CN107677340A - High-frequency model, radar levelmeter and its manufacture method for level gauging - Google Patents
High-frequency model, radar levelmeter and its manufacture method for level gauging Download PDFInfo
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- CN107677340A CN107677340A CN201711088530.6A CN201711088530A CN107677340A CN 107677340 A CN107677340 A CN 107677340A CN 201711088530 A CN201711088530 A CN 201711088530A CN 107677340 A CN107677340 A CN 107677340A
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- 229910052751 metal Inorganic materials 0.000 claims description 18
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- 229920003023 plastic Polymers 0.000 claims description 9
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- 238000009434 installation Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
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- 238000007789 sealing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
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- 238000000354 decomposition reaction Methods 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/284—Electromagnetic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S13/06—Systems determining position data of a target
- G01S13/08—Systems for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- Radar Systems Or Details Thereof (AREA)
Abstract
The invention provides a kind of high-frequency model, radar levelmeter and its manufacture method for level gauging.High-frequency model includes：Emitter, guide wave device and pcb board, wherein, emitter includes：Radiating element and non-conductive lid, the radiating element and non-conductive lid are arranged on the homonymy of pcb board, and non-conductive lid limits to form radial chamber with pcb board, so that radiating element is placed within the radial chamber, wherein, guide wave device is arranged on the homonymy of pcb board with emitter, and form guided wave path corresponding with radiating element, the cap portion of non-conductive lid covering radiating element connects with the root edge of the part of the formation guided wave path of guide wave device, and the height of cap portion is set such that the radiating surface of the radiating element is less than the wavelength that radiating element launches electromagnetic wave to the distance between the starting point of guided wave path.The high-frequency model is sealed by non-conductive module lid to radiating element, and unnecessary reflection caused by seal will not occur.
Description
Technical field
The present invention relates to level gauging technology, in particular to a kind of high-frequency model for level gauging and application
The radar levelmeter of the high-frequency model, and the processing method to them.
Background technology
Radar levelmeter is a kind of time interval by between instrumentation radar transmission signal and reflected signal reception to survey
Level meter signal launch point is measured to the measuring instrument of the distance between measured object shots.
For the radar levelmeter with waveguide, generally by radar levelmeter high-frequency model signal generation apparatus
Electromagnetic signal is produced, then is outwards launched by the radiating element of the high-frequency model, the transmission signal is then by waveguide transmission.
Consider for explosion-proof security reason, it is necessary to prevent volatile material or admixture of gas from holding tested material
Container inside enter the inside of radar levelmeter.
For example, Chinese invention patent application discloses CN104428943A and Chinese invention patent application discloses
CN104428944A discloses a kind of waveguide coupling input unit, high-frequency model, fill level radar and application with seal,
By setting the seal come high-frequency model in a gas tight manner relative to being environmentally isolated in the initiation region of waveguide.And this
The special scheme for setting seal of kind needs waveguide initiation region, the transitional region for leading to waveguide main region and waveguide main region
Mutual size relationship (the mutual magnitude relationship of internal diameter) between domain coordinates, it is also necessary to auxiliary in the inside and outside setting web of waveguide etc.
Part is helped, complicated and seal deviation position, which also results in, loses sealing effectiveness or plant failure, in addition, seal
Also unnecessary reflection can be produced with the junction of waveguide for the signal that radiating element is launched.
The content of the invention
The invention provides a kind of new high-frequency model for level gauging, it is by non-conductive module lid to radiation element
Part is sealed, and unnecessary reflection caused by seal will not occur, and structure is simpler, and manufacturing procedure is simplified,
Cost is also minimized.
According to an aspect of the present invention, there is provided a kind of high-frequency model for level gauging, it includes：Emitter,
Guide wave device and pcb board, wherein, the emitter includes：Radiating element and non-conductive lid, the radiating element and non-conductive
Lid is arranged on the homonymy of pcb board, and the non-conductive lid limits to form radial chamber with the pcb board so that the spoke
Element is penetrated to be placed within the radial chamber, wherein, the guide wave device is arranged on the homonymy of the pcb board with the emitter,
And guided wave path corresponding with the radiating element is formed, the non-conductive lid covers the cap portion of the radiating element
Connect with the root edge of the part of the formation guided wave path of the guide wave device, and the height of the cap portion is set and made
Obtain the radiating surface of the radiating element and launch electromagnetism less than the radiating element to the distance between the starting point of the guided wave path
The wavelength of ripple.
