CN107657212A - Composite fingerprint identifies module and electronic equipment - Google Patents
Composite fingerprint identifies module and electronic equipment Download PDFInfo
- Publication number
- CN107657212A CN107657212A CN201710696779.9A CN201710696779A CN107657212A CN 107657212 A CN107657212 A CN 107657212A CN 201710696779 A CN201710696779 A CN 201710696779A CN 107657212 A CN107657212 A CN 107657212A
- Authority
- CN
- China
- Prior art keywords
- electrode block
- module
- signal
- identification module
- fingerprint identification
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 101
- 230000005611 electricity Effects 0.000 claims description 13
- 238000002604 ultrasonography Methods 0.000 claims description 13
- 230000003071 parasitic effect Effects 0.000 claims description 9
- 238000011065 in-situ storage Methods 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000005684 electric field Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000010287 polarization Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 2
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- ZGEYCCHDTIDZAE-BYPYZUCNSA-N L-glutamic acid 5-methyl ester Chemical compound COC(=O)CC[C@H](N)C(O)=O ZGEYCCHDTIDZAE-BYPYZUCNSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- VKEQBMCRQDSRET-UHFFFAOYSA-N Methylone Chemical compound CNC(C)C(=O)C1=CC=C2OCOC2=C1 VKEQBMCRQDSRET-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- -1 greasy dirt Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention provides a kind of composite fingerprint identification module, including composite fingerprint identification module and switch module, the composite fingerprint identification module is electrically connected with the switch module, composite fingerprint identification module has the first recognition mode and the second recognition mode, under the first recognition mode, composite fingerprint identification module carries out fingerprint recognition with ultrasonic type fingerprint recognition principle, and under the second recognition mode, composite fingerprint identification module carries out fingerprint recognition with capacitance type fingerprint recognition principle；The switch module control composite fingerprint identification module switches between the first recognition mode and the second recognition mode.The present invention also provides the electronic equipment using composite fingerprint identification module.Composite fingerprint identification module and electronic equipment have the advantages that good environmental adaptability in the present invention.
Description
【Technical field】
The present invention relates to fingerprint identification technology field, and in particular to a kind of composite fingerprint identification module and electronic equipment.
【Background technology】
At present, fingerprint identification technology such as has been widely used in mobile terminal, smart home, fought crime at the multiple fields.
Life to people brings many facility and safety.The fingerprint identification technology of present main flow has light fingerprint recognition, condenser type
Fingerprint recognition and ultrasonic fingerprint identification, but they also have the shortcomings that respective, such as light fingerprint recognition and capacitance type fingerprint are known
Not when finger there are the materials such as greasy dirt, dust, water, it is easy for that fingerprint image can not be parsed；And ultrasonic fingerprint recognition is for dry hand
The discrimination of finger is very low.Therefore, existing fingerprint recognition module is difficult to adapt to different environment, and our urgent needs seek one kind can
Suitable for the fingerprint recognition module under varying environment.
【The content of the invention】
The problem of to overcome the environmental suitability difference of existing fingerprint recognition module, the present invention provide composite fingerprint identification mould
Group and electronic equipment.
Technical scheme is to provide a kind of composite fingerprint identification module, bag used by the present invention solves above-mentioned technical problem
Composite fingerprint identification module and switch module are included, the composite fingerprint identification module electrically connects with the switch module
Connect, composite fingerprint identification module has the first recognition mode and the second recognition mode, and under the first recognition mode, combined type refers to
Line identification module carries out fingerprint recognition with ultrasonic type fingerprint recognition principle, under the second recognition mode, composite fingerprint identification
Module carries out fingerprint recognition with capacitance type fingerprint recognition principle；The switch module controls composite fingerprint identification module first
Switched between recognition mode and the second recognition mode.
