CN107732399B - Ultra-wideband tri-frequency four-port microstrip combiner for wireless mobile communication system - Google Patents
Ultra-wideband tri-frequency four-port microstrip combiner for wireless mobile communication system Download PDFInfo
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- CN107732399B CN107732399B CN201711010538.0A CN201711010538A CN107732399B CN 107732399 B CN107732399 B CN 107732399B CN 201711010538 A CN201711010538 A CN 201711010538A CN 107732399 B CN107732399 B CN 107732399B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/19—Conjugate devices, i.e. devices having at least one port decoupled from one other port of the junction type
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Abstract
The invention discloses an ultra wide band three-frequency four-port microstrip combiner for a wireless mobile communication system, which is made of a double-sided printed circuit board, wherein the back of the PCB is a whole copper layer, and the front line of the PCB comprises a combiner port, a first frequency division port, a second frequency division port, a third frequency division port, a 3G &4G channel and a 5G channel, wherein: the 3G &4G path and the 5G path are combined at a combining port through a T-shaped junction; the 5G path is composed of a high-pass filter and is connected to a third frequency division port; the 3G &4G path consists of a first low-pass filter, a 3G &4G low-frequency path and a 3G &4G high-frequency path which are connected through T-shaped junctions; the 3G &4G low-frequency band path is composed of a second low-pass filter and is connected to the first frequency-dividing port; the 3G &4G high-frequency band path is composed of a band-pass filter and is connected to the second frequency dividing port.
Description
Technical Field
The invention relates to the technical field of antennas and microwaves, in particular to an ultra wide band three frequency four port microstrip combiner for a wireless mobile communication system.
Background
With the development of mobile communication technology, sites of existing base stations are densely deployed, so that the site selection of the base stations is increasingly difficult. Coexistence of 3G and 4G multisystems will last for a long time. In order to reduce the cost of the station site, the multi-system common antenna feed scheme can well solve the problem of the station building cost, so that the multi-frequency antenna is produced.
The combiner is a key component in the transceiver of the modern communication system, and the performance of the combiner is directly related to the whole communication system.
By adopting the combiner, the multi-path signals of different systems can be effectively realized, and one set of broadband antenna is shared. The combiner is a core component of the multi-frequency antenna, and the existing combiner arranged in the base station antenna mainly adopts a micro-strip combiner scheme, so that the combiner is convenient to process, low in cost, small in size and convenient to integrate. However, for the multi-frequency microstrip combiner, the design of the matching circuit becomes more complicated, and the size of the combiner is increased due to the existence of the matching circuit. The existing microstrip combiner is basically a dual-frequency three-port combiner, and the most important application scenarios are signal combining of two systems, namely TD-SCDMA of 3G system and TD-LTE of 4G system, that is, so-called FAD frequency band microstrip combiner. With the rapid development of the 5G technology and the publication of the 5G spectrum, it is expected that the problem of sharing antenna feed resources by the 5G system, the 4G system and even the 3G system will be faced quickly, so the current dual-frequency three-port combiner cannot be used, and the problem of combining more frequency bands is urgently needed to be solved.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides an ultra wide band three-frequency four-port microstrip combiner for a wireless mobile communication system, which solves the problem that an antenna feeder resource is shared by a 5G system, a 4G system and even a 3G system.
In order to achieve the above purpose, the technical solution adopted to solve the technical problems is as follows:
the utility model provides a four port microstrip combiners of ultra wide band three frequencies for wireless mobile communication system, is made by two-sided printed circuit board, and the PCB board back is whole face copper layer, and PCB board front surface circuit is including combining port, first frequency division port, second frequency division port, third frequency division port, 3G &4G route and 5G route, wherein:
the 3G &4G path and the 5G path are combined at a combining port through a T-shaped junction;
the 5G path is composed of a high-pass filter and is connected to a third frequency division port;
the 3G &4G path consists of a first low-pass filter, a 3G &4G low-frequency path and a 3G &4G high-frequency path which are connected through T-shaped junctions;
the 3G &4G low-frequency band path is formed by a second low-pass filter and is connected to the first frequency division port;
the 3G &4G high-frequency band path is composed of a band-pass filter and is connected to the second frequency-dividing port.
