CN107731774A - A kind of heat radiating type camera module chip-packaging structure - Google Patents
A kind of heat radiating type camera module chip-packaging structure Download PDFInfo
- Publication number
- CN107731774A CN107731774A CN201710792870.0A CN201710792870A CN107731774A CN 107731774 A CN107731774 A CN 107731774A CN 201710792870 A CN201710792870 A CN 201710792870A CN 107731774 A CN107731774 A CN 107731774A
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- Prior art keywords
- circuit board
- metal substrate
- chip
- groove
- camera module
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of heat radiating type camera module chip-packaging structure, including chip and circuit board, chip fixes fitting on circuit boards, circuit board is two-layer composite, including circuit board body and metal substrate, circuit board body is fitted on metal substrate, and circuit board body is provided with the storage glue hole of insertion circuit board body front and back, heat-conducting glue is full of in storage glue hole, chip carrier fully contacts on storage glue hole aperture and with heat-conducting glue.The present invention makes circuit board by the way of common plate sill and metal substrate are compound, chip quickly can be distributed heat conduction caused by chip operation by the strong metal substrate of thermal conductivity, and it can integrate set metal substrate groove, introducing cooling fluid multiple means further to strengthen heat dispersion on this basis, ensure camera module normal work, overcome the problems such as noise caused by high fever is more, image resolution declines.
Description
Technical field
The present invention relates to a kind of camera module structure, more specifically, it relates to which a kind of heat radiating type camera module chip seals
Assembling structure.
Background technology
Camera module, it is mainly used in the electronic terminal products such as mobile phone, tablet personal computer, unmanned plane, Medical Devices, now
The indispensability configuration of many equipment in Internet era and the image information trap tool that people are essential are turned into.Take the photograph at present
As module chip encapsulate prevailing technology be COB package methods as shown in Figure 1, heat dispersion is limited, for mobile phone recorded video,
In the case that the continuation such as unmanned plane shooting use camera function, chip persistent fever and caloric value exceeds chip cooling ability,
The problem of bad of now radiating, can cause noise to increase, and then cause Xie Xi, picture texture decline.Publication No.
CN205140128U utility model disclosed a kind of detection device provided with heat radiating fin structure on April 6th, 2016, including outer
Shell, upper lid, sheet metal component, circuit board, camera lens, buttock line, wherein, process chip, the process chip are installed on the circuit board
Upper surface be connected with fin, the fin is fixedly connected with the circuit board.The present invention is by with heat radiating fin structure generation
Fan structure has been replaced, has both saved space, has met demand of the product to steadiness again, fin can be fixed on electricity well
On the plate of road；Meanwhile pedestrian that can be to enter in Intelligent Measurement tunnel of the invention, and alarm, the generation to avoid traffic accident are right
In maintaining traffic order, ensure that traffic safety has important meaning.Meanwhile the cost of manpower monitoring is saved, accuracy of detection is high,
It is highly reliable.The installation cost is low, and installation is simple and convenient；Detection algorithm strong robustness, degree of intelligence are high.But the detection device is only
Radiated by fin conductive, less efficient, radiating effect is limited.
The content of the invention
Use at present in COB package method camera modules, heat dispersion is limited, easily because radiating not when prolonged periods work
It is good to cause noise to increase, Xie Xi, picture texture decline the problem of, to overcome this defect, the invention provides one kind improve dissipate
Heat structure, the heat radiating type camera module chip-packaging structure of heat dispersion is greatly enhanced.