Preferably, the composite fingerprint identification module includes upper electrode layer, piezoelectric layer and lower electrode layer, upper electrode layer
It is separately positioned on lower electrode layer on relative two surfaces of piezoelectric layer, upper electrode layer includes the Top electrode block of array arrangement, under
Electrode layer includes the bottom electrode block of array arrangement, and Top electrode block is corresponded with bottom electrode block and set, and switch module includes multiple
Switch element, each Top electrode block and bottom electrode block connect a switch element respectively.
Preferably, the signal that composite fingerprint identification module further comprises at least being acquired capacitive feedback signal is adopted
Collect module, signal acquisition module includes multiple signal gathering units, and signal gathering unit passes through a pair of switch and Top electrode block 1
It should connect.
Preferably, the switch element includes at least one switch, and Top electrode block and bottom electrode block are opened by described at least one
The switching of pass may be connected to GND, VDD and Vx, wherein Vx<VDD.
Preferably, under the first recognition mode, composite fingerprint identification module includes initial shift：Top electrode block and
Bottom electrode block meets GND to realize that electric charge is reset, the second working stage：Bottom electrode block meets GND, and Top electrode block is alternately connect with pressure difference
Two voltage signals excite piezoelectric layer produce ultrasonic wave transmission signal；3rd working stage：Top electrode block connects the electricity of a fixation
Signal is pressed, bottom electrode block connects signal gathering unit, and ultrasonic reflections signal encounters finger back reflection and returns to produce ultrasound feedback
Ultrasound feedback signal is converted into being transferred to the signal gathering unit being connected with bottom electrode block after electric signal by signal, piezoelectric layer.
Preferably, under the second recognition mode, composite fingerprint identification module includes initial shift：Top electrode block and
Bottom electrode block meets GND to realize that electric charge is reset, the second working stage：Top electrode block and bottom electrode block connect VDD, Top electrode block and hand
Parasitic capacitance charging between finger；3rd working stage：Top electrode block connects signal gathering unit and Vx, and bottom electrode block meets Vx, letter
Number collecting unit gathers the discharge signal of the parasitic capacitance.
Preferably, the composite fingerprint identification module includes upper electrode layer and piezoelectric layer and lower electrode layer, Top electrode
Layer is separately positioned on relative two surfaces of piezoelectric layer with lower electrode layer, and upper electrode includes the Top electrode block of array arrangement,
Lower electrode layer includes bottom electrode block, the bottom electrode block for the single Top electrode block corresponding to the array arrangement or it is multiple with it is described
The Top electrode block of array arrangement corresponds electrode block, and switch module includes multiple switch unit, composite fingerprint identification module
Further comprise the signal acquisition module being acquired to ultrasound feedback signal and capacitive feedback signal, bottom electrode block is by opening
Close unit and may be connected to GND, VDD and Vx, each Top electrode block may be connected to GND, VDD, Vx and signal by even switch element
Acquisition module.
Preferably, the piezoelectric layer is polarization film in situ.
Preferably, the composite fingerprint identification module further comprises signal processing module, the signal processing module
The signal that signal acquisition module transmits is handled to obtain fingerprint recognition image.
The present invention also provides a kind of electronic equipment, and the electronic equipment includes composite fingerprint identification mould as described above
Group.
Compared with prior art, composite fingerprint identification module includes ultrasonic type fingerprint can either being used to know in the present invention
Other principle carries out fingerprint recognition, and and can carries out fingerprint recognition using capacitance type fingerprint recognition principle, in this way, substantially increasing fingerprint
The environmental suitability of identification.Further, the application is arbitrarily switched by switch module to two kinds of recognition modes, simple side
Just.
Electronic equipment using composite fingerprint identification module has the advantages of fingerprint recognition is accurate.
【Brief description of the drawings】
Fig. 1 is the layer structure schematic diagram of first embodiment of the invention composite fingerprint identification module.
Fig. 2 is the circuit modular structure schematic diagram of first embodiment of the invention composite fingerprint identification module.
Fig. 3 is the structural representation of first embodiment of the invention composite fingerprint identification module.
Fig. 4 is the particular circuit configurations schematic diagram of first embodiment of the invention composite fingerprint identification module.