High-frequency model according to embodiments of the present invention, for example, the non-conductive lid covers the lid of the radiating element
Partial height is launched the half of the wavelength of electromagnetic wave by the radiating element.
High-frequency model according to embodiments of the present invention, for example, the non-conductive lid described in PTFE plastics or PP plastic productions
The cap portion of the radiating element is covered, the height of the cap portion is 1.34mm.
High-frequency model according to embodiments of the present invention, for example, the non-conductive lid covers the lid of the radiating element
The tube wall root edge that part forms guided wave path with the guide wave device connects.
High-frequency model according to embodiments of the present invention, for example, the guided wave path is cylindrical cavity or has reducing cavity
Structure.
High-frequency model according to embodiments of the present invention, for example, the guide wave device formed the part of the guided wave path by
Metal material is made.
High-frequency model according to embodiments of the present invention, for example, the radiating element is arranged on the insulating barrier of the pcb board
On, the non-conductive lid is arranged on the pcb board.
High-frequency model according to embodiments of the present invention, for example, the high-frequency model also includes radar signal R-T unit, should
Radar signal R-T unit includes one or more chips, and is electrically connected with the radiating element of the emitter, the chip bag
Include the microwave chip for producing the electromagnetic wave launched by the radiating element or the function with as.
High-frequency model according to embodiments of the present invention, for example, coating metal layer is applied on the surface of the insulating barrier of the pcb board,
Then wiring is formed on the metal layer, and the radar signal R-T unit is electrically connected with the radiating element.
High-frequency model according to embodiments of the present invention, for example, will be believed electromagnetic wave as caused by the chip by microstrip line
Number it is transferred to the radiating element.
High-frequency model according to embodiments of the present invention, for example, the chip and the microstrip line are set with the radiating element
The homonymy in the pcb board is put, and the chip or the chip and the microstrip line are arranged at absorbing material and limited
In fixed space.
High-frequency model according to embodiments of the present invention, limited for example, the absorbing material is arranged on the non-conductive lid
Space in.
High-frequency model according to embodiments of the present invention, for example, the radiating element is the laminar device with compared with small area
Part.
High-frequency model according to embodiments of the present invention, for example, the high-frequency model is applied to 75-120GHz radar thing position
Measurement application.
According to another aspect of the present invention, there is provided a kind of radar levelmeter, it includes foregoing high-frequency model.
According to another aspect of the invention, there is provided a kind of manufacture method of radar levelmeter, it includes：In pcb board
Partial metal layers are formed on insulating barrier；Radiating element is installed on the insulating barrier；On the insulating barrier and the radiation
Element identical side is installed by radar signal R-T unit and non-conductive lid；Installation guide wave device is aligned in the same side；By height
Frequency module is installed on the casing part of radar levelmeter gauge outfit；Into the space limited by radar levelmeter gauge outfit shell part
Filling with sealant.
In accordance with a further aspect of the present invention, there is provided a kind of radar levelmeter manufactured by preceding method.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, the accompanying drawing of embodiment will be simply situated between below
Continue, it should be apparent that, drawings in the following description merely relate to some embodiments of the present invention, rather than limitation of the present invention.
Fig. 1 is the decomposition view of the high-frequency model according to an embodiment of the invention for radar levelmeter；
Fig. 2A is the three-dimensional view after the high-frequency model assembling shown in Fig. 1；
Fig. 2 B are the three-dimensional views of another angle after the high-frequency model assembling shown in Fig. 1；
Fig. 3 A are the partial sectional views after the high-frequency model assembling shown in Fig. 1；
Fig. 3 B are the fragmentary side cross-sectional views after the high-frequency model assembling shown in Fig. 1；
Fig. 4 A schematically show the partial sectional view of the radar levelmeter with the high-frequency model shown in Fig. 1；
Fig. 4 B schematically show the fragmentary side cross-sectional view of the radar levelmeter with the high-frequency model shown in Fig. 1；
Fig. 5 A and Fig. 5 B schematically show the positive partial cutaway of high-frequency model in accordance with another embodiment of the present invention
View and side partial sectional view；
Fig. 6 A and Fig. 6 B schematically show the positive partial cutaway of the high-frequency model according to another embodiment of the invention
View and side partial sectional view.
Reference text
100 emitters
101 radiating elements
102 non-conductive lids
103 radial chambers
200 guide wave devices
201 guided wave paths
300 pcb boards
301 insulating barriers
302 metal levels
303 substrates
400 radar signal R-T units
401 chips
402 microstrip lines
403 absorbing materials
501 screws
502 adhesive tapes
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright part of the embodiment, rather than whole embodiments.Based on described embodiments of the invention, ordinary skill
The every other embodiment that personnel are obtained on the premise of without creative work, belongs to the scope of protection of the invention.
Unless otherwise defined, technical term or scientific terminology used herein should be in art of the present invention and had
The ordinary meaning that the personage of general technical ability is understood.Used in present patent application specification and claims " the
One ", " second " and similar word are not offered as any order, quantity or importance, and are used only to distinguish different
Part.Equally, the similar word such as "one" or " one " also not necessarily represents quantity limitation." comprising " or "comprising" etc.
Similar word means to occur element before the word or object cover the element for appearing in the word presented hereinafter or object and
It is equivalent, and is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or the connection of machinery, but electrical connection can be included, it is either directly or indirect." on ", " under ", " left side ",
" right side " etc. is only used for representing relative position relation, after the absolute position for being described object changes, then the relative position relation
May correspondingly it change.
Fig. 1 is the decomposition view of the high-frequency model according to an embodiment of the invention for radar levelmeter.Such as Fig. 1 institutes
Showing, emitter 100 includes radiating element 101 and non-conductive lid 102, and in radiating element 101 and non-conductive lid 102
Between the radial chamber 103 that is formed.Wherein, radiating element 101 and non-conductive lid 102 are set in the homonymy of pcb board 300, specifically
For, radiating element 101 is arranged on the insulating barrier of pcb board (printed circuit board (PCB)) 300, and non-conductive lid 102 is also installed on this
On pcb board, and form radial chamber 103 so that radiating element 101 is placed within the radial chamber 103.Can be for example, by double faced adhesive tape
Non-conductive lid 102 is pasted onto on pcb board 300.
Guide wave device 200 is arranged on the homonymy of pcb board 300 with emitter 100, and is formed and radiating element 101
Guided wave path 201 corresponding to position and area, the guided wave path can be cylindrical cavities, as being launched by radiating element 101
Electromagnetic signal transmission passage.Alternatively, the cylindrical cavity is cylindrical cavity (as fig. 5 a and fig. 5b).The guided wave
Path 201 can also have reducing cavity body structure (as shown in Figure 6 A and 6 B).In general, guide wave device 200, at least leads
Wave apparatus 200 forms the part of guided wave path 201, is made up of metal material, and it can play shielding action to electromagnetic wave, thus
Guiding is output to outside guide wave device 200 from the electromagnetic wave that radiating element 101 is sent by guided wave path 201.Guide wave device 200
Outside side can also connect outside waveguide pipe or antenna etc..
In Fig. 1, non-conductive lid 102 includes two parts, and area is smaller, highly relatively low and with semi-circular top portion
Points 1021 corresponding with radiating element 101, for covering radiating element 101；The area of another part 1022 and height more greatly and have
There is rectangular shape to be used to cover other circuit parts on pcb board 300.Non-conductive lid 102 is led using the non-of such as plastics
Electric material is made, and itself can not produce shielding action to electromagnetic signal, mainly play the electricity to including radiating element 101
The sealing function of road part, prevent volatile material or admixture of gas from entering thunder inside the container for holding tested material
Up to the circuit part of level meter.
The above-mentioned two part 1021 and 1022 of non-conductive lid 102 can be integrally formed, form the cavity of connection,
Scheme as shown in Figure 1, this design are easy to process.Because non-conductive lid 102 itself does not have electro-magnetic screen function, therefore
Its shape and structure have larger design space, for example, non-conductive lid 102 is covered into radiating element 101 and other circuits
Partial two parts are independently realized, different shape etc. are respectively adopted, and are all optional schemes.
For the parameter designing of non-conductive lid 102, the important point is the cap portion for covering radiating element 101
1021 height, i.e., relative to the height of pcb board 300.Because non-conductive lid 102 covers the cap portion of radiating element 101
1021 surfaces for being arranged on the pcb board 300 for being pasted with radiating element 101 form the annular of guided wave path 201 with guide wave device 200
Between tube wall lower edge, as shown in figure 1, the cap portion for therefore covering radiating element 101 actually determines the spoke of radiating element
Face is penetrated the distance between to the starting point of guided wave path 201, if setting the height of the cap portion 1021 of covering radiating element 101
So that the radiating surface of radiating element launches electromagnetic wave to the distance between the starting point of guided wave path 201 less than radiating element 101
Wavelength (λ), then launch from radiating element 101 and into guided wave path 201 electromagnetic wave only seldom part from for close
(corresponding to short transverse) ovfl of the cap portion 1021 of envelope is gone out.If the lid of covering radiating element 101 is set
The height of body portion 1021 causes the radiating surface of radiating element to be less than radiating element to the distance between the starting point of guided wave path 201
101 launch the wavelength (λ) of electromagnetic wave, then the height that can set cap portion 1021 is to send out penetrate electromagnetic wavelength one
Half, i.e. λ/2.The height parameter of cap portion 1021 is the dielectric constant and material thickness with the own material of cap portion 1021
Related, for material thickness (thickness of the entity part of the non-cavity of lid) relatively thin and plastic material cap portion 1021
Speech, the height using λ/2 or so is suitable.For example, for 75-120GHz frequencies or the slightly above electromagnetism of 120GHz frequencies
Ripple, its wavelength are about 3mm~2mm.If with PTFE plastics or PP plastic production cap portions, for 78G signal, it is high
Degree can be 1.34mm.It is further, it is also possible to non-to manufacture using other plastics (such as PEEK) or other non-conducting materials
The entirety or part of conductive cover.
Cap portion 1021 for sealing docked with the tube wall root edge of the formation guided wave path 201 of guide wave device 200 or
Bonding, therefore, the cap portion 1021 is in side by covering on radiating element 101 and close on the surface of root edge and pcb board 300
Envelope connection, so as to be sealed to radiating element 101；Sealed in its another side surface with the corresponding contact surface of guide wave device 200
Connection, is sealed hence for one end of guided wave path 201, prevents extraneous gas etc. from entering radar from guided wave path 201
Inside level meter.Because the part that guide wave device 200 forms guided wave path 201 is metal material, rather than the right and wrong of conductive cover 102
Conductive material, therefore both usual materials are different, can be tightly connected both by modes such as bondings.It is explosion-proof in order to reach
Effect, it can also be sealed by way of to high-frequency model entirety encapsulating, if by the way of encapsulating, can not be right
The bonding and cap portion 1021 on cap portion 1021 and the surface of pcb board 300 and the root edge of guided wave path 201 dock or it is viscous
Connect and propose higher seal request.
Radar levelmeter according to embodiments of the present invention, high-frequency model is except including emitter 100, guide wave device 200
Outside pcb board 300, in addition to radar signal R-T unit 400.Radar signal R-T unit 400 can include one or more
Individual chip 401, and electrically connected with the radiating element 101 of emitter 100.For example, as shown in Figure 1 and shown in Figure 3 B, in pcb board 300
Surface be provided with one or more chips 401, the part of the chip 401 as radar signal R-T unit 400, including production
The microwave chip of the raw electromagnetic wave launched by radiating element 101 can also dock with such function, such chip 401
The electromagnetic wave signal received is handled.Chip 401 can also include other chips of radar levelmeter, for example, radar thing position
The control chip of meter, other chips of high-frequency model, etc..
, can in order to realize the electrical connection between radar signal R-T unit 400 and the radiating element 101 of emitter 100
To apply coating metal layer on the surface of the insulating barrier of pcb board 300, wiring is then formed on the metal layer, by radar signal
R-T unit 400 is connected with radiating element 101., will be as caused by chip by microstrip line 402 in the scheme shown in Fig. 1
Electromagnetic wave signal is transferred to radiating element 101, can also use other signal transmission forms.
Chip 401, microstrip line 402 and radiating element 101 can be arranged on the homonymy of pcb board 300, so be easy to process.
The circuit connecting wire part of radar levelmeter can be realized by making pcb board 300.
Furthermore it is possible to above chip 401 set absorbing material 403, as shown in figure 1, the absorbing material 403 be arranged on it is non-
In the space that conductive cover 102 is limited, its shape can also match with the restriction space, for carrying out electricity to chip 401
Magnetic wave shields；The space that the absorbing material 403 is limited itself, which can not only accommodate multiple chips 401, can also accommodate microstrip line
402, and for absorbing electromagnetic wave caused by the electronic devices such as microstrip line.
Fig. 2A is the three-dimensional view after the high-frequency model assembling shown in Fig. 1, and Fig. 2 B are after the high-frequency model shown in Fig. 1 assembles
Another angle three-dimensional view.It can more clearly find out emitter 100, guide wave device with reference to Fig. 2A, Fig. 2 B and Fig. 1
Relative position relation between 200 and pcb board 300.Wherein, the non-conductive lid 102 of emitter 100 is used to seal radiation element
The part 1021 of part 101 is arranged between the root edge of guide wave device 200 and the corresponding part of pcb board 300.Can be with being for example bonded
Mode emitter 100 is fixedly connected on to the surface of pcb board 300, can also be with the mode that such as screw is fixed by guided wave
Device 200 is fixedly connected on the same surface of pcb board 300.
Fig. 3 A are the partial sectional views after the high-frequency model assembling shown in Fig. 1, and Fig. 3 B are the high-frequency models shown in Fig. 1
Fragmentary side cross-sectional view after assembling.
As shown in Figure 3 A and Figure 3 B, pcb board 300 has insulating barrier 301, the metal level (i.e. copper clad layers) 302 being arranged in order
With substrate (base material) 303, they form multi-layer compound structure.Alternatively, substrate 303 itself can also be the pcb board of multilayer.Root
According to embodiments of the invention, as shown in Figure 3 A and Figure 3 B, radiating element 101 is attached to the insulating barrier 301 of pcb board 300, and
Metal level 302 can also be formed on insulating barrier 301, to form circuit.
Pcb board 300 is provided with the side of radiating element 101 and is provided with non-conductive lid 102, and the non-conductive lid
102 form the radial chamber 103 for accommodating radiating element 101.Radial chamber 103 is that letter is transmitted from microstrip line 402 to radiating element 101
Number provide space.
In addition, as shown in Figure 3 A and Figure 3 B, radiating element 101 and the side of non-conductive lid 102 are being set, with radial chamber
The surface of insulating layer of pcb board corresponding to 103 does not cover or inwhole coating metal layer, specifically, what radiating element 101 contacted
Part and its surrounding part (being part corresponding with the projected area of radial chamber 103 altogether) without metal level (except
The electronic circuit (microstrip line) that radiating element 101 is connected with radar signal R-T unit 400).
Radiating element 101 can be the laminar device with compared with small area, and with such as square or rectangular
Shape.
For example, for cylindrical (as fig. 5 a and fig. 5b) or toroidal (as shown in Figure 3 A and Figure 3 B) guided wave path
For, the size (diameter of the guided wave path 201 formed) of the endoporus of guide wave device or one close to non-conductive lid 102
The hole size at end can match with the size of radial chamber 103.Alternatively, guided wave path 201 can also use other become
Gauge structure (as shown in Figure 6 A and 6 B).
Fig. 5 A and Fig. 5 B schematically show the positive partial cutaway of high-frequency model in accordance with another embodiment of the present invention
View and side partial sectional view；Fig. 6 A and Fig. 6 B schematically show the high-frequency model according to another embodiment of the invention
Fragmentary sectional elevation view and side partial sectional view.Compared with the structure of the high-frequency model shown in Fig. 3 A and Fig. 3 B, Fig. 5 A and
The shape for differing only in guided wave path 201 of high-frequency model shown in Fig. 5 B and Fig. 6 A and Fig. 6 B.
Fig. 4 A schematically show the partial sectional view of the radar levelmeter with the high-frequency model shown in Fig. 1,
Fig. 4 B schematically show the fragmentary side cross-sectional view of the radar levelmeter with the high-frequency model shown in Fig. 1.Such as Fig. 4 A and
, can be in thing position after high-frequency model according to embodiments of the present invention is installed on into radar levelmeter gauge outfit part shown in Fig. 4 B
Filling with sealant in the space that meter gauge outfit part enclosure mainly limits, the part in addition to guided wave passage opening is all close
Envelope, can so obtain better seal effect.
Process the high-frequency model of guide wave device according to embodiments of the present invention including the guide wave device and apply the height
During the radar levelmeter of frequency module, the printed substrate first in processing high-frequency model, specifically, before coating metal layer
The through hole of such as bolt hole is processed in the substrate of pcb board, then printed metal layer, then processing forms insulating barrier on the metal layer；
Then partial metal layers are formed on the insulating layer, and a part for the metal level is used for the radar signal transmitting-receiving dress for realizing high-frequency model
Put the electrical connection with radiating element；Radiating element is installed, on insulating barrier and radiating element identical side installation radar letter
The device such as number R-T unit and non-conductive lid, and in guide wave device of this side contraposition installation for high-frequency model.As before
It is described, guide wave device can be fixed on printed substrate with modes such as bolts, and the high-frequency model is installed on radar thing position
Count the casing part of gauge outfit, can also the filling with sealant into the space limited by radar levelmeter gauge outfit shell part again,
So gauge outfit part can be caused integrally to realize requirement of explosion proof.
The frequency range of current frequency modulated continuous wave radar (FMCW) level meter is in 4-27GHz, as radar is led in automobile
The application development in domain, the frequency of radar have been applied to 75-120GHz.Level gauging is more advantageous using high-frequency signal, such as side
Tropism is good, and meter size is smaller.
High-frequency model according to embodiments of the present invention and the radar levelmeter using the high-frequency model, can avoid exploding
Property gas enter electronics cavity in, and can be applied to 75-120GHz radar level measurement application.
Described above is only the exemplary embodiment of the present invention, not for limiting the scope of the invention, this hair
Bright protection domain is determined by appended claim.
Claims (17)
1. a kind of high-frequency model for level gauging,
Characterized in that,
Including：Emitter (100), guide wave device (200) and pcb board (300),
Wherein,
The emitter (100) includes：Radiating element (101) and non-conductive lid (102), the radiating element (101) and non-
Conductive cover (102) is arranged on the homonymy of pcb board (300), and the non-conductive lid (102) limits with the pcb board (300)
It is shaped as radial chamber (103) so that the radiating element (101) is placed within the radial chamber (103),
Wherein,
The guide wave device (200) and the emitter (100) are arranged on the homonymy of the pcb board (300), and formed with
Guided wave path (201) corresponding to the radiating element (101),
The non-conductive lid (102) covers the cap portion (1021) of the radiating element (101) and the guide wave device
(200) root edge of the part of the formation guided wave path (201) connects, and the height of the cap portion (1021) is set
So that the radiating surface of the radiating element (101) is less than the radiation element to the distance between the starting point of the guided wave path (201)
Part (101) launches the wavelength of electromagnetic wave.
2. high-frequency model according to claim 1, it is characterised in that the non-conductive lid (102) covers the radiation
The height of the cap portion (1021) of element (101) is launched the half of the wavelength of electromagnetic wave by the radiating element (101).
3. high-frequency model according to claim 1, it is characterised in that non-conductive described in PTFE plastics or PP plastic productions
Lid (102) covers the cap portion (1021) of the radiating element (101), and the height of the cap portion (1021) is
1.34mm。
4. high-frequency model according to claim 1, it is characterised in that the non-conductive lid (102) covers the radiation
The tube wall root edge that the cap portion (1021) of element (101) forms guided wave path (201) with the guide wave device (200) connects.
5. high-frequency model according to claim 1, it is characterised in that the guided wave path (201) is cylindrical cavity or tool
There is reducing cavity body structure.
6. high-frequency model according to claim 1, it is characterised in that the guide wave device (200) forms the guided wave and led to
The part on road (201) is made up of metal material.
7. high-frequency model according to claim 1, it is characterised in that the radiating element (101) is arranged on the pcb board
(300) on insulating barrier, the non-conductive lid (102) is arranged on the pcb board (300).
8. high-frequency model according to claim 1, it is characterised in that the high-frequency model also includes radar signal transmitting-receiving dress
Put (400), the radar signal R-T unit (400) includes one or more chips (401), and with the emitter (100)
Radiating element (101) electrical connection, the chip (401) include produce by the radiating element (101) transmitting electromagnetic wave it is micro-
Ripple chip or the function with as.
9. high-frequency model according to claim 8, it is characterised in that applied on the surface of the insulating barrier of the pcb board (300)
Coating metal layer, wiring is then formed on the metal layer, by the radar signal R-T unit (400) and the radiation element
Part (101) electrically connects.
10. high-frequency model according to claim 8 or claim 9, it is characterised in that will be by the chip by microstrip line (402)
(401) electromagnetic wave signal caused by is transferred to the radiating element (101).
11. high-frequency model according to claim 10, it is characterised in that the chip (401) and the microstrip line (402)
It is arranged on the homonymy of the pcb board (300) with the radiating element (101), and by the chip (401) or the chip
(401) it is arranged at the microstrip line (402) in the space that absorbing material (403) is limited.
12. high-frequency model according to claim 11, it is characterised in that the absorbing material (403) is arranged on described non-
In the space that conductive cover (102) limits.
13. high-frequency model according to claim 1, it is characterised in that the radiating element (101) is that have compared with small area
Laminar device.
14. high-frequency model according to claim 1, it is characterised in that the high-frequency model is applied to 75-120GHz thunder
Up to level gauging application.
15. a kind of radar levelmeter, it is characterised in that the radar levelmeter is included any one of claim 1-14
High-frequency model.
A kind of 16. manufacture method of radar levelmeter, it is characterised in that including：
Partial metal layers are formed on the insulating barrier of pcb board；
Radiating element is installed on the insulating barrier；
On the insulating barrier and radiating element identical side installation radar signal R-T unit and non-conductive lid；
Installation guide wave device is aligned in the same side；
High-frequency model is installed on to the casing part of radar levelmeter gauge outfit；
The filling with sealant into the space limited by radar levelmeter gauge outfit shell part.
17. a kind of radar levelmeter, it is characterised in that the radar thing position is manufactured with the manufacture method described in claim 16
Meter.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711088530.6A CN107677340A (en) | 2017-11-08 | 2017-11-08 | High-frequency model, radar levelmeter and its manufacture method for level gauging |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711088530.6A CN107677340A (en) | 2017-11-08 | 2017-11-08 | High-frequency model, radar levelmeter and its manufacture method for level gauging |
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| CN108801398A (en) * | 2018-06-27 | 2018-11-13 | 福州盛博电子有限公司 | A kind of 120GHz frequency modulated continuous wave radars level meter and distance measuring method |
| CN109186714A (en) * | 2018-10-12 | 2019-01-11 | 北京古大仪表有限公司 | A kind of high-frequency model and radar levelmeter for level gauging |
| WO2019091231A1 (en) * | 2017-11-08 | 2019-05-16 | 北京古大仪表有限公司 | High-frequency module for level measurement, and radar level instrument |
| WO2020073660A1 (en) * | 2018-10-12 | 2020-04-16 | 北京古大仪表有限公司 | High-frequency module for level gauging and radar level gauge |
| CN113514130A (en) * | 2021-09-15 | 2021-10-19 | 成都万江港利科技股份有限公司 | Non-contact radar water level measuring device |
| CN113782935A (en) * | 2021-08-19 | 2021-12-10 | 北京古大仪表有限公司 | Microstrip-waveguide converter and radar level gauge |
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