Further, the first low-pass filter and the high-pass filter both use a 5 th order band-pass filter.
Further, the second low-pass filter and the band-pass filter adopt a 3 rd order filter.
Preferably, the open-circuit branches all adopt lambda/4 stepped impedance resonators.
Furthermore, the PCB is a high-frequency board with good dielectric constant of 2.5-3.5.
Furthermore, the working frequency range of the 3G &4G low-frequency band channel is 690-960 MHz, the working frequency range of the 3G &4G high-frequency band channel is 1700-2700 MHz, and the working frequency range of the 5G channel is 3300-3800 MHz.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
the ultra-wideband tri-band four-port microstrip combiner for the wireless mobile communication system has the characteristics of simple structure, compact layout, small area of a used PCB (printed circuit board), strong universality of a design method, simple processing, suitability for mass production, excellent performance and the like.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
Fig. 1 is a front surface circuit distribution diagram of a PCB board in an ultra wide band three frequency four port microstrip combiner for a wireless mobile communication system according to the present invention;
fig. 2 is a diagram of a frequency division method of a four-frequency microstrip combiner in an ultra-wideband three-frequency four-port microstrip combiner for a wireless mobile communication system according to the present invention;
fig. 3 is a schematic diagram of a triple-band combiner in an ultra-wideband triple-band four-port microstrip combiner for a wireless mobile communication system according to the present invention;
fig. 4 is an electrical performance data diagram of an ultra wide band three frequency four port microstrip combiner for a wireless mobile communication system according to the present invention.
[ description of main symbols ]
1-a combiner port;
2-a first frequency-division port;
3-a second frequency division port;
4-a third crossover port;
201-3G &4G path;
202-a first low pass filter;
203-3G &4G low band path;
a 204-3G &4G high band path;
205-a second low-pass filter;
206-band pass filter;
301-5G vias;
302-high pass filter.
Detailed Description
While the embodiments of the present invention will be described and illustrated in detail with reference to the accompanying drawings, it is to be understood that the invention is not limited to the specific embodiments disclosed, but is intended to cover various modifications, equivalents, and alternatives falling within the scope of the invention as defined by the appended claims.
Example one
As shown in fig. 1, the present application discloses an ultra wide band three-frequency four-port microstrip combiner for wireless mobile communication system, which is made of a double-sided printed circuit board, the back of the PCB is a full-sided copper layer, the front-sided circuit of the PCB comprises a combiner port 1, a first frequency-dividing port 2, a second frequency-dividing port 3, a third frequency-dividing port 4, a 3G &4G path 201 and a 5G path 301, wherein:
the 3G &4G path 201 and the 5G path 301 are combined at a combining port 1 through a T-shaped junction;
the 5G path 301 is formed by a high-pass filter 302 and is connected to the third crossover port 4;
the 3G &4G path 201 is composed of a first low-pass filter 202, a 3G &4G low-frequency path 203 and a 3G &4G high-frequency path 204 through T-shaped junctions;
the 3G &4G low band path 203 is formed by a second low pass filter 205 and is connected to the first frequency-dividing port 2;
the 3G &4G high band path 204 is formed by a band pass filter 206 and is connected to the second frequency-divided port 3.
The design method adopted by the embodiment is that the frequency band is divided into two parts, namely a 3G &4G system frequency band and a 5G system frequency band, and a frequency division path is manufactured according to the two parts. Then, the 3G &4G frequency division path is divided into two parts, namely a low-frequency path (690-960 MHz) and a high-frequency path (1700-2700 MHz). Specifically, the working frequency range of the 3G &4G low-frequency band access 203 is 690-960 MHz, the working frequency range of the 3G &4G high-frequency band access 204 is 1700-2700 MHz, and the working frequency range of the 5G access 301 is 3300-3800 MHz. The working frequency range of the first frequency division port 2 is 690-960 MHz, the working frequency range of the second frequency division port 3 is 1700-2700 MHz, and the working frequency range of the third frequency division port 4 is 3300-3800 MHz.
Further, the first low-pass filter 202 and the high-pass filter 302 both use 5 th order bandpass filters. The second low-pass filter 205 and the band-pass filter 206 are 3 rd order filters. Specifically, in order to ensure the normal operation of the three-frequency combiner, it is critical to achieve good isolation of the three-way frequency division. At the front end of the branch circuit requiring secondary frequency division, quite good return loss, insertion loss and out-of-band rejection must be guaranteed. For this reason, both the low pass filter 202 and the high pass filter 302 are designed as 5 th order bandpass filters, and higher orders can provide better out-of-band rejection. Thus, both the low pass filter 202 and the high pass filter 302 have 5 open stubs and the bending process is used to reduce the PCB area. On the premise of ensuring the performance, similarly, in order to reduce the area, the second low-pass filter 205 and the band-pass filter 206 adopt a 3-order design, so that there are 3 open branches and at least 2 branches.
Preferably, the open-circuit branches all adopt lambda/4 stepped impedance resonators. In this embodiment, in order to enable the filter to have a more flexible transmission zero point, all open branches are implemented by using a λ/4 Stepped Impedance Resonator (SIR), the transmission zero point can be controlled by different impedance ratios of two lines on the SIR, the impedance ratio can also affect the total length of the SIR, and a smaller impedance ratio can implement a shorter length, so that the length of the open branches can be flexibly controlled.
Furthermore, the PCB is a high-frequency board with good dielectric constant of 2.5-3.5.
In this embodiment, for signal transmission, a coaxial cable is conveniently welded, bonding pads are disposed at the combination port 1, the first frequency division port 2, the second frequency division port 3, and the third frequency division port 4, and are used for welding an outer conductor of the coaxial cable, cable cores are welded at the combination port 1, the first frequency division port 2, the second frequency division port 3, and the third frequency division port 4, and the bonding pads are about 1mm away from a signal port surface, so as to avoid short circuit. Meanwhile, a plurality of grounding through holes are formed in the bonding pad and form good grounding with a copper layer on the back surface of the PCB.
The multi-frequency microstrip combiner is different from a dual-frequency microstrip combiner, and in order to realize good isolation and effective work of each shunt, a design idea of frequency division step by step is adopted. In the three-frequency combiner of this embodiment, a group of 3G and 4G frequency bands and a group of 5G frequency bands are used separately, and then frequency division is performed for the second time. Taking a four-frequency microstrip combiner as an example, as shown in fig. 2, two adjacent frequency bands are combined into one group to form a first frequency-division combining, and then the two groups are subjected to a second frequency-division combining to finally obtain a four-frequency combiner. The filters used therein can be implemented with an open circuit SIR of lambda/4.
Example two
As shown in fig. 3, when the frequency division combining is performed for the first time, the 3G &4G low-frequency band path (690 to 960MHz) may be used alone as one path, and the 3G &4G high-frequency band path (1700 to 2700MHz) and the 5G path 301(3300 to 3800MHz) constitute another path, and then are divided again when the frequency division is performed for the second time, so that the 3G &4G high-frequency band path (1700 to 2700MHz) and the 5G path still obtain 3 ports. Correspondingly, in the frequency division mode, in order to ensure good performance of secondary frequency division of the 301 branch, the 301 branch adopts a 5-branch lambda/4 terminal short-circuit stepped impedance resonator SIR. And the other three filters are 3-branch lambda/4 open-circuit stepped impedance resonators SIR.
In addition, as shown in fig. 4, it can be seen that the reflection coefficient S11 is smaller than-15 dB in all three frequency bands, the insertion loss S21 of all three pass bands is smaller than 1dB, and the out-of-band rejection is larger than 30dB, which is excellent for the microstrip combiner.
While the invention has been described with reference to specific preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (6)
1. The utility model provides a four port microstrip combiners of ultra wide band three frequency for wireless mobile communication system, is made by two-sided printed wiring board, and the PCB board back is whole face copper layer, its characterized in that, PCB board front surface circuit includes closes way port, first frequency division port, second frequency division port, third frequency division port, 3G &4G route and 5G route, wherein:
the 3G, 4G and 5G paths are combined at the combining port through a T-shaped junction;
the 5G path is formed by a high-pass filter and is connected to a third frequency division port;
the 3G &4G path consists of a first low-pass filter, a 3G &4G low-frequency path and a 3G &4G high-frequency path, and the 3G &4G low-frequency path and the 3G &4G high-frequency path are connected through a T-shaped junction;
the 3G &4G low-frequency band path is formed by a second low-pass filter and is connected to the first frequency division port;
the 3G &4G high-frequency band path is composed of a band-pass filter and is connected to the second frequency dividing port.
2. The ultra-wideband three-port microstrip combiner according to claim 1, wherein the first low-pass filter and the high-pass filter are both 5-order bandpass filters, and have 5 open-circuit branches.
3. The ultra-wideband tri-band four-port microstrip combiner according to claim 1, wherein the second low pass filter and the band pass filter are 3 order filters having 3 open branches.
4. The ultra-wideband tri-band four-port microstrip combiner according to claim 2 or 3, wherein the open-circuited stubs both use λ/4 ladder impedance resonators.
5. The ultra-wideband tri-band four-port microstrip combiner for the wireless mobile communication system according to claim 1, wherein the PCB board is a high frequency board with a dielectric constant between 2.5 and 3.5.
6. The ultra-wideband tri-band four-port microstrip combiner for the wireless mobile communication system according to claim 1, wherein the operating frequency band of the 3G &4G low frequency band path is 690-960 MHz, the operating frequency band of the 3G &4G high frequency band path is 1700-2700 MHz, and the operating frequency band of the 5G path is 3300-3800 MHz.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711010538.0A CN107732399B (en) | 2017-10-25 | 2017-10-25 | Ultra-wideband tri-frequency four-port microstrip combiner for wireless mobile communication system |
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| CN201711010538.0A CN107732399B (en) | 2017-10-25 | 2017-10-25 | Ultra-wideband tri-frequency four-port microstrip combiner for wireless mobile communication system |
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| CN107732399B true CN107732399B (en) | 2022-07-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108649971B (en) * | 2018-08-20 | 2020-07-07 | 维沃移动通信有限公司 | Terminal equipment |
| CN109301457B (en) * | 2018-10-15 | 2023-09-05 | 京信通信技术(广州)有限公司 | Base station antenna and feed network system thereof |
| CN111710948B (en) * | 2020-05-18 | 2022-07-08 | 深圳市南斗星科技有限公司 | Combiner |
| CN112909464B (en) * | 2021-01-25 | 2021-11-02 | 中天通信技术有限公司 | Microstrip combiner with uniform impedance branch loading |
| CN116826342A (en) * | 2023-06-12 | 2023-09-29 | 佛山市迪安通讯设备有限公司 | Three-frequency microstrip combiner |
| CN116995386B (en) * | 2023-08-09 | 2024-02-23 | 佛山市粤海信通讯有限公司 | Out-of-band suppression enhanced combiner |
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| GB1508846A (en) * | 1975-06-18 | 1978-04-26 | Hazeltine Corp | N-way power divider with remote isolating resistors |
| GB0426443D0 (en) * | 2004-12-02 | 2005-01-05 | Koninkl Philips Electronics Nv | Distributed diplexer |
| CN201044258Y (en) * | 2007-06-26 | 2008-04-02 | 京信通信***（中国）有限公司 | GSM/DCS/WCDMA three-frequency combiner |
| US8305941B2 (en) * | 2009-09-02 | 2012-11-06 | Cohen Allen S | Broadband combining system with high spectrum efficiency for use in wireless communications |
| CN103887583B (en) * | 2012-12-21 | 2016-09-14 | 京信通信***（中国）有限公司 | Micro-strip triplexer |
| CN103856230B (en) * | 2013-08-08 | 2016-06-15 | 北京九天利建信息技术股份有限公司 | The antenna installation of Big Dipper bimodulus navigation terminal and navigation terminal |
| CN105958165B (en) * | 2016-06-08 | 2018-09-14 | 南京信息工程大学 | A kind of three frequency range of miniaturization high isolation, six tunnel micro-strip combiner |
| CN106159398A (en) * | 2016-08-31 | 2016-11-23 | 广东通宇通讯股份有限公司 | Broadband combiner |
| CN106602196B (en) * | 2016-11-16 | 2019-07-30 | 中山大学 | The power divider and its design method for supporting microwave and millimeter wave frequency range to cooperate |
| CN207409639U (en) * | 2017-10-25 | 2018-05-25 | 上海安费诺永亿通讯电子有限公司 | A kind of three frequency four-port microstrip combiner of ultra wide band for mobile radio system |
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