Fig. 5 is the deformation schematic diagram of the particular circuit configurations of first embodiment of the invention composite fingerprint identification module.
Fig. 6 is the layer structure schematic diagram of second embodiment of the invention composite fingerprint identification module.
Fig. 7 is the circuit modular structure schematic diagram of second embodiment of the invention composite fingerprint identification module.
Fig. 8 is the structural representation of second embodiment of the invention composite fingerprint identification module.
Fig. 9 is the particular circuit configurations schematic diagram of second embodiment of the invention composite fingerprint identification module.
【Embodiment】
In order that the purpose of the present invention, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and embodiment,
The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
It is not intended to limit the present invention.
Referring to Fig. 1, first embodiment of the invention composite fingerprint identification module 10 includes composite fingerprint identification module
10a and control circuitry layer 17, control circuitry layer 17 are arranged on below composite fingerprint identification module 10a (mentioned in the present invention
Wait the noun of locality to be only limitted to relative position in given view, rather than absolute position up and down, it will be understood that given view exists
After 180 ° of rotations are carried out in plane, position word " under " can replace with position word " on ").It is appreciated that control circuitry layer 17
Position can according to the practical layout of product need be adjusted, it can be arranged on composite fingerprint identification module 10a's
Left side, right side or lower right side etc..
Referring to Fig. 2, control circuitry layer 17 and composite fingerprint identification module 10a is electrically connected with, and specifically, control circuit
Layer 17 includes switch module 171, the signal processing module 175 of signal acquisition module 173 and one, signal processing module 175 and letter
Number acquisition module 173 and composite fingerprint identification module 10a are electrically connected with successively, and switch module 171 is also connected to combined type
Fingerprint identification module 10a.Composite fingerprint identification module 10a has the first recognition mode and the second recognition mode, knows first
Under other pattern, composite fingerprint identification module 10a carries out fingerprint recognition with ultrasonic type fingerprint recognition principle, and mould is identified second
Under formula, composite fingerprint identification module 10a carries out fingerprint recognition with capacitance type fingerprint recognition principle；The switch module 171 is controlled
Composite fingerprint identification module 10a processed is switched between the first recognition mode and the second recognition mode.Signal acquisition module
173 collections come from the signal for corresponding to finger print information caused by composite fingerprint identification module 10a and are passed along at signal
Reason module 175 is handled to obtain fingerprint image.Switch module 171 can be according to the temperature of environment, humidity etc. to combined type
Fingerprint identification module 10a recognition mode is switched over, and it can also be switched over according to current fingerprint recognition process, e.g.,
In setting time, when not succeeded with the first recognition mode progress fingerprint recognition, then switch module control composite fingerprint is known
Other module 10a is switched to the second recognition mode；Or signal processing module 175 confirms that fingerprint recognition fails under current recognition mode
When, switch module control composite fingerprint identification module 10a is switched to another recognition mode.
Referring to Fig. 3, composite fingerprint identification module 10a includes upper electrode layer 11, piezoelectric layer 13 and lower electrode layer 15,
Upper electrode layer 11 and lower electrode layer 15 are separately positioned on two relative surfaces of piezoelectric layer 13, and control circuitry layer 17 is arranged on down
Side of the electrode layer 15 away from piezoelectric layer 13.Specifically, upper electrode layer 11 includes the Top electrode block 111 of array arrangement, bottom electrode
Layer 15 includes the bottom electrode block 151 of array arrangement, and Top electrode block 111 is corresponded with bottom electrode block 151 and set, i.e. Top electrode block
111 projection on lower electrode layer 15 is at least partly overlapping with bottom electrode block 151, it is preferable that Top electrode block 111 is in lower electrode layer
Projection on 15 is consistent with the area size of bottom electrode block 151 and just overlapping.
