CN107674625A - Electronic component is integrally formed with adhesive and preparation method thereof - Google Patents
Electronic component is integrally formed with adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN107674625A CN107674625A CN201711042913.XA CN201711042913A CN107674625A CN 107674625 A CN107674625 A CN 107674625A CN 201711042913 A CN201711042913 A CN 201711042913A CN 107674625 A CN107674625 A CN 107674625A
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- China
- Prior art keywords
- parts
- adhesive
- electronic component
- integrally formed
- ethylene glycol
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
This application discloses electronic component to be integrally formed with adhesive and preparation method thereof, include in parts by weight, 5 25 parts of 255 433 parts of epoxy resin, 48 86 parts of polyamide, 29 74 parts of toluenesulfonic acid sodium salt, 10 20 parts of ethylene glycol monobutyl ether, 165 199 parts of silane coupler, 210 287 parts of ethyl acetate, 27 80 parts of kaolin, 72 104 parts of imidazoles, 19 152 parts of polystyrene, 23 41 parts of sodium nitrate, 20 50 parts of polyester resin and ethoxylated dodecyl alcohol.Thus, adhesive of the invention has had technique applicability, high-adhesive-strength, high bulk strength, meet the new demand of electronic component integral molding techniques.
Description
Technical field
The present invention relates to adhesive, more particularly to electronic component to be integrally formed with adhesive and preparation method thereof.
Background technology
The hair of computer main board technology is attributed to the fact that in the appearance for being integrally formed electronic component using integrated inductance as representative
Exhibition and the development of power technology.CPU frequency more and more higher, therefore have very high requirement to stable power-supplying and filtering aspect,
Integrated inductance can the long-term work under conditions of high current, and can be CPU stable power-supplyings.Got over the volume of electronic product
Next smaller, power is increasing, and electronic component is also towards small size, high-power aspect development.Good material property and special
Design, makes induction structure more stable, and impedance is lower, therefore just has higher efficiency.
Due to many advantages of integrated inductance, traditional assembling inductance will be progressively substituted, this has also just promoted electronics
The development of component integral molding techniques, and the adhesive technique applicability for being traditionally used for electronic component assembling is low, viscous
It is also low to connect insufficient strength, bulk strength.
The content of the invention
It is an object of the invention to provide electronic component to be integrally formed with adhesive and preparation method thereof, the above-mentioned existing skill of solution
One or more in art problem.
According to an aspect of the present invention, there is provided electronic component is integrally formed with adhesive, is included in parts by weight, ring
It is oxygen tree fat 255-433 parts, polyamide 48-86 parts, toluenesulfonic acid sodium salt 29-74 parts, ethylene glycol monobutyl ether 10-20 parts, silane coupled
Agent 165-199 parts, ethyl acetate 210-287 parts, kaolin 27-80 parts, imidazoles 72-104 parts, polystyrene 19-152 parts, nitre
Sour sodium 23-41 parts, polyester resin 20-50 parts and ethoxylated dodecyl alcohol 5-25 parts.
In some embodiments：Include in parts by weight, 255 parts of epoxy resin, 48 parts of polyamide, toluenesulfonic acid sodium salt 29
Part, 10 parts of ethylene glycol monobutyl ether, 165 parts of silane coupler, 210 parts of ethyl acetate, 27 parts of kaolin, 72 parts of imidazoles, polyphenyl second
5 parts of 19 parts of alkene, 23 parts of sodium nitrate, 20 parts of polyester resin and ethoxylated dodecyl alcohol.
In some embodiments：Include in parts by weight, 335 parts of epoxy resin, 70 parts of polyamide, toluenesulfonic acid sodium salt 57
Part, 15 parts of ethylene glycol monobutyl ether, 177 parts of silane coupler, 235 parts of ethyl acetate, 54 parts of kaolin, 87 parts of imidazoles, polyphenyl second
18 parts of 50 parts of alkene, 35 parts of sodium nitrate, 35 parts of polyester resin and ethoxylated dodecyl alcohol.
In some embodiments：Include in parts by weight, 433 parts of epoxy resin, 86 parts of polyamide, toluenesulfonic acid sodium salt 74
Part, 20 parts of ethylene glycol monobutyl ether, 199 parts of silane coupler, 287 parts of ethyl acetate, 80 parts of kaolin, 104 parts of imidazoles, polyphenyl second
25 parts of 152 parts of alkene, 41 parts of sodium nitrate, 50 parts of polyester resin and ethoxylated dodecyl alcohol.
Present invention also offers above-mentioned electronic component to be integrally formed the preparation method with adhesive, including following step
Suddenly:
Step 1：Epoxy resin, ethylene glycol monobutyl ether, ethyl acetate and polyester resin are well mixed and be dehydrated, it is standby；
Step 2：Lead to nitrogen into reactor, add mixture described in step (1), stirring, add laruyl alcohol polyoxy second
Alkene ether and silane coupler, heating response system, control 130 DEG C of temperature, insulation reaction 8h；
Step 3：Leftover materials are added into above-mentioned reaction system, continue to react, uniform stirring 1h, are then cooled to room
Temperature, obtain pre-emulsion；
Step 4：Pre-emulsion described in step (3) is added into reactor, is passed through nitrogen, heating response system, control temperature
90 DEG C, insulation reaction 8h of degree, then it is down to room temperature discharging.
The present invention adhesive had technique applicability, high-adhesive-strength, high bulk strength, meet electronic component
The new demand of integral molding techniques.
Embodiment
The present invention is described in further detail below by embodiment.
Embodiment 1：
Electronic component is integrally formed with adhesive, is included in parts by weight, 255 parts of epoxy resin, 48 parts of polyamide, first
29 parts of benzene sulfonic acid sodium salt, 10 parts of ethylene glycol monobutyl ether, 165 parts of silane coupler, 210 parts of ethyl acetate, 27 parts of kaolin, imidazoles 72
Part, 19 parts of polystyrene, 23 parts of sodium nitrate, 20 parts of polyester resin and 5 parts of ethoxylated dodecyl alcohol.
Electronic component of the present invention is integrally formed the preparation method with adhesive：Comprise the following steps:
Step 1：Epoxy resin, ethylene glycol monobutyl ether, ethyl acetate and polyester resin are well mixed and be dehydrated, it is standby；
Step 2：Lead to nitrogen into reactor, add mixture described in step (1), stirring, add laruyl alcohol polyoxy second
Alkene ether and silane coupler, heating response system, control 130 DEG C of temperature, insulation reaction 8h；
Step 3：Leftover materials are added into above-mentioned reaction system, continue to react, uniform stirring 1h, are then cooled to room
Temperature, obtain pre-emulsion；
Step 4：Pre-emulsion described in step (3) is added into reactor, is passed through nitrogen, heating response system, control temperature
90 DEG C, insulation reaction 8h of degree, then it is down to room temperature discharging.
Embodiment 2：
Electronic component is integrally formed with adhesive, is included in parts by weight, 335 parts of epoxy resin, 70 parts of polyamide, first
57 parts of benzene sulfonic acid sodium salt, 15 parts of ethylene glycol monobutyl ether, 177 parts of silane coupler, 235 parts of ethyl acetate, 54 parts of kaolin, imidazoles 87
Part, 50 parts of polystyrene, 35 parts of sodium nitrate, 35 parts of polyester resin and 18 parts of ethoxylated dodecyl alcohol.
Electronic component of the present invention is integrally formed the preparation method with adhesive：Comprise the following steps:
Step 1：Epoxy resin, ethylene glycol monobutyl ether, ethyl acetate and polyester resin are well mixed and be dehydrated, it is standby；
Step 2：Lead to nitrogen into reactor, add mixture described in step (1), stirring, add laruyl alcohol polyoxy second
Alkene ether and silane coupler, heating response system, control 130 DEG C of temperature, insulation reaction 8h；
Step 3：Leftover materials are added into above-mentioned reaction system, continue to react, uniform stirring 1h, are then cooled to room
Temperature, obtain pre-emulsion；
Step 4：Pre-emulsion described in step (3) is added into reactor, is passed through nitrogen, heating response system, control temperature
90 DEG C, insulation reaction 8h of degree, then it is down to room temperature discharging.
Embodiment 3：
Electronic component is integrally formed with adhesive, is included in parts by weight, 433 parts of epoxy resin, 86 parts of polyamide, first
74 parts of benzene sulfonic acid sodium salt, 20 parts of ethylene glycol monobutyl ether, 199 parts of silane coupler, 287 parts of ethyl acetate, 80 parts of kaolin, imidazoles
25 parts of 104 parts, 152 parts of polystyrene, 41 parts of sodium nitrate, 50 parts of polyester resin and ethoxylated dodecyl alcohol.
Electronic component of the present invention is integrally formed the preparation method with adhesive：Comprise the following steps:
Step 1：Epoxy resin, ethylene glycol monobutyl ether, ethyl acetate and polyester resin are well mixed and be dehydrated, it is standby；
Step 2：Lead to nitrogen into reactor, add mixture described in step (1), stirring, add laruyl alcohol polyoxy second
Alkene ether and silane coupler, heating response system, control 130 DEG C of temperature, insulation reaction 8h；
Step 3：Leftover materials are added into above-mentioned reaction system, continue to react, uniform stirring 1h, are then cooled to room
Temperature, obtain pre-emulsion；
Step 4：Pre-emulsion described in step (3) is added into reactor, is passed through nitrogen, heating response system, control temperature
90 DEG C, insulation reaction 8h of degree, then it is down to room temperature discharging.
In summary, adhesive of the invention has had technique applicability, high-adhesive-strength, high bulk strength, meet
The new demand of electronic component integral molding techniques.
Described above is only one embodiment of the present invention, it is noted that to those skilled in the art,
Without departing from the concept of the premise of the invention, some similar modification and improvement can also be made, these also should be regarded as this
Within the protection domain of invention.
Claims (5)
1. electronic component is integrally formed with adhesive, it is characterised in that：Include in parts by weight, epoxy resin 255-433 parts,
Polyamide 48-86 parts, toluenesulfonic acid sodium salt 29-74 parts, ethylene glycol monobutyl ether 10-20 parts, silane coupler 165-199 parts, acetic acid
Ethyl ester 210-287 parts, kaolin 27-80 parts, imidazoles 72-104 parts, polystyrene 19-152 parts, sodium nitrate 23-41 parts, polyester
Resin 20-50 parts and ethoxylated dodecyl alcohol 5-25 parts.
2. electronic component according to claim 1 is integrally formed with adhesive, it is characterised in that：Wrap in parts by weight
Include, 255 parts of epoxy resin, 48 parts of polyamide, 29 parts of toluenesulfonic acid sodium salt, 10 parts of ethylene glycol monobutyl ether, 165 parts of silane coupler,
210 parts of ethyl acetate, 27 parts of kaolin, 72 parts of imidazoles, 19 parts of polystyrene, 23 parts of sodium nitrate, 20 parts of polyester resin and bay
5 parts of alcohol APEO.
3. electronic component according to claim 2 is integrally formed with adhesive, it is characterised in that：Wrap in parts by weight
Include, 335 parts of epoxy resin, 70 parts of polyamide, 57 parts of toluenesulfonic acid sodium salt, 15 parts of ethylene glycol monobutyl ether, 177 parts of silane coupler,
235 parts of ethyl acetate, 54 parts of kaolin, 87 parts of imidazoles, 50 parts of polystyrene, 35 parts of sodium nitrate, 35 parts of polyester resin and bay
18 parts of alcohol APEO.
4. electronic component according to claim 1 is integrally formed with adhesive, it is characterised in that：Wrap in parts by weight
Include, 433 parts of epoxy resin, 86 parts of polyamide, 74 parts of toluenesulfonic acid sodium salt, 20 parts of ethylene glycol monobutyl ether, 199 parts of silane coupler,
287 parts of ethyl acetate, 80 parts of kaolin, 104 parts of imidazoles, 152 parts of polystyrene, 41 parts of sodium nitrate, 50 parts of polyester resin and month
25 parts of cinnamic alcohol APEO.
5. a kind of any one of claim 1-4 electronic components that prepare are integrally formed method with adhesive, its feature exists
In comprising the following steps:
Step 1：Epoxy resin, ethylene glycol monobutyl ether, ethyl acetate and polyester resin are well mixed and be dehydrated, it is standby；
Step 2：Lead to nitrogen into reactor, add mixture described in step (1), stirring, add ethoxylated dodecyl alcohol
And silane coupler, heating response system, control 130 DEG C of temperature, insulation reaction 8h；
Step 3：Leftover materials are added into above-mentioned reaction system, continue to react, uniform stirring 1h, room temperature is then cooled to, obtains
To pre-emulsion；
Step 4：Pre-emulsion described in step (3) is added into reactor, nitrogen is passed through, heating response system, controls temperature 90
DEG C, insulation reaction 8h, then it is down to room temperature discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711042913.XA CN107674625A (en) | 2017-10-30 | 2017-10-30 | Electronic component is integrally formed with adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711042913.XA CN107674625A (en) | 2017-10-30 | 2017-10-30 | Electronic component is integrally formed with adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107674625A true CN107674625A (en) | 2018-02-09 |
Family
ID=61143074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711042913.XA Pending CN107674625A (en) | 2017-10-30 | 2017-10-30 | Electronic component is integrally formed with adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107674625A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088232A (en) * | 2021-05-14 | 2021-07-09 | 河北星辰工程科技有限公司 | Slow-bonding agent and slow-bonding prestressed steel bar |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102161875A (en) * | 2009-12-30 | 2011-08-24 | 第一毛织株式会社 | Attach film composition for semiconductor assembly, attach film for semiconductor assembly using the same and attach belt |
| CN101130679B (en) * | 2006-08-25 | 2011-11-16 | 比亚迪股份有限公司 | Adhesion agent and method of manufacturing the same |
| US20130225020A1 (en) * | 2012-02-24 | 2013-08-29 | Kraton Polymers Us Llc | High flow, hydrogenated styrene-butadiene-styrene block copolymer and applications |
| CN102167963B (en) * | 2009-12-21 | 2014-03-26 | 第一毛织株式会社 | Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device |
-
2017
- 2017-10-30 CN CN201711042913.XA patent/CN107674625A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101130679B (en) * | 2006-08-25 | 2011-11-16 | 比亚迪股份有限公司 | Adhesion agent and method of manufacturing the same |
| CN102167963B (en) * | 2009-12-21 | 2014-03-26 | 第一毛织株式会社 | Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device |
| CN102161875A (en) * | 2009-12-30 | 2011-08-24 | 第一毛织株式会社 | Attach film composition for semiconductor assembly, attach film for semiconductor assembly using the same and attach belt |
| US20130225020A1 (en) * | 2012-02-24 | 2013-08-29 | Kraton Polymers Us Llc | High flow, hydrogenated styrene-butadiene-styrene block copolymer and applications |
Non-Patent Citations (1)
| Title |
|---|
| 李子东 等: "《胶黏剂助剂》", 30 June 2009 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088232A (en) * | 2021-05-14 | 2021-07-09 | 河北星辰工程科技有限公司 | Slow-bonding agent and slow-bonding prestressed steel bar |
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| PB01 | Publication | ||
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Application publication date: 20180209 |