CN107731572A - A kind of chip conducting polymer aluminum capacitor solidifies fixture - Google Patents
A kind of chip conducting polymer aluminum capacitor solidifies fixture Download PDFInfo
- Publication number
- CN107731572A CN107731572A CN201710934596.6A CN201710934596A CN107731572A CN 107731572 A CN107731572 A CN 107731572A CN 201710934596 A CN201710934596 A CN 201710934596A CN 107731572 A CN107731572 A CN 107731572A
- Authority
- CN
- China
- Prior art keywords
- chip
- conducting polymer
- lower plate
- train wheel
- wheel bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
Abstract
The present invention provides a kind of chip conducting polymer aluminum capacitor solidification fixture, including train wheel bridge component and lower plate component, the lower plate component are provided with lower plate, steel plate are inlaid with lower plate；The steel plate carries provided with technique, and technique carrier band, which is provided with, has been bonded chip to be solidified；The both ends of the lower plate are fixed with guide pillar, and train wheel bridge component is socketed on guide pillar；The middle part of the train wheel bridge component is provided with probe post, and the end of probe post is provided with polytetrafluoroethylene (PTFE) briquetting.The present invention utilizes train wheel bridge component moving up and down and the probe post of extension type, it ensure that the chip conducting polymer aluminum capacitor chip negative pole of itself and different-thickness is pressed into contact with, overcome chip conducting polymer aluminum capacitor chip lamination solidifying requirements overlapping with chip with technique carrier band negative pole or chip after lamination bonding, effectively reduce the ESR losses of product, product qualification rate is improved, ensure that the reliability of product.
Description
Technical field
The present invention relates to a kind of chip conducting polymer aluminum capacitor to solidify fixture, belongs to chip conducting polymer aluminum capacitor
Device manufacturing technology field.
Background technology
After chip conducting polymer aluminum capacitor lamination bonding, silver paste need to be consolidated in 140 DEG C~180 DEG C of environment high temperature
Change, in order to ensure that technique carrier band negative pole and capacitor core bag negative pole are in close contact, or multilayer core bag cathode contact is good, existing logical
It is between product to be solidified is directly placed at two blocks of parallel steel plates of heating, to close two blocks of steel plates by external force with technology
Hold together, so as to limit technique carrier band the distance between negative pole and capacitor core bag negative pole to reach solidification purpose.
Because capacitor core bag is during polymerization, leaching graphite silver paste, capacitor core bag consistency of thickness can not be ensured, profit
With above-mentioned existing method, often result in the big product of thickness by squeeze crack, break and scrap.The small product of thickness, work
Skill carrier band negative pole is Nian Jie between capacitor chip negative pole or capacitor chip negative pole loose, and contact area is too small, and product
Electrical parameter ESR is excessive unqualified, while this product, during plastic packaging, resin squeezes into chip in the presence of injection pressure
Gap between chip, cause product loss, ESR excessive and unqualified.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of chip conducting polymer aluminum capacitor to solidify fixture, should
The qualification rate of chip conducting polymer aluminum capacitor is effectively ensured in chip conducting polymer aluminum capacitor solidification fixture, reduces production
The ESR losses of product, ensure that the reliability of product.
The present invention is achieved by the following technical programs.
A kind of chip conducting polymer aluminum capacitor solidification fixture provided by the invention, including train wheel bridge component and lower plate
Component, the lower plate component are provided with lower plate, steel plate are inlaid with lower plate；The steel plate carries provided with technique, work
Skill carrier band, which is provided with, has been bonded chip to be solidified；The both ends of the lower plate are fixed with guide pillar, and train wheel bridge component, which is socketed in, leads
On post；The middle part of the train wheel bridge component is provided with probe post, and the end of probe post is provided with polytetrafluoroethylene (PTFE) briquetting, chip and probe
Post, the position of polytetrafluoroethylene (PTFE) briquetting are corresponding.
The train wheel bridge component can move up and down on guide pillar, and probe post is provided with telescopic extension spring.
The both ends of the lower plate are also equipped with axle, and axle is located at the side of guide pillar.
Bolt is connected with the axle, bolt is fixed on train wheel bridge component by nut.
The bolt can left and right upset and locking.
The nut is locking butterfly nut, is matched with bolt.
The guide pillar is provided with guide pin bushing.
The side of the technique carrier band is provided with positioning hole, and pilot pin is provided with the both ends of technique carrier band.
The train wheel bridge component, the material of lower plate component are insulation, exotic material.
The steel plate is the stainless steel plate for being coated with Teflon, and chip 6 is chip conducting polymer aluminum electrolytic capacitor core piece.
The beneficial effects of the present invention are：Using train wheel bridge component moving up and down and the probe post of extension type, protect
The chip conducting polymer aluminum capacitor chip negative pole that it has been demonstrate,proved with different-thickness is pressed into contact with, and overcomes chip conducting polymer
Aluminum capacitor chip lamination solidifying requirements overlapping with chip with technique carrier band negative pole or chip after lamination bonding, are effectively reduced
The ESR losses of product, improve product qualification rate, ensure that the reliability of product.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the enlarged drawing at Fig. 1 C；
Fig. 3 is the structural representation of present invention process carrier band；
Fig. 4 is the design sketch before chip-stack bonding solidification of the present invention；
Fig. 5 is the design sketch after chip-stack bonding solidification of the present invention；
In figure：1- train wheel bridge components, 2- lower plate components, 3- guide pillars, 4- probe posts, 5- polytetrafluoroethylene (PTFE) briquettings, 6- cores
Piece, 7- steel plates, 8- bolts, 9- nuts, 10- lower plates, 11- guide pin bushings, 12- techniques carrier band, 13- pilot pins, 14- axles.
Embodiment
Be described further below technical scheme, but claimed scope be not limited to it is described.
As depicted in figs. 1 and 2, a kind of chip conducting polymer aluminum capacitor solidification fixture, including train wheel bridge component 1 is with
Cleat assembly 2, the lower plate component 2 are provided with lower plate 10, steel plate 7 are inlaid with lower plate 10；The steel plate 7 is provided with
The technique carrier band 12 after lamination is placed, technique carrier band 12, which is provided with, has been bonded chip 6 to be solidified；The both ends of the lower plate 10
Guide pillar 3 is fixed with, train wheel bridge component 1 is socketed on guide pillar 3；The middle part of the train wheel bridge component 1 is provided with probe post 4, probe post 4
End be provided with polytetrafluoroethylene (PTFE) briquetting 5, chip 6 is corresponding with the position of probe post 4, polytetrafluoroethylene (PTFE) briquetting 5.
The train wheel bridge component 1 can move up and down on guide pillar 3, and probe post 4 is provided with telescopic extension spring, and it is mainly made
With being situation for overcoming the different-thickness of chip 6, particularly during one-step method polymerization, graphite silver paste, monolithic chip 6 is thick
It is larger to spend error, and the combination stack of multilayer chiop 6 is bonded, then whole piece technique carries the entirety of numerous overlapping chips 6 on 12
Thickness error is just bigger, by elastic probe post 4, contacts its uniform-compression.
The both ends of the lower plate 10 are also equipped with axle 14, and axle 14 is located at the side of guide pillar 3, and bolt 8 and nut 9 are with axle 14
For rotating fulcrum, left and right upset is realized.
Bolt 8 is connected with the axle 14, bolt 8 is fixed on train wheel bridge component 1 by nut 9, for locking lower folder
Board component 2 and train wheel bridge component 1.
The bolt 8 can left and right upset and locking, be easy to the assembling and dismounting of train wheel bridge component 1 and lower plate component 2, spiral shell
Mother 9 is locking butterfly nut, is matched with bolt 8.
The guide pillar 3 is provided with guide pin bushing 11, for limiting probe post 4, clamping stroke, and after the lamination of chip 6 bonding, the number of plies
Different then thickness is different, need to use the guide pin bushing 11 of different height size, carry out the solidification of control chip 6.
The side of the technique carrier band 12 is provided with positioning hole, as shown in figure 3, being provided with pilot pin at the both ends of technique carrier band 12
13, pilot pin 13 shares two, for limiting technique 12 positions of carrier band and tangling the positioning hole on technique carrier band 12, reaches chip
The purpose of 6 positioning.
The train wheel bridge component 1, the material of lower plate component 2 are insulation, exotic material, and steel plate 7 is to be coated with iron fluorine
The stainless steel plate of dragon, possesses the characteristic for being not easy burn into adhesion, for chip placement 6, while can prevent from overflowing the adhesion of silver paste.
Embodiment 1
As described above, a kind of chip conducting polymer aluminum capacitor solidification fixture, including lower plate component 2 and train wheel bridge group
Part 1, is fixed on the guide pillar 3 at the upper surface both ends of lower plate component 2, and train wheel bridge component 1 is set on guide pillar 3 and can be along guide pillar 3
Lower movement, the long 50mm of the threaded upper ends of guide pillar 3, lower plate component 2 and train wheel bridge component 1 are locked using nut 9.
Train wheel bridge component 1 includes the band telescopic probe post 4 of extension spring, and its main function is for overcoming chip 6 different thick
The situation of degree, particularly during one-step method polymerization, graphite silver paste, the thickness error of monolithic chip 6 is larger, and multilayer chiop 6
Combination stack is bonded, then the integral thickness error of numerous overlapping chips 6 on whole piece technique carrier band 12 is just bigger, passes through elasticity
Probe post 4 contacts its uniform-compression；The polytetrafluoroethylene (PTFE) briquetting 5 of the end of probe post 4 connection installation, utilizes polytetrafluoroethylene (PTFE)
The material of briquetting 5 has good self-lubricity, corrosion resistance, temperature tolerance, it is ensured that chip conducting polymer aluminum capacitor chip not by
Adhesion, the position of polytetrafluoroethylene (PTFE) briquetting 5 be not corresponding with the position of chip 6 for pollution and unnecessary silver paste.
In this process, to ensure the position of the position, i.e. chip 6 of technique carrier band 12, in the plating iron that lower plate 10 is inlayed
The both ends of fluorine dragon stainless steel plate 7 are provided with carrier band pilot pin 13, to tangle the positioning hole of technique carrier band 12, reach chip 6 and position
Purpose, its stainless steel plate 7 inlayed need to plate the thick Teflons of 0.1mm, be not easy the characteristic of burn into adhesion using it to place core
Piece 6, while can prevent from overflowing the adhesion of silver paste, as shown in Figure 4 and Figure 5.
Specifically use process：Lamination is bonded to the work of the uncured chip 6 with chip conducting polymer aluminum capacitor
Skill carrier band 12, is placed on Teflon stainless steel plate 7, ensures position using pilot pin 13, while train wheel bridge component 1 is in locking screw
The locking of mother 9 is issued to descending, makes the parallel contact chip 6 of polytetrafluoroethylene (PTFE) block 5 of the end of elastic probe post 4, utilizes extension spring
Pretightning force, make chip 6 squeeze, whole solidification fixture is placed into air dry oven again after clamping, hot setting.
Embodiment 2
As described above, a kind of chip conducting polymer aluminum capacitor solidification fixture, technique carrier band 12 installation and remove
During, because distance is too small between lower plate component 2 and train wheel bridge component 1, the installation of technique carrier band 12 and dismounting are not easy to, because
This, as shown in figure 1, in lower plate component 2 and the both ends installation locking bolt 8 and nut 9 of train wheel bridge component 1, bolt 8 and nut
9 with axle 14 be rotating fulcrum, can left and right upset；Unclamp nut 9 and put down bolt 8, be easy to be placed or taken out technique carrier band 12, when need
When clamping chip 6, lower plate component 2 and train wheel bridge component 1 are closed up with guide pillar 3 for guiding, then clamping screw 8.
Simultaneously in lower plate component 2 and the clamping process of train wheel bridge component 1, clamp the compression strength of stroke or probe post 4 without
Method controls size, can cause the problems with of chip 6：Compression strength is excessive, and chip 6 will be damaged, polymer layer departs from, and cause to produce
The parameters such as product leakage current are unqualified；It is too small to compress strength, then between chip 6 or chip 6 and technique 12 negative poles of carrier band be connected it is bad,
During later process plastic packaging operation, the gap between resin injection chip 6, product E SR losses can be caused unqualified, therefore, such as Fig. 1
It is shown, the mounting guide sleeve 11 on the guide pillar 3 at the both ends of lower plate component 2, after carrying out the lamination of control chip 6 bonding, even if the number of plies is different
Cause thickness different, lower plate component 2 and train wheel bridge component 1 also have pretension stroke.
In summary, preferred embodiment two, the invention has the advantages that：
1) it can meet that the lamination solidification of different-thickness size chip conducting polymer aluminum capacitor chip 6 uses, using model
Enclose wide；
2) chip conducting polymer aluminum capacitor chip 6 is neat after solidifying, microscopic damage is small, improves product qualification rate,
It ensure that the reliability of product.
Claims (10)
1. a kind of chip conducting polymer aluminum capacitor solidifies fixture, including train wheel bridge component (1) and lower plate component (2), its
It is characterised by：The lower plate component (2) is provided with lower plate (10), and steel plate (7) is inlaid with lower plate (10)；The steel plate
(7) technique carrier band (12) is provided with, technique carrier band (12) is provided with and has been bonded chip to be solidified (6)；The lower plate (10)
Both ends be fixed with guide pillar (3), train wheel bridge component (1) is socketed on guide pillar (3)；The middle part of the train wheel bridge component (1) is provided with
Probe post (4), the end of probe post (4) are provided with polytetrafluoroethylene (PTFE) briquetting (5), chip (6) and probe post (4), polytetrafluoroethylene (PTFE)
The position of briquetting (5) is corresponding.
2. chip conducting polymer aluminum capacitor as claimed in claim 1 solidifies fixture, it is characterised in that：The train wheel bridge group
Part (1) can move up and down on guide pillar (3), and probe post (4) is provided with telescopic extension spring.
3. chip conducting polymer aluminum capacitor as claimed in claim 1 solidifies fixture, it is characterised in that：The lower plate
(10) both ends are also equipped with axle (14), and axle (14) is located at the side of guide pillar (3).
4. chip conducting polymer aluminum capacitor as claimed in claim 3 solidifies fixture, it is characterised in that：On the axle (14)
Bolt (8) is connected with, bolt (8) is fixed on train wheel bridge component (1) by nut (9).
5. chip conducting polymer aluminum capacitor as claimed in claim 4 solidifies fixture, it is characterised in that：The bolt (8)
Can left and right upset and locking.
6. chip conducting polymer aluminum capacitor as claimed in claim 4 solidifies fixture, it is characterised in that：The nut (9)
To lock butterfly nut, match with bolt (8).
7. chip conducting polymer aluminum capacitor as claimed in claim 1 solidifies fixture, it is characterised in that：The guide pillar (3)
It is provided with guide pin bushing (11).
8. chip conducting polymer aluminum capacitor as claimed in claim 1 solidifies fixture, it is characterised in that：The technique carrier band
(12) side is provided with positioning hole, and pilot pin (13) is provided with the both ends of technique carrier band (12).
9. chip conducting polymer aluminum capacitor as claimed in claim 1 solidifies fixture, it is characterised in that：The train wheel bridge group
Part (1), the material of lower plate component (2) are insulation, exotic material.
10. chip conducting polymer aluminum capacitor as claimed in claim 1 solidifies fixture, it is characterised in that：The steel plate (7)
To be coated with the stainless steel plate of Teflon, chip (6) is chip conducting polymer aluminum electrolytic capacitor core piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710934596.6A CN107731572A (en) | 2017-10-10 | 2017-10-10 | A kind of chip conducting polymer aluminum capacitor solidifies fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710934596.6A CN107731572A (en) | 2017-10-10 | 2017-10-10 | A kind of chip conducting polymer aluminum capacitor solidifies fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731572A true CN107731572A (en) | 2018-02-23 |
Family
ID=61210062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710934596.6A Pending CN107731572A (en) | 2017-10-10 | 2017-10-10 | A kind of chip conducting polymer aluminum capacitor solidifies fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107731572A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109018684A (en) * | 2018-09-21 | 2018-12-18 | 南通成晟电子实业有限公司 | A kind of capacitor packing device |
| CN109249560A (en) * | 2018-10-24 | 2019-01-22 | 南京航空航天大学 | A kind of composite material grid interlayer flange molding mold and forming method |
| CN110246707A (en) * | 2018-03-06 | 2019-09-17 | 台湾染敏光电股份有限公司 | Encapsulation equipment for dye sensitization solar battery and method |
| CN113871182A (en) * | 2021-10-29 | 2021-12-31 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Coplanarity curing tool and mounting method for planar inductor |
| CN114171322A (en) * | 2020-09-11 | 2022-03-11 | 丰宾电子（深圳）有限公司 | Lamination pressing method for solid electrolyte aluminum electrolytic capacitor |
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| CN105500242A (en) * | 2016-01-22 | 2016-04-20 | 中国工程物理研究院总体工程研究所 | Pressurizing clamp for constant force application for copper sheet bonding component |
| CN104260009B (en) * | 2014-08-23 | 2016-05-11 | 华东光电集成器件研究所 | A kind of substrate binding clamping and positioning device |
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| CN101568419A (en) * | 2007-02-05 | 2009-10-28 | 东丽株式会社 | Apparatus and method for manufacturing laminate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246707A (en) * | 2018-03-06 | 2019-09-17 | 台湾染敏光电股份有限公司 | Encapsulation equipment for dye sensitization solar battery and method |
| CN110246707B (en) * | 2018-03-06 | 2021-08-20 | 台湾染敏光电股份有限公司 | Dye-sensitized solar cell packaging equipment and method |
| CN109018684A (en) * | 2018-09-21 | 2018-12-18 | 南通成晟电子实业有限公司 | A kind of capacitor packing device |
| CN109249560A (en) * | 2018-10-24 | 2019-01-22 | 南京航空航天大学 | A kind of composite material grid interlayer flange molding mold and forming method |
| CN114171322A (en) * | 2020-09-11 | 2022-03-11 | 丰宾电子（深圳）有限公司 | Lamination pressing method for solid electrolyte aluminum electrolytic capacitor |
| CN114171322B (en) * | 2020-09-11 | 2023-06-30 | 丰宾电子科技股份有限公司 | Lamination pressing method for solid electrolyte aluminum electrolytic capacitor |
| CN113871182A (en) * | 2021-10-29 | 2021-12-31 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Coplanarity curing tool and mounting method for planar inductor |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |
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| RJ01 | Rejection of invention patent application after publication |