The technical scheme is that：A kind of heat radiating type camera module chip-packaging structure, including chip and circuit board, core
Piece fixes fitting on circuit boards, and circuit board is two-layer composite, including circuit board body and metal substrate, circuit board body
It is fitted on metal substrate, circuit board body is provided with the storage glue hole of insertion circuit board body front and back, and storage glue fills in hole
Full heat-conducting glue, chip carrier fully contact on storage glue hole aperture and with heat-conducting glue.The plate sill of ordinary circuit board has fire-retardant
Ratio phenolic paper laminate, flame-retardant glass fabric laminates etc., heat conductivility is general, circuit board sheet in this camera module chip-packaging structure
Body still uses common plate sill, it is ensured that the laying processing characteristics of circuit is unaffected, and composite guide is hot strong on this basis
Metal substrate, chip by metal substrate can quickly by caused by chip operation heat conduction distributes.Chip
When being radiated by metal substrate, directly contact conduction radiating efficiency highest, but unless chip, metal substrate it is all substantially flat and
Fitting completely, otherwise it is difficult to reach complete directly contact.And in fact because the working environment of circuit board is it is difficult to ensure that definitely
It is dustless, and metal surface typically can all aoxidize, therefore chip, metal substrate are not accomplished to be bonded completely.In the case, exist
Filled between metal substrate and chip with the preferable heat-conducting glue of thermal conductivity, can fully realize soft contact, so as to efficiently
Carry out heat loss through conduction.
Preferably, metal substrate bottom is provided with groove.Groove is set make it that metal substrate is uneven, equivalent to increase
Metal substrate bottom surface product, the radiating conducting surface of metal substrate also increases, so as to the radiating of speed-up chip.
Preferably, in remaining groove in addition to the groove at head and the tail both ends, the adjacent ditch of each groove one end and side
Groove connects with one end, and the groove other end then connects with the adjacent trenches of opposite side with one end, and it is wavy that all grooves connect into tooth form,
Cover sheet is also posted in metal substrate bottom, and the two-port that groove is linked to be passage is connected with cooling fluid joint, fluid coupling respectively
It is connected on cooling fluid pipeline.Cover sheet is bonded with metal substrate, makes the groove of inside connect to form the unidirectional of a both ends open
Passage, after gutter channel connects cooling fluid joint, the negotiable air from cooling fluid pipeline, cooling water in gutter channel
Etc. cooling fluid, promote the cooling of metal substrate itself, keep the temperature difference of metal substrate and chip chamber, improve metal substrate and core
Heat conduction efficiency between piece, further strengthen the heat dispersion of this heat radiating type camera module chip-packaging structure.
Preferably, it is connected between adjacent trenches in end portions cross.The wavy gutter channel of sawtooth can be so formed, is processed
Come relatively easy.
As an alternative, all grooves are parallel, connected between adjacent trenches by connectivity slot.The groove of square-wave-shaped can so be formed
Passage, after being passed through cooling fluid, the cooling radiation scope of formation is more regular.
As an alternative, groove includes fluid spreading grooves and guiding groove, and fluid spreading grooves are multiple tracks and are arranged in concentric circles, are drawn
Guide groove is along all fluid spreading grooves of fluid spreading grooves radial communication.Cooling fluid is introduced and drawn metal substrate by guiding groove, cold
But diffusion profile makes metal substrate obtain large area cooling to bigger region after fluid enters fluid spreading grooves.
Preferably, metal substrate is connected by screw with circuit board body, screw runs through metal substrate and circuit board sheet
Body, metal substrate and circuit board body overlapping portion are provided with sealing ring.Metal substrate is designed to that demountable structure is beneficial to camera module
Maintenance, after camera module uses certain time, heat-conducting glue may be dry and hard, it is necessary to change to keep optimal heat conductivility,
If without metal substrate, it is necessary to which storage glue hole can just be exposed by removing chip, and want the wiring of plug chip to draw when dismounting chip
Pin, certain risk be present, the pin once careless manipulation may fracture.And by dismounting metal substrate, can be more easily complete
Changed into heat-conducting glue.Using demountable structure, metal substrate area may not necessarily be processed into big with circuit board body etc., and only need
Covering storage glue hole, and metal substrate can individually carry out thickening processing, so that the radiating such as groove, cooling fluid joint is strong
Change structure processing to be more easily performed.In addition, during metal substrate loads, with metal substrate and close, the gold of chip
Belong to substrate gradually can pressurize to heat-conducting glue, heat-conducting glue is fully contacted with chip, it is ensured that the efficiency of heat transfer.
The beneficial effects of the invention are as follows：
Improve the heat-sinking capability of camera module, it is ensured that camera module normal work.The present invention uses common plate sill and metal
The compound mode of substrate makes circuit board, and chip can be by the strong metal substrate of thermal conductivity quickly by caused by chip operation
Heat conduction distributes, and can integrate set metal substrate groove, introducing cooling fluid multiple means to enter one on this basis
Step strengthens heat dispersion, it is ensured that camera module normal work, overcomes more, image resolution decline of noise caused by high fever etc. to ask
Topic.
Brief description of the drawings
Fig. 1 is a kind of COB encapsulating structures schematic diagram of the prior art；
Fig. 2 is a kind of structural representation of the present invention；
Fig. 3 is a kind of structural representation of circuit board in the present invention；
Fig. 4 is a kind of distribution schematic diagram of the groove on metal substrate in the present invention；
Fig. 5 is another distribution schematic diagram of the groove on metal substrate in the present invention；
Fig. 6 is distribution schematic diagram of the groove on metal substrate in embodiment 5；
Fig. 7 is vertical profile structural representation of the present invention in embodiment 5.
In figure, 1- chips, 2- circuit board bodies, 3- metal substrates, 4- storage glue hole, 5- heat-conducting glues, 6- grooves, 7- connections
Groove, 8- cover sheets, 9- fluid couplings, 10- cooling fluid pipelines, 11- fluid spreading grooves, 12- guiding grooves, 13- sealing rings.
Embodiment
The invention will be further described for specific embodiment below in conjunction with the accompanying drawings.
Embodiment 1：
As shown in Fig. 2 a kind of heat radiating type camera module chip-packaging structure, including chip 1 and circuit board, chip 1 fix fitting
On circuit boards, circuit board is two-layer composite, including circuit board body 2 and metal substrate 3, and circuit board body 2 is with common
Plate sill is made, and the printed circuit on circuit board is laid in circuit board body 2, and circuit board body 2 is fitted in metal substrate 3
On, metal substrate 3 is the flat board of full wafer.The storage glue hole 4 of the insertion front and back of circuit board body 2 is provided with circuit board body 2,
Heat-conducting glue 5 is full of in storage glue hole 4, chip 1 is set up on the aperture of storage glue hole 4, and the surrounding of chip 1 is attached to the electricity around storage glue hole 4
On road plate body 2, the center section of chip 1 is hanging and is fully contacted with heat-conducting glue 5, on the pin on chip 1 and circuit board body 2
Wire be connected.
Soft contact can fully be realized by the preferable heat-conducting glue 5 of thermal conductivity between metal substrate 3 and chip 1, so as to high
Effect ground carries out heat loss through conduction.
Embodiment 2：
As shown in figure 3, the bottom of metal substrate 3 is provided with six parallel grooves 6.Remaining is the same as embodiment 1.
Set groove 6 make it that the bottom surface of metal substrate 3 is uneven, accumulated equivalent to the bottom surface of metal substrate 3 is increased, gold
The radiating conducting surface of category substrate 3 also increases, so as to the radiating of speed-up chip 1.
Embodiment 3：
As shown in figure 4, groove 6 totally seven, in addition to the groove 6 at head and the tail both ends, in remaining five groove 6, each one end of groove 6
Connected with the adjacent trenches of side with one end, the other end of groove 6 then connects with the adjacent trenches of opposite side with one end, adjacent trenches
It is connected between 6 in end portions cross, all grooves 6 connect into the wavy gutter channel of tooth form.Also post cover sheet in the bottom of metal substrate 3
8, the two-port that groove 6 is linked to be passage is connected with cooling fluid joint 9 respectively, and fluid coupling 9 is connected on cooling fluid pipeline 10,
The top of cooling fluid pipeline 10 connects a cooling fan.Remaining is the same as embodiment 1.
Cover sheet is bonded with metal substrate, the groove of inside is connected the half-duplex channel to form a both ends open, groove leads to
After road connects cooling fluid joint, the air-flow that cooling fan rotates generation enters through cooling fluid pipeline 10, cooling fluid joint 9
Flowed in gutter channel, promote the cooling of itself of metal substrate 3, keep the temperature difference between metal substrate 3 and chip 1, improve metal
Heat conduction efficiency between substrate 3 and chip 1, further strengthen the heat dispersion of this heat radiating type camera module chip-packaging structure.
Embodiment 4：
As shown in figure 5, groove 6 totally five, all grooves 6 are parallel, and square-wave-shaped is formed by the connection of connectivity slot 7 between adjacent trenches 6
Gutter channel.Remaining is the same as embodiment 3.
Embodiment 5：
Groove 6 includes fluid spreading grooves 11 and guiding groove 12, and fluid spreading grooves 11 are eight and are arranged in concentric circles, guiding groove 12
Along all fluid spreading grooves 11 of the radial communication of fluid spreading grooves 11.Remaining is the same as embodiment 3.
Cooling air-flow is introduced and drawn metal substrate 3 by guiding groove 12, and cooling air-flow spreads after entering fluid spreading grooves 11
Bigger region is distributed to, metal substrate 3 is obtained large area cooling.
Embodiment 6：
Fluid spreading grooves 11 are ten.Remaining is the same as embodiment 5.
Embodiment 7：
As shown in Figure 6, Figure 7, metal substrate 3 is less than circuit board body 2, and more than storage glue hole 4, metal substrate 3 by screw and
Matching nut is fixed on the bottom surface of circuit board body 2, and screw is through cover sheet 8, metal substrate 14, circuit board body 2, Metal Substrate
Piece 14 is provided with sealing ring 16 with the overlapping portion of main board 13, and the region that sealing ring 16 encloses is more than storage glue hole 4.Metal substrate 3 is carried out
Thickening is handled, and so as to which groove 6 is easier to process, gutter channel is more likely formed.Remaining is the same as embodiment 5.
When carrying out camera module maintaining, by crossing dismounting metal substrate 3, heat-conducting glue can be more easily completed more
Change.In addition, during metal substrate 3 loads, close with metal substrate 3 and chip 1, metal substrate 3 can be gradually right
Heat-conducting glue 5 pressurizes, and heat-conducting glue 5 is fully contacted with chip 1, it is ensured that the efficiency of heat transfer.
Claims (7)
1. a kind of heat radiating type camera module chip-packaging structure, including chip（1）And circuit board, chip（1）Fixation is fitted in electricity
On the plate of road, it is characterized in that circuit board is two-layer composite, including circuit board body（2）And metal substrate（3）, circuit board body
（2）It is fitted in metal substrate（3）On, circuit board body（2）It is provided with insertion circuit board body（2）The storage glue hole of front and back
（4）, storage glue hole（4）It is interior to be full of heat-conducting glue（5）, chip（1）It is set up in storage glue hole（4）On aperture and and heat-conducting glue（5）Fully connect
Touch.
2. heat radiating type camera module chip-packaging structure according to claim 1, it is characterized in that metal substrate（3）Bottom is set
There is multiple tracks groove（6）.
3. heat radiating type camera module chip-packaging structure according to claim 2, it is characterized in that the groove except head and the tail both ends
（6）Remaining groove in addition（6）In, each groove（6）One end connects with the adjacent trenches of side with one end, groove（6）It is another
End then connects with the adjacent trenches of opposite side with one end, all grooves（6）It is wavy to connect into tooth form, metal substrate（3）Bottom is also
Post cover sheet（8）, groove（6）The two-port of be linked to be passage is connected with cooling fluid joint respectively（9）, fluid coupling（9）Even
In cooling fluid pipeline（10）On.
4. heat radiating type camera module chip-packaging structure according to claim 3, it is characterized in that adjacent trenches（6）Between holding
Portion, which intersects, to be connected.
5. heat radiating type camera module chip-packaging structure according to claim 3, it is characterized in that all grooves（6）It is parallel,
Adjacent trenches（6）Between pass through connectivity slot（7）Connection.
6. heat radiating type camera module chip-packaging structure according to claim 2, it is characterized in that groove（6）Expand including fluid
Dissipate groove（11）And guiding groove（12）, fluid spreading grooves（11）For multiple tracks and concentric circles is arranged in, guiding groove（12）Spread along fluid
Groove（11）All fluid spreading grooves of radial communication（11）.
7. heat radiating type camera module chip-packaging structure according to any one of claim 1 to 6, it is characterized in that Metal Substrate
Piece（3）With circuit board body（2）It is connected by screw, screw runs through metal substrate（3）And circuit board body（2）, metal substrate
（3）And circuit board body（2）Overlapping portion is provided with sealing ring（13）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792870.0A CN107731774A (en) | 2017-09-05 | 2017-09-05 | A kind of heat radiating type camera module chip-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792870.0A CN107731774A (en) | 2017-09-05 | 2017-09-05 | A kind of heat radiating type camera module chip-packaging structure |
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| Publication Number | Publication Date |
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| CN107731774A true CN107731774A (en) | 2018-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710792870.0A Pending CN107731774A (en) | 2017-09-05 | 2017-09-05 | A kind of heat radiating type camera module chip-packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115497891A (en) * | 2022-09-30 | 2022-12-20 | 高能瑞泰(山东)电子科技有限公司 | Detector chip placing carrier with multiple stations capable of being placed variably |
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|---|---|---|---|---|
| CN1308373A (en) * | 2000-02-11 | 2001-08-15 | Abb半导体有限公司 | Heat dissipator for high-power semiconductor module |
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| US20070236883A1 (en) * | 2006-04-05 | 2007-10-11 | Javier Ruiz | Electronics assembly having heat sink substrate disposed in cooling vessel |
| US20090219694A1 (en) * | 2006-02-10 | 2009-09-03 | Ecpe Engineering Center For Power Electronics Gmbh | Power Electronics Assembly |
| CN102098870A (en) * | 2011-03-10 | 2011-06-15 | 沈李豪 | Composite printed circuit board (PCB) and manufacturing method thereof |
| US8391009B2 (en) * | 2010-06-18 | 2013-03-05 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipating assembly |
| US20150097281A1 (en) * | 2013-10-03 | 2015-04-09 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP2017017133A (en) * | 2015-06-30 | 2017-01-19 | 昭和電工株式会社 | Liquid-cooled type cooling device |
| CN106997872A (en) * | 2016-01-26 | 2017-08-01 | 三菱电机株式会社 | Semiconductor device |
-
2017
- 2017-09-05 CN CN201710792870.0A patent/CN107731774A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308373A (en) * | 2000-02-11 | 2001-08-15 | Abb半导体有限公司 | Heat dissipator for high-power semiconductor module |
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| US20090219694A1 (en) * | 2006-02-10 | 2009-09-03 | Ecpe Engineering Center For Power Electronics Gmbh | Power Electronics Assembly |
| US20070236883A1 (en) * | 2006-04-05 | 2007-10-11 | Javier Ruiz | Electronics assembly having heat sink substrate disposed in cooling vessel |
| US8391009B2 (en) * | 2010-06-18 | 2013-03-05 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipating assembly |
| CN102098870A (en) * | 2011-03-10 | 2011-06-15 | 沈李豪 | Composite printed circuit board (PCB) and manufacturing method thereof |
| US20150097281A1 (en) * | 2013-10-03 | 2015-04-09 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP2017017133A (en) * | 2015-06-30 | 2017-01-19 | 昭和電工株式会社 | Liquid-cooled type cooling device |
| CN106997872A (en) * | 2016-01-26 | 2017-08-01 | 三菱电机株式会社 | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115497891A (en) * | 2022-09-30 | 2022-12-20 | 高能瑞泰(山东)电子科技有限公司 | Detector chip placing carrier with multiple stations capable of being placed variably |
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Application publication date: 20180223 |
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