Piezoelectric layer 13 is piezoelectric film, it is preferable that piezoelectric layer 13 is the piezoelectric film of polarization in situ, i.e., described piezoelectric layer 13 is to adopt
Polarized to be formed with the mode of original position polarization.Specially described piezoelectric layer 13 is to be formed in situ piezoelectric film, the pressure in matrix one side
Electrolemma includes relative first surface and second surface, and the first surface potential for making the piezoelectric film is zero；In the piezoelectric film
Side where second surface provides the first electric field and the second electric field, and the potential of the first electric field is higher than the potential of the second electric field；First
The environmental gas of the side where the piezoelectric film second surface is ionized in the presence of electric field, the environmental gas passes through the second electric field
And the second surface of piezoelectric film is gathered in, make to form the film internal electric field along film thickness direction in the piezoelectric film, to the pressure
Electrolemma carries out polarization and forms the piezoelectric layer 13.
In actual production, can be will using modes such as chemical vapor deposition, physical vapour deposition (PVD), plasma sputterings
Piezoelectric film is formed on matrix.In the prior art, piezoelectric film is glued typically by existing finished product is purchased by one layer of tack coat
It is attached on matrix to be polarized, generally, the thickness of piezoelectric layer 13 that such a method is formed is not suitable with existing electricity more than 30 μm
The frivolous development trend of sub- device, and using the composite fingerprint identification module 10 of this piezoelectric layer 13, due to piezoelectric layer 13
It is too thick, therefore resolution ratio is relatively low.And the piezoelectric layer 13 of the offer of the present invention is formed in situ on matrix, therefore very thin thickness, and
And formation process is simple, so as to reduce the transmission loss of signal, the fingerprint for being advantageous to improve composite fingerprint identification module 10 is known
Other resolution ratio.Furthermore the present invention sets electrode compared to the upper and lower surface directly in piezoelectric layer 13, and piezoelectric layer 13 will not be made straight
Connect and bear applied high voltage electric field, be avoided that piezoelectric layer 13 is breakdown.The present invention (can be for details, reference can be made to using ion body polarization
The Chinese patent application of Application No. 201710108374.9) or X ray polarization (for details, reference can be made to Application No.
201611222575.3 Chinese patent application) mode form the piezoelectric layer 13, the piezoelectric layer 13 formed can be accomplished
It is very thin, moreover, the piezo-electric effect of the piezoelectric layer 13 of the present invention is preferable and service life is grown, can be good at being useful in combined type
In fingerprint recognition module 10, beneficial to realize composite fingerprint identify 10 preferable recognition effect of module.In the present invention, original has been carried out
The piezo-electric effect D33 of the piezoelectric layer 13 of bit polarization scope is 20-35pC/N.
The material of the piezoelectric layer 13 is piezoelectric, specific to can be selected but be not limited to：Kynoar, polyvinyl chloride,
Poly-γ-methyl-L-glutamate, one or several kinds of combinations in makrolon, polyvinylidene fluoride copolymer.
In some embodiments of the invention, the copolymer of the material selection Kynoar of the piezoelectric layer 13 is poly- inclined
PVF-trifluoro-ethylene copolymer, in order to obtain the preferable piezoelectric layer 13 of piezo-electric effect, the Kynoar and trifluoro-ethylene
The scope of mass ratio be (60-95)：(5-30), it is preferable that the scope of its mass ratio is (75-86)：(15-25), further
Preferably, its mass ratio is 80：20, the Kynoar and trifluoro-ethylene copolymer can more individually be dropped from Kynoar
Low cost, and it also has preferable piezo-electric effect.
The thickness of the piezoelectric layer 13 is less than 30 μm, and its thickness may further be less than 9 μm, yet further, its thickness
Can be 1.5-7.4 μm, 1.9-7.2 μm, 2.2-8.6 μm, 2.8-8.4 μm or 3.6-6.6 μm, further, can be specific
It is 1.8 μm, 2.4 μm, 2.6 μm, 3.7 μm, 3.9 μm, 4.2 μm, 4.6 μm, 5.6 μm, 5.8 μm, 6.7 μm, 8.6 μm, 8.7 μm.
Fig. 3 and 4 are referred to, switch module 171 includes multiple switch unit 1711, multiple switch unit 1711 and Top electrode
Block 111 and bottom electrode block 151 are connected one to one, i.e. each Top electrode block 111 and each bottom electrode block 151 are respectively connected with
One switch element 1711.Switch element 1711 includes at least one switch, Top electrode block 111 and bottom electrode block 151 by it is described extremely
The switching of a few switch may be connected to GND, VDD and Vx.Specifically, the switch that the switch module 171 includes can be one
It is or multiple.Illustrated in the present invention so that switch element 1711 includes 3 switches as an example.
Signal acquisition module 173 includes multiple signal gathering units 1731, signal gathering unit 1731 by switch Sp with
Top electrode block 111 connects one to one, i.e., each Top electrode block 111 connects a signal gathering unit 1731.Signal gathering unit
1731 are connected one to one by switching St with bottom electrode block 151, i.e., each bottom electrode block 151 connects a signal gathering unit
1731。
Please continue to refer to Fig. 3 and Fig. 4, with a Top electrode block 111 and a bottom electrode connecting valve unit 1711 and letter
The explanation of composite fingerprint identification module 10a operation principles is carried out exemplified by number collecting unit 1731.Top electrode block 111 is connected
Switch element 1711 include switching S1, S2 and S3, S1, S2 and S3 one end are connected to Top electrode block 111, other end point
VDD (operating voltage), GND (ground voltage) and Vx (medium voltage) are not connected to.The switch element that bottom electrode block 151 is connected
1711 include switching S4, S5 and S6, and S4, S5 and S6 one end are connected to bottom electrode block 151, and other end is connected respectively to
VDD, GND and Vx.Vx<VDD, it is preferable that Vx=(0.3-0.7) VDD, more preferably, Vx=(0.3-0.5) VDD.
Under the first recognition mode, composite fingerprint identification module 10 includes initial shift：S2, S5 conducting are switched,
Top electrode block 111 and bottom electrode block 151 meet GND to realize that electric charge is reset；Second working stage：Switch S5 is tended to remain on,
S1 and S2 alternate conductions are switched, i.e. bottom electrode block 151 meets GND, and Top electrode block 111 alternately meets VDD and GND to produce square-wave signal
Piezoelectric layer 13 is excited to produce ultrasonic wave transmission signal；Preferably, the frequency of square-wave signal is 1~10MHz.3rd working stage：
S2, St conducting are switched, Top electrode block 111 meets GND, and bottom electrode block 151 connects signal gathering unit 1731, and ultrasonic reflections signal touches
Return to produce ultrasound feedback signal to finger back reflection, piezoelectric layer 13 transmits after ultrasound feedback signal is converted into electric signal
Give the signal gathering unit 1731 of the connection of bottom electrode block 151.Preferably, the first stage under the first identification module, second-order
Section and phase III are carried out successively.
Under the second recognition mode, composite fingerprint identification module 10 includes initial shift：S2, S5 conducting are switched,
Top electrode block 111 and bottom electrode block 151 meet GND to realize that electric charge is reset.Second working stage：Switch S1, S4 conducting, Top electrode
Block 111 and bottom electrode block 151 meet VDD, and bottom electrode block 151 and bottom electrode block 151 connect same level signal, such piezoelectric layer 13
Electric field would not occur, so as to avoid piezoelectric layer 13 from producing ultrasonic wave transmission signal to produce interference.Top electrode block 111 with
Parasitic capacitance Cx between finger is charged.3rd working stage：S3, S6, Sp conducting are switched, due to Vx<VDD, therefore, finger
With the parasitic capacitance discharge between Top electrode block 111, signal gathering unit 1731 gathers the discharge signal of the parasitic capacitance Cx,
It is specially discharge charge, and the number of discharge charge has corresponded to different finger print informations.Signal processing module 175 is adopted according to signal
The discharge signal that collection unit 1731 is collected can computing acquisition fingerprint image.Preferably, under the second identification module
One stage, second stage and phase III are carried out successively.
Deformed as one kind, in the phase III of the first recognition mode, Top electrode block 111 is not limited to connect GND voltage,
It can also be connection VDD or Vx voltages, as long as upper contiguous block 111 connects a fixed voltage as reference signal, to be somebody's turn to do
Fixed voltage can be GND, VDD or Vx.
Being deformed as one kind, the signal gathering unit 1731 being connected with bottom electrode can be omitted, and the 3rd of the first recognition mode the
In stage, Sp conductings, S5 or S4 or S6 conductings, ultrasound feedback signal by piezoelectric layer 13 be converted into being transferred to after electric signal with
The signal gathering unit 1731 that Top electrode 111 connects.
Referring to Fig. 5, as a kind of deformation, the signal gathering unit 1731 being connected with bottom electrode is omitted, bottom electrode block 151
For the electrode of monolithic, and the bottom electrode block 151 is corresponding with the Top electrode block 111 of the array arrangement in upper electrode layer, i.e. bottom electrode
Layer is a flood.
It is appreciated that among the first recognition mode, switch S1 and S2 alternate conductions are to provide for one and alternately changed
Voltage signal to piezoelectric layer 13 to produce ultrasonic wave transmission signal.
Variant embodiment in the present embodiment is applicable to other embodiment according to actual conditions.
Referring to Fig. 6, second embodiment of the invention composite fingerprint identification module 20 includes composite fingerprint identification module
20a and control circuitry layer 27, control circuitry layer 27 are arranged on below composite fingerprint identification module 20a (mentioned in the present invention
Wait the noun of locality to be only limitted to relative position in given view, rather than absolute position up and down, it will be understood that given view exists
After 180 ° of rotations are carried out in plane, position word " under " can replace with position word " on ").It is appreciated that control circuitry layer 27
Position can according to the practical layout of product need be adjusted, it can be arranged on composite fingerprint identification module 20a's
Left side, right side or lower right side etc..
Referring to Fig. 7, control circuitry layer 27 and composite fingerprint identification module 20a is electrically connected with, and specifically, control circuit
Layer 27 includes switch module 271, the signal processing module 275 of signal acquisition module 273 and one, signal processing module 275 and letter
Number acquisition module 273 and composite fingerprint identification module 20a are electrically connected with successively, and switch module 271 is also connected to combined type
Fingerprint identification module 20a.Composite fingerprint identification module 20a has the first recognition mode and the second recognition mode, knows first
Under other pattern, composite fingerprint identification module 20a carries out fingerprint recognition with ultrasonic type fingerprint recognition principle, and mould is identified second
Under formula, composite fingerprint identification module 20a carries out fingerprint recognition with capacitance type fingerprint recognition principle；The switch module 271 is controlled
Composite fingerprint identification module 20a processed is switched between the first recognition mode and the second recognition mode.Signal acquisition module
273 collections come from the signal for corresponding to finger print information caused by composite fingerprint identification module 20a and are passed along at signal
Reason module 275 is handled to obtain fingerprint image.Switch module 271 can be according to the temperature of environment, humidity etc. to combined type
Fingerprint identification module 20a recognition mode is switched over, and it can also be switched over according to current fingerprint recognition process, e.g.,
In setting time, when not succeeded with the first recognition mode progress fingerprint recognition, then switch module control composite fingerprint is known
Other module 20a is switched to the second recognition mode；Or signal processing module 275 confirms that fingerprint recognition fails under current recognition mode
When, switch module control composite fingerprint identification module 20a is switched to another recognition mode.
Please continue to refer to Fig. 8, composite fingerprint identification module 20a includes upper electrode layer 21, piezoelectric layer 22, middle electrode layer 23
And lower electrode 24, upper electrode layer 21 and middle electrode layer 23 are separately positioned on two relative surfaces of piezoelectric layer 22, lower floor
The spacing of electrode 24 is arranged on middle side of the electrode layer 23 away from piezoelectric layer 22.Specifically, upper electrode layer 21 includes array arrangement
Top electrode block 211, middle electrode layer 23 include the middle electrode block 231 of array arrangement, and lower electrode layer 24 includes the lower electricity of array arrangement
Pole block 241,242, Top electrode block 211 are corresponded with middle electrode block 231 and set, i.e., Top electrode block 211 is on middle electrode layer 23
Projection it is at least partly overlapping with middle electrode block 231, it is preferable that projection of the Top electrode block 211 on middle electrode layer 23 and middle electricity
The area size of pole block 231 is consistent, and just overlapping.Each Top electrode block 211 two bottom electrodes block 241 corresponding with middle electrode block 231,
242, it will be understood that Top electrode block 211 or middle electrode block 231 include two pieces of bottom electrodes in the view field on lower electrode layer 24
Block 241,242.Two bottom electrode blocks 241,242 of the corresponding same Top electrode block 211 of order or middle electrode block 231 are the first bottom electrode block
241 and the second bottom electrode block 242.
Piezoelectric layer 22 is piezoelectric film, it is preferable that piezoelectric layer 22 is the piezoelectric film in situ to polarize.
Fig. 8 and Fig. 9 are referred to, switch module 27 includes multiple switch unit 2711, multiple switch unit 2711 and upper electricity
Pole block 211, middle electrode block 231 and bottom electrode block connect one to one, i.e. each Top electrode block 211, middle electrode block 231 with
And bottom electrode block is respectively connected with a switch element 2711.Switch element 2711 includes at least one switch, Top electrode block 211 and lower electricity
Pole block may be connected to GND, VDD and Vx by the switching of described at least one switch.Specifically, the switch module 271 includes
Switch can be one or more.Illustrated in the present invention so that switch element 2711 includes 3 switches as an example.
Signal acquisition module 273 includes multiple signal gathering units 2731, signal gathering unit 2731 by switch Sp with
Top electrode block 211 connects one to one, i.e., each Top electrode block 211 connects a signal gathering unit 2731.Signal gathering unit
2731 are connected one to one by switching St with middle electrode block 231, i.e., each middle electrode block 231 connects a signal gathering unit
2731。
Please continue to refer to Fig. 9, with a Top electrode block 211 and a middle electrode connecting valve unit 2711 and signal acquisition
Unit 2731, the first bottom electrode block 241 and the second bottom electrode block being correspondingly arranged with the Top electrode block 211 and bottom electrode block
242 are all connected with carrying out the explanation of composite fingerprint identification module 20a operation principles exemplified by a switch element.Top electrode block 211
The switch element 2711 connected includes switching S1, S2 and S3, and S1, S2 and S3 one end are connected to Top electrode block 211, in addition
One end is connected respectively to VDD, GND and Vx.The switch element 2711 that middle electrode block 231 is connected includes switching S4, S5 and S6,
S4, S5 and S6 one end are connected to bottom electrode block, and other end is connected respectively to VDD, GND and Vx.The institute of first bottom electrode block 241
The switch element 2711 of connection includes switching S7, S8 and S9, and S7, S8 and S9 one end are connected to the first bottom electrode block 241, separately
Outer one end is connected respectively to VDD, GND and Vx.The switch element 2711 that second bottom electrode block 242 is connected include switch S10,
S11 and S12, S10, S11 and S12 one end are connected to the second bottom electrode block 242, other end be connected respectively to VDD, GND and
Vx.Vx<VDD, it is preferable that Vx=(0.3-0.7) VDD, more preferably, Vx=(0.3-0.5) VDD.
Under the first recognition mode, composite fingerprint identification module 10 includes initial shift：Switch S2, S5, S8,
S11 is turned on, and Top electrode block 211, middle electrode block 231, the first bottom electrode block 241 and the second bottom electrode block 242 meet GND to realize electricity
Lotus resets.Second working stage：Switch S5, S8, S11 are tended to remain on, and switch S1 and S2 alternate conductions, i.e., middle electrode block
231st, the first bottom electrode block 241 and the second bottom electrode block 242 meet GND, and Top electrode block 211 alternately meets VDD and GND to produce square wave
Signal excitation piezoelectric layer 22 produces ultrasonic wave transmission signal；Preferably, the frequency of square-wave signal is 1~10MHz.3rd work rank
Section：Switching S2, St, S8, S11 conducting, i.e., Top electrode block 211, the first bottom electrode block 241 and the second bottom electrode block 242 meet GND,
Middle electrode block 231 connects signal gathering unit 2731, and ultrasonic reflections signal encounters finger back reflection and returns to produce ultrasound feedback
Ultrasound feedback signal is converted into being transferred to the signal acquisition being connected with middle electrode block 231 after electric signal by signal, piezoelectric layer 22
Unit 2731.Preferably, first stage, second stage and the phase III under the first identification module are carried out successively.
Under the second recognition mode, composite fingerprint identification module 20 includes initial shift：Switch S2, S5, S8,
S11 is turned on, and Top electrode block 211, middle electrode block 231, the first bottom electrode block 241 and the second bottom electrode block 242 meet GND to realize electricity
Lotus resets.Second working stage：Switch S1, S4, S7, S11 conducting, Top electrode block 211, the bottom electrode of middle electrode block 231 and first
Block 241 meets VDD, and Top electrode block 211 and the bottom electrode block 241 of middle electrode block 231 and first connect same level signal, so presses
Electric field would not occur in electric layer 22, so as to avoid piezoelectric layer 22 from producing ultrasonic wave transmission signal to produce interference, middle electrode
The electric capacity C1 formed between the bottom electrode block 241 of block 231 and first does not work.Posting between Top electrode block 211 and finger
Give birth to electric capacity Cx and charged；Second bottom electrode block 242 connects GND voltage, the middle bottom electrode block 242 of electrode block 231 and second it
Between electric capacity C2 charging.3rd working stage：S3, S6, S8, S11, Sp conducting are switched, due to Vx<VDD, therefore, electric capacity C2 is to electricity
Hold electric capacity C1 electric discharges, and the parasitic capacitance Cx electric discharges between finger and Top electrode block 211, signal gathering unit 2731 gathers described
Parasitic capacitance Cx discharge signal, it is specially discharge charge, and the number of discharge charge has corresponded to different finger print informations.Signal
The discharge signal that processing module 175 is collected according to signal gathering unit 2731 can computing acquisition fingerprint image.It is preferred that
Ground, first stage, second stage and phase III under the second identification module are carried out successively.
Deformed as one kind, in the phase III of the first recognition mode, Top electrode block 211211 is not limited to connect GND electricity
Pressure, it can also be connection VDD or Vx voltages, as long as the reference signal that the connection of upper contiguous block 211 one is fixed.
Deformed as one kind, the signal gathering unit 2731 being connected with middle electrode block 231 can be omitted, the first recognition mode
In phase III, Sp conductings, middle electrode block 231, the first bottom electrode block 241 and the second bottom electrode block 242 meet VDD or GND or Vx
Voltage.Ultrasound feedback signal is converted into being transferred to the signal gathering unit being connected with Top electrode after electric signal by piezoelectric layer 22
2731.Middle electrode layer can also be further deformed into the form of a flood.
It is appreciated that among the first recognition mode, switch S1 and S2 alternate conductions are to provide for one and alternately changed
Voltage signal to piezoelectric layer 22 to produce ultrasonic wave transmission signal.It is supplied to the voltage signal of Top electrode block 211 to be not limited to
VDD and GND, it can also be other any two voltage signals with pressure difference.
Deformed as one kind, in the phase III of the first recognition mode, Top electrode block 111 is not limited to connect GND voltage,
It can also be connection VDD or Vx voltages, as long as upper contiguous block 111 connects a fixed voltage as reference signal, to be somebody's turn to do
Fixed voltage can be GND, VDD or Vx.
Being deformed as one kind, the signal gathering unit 2731 being connected with middle electrode can be omitted, and the 3rd of the first recognition mode the
In stage, