CN107683045B - Shell manufacturing method, shell and electronic equipment - Google Patents
Shell manufacturing method, shell and electronic equipment Download PDFInfo
- Publication number
- CN107683045B CN107683045B CN201711036404.6A CN201711036404A CN107683045B CN 107683045 B CN107683045 B CN 107683045B CN 201711036404 A CN201711036404 A CN 201711036404A CN 107683045 B CN107683045 B CN 107683045B
- Authority
- CN
- China
- Prior art keywords
- self
- cleaning particles
- protective layer
- housing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000004140 cleaning Methods 0.000 claims abstract description 104
- 239000011241 protective layer Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 238000013032 photocatalytic reaction Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims description 101
- 239000010410 layer Substances 0.000 claims description 25
- 239000002243 precursor Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000005498 polishing Methods 0.000 claims description 9
- 150000004703 alkoxides Chemical class 0.000 claims description 6
- 239000003086 colorant Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 4
- 238000001354 calcination Methods 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 230000007062 hydrolysis Effects 0.000 claims description 4
- 238000006460 hydrolysis reaction Methods 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims 2
- 239000002519 antifouling agent Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000005488 sandblasting Methods 0.000 claims 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 abstract description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 abstract description 3
- 239000001569 carbon dioxide Substances 0.000 abstract description 3
- 239000004519 grease Substances 0.000 abstract description 3
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005416 organic matter Substances 0.000 abstract description 2
- 239000008187 granular material Substances 0.000 abstract 3
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 229910052681 coesite Inorganic materials 0.000 description 11
- 229910052906 cristobalite Inorganic materials 0.000 description 11
- 229910052682 stishovite Inorganic materials 0.000 description 11
- 229910052905 tridymite Inorganic materials 0.000 description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000001027 hydrothermal synthesis Methods 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 230000001699 photocatalysis Effects 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000003980 solgel method Methods 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- -1 aluminum alloy Chemical compound 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910002915 BiVO4 Inorganic materials 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
- C03C17/009—Mixtures of organic and inorganic materials, e.g. ormosils and ormocers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5072—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with oxides or hydroxides not covered by C04B41/5025
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the application discloses casing manufacturing method, casing and electronic equipment, through forming the protective layer on the surface of substrate towards the electronic equipment outside, including the automatically cleaning granule in the protective layer, the automatically cleaning granule exposes in the surface of protective layer, the automatically cleaning granule takes place the photocatalytic reaction when receiving light and shine, decomposes the organic matter into carbon dioxide and water, also will be attached to the grease degradation in the fingerprint on casing surface to reach the purpose of automatic elimination fingerprint.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a shell manufacturing method, a shell and electronic equipment.
Background
At present, fingerprint prints are easily adhered to the outer surface of the shell of electronic equipment, such as mobile phones and tablet computers.
Disclosure of Invention
The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment, which can automatically clean fingerprint prints on the outer surface of the shell.
The embodiment of the application provides a shell manufacturing method, wherein the shell is applied to electronic equipment, and the shell manufacturing method comprises the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, and the second surface faces the outer side of the electronic equipment; and
and arranging a protective layer on the second surface of the substrate, wherein the protective layer comprises self-cleaning particles, the self-cleaning particles are exposed on the surface of the protective layer, and the self-cleaning particles generate a photocatalytic reaction to degrade organic matters when receiving light irradiation.
The embodiment of the application further provides a shell, which is applied to electronic equipment, the shell comprises a substrate and a protective layer, the substrate comprises a first surface and a second surface, the first surface faces towards the inner side of the electronic equipment, the second surface faces towards the outer side of the electronic equipment, the protective layer is arranged on the second surface of the substrate, the protective layer comprises self-cleaning particles, the self-cleaning particles are exposed on the surface of the protective layer, and the self-cleaning particles can perform a photocatalytic reaction to degrade organic matters when receiving light irradiation.
The embodiment of the application further provides an electronic device, which comprises a housing, the housing comprises a substrate and a protective layer, the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic device, the second surface faces the outer side of the electronic device, the protective layer is arranged on the second surface of the substrate, the protective layer comprises self-cleaning particles, the self-cleaning particles are exposed on the surface of the protective layer, and the self-cleaning particles are subjected to a photocatalytic reaction to degrade organic matters when receiving light irradiation.
According to the shell manufacturing method provided by the embodiment of the application, the protective layer is formed on the surface of the substrate facing the outer side of the electronic equipment, the protective layer comprises the self-cleaning particles, the self-cleaning particles are exposed on the surface of the protective layer, the self-cleaning particles are subjected to a photocatalytic reaction when receiving light irradiation, organic matters are decomposed into carbon dioxide and water, grease attached to the surface of the shell is degraded, and therefore the purpose of automatically eliminating fingerprints is achieved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present application.
Fig. 4 is a cross-sectional view of the first embodiment of fig. 3 in the direction a-a.
Fig. 5 is a cross-sectional view of the second embodiment of fig. 3 in the direction a-a.
Fig. 6 is a cross-sectional view of the third embodiment of fig. 3 in the direction a-a.
Fig. 7 is another schematic structural diagram of the housing according to the embodiment of the present application.
Fig. 8 is another schematic structural diagram of the rear cover according to the embodiment of the present application.
Fig. 9 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 10 is a first flowchart illustrating a method for manufacturing a rear cover according to an embodiment of the present disclosure.
Fig. 11 is a second flowchart illustrating a method for manufacturing a rear cover according to an embodiment of the present disclosure.
Fig. 12 is a third flowchart illustrating a method for manufacturing a rear cover according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment. The details will be described below separately.
In the present embodiment, a description will be made in terms of a method for manufacturing a rear cover, which may form a housing that may be provided in an electronic device, such as a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), and the like.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 1 comprises a housing 10, a display 20, a printed circuit board 30, and a battery 40.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present disclosure.
The housing 10 may include a cover plate 11, a middle frame 12, and a rear cover 13. The cover plate 11, the middle frame 12 and the rear cover 13 are combined with each other to form the housing 10. The housing 10 has a closed space formed by the cover plate 11, the middle frame 12 and the rear cover 13 to accommodate the display 20, the printed circuit board 30, the battery 40 and the like.
In some embodiments, the cover plate 11 is covered on the middle frame 12. The rear cover 13 is covered on the middle frame 12. The cover plate 11 and the rear cover 13 are located on opposite sides of the center frame 12. The cover plate 11 and the rear cover 13 are oppositely arranged. The closed space of the housing 10 is located between the cover plate 11 and the rear cover 13.
The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire.
The middle frame 12 may be a metal housing, such as an aluminum alloy middle frame 12. It should be noted that the material of the frame 12 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the middle frame 12 can be a ceramic middle frame or a glass middle frame. For another example: the middle frame 12 may be a plastic middle frame. Also for example: the middle frame 12 may be a structure in which metal and plastic are matched with each other, and the plastic part may be formed by injection molding on a metal plate.
The rear cover 13 may be a metal rear cover, such as an aluminum alloy rear cover, a stainless steel rear cover. The rear cover 13 may also be a glass rear cover or a ceramic rear cover.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present disclosure.
The rear cover 13 may include an inner surface 131 and an outer surface 132 disposed opposite one another. The inner surface 131 of the rear cover 13 is adjacent to the center frame 12 and the cover plate 11, and constitutes a part of the inner surface of the housing 10. The outer surface 132 of the rear cover 13 is separated from the center frame 12 and the cover plate 11, and constitutes a part of the outer surface of the housing 10. The rear cover 13 may further include a through hole 133, and the through hole 133 may be used to mount a camera.
Referring to fig. 4, fig. 4 is a cross-sectional view taken along a-a direction of fig. 3.
For convenience of explanation, the case will be described below by taking the rear cover 13 as an example.
The rear cover 13 may include a substrate 134 and a protective layer 135. The protection layer 135 is disposed on a surface of the rear cover 13 away from the cover plate 11.
The base material 134 may be made of aluminum, such as aluminum alloy, stainless steel, glass, ceramic, or the like.
