for the first input end (12a) of the first high-frequency signal；
B) it is used for the second input (32) of the second high-frequency signal；
C) output end (30)；
D) balance connection (12b)；
E) the first electric conductor (14) between the first input end (12a) and the output end (30), wherein, first electricity
Conductor (14) is substantially constructed in the form of plane formula surface electrode；
F) the second electric conductor (16) between second input (32) and the balance connection (12b), wherein, described second
Electric conductor (16) is substantially constructed in the form of plane formula surface electrode, wherein, the second electric conductor (16) capacitive character
Ground and inductively coupled with first electric conductor (14)；
G) cooling body (40), wherein, the total surface of first electric conductor (14) more than 70% with the cooling body (40)
Distance is equal to the total surface of second electric conductor (16) and the distance of the cooling body.
2. power combiner according to claim 1, wherein, first electric conductor and second electric conductor (14,
16) so it is arranged symmetrically on the cooling body (40) so that parasitic capacitance is symmetrically distributed to two conductors (14,16)
On.
3. power combiner according to claim 2, wherein, first electric conductor (14) and/or described second electricity
The inside winding of conductor (16) has the section (50) for being not parallel to outside winding extension, so as to the internal winding with it is described
Phase equilibrium is produced between outside winding.
4. the power combiner according to any one of the claims, wherein, the summary table of first electric conductor (14)
More than the 60% of face is superimposedly and especially coplanarly relative with the total surface of second electric conductor (16).
5. the power combiner according to any one of the claims, wherein, in the case where frequency is more than 1MHz, institute
The reference impedance for stating first input end (12a) and second input (32) place is less than 50 Ω, especially 25 Ω.
6. the power combiner according to any one of the claims, wherein, first electric conductor (14) has the
One first conductor segment (14a) and the two the first conductor segments (14b), second electric conductor (16) have the one the second conductor segments
(16a) and the two the second conductor segments (16b), wherein, more than 70% coplanar ground of the two the second conductor segment (16b) and folded
Ground is closed relative to the one the first conductor segment (14a) displacement ground extensions, more than the 70% of the two the first conductor segment (14b) is coplanar
Ground and superimposedly relative to the one the second conductor segments (16a) displacement ground extension.
7. power combiner according to claim 6, wherein, the cooling body (40) is arranged in the one the second conductor
Between section (16a) and the two the first conductor segment (14b).
8. the power combiner according to any one of the claims, wherein, the power combiner (10) is described
There is electricity between the plane formula surface electrode of the plane formula surface electrode of first electric conductor (14) and second electric conductor (16)
Medium, especially electrically insulating substrate bottom (18).
9. the power combiner according to any one of the claims, wherein, the first plane formula surface electrode and
Two plane formula surface electrodes have a some parts section (24a-d, 26a-d), and the segment section is alternately in dielectric, especially institute
State on the first plane master at electrically insulating substrate bottom (18) and dielectric, especially described electrically insulating substrate bottom (18) with it is described
Extend on the second opposite plane master of first plane master.
10. the power combiner according to any one of the claims, wherein, first electric conductor (14) and institute
State the second electric conductor (16) has number of turn n respectively>1.
11. the power combiner according to any one of the claims, wherein, the power combiner is configured to coupling
1MHz is closed to the high-frequency signal between 200MHz.
12. the power combiner according to any one of the claims, it is high that the power combiner is configured to output
In 2kW power.
13. the power combiner according to any one of the claims, the power combiner is with 90 ° of hybrid couplers
Form construction.
14. a kind of power combiner device (44), it has the power combiner according to any one of the claims
(10), wherein, the power combiner device (44) has the first high-frequency signal source for being connected to first input end (12a) place
(46a), the second high-frequency signal source (46b) for being connected to the second input (32) place and particular to output end (30) place
Electrical appliance (48).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015212233.6 | 2015-06-30 | ||
| DE102015212233.6A DE102015212233A1 (en) | 2015-06-30 | 2015-06-30 | Power combiner with symmetrically arranged heat sink and power combiner arrangement |
| PCT/EP2016/065380 WO2017001598A1 (en) | 2015-06-30 | 2016-06-30 | Power combiner having a symmetrically arranged cooling body and power combiner arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107735901A true CN107735901A (en) | 2018-02-23 |
| CN107735901B CN107735901B (en) | 2021-01-12 |
Family
ID=56464172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680038790.XA Active CN107735901B (en) | 2015-06-30 | 2016-06-30 | Power combiner with symmetrically arranged cooling bodies and power combiner device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10541459B2 (en) |
| EP (1) | EP3317917A1 (en) |
| JP (1) | JP6761823B2 (en) |
| KR (1) | KR102302637B1 (en) |
| CN (1) | CN107735901B (en) |
| DE (1) | DE102015212233A1 (en) |
| WO (1) | WO2017001598A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11737693B2 (en) | 2012-12-04 | 2023-08-29 | Magnolia Medical Technologies, Inc. | Sterile bodily-fluid collection device and methods |
| US11786155B2 (en) | 2019-02-08 | 2023-10-17 | Magnolia Medical Technologies, Inc. | Devices and methods for bodily fluid collection and distribution |
| US11819329B2 (en) | 2012-05-30 | 2023-11-21 | Magnolia Medical Technologies, Inc. | Fluid diversion mechanism for bodily-fluid sampling |
| US11890452B2 (en) | 2012-10-11 | 2024-02-06 | Magnolia Medical Technologies, Inc. | Systems and methods for delivering a fluid to a patient with reduced contamination |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015212233A1 (en) | 2015-06-30 | 2017-01-05 | TRUMPF Hüttinger GmbH + Co. KG | Power combiner with symmetrically arranged heat sink and power combiner arrangement |
| EP3605115A1 (en) | 2018-08-02 | 2020-02-05 | TRUMPF Huettinger Sp. Z o. o. | Arc detector for detecting arcs, plasma system and method of detecting arcs |
| EP3605582A1 (en) | 2018-08-02 | 2020-02-05 | TRUMPF Huettinger Sp. Z o. o. | Power converter and power supply system |
| DE102019134463B3 (en) * | 2019-12-16 | 2021-05-12 | TRUMPF Hüttinger GmbH + Co. KG | High frequency high voltage electrical conductor device |
| CN113945876B (en) * | 2020-07-15 | 2024-02-20 | 西门子(深圳)磁共振有限公司 | Hybrid quadrature signal generator, coil transmit front-end device, radio frequency coil system, and magnetic resonance imaging system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4091343A (en) * | 1975-06-30 | 1978-05-23 | Epsilon Lambda Electronics Corp. | Insular waveguide directional coupler |
| JP2006202975A (en) * | 2005-01-20 | 2006-08-03 | Fujitsu Ltd | Electronic device with cooling structure for high-density mounting |
| US20060208827A1 (en) * | 2003-09-12 | 2006-09-21 | Erich Pivit | 90-Degree hybrid |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3506932A (en) * | 1968-02-28 | 1970-04-14 | Bell Telephone Labor Inc | Quadrature hybrid coupler |
| JP2817487B2 (en) * | 1991-12-09 | 1998-10-30 | 株式会社村田製作所 | Chip type directional coupler |
| US5521563A (en) * | 1995-06-05 | 1996-05-28 | Emc Technology, Inc. | Microwave hybrid coupler |
| JP3125691B2 (en) * | 1995-11-16 | 2001-01-22 | 株式会社村田製作所 | Coupled line element |
| JP3257487B2 (en) * | 1997-12-05 | 2002-02-18 | 株式会社村田製作所 | Directional coupler |
| US7028267B1 (en) * | 1999-12-07 | 2006-04-11 | Microsoft Corporation | Method and apparatus for capturing and rendering text annotations for non-modifiable electronic content |
| US6774743B2 (en) * | 2000-11-09 | 2004-08-10 | Merrimac Industries, Inc. | Multi-layered spiral couplers on a fluropolymer composite substrate |
| US6806789B2 (en) | 2002-01-22 | 2004-10-19 | M/A-Com Corporation | Quadrature hybrid and improved vector modulator in a chip scale package using same |
| JP2005184631A (en) * | 2003-12-22 | 2005-07-07 | Renesas Technology Corp | High-frequency power amplifying electronic component |
| EP1701376B1 (en) | 2005-03-10 | 2006-11-08 | HÜTTINGER Elektronik GmbH + Co. KG | Vacuum plasma generator |
| EP1699107B1 (en) | 2005-03-05 | 2017-05-31 | TRUMPF Hüttinger GmbH + Co. KG | 3 dB coupler |
| US7646261B2 (en) * | 2005-09-09 | 2010-01-12 | Anaren, Inc. | Vertical inter-digital coupler |
| US8044749B1 (en) * | 2008-02-26 | 2011-10-25 | Anaren, Inc. | Coupler device |
| DE202010016850U1 (en) | 2010-12-22 | 2011-04-14 | Hüttinger Elektronik Gmbh + Co. Kg | RF power coupler |
| DE102011087807B4 (en) | 2011-12-06 | 2015-11-12 | TRUMPF Hüttinger GmbH + Co. KG | Output network for a plasma supply device and plasma supply device |
| US9214715B2 (en) * | 2012-09-27 | 2015-12-15 | Anaren, Inc. | Hybrid coupler device having plural transmission line structures with unwound-rewound geometry |
| DE102015212233A1 (en) | 2015-06-30 | 2017-01-05 | TRUMPF Hüttinger GmbH + Co. KG | Power combiner with symmetrically arranged heat sink and power combiner arrangement |
-
2015
- 2015-06-30 DE DE102015212233.6A patent/DE102015212233A1/en active Pending
-
2016
- 2016-06-30 CN CN201680038790.XA patent/CN107735901B/en active Active
- 2016-06-30 KR KR1020177037462A patent/KR102302637B1/en active IP Right Grant
- 2016-06-30 WO PCT/EP2016/065380 patent/WO2017001598A1/en active Application Filing
- 2016-06-30 JP JP2017568162A patent/JP6761823B2/en active Active
- 2016-06-30 EP EP16740973.9A patent/EP3317917A1/en active Pending
-
2017
- 2017-12-27 US US15/855,129 patent/US10541459B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4091343A (en) * | 1975-06-30 | 1978-05-23 | Epsilon Lambda Electronics Corp. | Insular waveguide directional coupler |
| US20060208827A1 (en) * | 2003-09-12 | 2006-09-21 | Erich Pivit | 90-Degree hybrid |
| JP2006202975A (en) * | 2005-01-20 | 2006-08-03 | Fujitsu Ltd | Electronic device with cooling structure for high-density mounting |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11819329B2 (en) | 2012-05-30 | 2023-11-21 | Magnolia Medical Technologies, Inc. | Fluid diversion mechanism for bodily-fluid sampling |
| US11890452B2 (en) | 2012-10-11 | 2024-02-06 | Magnolia Medical Technologies, Inc. | Systems and methods for delivering a fluid to a patient with reduced contamination |
| US11737693B2 (en) | 2012-12-04 | 2023-08-29 | Magnolia Medical Technologies, Inc. | Sterile bodily-fluid collection device and methods |
| US11786155B2 (en) | 2019-02-08 | 2023-10-17 | Magnolia Medical Technologies, Inc. | Devices and methods for bodily fluid collection and distribution |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018523397A (en) | 2018-08-16 |
| EP3317917A1 (en) | 2018-05-09 |
| US20180123212A1 (en) | 2018-05-03 |
| DE102015212233A1 (en) | 2017-01-05 |
| KR102302637B1 (en) | 2021-09-15 |
| CN107735901B (en) | 2021-01-12 |
| JP6761823B2 (en) | 2020-09-30 |
| US10541459B2 (en) | 2020-01-21 |
| KR20180021726A (en) | 2018-03-05 |
| WO2017001598A1 (en) | 2017-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107735901A (en) | Power combiner and power combiner device with the cooling body being arranged symmetrically | |
| US7705705B2 (en) | Transformer structure | |
| US10396720B2 (en) | High-frequency amplifier apparatuses | |
| JP5606312B2 (en) | Plasma power supply device | |
| CN106409783B (en) | The semiconductor packages based on PCB with integrated electrical function | |
| CN107852087A (en) | High power density inverter (i) | |
| KR100564928B1 (en) | Transmission line type components | |
| CN107820647B (en) | Power combiner for coupling high frequency signals and power combiner arrangement | |
| JP2004235556A (en) | Laminated capacitor, wiring board, decoupling circuit, and high-frequency circuit | |
| CN107852840B (en) | DC/AC power converter | |
| JP2006245591A (en) | 3dB COUPLER | |
| CN110120736A (en) | Water cooling power module | |
| US11601108B2 (en) | Isolator and communication system | |
| US20150061807A1 (en) | Transformer | |
| CN107393715A (en) | Capacitor, the intermediate circuit particularly for multiphase system | |
| US20070217122A1 (en) | Capacitor | |
| EP3306799B1 (en) | Power conversion device | |
| CN109599258A (en) | A kind of high voltage isolating transformer | |
| JP2016092864A (en) | Power converter | |
| CN100530815C (en) | Transmission line apparatus | |
| JP2012191203A (en) | Multi-plate board embedded capacitor and methods for fabricating the same | |
| CN102867816A (en) | Power electronics system with cooling device | |
| JP2012227204A (en) | Capacitive element and semiconductor device | |
| JP2008198863A (en) | Laminated common mode choke coil | |
| CN209982822U (en) | Radio frequency power supply PCB layout structure of ICP-MS |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |