CN107696665A - The control method and device that a kind of PCB is laminated automatically - Google Patents
The control method and device that a kind of PCB is laminated automatically Download PDFInfo
- Publication number
- CN107696665A CN107696665A CN201710983894.4A CN201710983894A CN107696665A CN 107696665 A CN107696665 A CN 107696665A CN 201710983894 A CN201710983894 A CN 201710983894A CN 107696665 A CN107696665 A CN 107696665A
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- China
- Prior art keywords
- temperature
- lamination
- point temperature
- pcb
- laminated
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Abstract
The invention discloses the control method that a kind of PCB is laminated automatically, is related to PCB production fields, comprises the following steps：The cured parameter of input layer in the controls, lamination cure parameter include heating rate, turn pressure point temperature, total head pressure value；Material is heated；Capturing material temperature data；Before material temperature reaches and turns pressure point temperature, the heating of material is controlled according to heating rate；When material temperature, which reaches, turns pressure point temperature, start boosting program and be pressurized to total head pressure value；Curing process is carried out to material.The invention also discloses the device that a kind of PCB is laminated automatically, including control system and lamination stove, warm table and laminating mechanism, warm table to be provided with temperature sensor, and temperature sensor is connected with control system signal.The lamination cure parameter of PCB material to be laminated is inputted in the controls, and subsequent control system is monitored and adjusted to each step in lamination solidification process according to the lamination cure parameter, realizes the automation of lamination solidification.
Description
Technical field
The present invention relates to PCB production fields, more particularly to the control method and device that a kind of PCB is laminated automatically.
Background technology
In PCB bonding processes, lamination procedure ensure that actual material temperature curve meets the solidifying requirements of material, wherein emphasis bag
Include heating rate, turn pressure point, total head pressure size, solidification temperature and hardening time etc..At present one is set using a kind of material
The method of kind fixed routine is made, to ensure that the processing of all the type materials meets to require, often using high requirement
Lamination procedure made, when carrying out the production of the relatively low number of plies or requirement, lamination procedure hardening time is often significantly
Beyond seeking time is wanted, the waste of efficiency and production capacity is brought.
The content of the invention
It is an object of the present invention to provide the control method that a kind of PCB is laminated automatically, according to lamination cure parameter from
The cured program in dynamic control PCB production processes middle level.
, can be according to lamination cure parameter certainly it is another object of the present invention to provide the device that a kind of PCB is laminated automatically
It is dynamic that lamination solidification is carried out to PCB.
To use following technical scheme up to this purpose, the present invention：
On the one hand, there is provided the control method that a kind of PCB is laminated automatically, comprise the following steps：
The cured parameter of input layer in the controls, it is described lamination cure parameter include heating rate, turn pressure point temperature,
Total head pressure value；
Material is heated；
Capturing material temperature data；
Before turning pressure point temperature described in reaching in material temperature, the heating of material is controlled according to the heating rate；
When material temperature reach it is described turn pressure point temperature when, start boosting program, be pressurized to the total head pressure value；
Curing process is carried out to material.
Control system is used for the collection and processing of various types of signal, and temperature and pressure are adjusted further according to the data collected
Section.Control system can be made up of programmable controller such as PLC and laminater control and execution unit.
Preferably, the step：Material is heated specially：
Material is heated by the heat transfer between warm table and material.
Preferably, the lamination cure parameter also includes solidification point temperature and hardening time, the step：Material is entered
Row curing process is specially：
When material temperature reaches the solidification point temperature, the temperature of the warm table is reduced to the solidification point temperature
Degree；
When duration is equal to the hardening time after material temperature reaches the solidification point temperature, terminate at solidification
Reason.
Preferably, in the step：When material temperature reaches the solidification point temperature, by the temperature of the warm table
It is reduced to before the solidification point temperature, it is further comprising the steps of：
When material temperature is less than 5 DEG C -20 DEG C of the solidification point temperature, the temperature of the warm table is reduced to higher than institute
State 5 DEG C -10 DEG C of solidification point temperature.
Preferably, the lamination cure parameter also includes rate of temperature fall, in the step：When material temperature reaches described
It is further comprising the steps of after terminating curing process when duration is equal to the hardening time after solidification point temperature：
Start cooling process, the cooling of material is controlled according to the rate of temperature fall.
Preferably, the lamination cure parameter also includes cooling end point temperature, in the step：Start cooling journey
Sequence, it is further comprising the steps of after the cooling that material is controlled according to the rate of temperature fall：
When material temperature reaches the cooling end point temperature, terminate cooling process.
Preferably, the lamination cure parameter also includes vacuum.
On the other hand, there is provided the device that a kind of PCB is laminated automatically, including control system and lamination stove, it is described to be laminated in stove
Provided with warm table and laminating mechanism, the warm table and the laminating mechanism are connected with the control system signal, described to add
Thermal station is provided with temperature sensor, and the temperature sensor is connected with the control system signal.
Preferably, the temperature sensor is thermocouple wire.
Preferably, also including vacuum control unit, the vacuum control unit is connected with the control system signal.
Beneficial effects of the present invention：The lamination cure parameter of PCB material to be laminated, subsequent control are inputted in the controls
System is monitored and adjusted to each step in lamination solidification process according to the lamination cure parameter, realizes lamination solidification
Automation.
Brief description of the drawings
Fig. 1 is the FB(flow block) for the control method that the PCB that the embodiment of the present invention one provides is laminated automatically；
Fig. 2 is the FB(flow block) for the control method that the PCB that the embodiment of the present invention two provides is laminated automatically.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one
As shown in figure 1, the control method that a kind of PCB is laminated automatically, comprises the following steps：
The cured parameter of S101, in the controls input layer, the lamination cure parameter include heating rate, turn pressure point
Temperature, total head pressure value.
Control system is used for the acquisition and processing of various types of signal, and temperature and pressure are adjusted further according to the data collected
Section.Control system includes programmable controller such as PLC and laminater control and execution unit.
Specifically, first input the lamination cure parameter of PCB material to be laminated in the controls, subsequent control system according to
The lamination cure parameter is monitored and adjusted to each step in lamination solidification process, realizes the automatic of lamination solidification
Change.
S102, material is heated.
Material is heated first with heater, while the laminating mechanism in laminater applies pressure to material.
Specifically, above-mentioned material is that PCB layer presses through various raw material needed for journey, such as core plate and the adjacent core plate of connection it
Between bonding sheet.
S103, capturing material temperature data.
Material temperature monitor in real time using temperature sensor such as thermocouple wire and temperature data is sent to control
System.
S104, material temperature reach it is described turn pressure point temperature before, the heating of material is controlled according to the heating rate.
Control system contrasts to material temperature and the pressure point temperature that turns in real time, and reaching described in material temperature turns pressure
Before point temperature, control system controls the heating of material according to the default heating rate, and it is above-mentioned default to ensure that heating meets
Heating rate, be controlled especially by the working condition to heater and then realize the control to material warms.
S105, when material temperature reach it is described turn pressure point temperature when, start boosting program, be pressurized to the total head pressure
Value.
When material temperature reach it is described turn pressure point temperature when, now start pressurization protocols, the laminating mechanism in laminater
The pressure of material is lifted, pressure process duration is 1.5min-3min.
S106, curing process is carried out to material.
Embodiment two
As shown in Fig. 2 the control method that a kind of PCB is laminated automatically, comprises the following steps：
The cured parameter of S201, in the controls input layer, the lamination cure parameter include heating rate, turn pressure point
Temperature, total head pressure value, solidification point temperature, hardening time, rate of temperature fall, cooling end point temperature and vacuum.
Control system is used for the collection and processing of various types of signal, and temperature and pressure are adjusted further according to the data collected
Section.Control system can be made up of programmable controller such as PLC and laminater control and execution unit.
Specifically, first input the lamination cure parameter of PCB material to be laminated in the controls, subsequent control system according to
The lamination cure parameter is monitored and adjusted to each step in lamination solidification process, realizes the automatic of lamination solidification
Change.
S202, by the heat transfer between warm table and material material is heated.
Material is placed on warm table occurs heat exchange between warm table, is monitored using temperature sensor such as thermocouple wire
Temperature data is simultaneously transferred to control system by the temperature of warm table.
Specifically, above-mentioned material is that PCB layer presses through various raw material needed for journey, such as core plate and the adjacent core plate of connection it
Between bonding sheet.
S203, capturing material temperature data.
Material temperature monitor in real time using temperature sensor such as thermocouple wire and temperature data is sent to control
System.
S204, material temperature reach it is described turn pressure point temperature before, the heating of material is controlled according to the heating rate.
Control system contrasts to material temperature and the pressure point temperature that turns in real time, and reaching described in material temperature turns pressure
Before point temperature, control system controls the heating of material according to the default heating rate, and it is above-mentioned default to ensure that heating meets
Heating rate, be controlled especially by the working condition to heater and then realize the control to material warms.
S205, when material temperature reach it is described turn pressure point temperature when, start boosting program, be pressurized to the total head pressure
Value.
When material temperature reach it is described turn pressure point temperature when, now start pressurization protocols, the laminating mechanism in laminater
The pressure of material is lifted, pressure process duration is 1.5min-3min.
After meeting preset time under the conditions of total head, according to conditions such as actual material temperature, hardening times in pressure reduction
Pressure is controlled.
S206, when material temperature is less than 5 DEG C -20 DEG C of the solidification point temperature, the temperature of the warm table is reduced to
Higher than 5 DEG C -10 DEG C of the solidification point temperature.
Specifically, accommodation is carried out according to heating rate, during 2 DEG C/min of heating rate, in material temperature less than solid
Heating platen temperature is reduced when changing 5 DEG C of temperature of point, during 3 DEG C/min of heating rate, when material temperature is less than 10 DEG C of solidification point temperature
Heating platen temperature is reduced, during 4 DEG C/min of heating rate, warm table temperature is reduced when material temperature is less than 15 DEG C of solidification point temperature
Degree, during 5 DEG C/min of heating rate, heating platen temperature is reduced when material temperature is less than 20 DEG C of solidification point temperature.
Namely the temperature of warm table is first lowered closer to solidification point temperature before material temperature reaches solidification point temperature,
The temperature difference so when material reaches solidification point temperature between warm table and material is smaller, the temperature of material will not continue to rise compared with
Big numerical value, reduce error.
S207, when material temperature reaches the solidification point temperature, the temperature of the warm table is reduced to the solidification
Point temperature.
When material temperature reaches the solidification point temperature, the temperature of the warm table is reduced to the solidification point temperature,
So that without temperature difference between warm table and material, material temperature keeps stable.
S208, when duration is equal to the hardening time after material temperature reaches the solidification point temperature, terminate
Curing process.
When material temperature is meeting hardening time at the time that the solidification point temperature is kept, terminate curing process.
S209, start cooling process, the cooling of material is controlled according to the rate of temperature fall.
Control system detects the material temperature in cooling process in real time, and finely tunes in real time, ensures material according to default drop
Warm speed is cooled, it is preferable that guarantee is reduced to than solidification temperature during low 20 DEG C of temperature from solidification temperature, material
Cooled according to default rate of temperature fall.
S210, when material temperature reach it is described cooling end point temperature when, terminate cooling process.
Further, when actual material temperature reaches tapping temperature, EP (end of program).
Vacuum is controlled in above-mentioned each step, ensures that vacuum meets preset requirement in manufacturing process；It is real
When the temperature of material temperature and warm table is acquired and analyzed.
Embodiment three
The present embodiment provides the device that a kind of PCB is laminated automatically, including control system and lamination stove, is set in the lamination stove
There are warm table and laminating mechanism, the warm table and the laminating mechanism are connected with the control system signal, the heating
Platform is provided with temperature sensor, and the temperature sensor is connected with the control system signal.
First heating rate is inputted to control system, turn pressure point temperature, total head pressure value, solidification point temperature, hardening time, drop
Warm speed and cooling end point temperature.
Specifically, material is placed on warm table and applies pressure to it using laminating mechanism, while on material
Set temperature sensor such as thermocouple wire to be used to detect the temperature of material and material temperature is passed into control system in real time.
Control system contrasts to material temperature with turning pressure point temperature in real time, material temperature reach turn pressure point temperature it
Before, control system controls the heating of material according to default heating rate, ensures that heating meets default heating rate, specific logical
Cross the control for being controlled and then realizing to the working condition of warm table to material warms.Turn pressure point temperature when material temperature reaches
When, now start pressurization protocols, the laminating mechanism being laminated in stove is lifted to the pressure of material, pressure process duration
For 1.5min-3min.
When material temperature is less than 5 DEG C -20 DEG C of solidification point temperature, the temperature of warm table is reduced to higher than solidification point temperature
5℃-10℃。
Specifically, accommodation is carried out according to heating rate, during 2 DEG C/min of heating rate, in material temperature less than solid
Heating platen temperature is reduced when changing 5 DEG C of temperature of point, during 3 DEG C/min of heating rate, when material temperature is less than 10 DEG C of solidification point temperature
Heating platen temperature is reduced, during 4 DEG C/min of heating rate, warm table temperature is reduced when material temperature is less than 15 DEG C of solidification point temperature
Degree, during 5 DEG C/min of heating rate, heating platen temperature is reduced when material temperature is less than 20 DEG C of solidification point temperature.
Namely the temperature of warm table is first lowered closer to solidification point temperature before material temperature reaches solidification point temperature,
The temperature difference so when material reaches solidification point temperature between warm table and material is smaller, the temperature of material will not continue to rise compared with
Big numerical value, reduce error.
When material temperature reaches solidification point temperature, the temperature of warm table is reduced to solidification point temperature so that warm table with
Without temperature difference between material, material temperature keeps stable.When material temperature meets admittedly in the time that the solidification point temperature is kept
When changing the time, terminate curing process.
Then start the cooling process of material, and cooled according to default rate of temperature fall.Control system detects drop in real time
Material temperature in warm program, and finely tune in real time, ensure that temperature-fall period meets default rate of temperature fall, it is preferable that ensure from solid
During change temperature is reduced to 20 DEG C lower than solidification temperature of temperature, material is cooled according to default rate of temperature fall.When
When reaching cooling point temperature, terminate cooling process；Simultaneously when material temperature reaches default tapping temperature, EP (end of program).
Specifically, the temperature sensor is thermocouple wire.Thermocouple wire detects the temperature of warm table and material in real time.
Specifically, in addition to vacuum control unit, the vacuum control unit are connected with the control system signal, are used for
Vacuum in lamination process is controlled.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating example of the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the field, may be used also on the basis of the above description
To make other changes in different forms.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (10)
1. the control method that a kind of PCB is laminated automatically, it is characterised in that comprise the following steps：
The cured parameter of input layer in the controls, the lamination cure parameter include heating rate, turn pressure point temperature, total head
Pressure value；
Material is heated；
Capturing material temperature data；
Before turning pressure point temperature described in reaching in material temperature, the heating of material is controlled according to the heating rate；
When material temperature reach it is described turn pressure point temperature when, start boosting program, be pressurized to the total head pressure value；
Curing process is carried out to material.
2. the control method that PCB according to claim 1 is laminated automatically, it is characterised in that the step：Material is carried out
Heating is specially：
Material is heated by the heat transfer between warm table and material.
3. the control method that PCB according to claim 2 is laminated automatically, it is characterised in that the lamination cure parameter is also
Including solidification point temperature and hardening time, the step：Carrying out curing process to material is specially：
When material temperature reaches the solidification point temperature, the temperature of the warm table is reduced to the solidification point temperature；
When duration is equal to the hardening time after material temperature reaches the solidification point temperature, terminate curing process.
4. the control method that PCB according to claim 3 is laminated automatically, it is characterised in that in the step：Described it will add
The temperature of thermal station is reduced to before the solidification point temperature, further comprising the steps of：
When material temperature is less than 5 DEG C -20 DEG C of the solidification point temperature, the temperature of the warm table is reduced to solid higher than described
Change 5 DEG C -10 DEG C of temperature of point.
5. the control method that PCB according to claim 3 is laminated automatically, it is characterised in that the lamination cure parameter is also
Including rate of temperature fall, in the step：Duration is equal to the solidification after material temperature reaches the solidification point temperature
It is further comprising the steps of after terminating curing process during the time：
Start cooling process, the cooling of material is controlled according to the rate of temperature fall.
6. the control method that PCB according to claim 5 is laminated automatically, it is characterised in that the lamination cure parameter is also
Including the end point temperature that cools, in the step：Start cooling process, according to the rate of temperature fall control material cooling it
Afterwards, it is further comprising the steps of：
When material temperature reaches the cooling end point temperature, terminate cooling process.
7. the control method that the PCB according to claim any one of 1-6 is laminated automatically, it is characterised in that the lamination is solid
Changing parameter also includes vacuum.
8. the device that a kind of PCB is laminated automatically, it is characterised in that require the controlling party described in any one of 1-7 for perform claim
Method, including control system and lamination stove, the lamination stove is interior to be provided with warm table and laminating mechanism, the warm table and the pressing
Mechanism is connected with the control system signal, and the warm table is provided with temperature sensor, the temperature sensor with it is described
Control system signal connects.
9. the device that PCB according to claim 8 is laminated automatically, it is characterised in that the temperature sensor is thermocouple
Line.
10. the device that PCB according to claim 8 is laminated automatically, it is characterised in that also including vacuum control unit, institute
Vacuum control unit is stated to be connected with the control system signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710983894.4A CN107696665B (en) | 2017-10-20 | 2017-10-20 | Control method and device for automatic lamination of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710983894.4A CN107696665B (en) | 2017-10-20 | 2017-10-20 | Control method and device for automatic lamination of PCB |
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| Publication Number | Publication Date |
|---|---|
| CN107696665A true CN107696665A (en) | 2018-02-16 |
| CN107696665B CN107696665B (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710983894.4A Active CN107696665B (en) | 2017-10-20 | 2017-10-20 | Control method and device for automatic lamination of PCB |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11317574A (en) * | 1998-01-19 | 1999-11-16 | Mitsui Mining & Smelting Co Ltd | Composite copper foil, manufacture thereof, copper-plated laminate and printed wiring board provided therewith |
| CN104827613A (en) * | 2015-05-13 | 2015-08-12 | 航天材料及工艺研究所 | Low-cost quick solidifying method for composite material |
| CN105346187A (en) * | 2015-11-16 | 2016-02-24 | 嘉兴市上村电子有限公司 | Copper-clad plate energy storage circulation hydraulic pressure forming device |
| CN106476405A (en) * | 2016-09-30 | 2017-03-08 | 生益电子股份有限公司 | The lamination sheeting process of PCB and PCB |
-
2017
- 2017-10-20 CN CN201710983894.4A patent/CN107696665B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11317574A (en) * | 1998-01-19 | 1999-11-16 | Mitsui Mining & Smelting Co Ltd | Composite copper foil, manufacture thereof, copper-plated laminate and printed wiring board provided therewith |
| CN104827613A (en) * | 2015-05-13 | 2015-08-12 | 航天材料及工艺研究所 | Low-cost quick solidifying method for composite material |
| CN105346187A (en) * | 2015-11-16 | 2016-02-24 | 嘉兴市上村电子有限公司 | Copper-clad plate energy storage circulation hydraulic pressure forming device |
| CN106476405A (en) * | 2016-09-30 | 2017-03-08 | 生益电子股份有限公司 | The lamination sheeting process of PCB and PCB |
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| Publication number | Publication date |
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| CN107696665B (en) | 2020-06-26 |
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