The substrate 134 includes a first surface 1341 and a second surface 1342. The first surface 1341 faces the inside of the electronic device, and the second surface 1342 faces the outside of the electronic device. In one embodiment, the first surface 1341 is disposed toward the cover plate 11 and the center frame 12. The first surface 1341 may be the inner surface 131 of the rear cover 13. The first surface 1341 is an inner surface of the housing 11. The second surface 1342 is disposed facing away from the cover plate 11 and the middle frame 12. The second surface 1342 is an outer surface of the housing 11.
The protection layer 135 is disposed on the second surface 1342 of the substrate 134. Self-cleaning particles 136 are included in the protective layer 135, the self-cleaning particles 136 being exposed to the surface of the protective layer 135. The self-cleaning particles 136 undergo a photocatalytic reaction to degrade organic matter when receiving light.
The protective layer 136 may be made of transparent paint.
In one embodiment, to enable the protective layer 135 to be more firmly attached to the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished to increase the flatness of the surface of the second surface 1342 of the substrate 134, so as to increase the adhesion of the protective layer 135 to the second surface 1342 of the substrate 134, and further enable the protective layer 135 to be firmly attached to the second surface 1342 of the substrate 134.
The self-cleaning particles 136 may be TiO2、SiO2、ZnO、CdS、WO3、Fe2O3And the like. The self-cleaning particles 136 may also be TiO doped with metal ions2、SiO2、ZnO、CdS、WO3、Fe2O3And the like. The metal ions used for doping may be silver ions, copper ions, or the like.
The self-cleaning particles 136 may be formed by Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), sol-gel method, or hydrothermal method.
In one embodiment, when the self-cleaning particles 136 are formed by chemical vapor deposition, TiCl may be used4And O2By controlling the temperature and pressure, TiO is formed2Nanoparticles, i.e. forming the self-cleaning particles 136.
In one embodiment, when the self-cleaning particles 136 are formed by a sol-gel method, a precursor sol may be prepared, a gel with a certain spatial structure may be generated by controlling PH, additives, temperature, and the like, and the self-cleaning particles 136 may be formed by drying and calcining the gel.
In one embodiment, metal alkoxide is used as raw material, solvent, water, catalyst, etc. are added, and hydrolysis and polymerization are performed to obtain precursor sol. The metal alkoxide may be Ti (OC)2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4And the like.
In one embodiment, when the passivation layer 135 is formed by a hydrothermal method, a precursor solution is prepared, and the self-cleaning particles 136 are formed by controlling the temperature and pressure to generate nanoparticles.
It is noted that referring to fig. 5-6, in some embodiments, protective layer 135 includes at least two colored regions 1351/1352, each colored region 1351/1352 having a different color, and colored regions 1351/1352 having different colors that employ self-cleaning particles 1361/1362.
For example, the protective layer 135 includes a first colored region 1351 and a second colored region 1352. The first colored region 1351 can employ a first self-cleaning particle 1361. The first self-cleaning particles 1361 may be white. The first self-cleaning particle 1361 may be made of TiO2ZnO, etc. The second colored region 1352 can employ a second self-cleaning particle 1362. The second self-cleaning particles 1362 may be yellow. The second self-cleaning particles 1362 can adopt CdS and BiVO4And the like. As another example, the protective layer 135 can also include a third colored region 1353. The third colored region 1353 employs third self-cleaning particles 1363. The third self-cleaning particles 1363 may be reddish brown in color. The third self-cleaning particles 1363 may be Fe2O3。
In one embodiment, the thickness of the protective layer 135 is greater than 10 microns. When the thickness of the protection layer 135 is less than 10 μm, the protection layer 135 has a small thickness and a high light transmittance, and is easily interfered by the color of the substrate 134, so that the self-cleaning particles 136 of the protection layer 135 are not well utilized, and meanwhile, the protection layer 135 is easily penetrated in the polishing process due to the small thickness of the protection layer 135, which is not beneficial to forming the protection layer 135. In one embodiment, the thickness of the protective layer 135 may be greater than 100 microns.
In one embodiment, the diameter of the self-cleaning particles 136 is less than 500 nanometers, so that the self-cleaning particles 136 have good photocatalytic properties, while the user does not feel the self-cleaning particles 136 on their surface when touching the housing. In one embodiment, the diameter of the self-cleaning particles 136 may be 50 nanometers to 100 nanometers. When the diameter of the self-cleaning particles 136 is smaller than 50nm, the manufacturing cost is high and the manufacturing process is complicated due to the small diameter of the self-cleaning particles 136; when the diameter of the self-cleaning particles 136 is larger than 100nm, the self-cleaning particles 136 are less photocatalytic due to the larger diameter of the self-cleaning particles 136.
For example, please refer to fig. 7, and fig. 7 is another schematic structural diagram of the housing according to the embodiment of the present application.
The housing 10a includes a cover plate 16 and a rear cover 17. In some embodiments, the cover plate 16 is directly attached to the rear cover 17. The cover plate 16 and the rear cover 17 are combined with each other to form the housing 10 a. The housing 10a has a closed space formed by the cover plate 16 and the rear cover 17 to accommodate the display 20, the printed circuit board 30, the battery 40, and the like.
Compared with the housing 10 shown in fig. 2, the housing 10a of fig. 7 does not include the middle frame, or the middle frame 12 and the rear cover 13 of fig. 2 are integrally formed to form a rear cover 17.
Specifically, please refer to fig. 8, fig. 8 is another schematic structural diagram of the rear cover according to the embodiment of the present application.
In some embodiments, the rear cover 17 includes an inner surface 171 and an outer surface 172, with the inner surface 171 and the outer surface 172 being oppositely disposed to form the entire surface of the rear cover 17. The various layer structures of the back cover 17 can be referred to the back cover 13, and are not described in detail here.
The printed circuit board 30 is installed in the housing 10, the printed circuit board 30 may be a main board of the electronic device 1, and functional components such as an antenna, a motor, a microphone, a camera, a light sensor, a receiver, and a processor may be integrated on the printed circuit board 30. In some embodiments, the printed circuit board 30 is fixed within the housing 10. Specifically, the printed circuit board 30 may be screwed to the middle frame 12 by screws, or may be snapped to the middle frame 12 by a snap-fit manner. It should be noted that the way of fixing the printed circuit board 30 to the middle frame 12 is not limited to this, and other ways, such as a way of fixing by a snap and a screw, may also be used.
The battery 40 is mounted in the housing 10, and the battery 40 is electrically connected to the printed circuit board 30 to supply power to the electronic apparatus 1. The case 10 may serve as a battery cover of the battery 40. The case 10 covers the battery 40 to protect the battery 40, and particularly, the rear cover 13 covers the battery 40 to protect the battery 40, reducing damage to the battery 40 due to a collision, a fall, or the like of the electronic apparatus 1.
The display screen 20 is mounted in the housing 10, and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1. The display screen 20 includes a display area 14 and a non-display area 15. The display area 14 may be used to display a screen of the electronic device 1 or provide a user with touch control. The top area of the non-display area 15 is provided with an opening for sound and light conduction, and the bottom of the non-display area 15 can be provided with functional components such as a fingerprint module, a touch key and the like. The cover plate 11 is mounted on the display screen 20 to cover the display screen 20, and forms the same display area and non-display area as the display screen 20, which can be referred to specifically as the display area and the non-display area of the display screen 20.
It should be noted that the structure of the display screen 20 is not limited to this. For example, the display screen may be a full-screen or an opposite-type screen, specifically, please refer to fig. 9, and fig. 9 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device in fig. 9 differs from the electronic device in fig. 1 in that: the non-display area 15a is directly formed on the display screen 20a, for example, the non-display area 15a of the display screen 20a is provided with a transparent structure so that an optical signal can pass through, or the non-display area of the display screen 20a is directly provided with an opening or a notch for light conduction, and the like, and the front camera, the photoelectric sensor, and the like can be arranged at the position of the non-display area so that the front camera can take a picture and the photoelectric sensor can detect. The display area 14a covers the entire surface of the electronic apparatus 1 a. It should be noted that the components of the housing 10, the printed circuit board 30, the battery 40, and the like in the electronic device 1a can refer to the above contents, and are not described herein again.
The invention also provides a manufacturing method of the shell.
The following description will be given taking the rear cover as an example, but the method for manufacturing the case according to the embodiment of the present application is not limited to the rear cover.
Referring to fig. 10, fig. 10 is a schematic flow chart illustrating a method for manufacturing a rear cover according to an embodiment of the present disclosure. The manufacturing method of the shell comprises the following steps:
step S101, providing a substrate 134, wherein the substrate 134 includes a first surface 1341 and a second surface 1342, the first surface 1341 faces the inside of the electronic device, and the second surface 1342 faces the outside of the electronic device.
The substrate 134 may be a metal material, such as aluminum, and further, such as aluminum alloy. The base material 134 may be obtained as it is or by processing a plate material, for example, by forging or aging an aluminum alloy plate material. The substrate 134 may also be glass, ceramic, or the like.
The first surface 1341 is disposed toward the cover plate 11 and the middle frame 12. The first surface 1341 may be the inner surface 131 of the rear cover 13. The first surface 1341 is an inner surface of the housing 11. The second surface 1342 is disposed facing away from the cover plate 11 and the middle frame 12. The second surface 1342 is an outer surface of the housing 11.
In step S102, a protective layer 135 is disposed on the second surface 1342 of the substrate 134, the protective layer 135 includes self-cleaning particles 136, the self-cleaning particles 136 are exposed on the surface of the protective layer 135, and the self-cleaning particles 135 undergo a photocatalytic reaction to degrade organic matters when receiving light.
In one embodiment, referring to fig. 11, the step S102 may include:
step S1021: polishing a second surface 1342 of the substrate 134; and
step S1022: a protective layer 135 is disposed on the second surface 1342 of the polished substrate 134, the protective layer 135 includes self-cleaning particles 136, the self-cleaning particles 136 are exposed on the surface of the protective layer 135, and the self-cleaning particles 135 undergo a photocatalytic reaction to degrade organic substances when receiving light.
In order to make the protection layer 135 more firmly attached to the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished to increase the flatness of the surface of the second surface 1342 of the substrate 134, so as to increase the adhesion of the protection layer 135 to the second surface 1342 of the substrate 134, and further make the protection layer 135 firmly attached to the second surface 1342 of the substrate 134.
In some embodiments, the second surface 1342 of the substrate 134 can be polished mechanically, chemically, electrochemically, ultrasonically, or the like. Such that the roughness of the second surface 1342 of the substrate 134 is reduced to obtain a bright, flat surface of the second surface 1342 of the substrate 134. The chemical polishing process is to regularly dissolve the second surface 1342 of the substrate 134 to achieve a smooth and flat surface. The electrochemical polishing method is to immerse the second surface 1342 of the substrate 134 as an anode and the insoluble metal as a cathode into an electrolytic bath simultaneously, and generate a selective anode solution by direct current, thereby increasing the brightness of the second surface 1342 of the substrate 134. Wherein the mechanical polishing is performed by cutting the second surface 1342 of the substrate 134 so that the second surface 1342 of the substrate 134 is plastically deformed to remove the polished protrusions and obtain a smooth surface. Wherein the substrate 134 is placed in the abrasive suspension and placed together in the ultrasonic field, and the second surface 1342 of the substrate 134 is polished by the ultrasonic oscillation.
In some embodiments, before polishing the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished, and then the polished second surface 1342 of the substrate 134 may be polished, so that the polishing effect is better, and the second surface 1342 of the substrate 134 is smoother. Here, it should be noted that the grinding process may be understood as a rough process before the polishing process. Namely, the outer surface of the rear cover can be subjected to rough grinding and then fine grinding to finish polishing treatment.
The protective layer 136 may be made of transparent paint.
The self-cleaning particles 136 may be TiO2、SiO2、ZnO、CdS、WO3、Fe2O3And the like. The self-cleaning particles 136 may also be TiO doped with metal ions2、SiO2、ZnO、CdS、WO3、Fe2O3And the like. The metal ions used for doping may be silver ions, copper ions, or the like.
The self-cleaning particles 136 may be formed by Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), sol-gel method, or hydrothermal method.
In one embodiment, when the self-cleaning particles 136 are formed by chemical vapor deposition, TiCl may be used4And O2By controlling the temperature and pressure, TiO is formed2Nanoparticles, i.e. forming the self-cleaning particles 136.
In one embodiment, when the self-cleaning particles 136 are formed by a sol-gel method, a precursor sol may be prepared, a gel with a certain spatial structure may be generated by controlling PH, additives, temperature, and the like, and the self-cleaning particles 136 may be formed by drying and calcining the gel.
In one embodiment, metal alkoxide is used as raw material, solvent, water, catalyst, etc. are added, and hydrolysis and polymerization are performed to obtain precursor sol. The metal alkoxide may be Ti (OC)2H5)4、Ti(OC3H7 i)4、Ti(OC4H9 n)4And the like.
In one embodiment, when the passivation layer 135 is formed by a hydrothermal method, a precursor solution is prepared, and the self-cleaning particles 136 are formed by controlling the temperature and pressure to generate nanoparticles.
It is noted that in some embodiments, the protective layer 135 includes at least two colored regions 1351/1352, each colored region 1351/1352 having a different color, and colored regions 1351/1352 having different colors employ self-cleaning particles 1361/1362.
For example, the protective layer 135 includes a first colored region 1351 and a second colored region 1352. The first colored region 1351 can employ a first self-cleaning particle 1361. The first self-cleaning particles 1361 may be white. The first self-cleaning particle 1361 may be made of TiO2ZnO, etc. The second colored region 1352 can employ a second self-cleaning particle 1362. The second self-cleaning particles 1362 may be yellow. The second self-cleaning particles 1362 can adopt CdS and BiVO4And the like. As another example, the protective layer 135 can also include a third colored region 1353. The third colored region 1353 employs third self-cleaning particles 1363. The third self-cleaning particles 1363 may be reddish brown in color. The third self-cleaning particles 1363 may be Fe2O3。
In one embodiment, referring to fig. 12, the method may further include:
step 103: the self-cleaning particles 136 are uniformly mixed in the protective lacquer to form a precursor.
The step S102 further includes:
step S102 a: applying the precursor to a second surface 1342 of the substrate 134;
step S102 b: drying the precursor on the second surface 1342 of the substrate 134 to obtain a front layer;
step S102 c: the pre-layer is sandblasted to expose self-cleaning particles 136 to form a protective layer 135, and the self-cleaning particles 136 undergo a photocatalytic reaction to degrade organic substances when receiving light irradiation.
In an embodiment, the step 101 may be performed before the step S103, after the step S103, or simultaneously with the step S103. Step S101 and step S103 are both located before step S102.
In one embodiment, the abrasive used in the grit blasting has a hardness greater than the hardness of the front layer and less than the hardness of the self-cleaning particles 136.
In one embodiment, the thickness of the protective layer 135 is greater than 10 microns. When the thickness of the protection layer 135 is less than 10 μm, the protection layer 135 has a small thickness and a high light transmittance, and is easily interfered by the color of the substrate 134, so that the self-cleaning particles 136 of the protection layer 135 are not well utilized, and meanwhile, the protection layer 135 is easily penetrated in the polishing process due to the small thickness of the protection layer 135, which is not beneficial to forming the protection layer 135. In one embodiment, the thickness of the protective layer 135 may be greater than 100 microns.
In one embodiment, the diameter of the self-cleaning particles 136 is less than 500 nanometers, so that the self-cleaning particles 136 have good photocatalytic properties, while the user does not feel the self-cleaning particles 136 on their surface when touching the housing. In one embodiment, the diameter of the self-cleaning particles 136 may be 50 nanometers to 100 nanometers. When the diameter of the self-cleaning particles 136 is smaller than 50nm, the manufacturing cost is high and the manufacturing process is complicated due to the small diameter of the self-cleaning particles 136; when the diameter of the self-cleaning particles 136 is larger than 100nm, the self-cleaning particles 136 are less photocatalytic due to the larger diameter of the self-cleaning particles 136.
In summary, the method for manufacturing the shell provided by the embodiment of the application forms the protective layer on the surface of the substrate facing the outer side of the electronic device, the protective layer comprises the self-cleaning particles, the self-cleaning particles are exposed on the surface of the protective layer, the self-cleaning particles generate a photocatalytic reaction when receiving light irradiation, organic matters are decomposed into carbon dioxide and water, and grease attached to the surface of the shell in the fingerprint is degraded, so that the purpose of automatically eliminating the fingerprint is achieved.
Those skilled in the art will appreciate that the structure of the electronic device 1 shown in fig. 1 does not constitute a limitation of the electronic device 1. The electronic device 1 may comprise more or fewer components than shown, or some components may be combined, or a different arrangement of components. The electronic device 1 may further include a memory, a bluetooth module, etc., which will not be described herein.
The above detailed description is provided for the housing manufacturing method, the housing and the electronic device provided in the embodiments of the present application, and the principle and the implementation of the present application are described in this document by applying specific examples, and the description of the above embodiments is only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (9)
1. A shell manufacturing method is applied to electronic equipment, and is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, and the second surface faces the outer side of the electronic equipment;
polishing the second surface of the base material, and then polishing the polished second surface of the base material;
and
arranging a protective layer on the second surface of the base material after polishing treatment, wherein the protective layer comprises self-cleaning particles, and the self-cleaning particles are prepared by the following steps:
metal alkoxide is adopted as a raw material, a solvent, water and a catalyst are added, and precursor sol is obtained through hydrolysis and polymerization reaction;
controlling the pH value, the additive and the temperature of the precursor sol to generate gel with a certain spatial structure;
drying and calcining the gel to form the self-cleaning particles;
uniformly mixing the self-cleaning particles in a protective paint to form a precursor, coating the precursor on the second surface of the base material, drying the precursor on the second surface of the base material to obtain a front layer, and performing sand blasting treatment on the front layer, wherein the self-cleaning particles are exposed on the surface of the protective layer, and when receiving light irradiation, the self-cleaning particles generate a photocatalytic reaction to degrade organic matters;
wherein the protective layer comprises at least two colored regions, each colored region has a different color, and colored regions of different colors employ the self-cleaning particles having different colors.
2. A method of making a housing as claimed in claim 1, wherein: the protective layer has a thickness greater than 10 microns.
3. A method of making a housing as claimed in claim 1, wherein: the diameter of the self-cleaning particles is less than 500 nanometers.
4. A method of making a housing as claimed in claim 1, wherein: the diameter of the self-cleaning particles is 50nm to 100 nm.
5. A shell is applied to electronic equipment, and is characterized in that: the shell comprises a substrate and a protective layer, the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, the second surface faces the outer side of the electronic equipment, the protective layer is arranged on the second surface of the substrate, self-cleaning particles are contained in the protective layer, and the self-cleaning particles are prepared through the following steps:
metal alkoxide is adopted as a raw material, a solvent, water and a catalyst are added, and precursor sol is obtained through hydrolysis and polymerization reaction;
controlling the pH value, the additive and the temperature of the precursor sol to generate gel with a certain spatial structure;
drying and calcining the gel to form the self-cleaning particles;
the self-cleaning particles are exposed on the surface of the protective layer, and when the self-cleaning particles receive light irradiation, a photocatalytic reaction is carried out to degrade organic matters;
wherein the protective layer comprises at least two colored regions, each colored region has a different color, and colored regions of different colors employ the self-cleaning particles having different colors.
6. The housing of claim 5, wherein: the protective layer has a thickness greater than 10 microns.
7. The housing of claim 5, wherein: the diameter of the self-cleaning particles is less than 500 nanometers.
8. The housing of claim 5, wherein: the diameter of the self-cleaning particles is 50nm to 100 nm.
9. An electronic device characterized by comprising a housing as claimed in any one of claims 5 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036404.6A CN107683045B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711036404.6A CN107683045B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107683045A CN107683045A (en) | 2018-02-09 |
| CN107683045B true CN107683045B (en) | 2020-08-04 |
Family
ID=61141903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711036404.6A Expired - Fee Related CN107683045B (en) | 2017-10-30 | 2017-10-30 | Shell manufacturing method, shell and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107683045B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11667585B2 (en) | 2018-09-19 | 2023-06-06 | Apple, Inc. | Ceramic substrate with glass fill for decoration and housing materials |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171966C (en) * | 1996-05-31 | 2004-10-20 | 东陶机器株式会社 | Antifouling member and coating composition |
| CN1900360A (en) * | 2006-07-14 | 2007-01-24 | 西南大学 | Process for preparing magnesium alloy surface function gradient film |
| CN1900361A (en) * | 2006-07-14 | 2007-01-24 | 西南大学 | Process for preparing neodymium-iron-boron permanent magnetic material surface gradient function coating layer |
| CN202535652U (en) * | 2012-02-11 | 2012-11-14 | 倪俊 | Electronic digital product having function of preventing fingerprint and grease |
| CN105609003A (en) * | 2014-11-13 | 2016-05-25 | 三星电子株式会社 | Display apparatus and method of manufacturing the same |
| CN205829770U (en) * | 2016-08-01 | 2016-12-21 | 广州市荟普新材料有限公司 | A kind of wear-resisting antifouling mobile phone shell |
| CN206100780U (en) * | 2016-10-21 | 2017-04-12 | 东莞市艾利精密五金有限公司 | Antifouling cell -phone shell with heat dissipation function |
-
2017
- 2017-10-30 CN CN201711036404.6A patent/CN107683045B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171966C (en) * | 1996-05-31 | 2004-10-20 | 东陶机器株式会社 | Antifouling member and coating composition |
| CN1900360A (en) * | 2006-07-14 | 2007-01-24 | 西南大学 | Process for preparing magnesium alloy surface function gradient film |
| CN1900361A (en) * | 2006-07-14 | 2007-01-24 | 西南大学 | Process for preparing neodymium-iron-boron permanent magnetic material surface gradient function coating layer |
| CN202535652U (en) * | 2012-02-11 | 2012-11-14 | 倪俊 | Electronic digital product having function of preventing fingerprint and grease |
| CN105609003A (en) * | 2014-11-13 | 2016-05-25 | 三星电子株式会社 | Display apparatus and method of manufacturing the same |
| CN205829770U (en) * | 2016-08-01 | 2016-12-21 | 广州市荟普新材料有限公司 | A kind of wear-resisting antifouling mobile phone shell |
| CN206100780U (en) * | 2016-10-21 | 2017-04-12 | 东莞市艾利精密五金有限公司 | Antifouling cell -phone shell with heat dissipation function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107683045A (en) | 2018-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107911964B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107683047B (en) | Shell manufacturing method, shell substrate, shell and electronic equipment | |
| CN205375505U (en) | Fingerprint sensor module | |
| CN107864581B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107645866B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107734891B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107683045B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107716253B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107896447B (en) | Shell manufacturing method, shell and electronic equipment | |
| WO2019062321A1 (en) | Housing manufacturing method, housing and electronic device | |
| US20160344090A1 (en) | Housing, electronic device employing same and manufacture method | |
| CN107708355B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107708362B (en) | Shell manufacturing method, shell and electronic equipment | |
| WO2013107065A1 (en) | Circuit substrate structure and manufacturing method thereof | |
| CN107734884B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107708352B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107889388B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107744932B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107670925B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107708356B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107734885B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN107708363B (en) | Shell manufacturing method, shell and electronic equipment | |
| CN114302604B (en) | Cover plate, preparation method thereof and electronic equipment | |
| US11268188B2 (en) | Aluminum physical vapor deposition for the cosmetic finishing of recycled aluminum alloys | |
| CN107683037B (en) | Shell manufacturing method, shell and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200804 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |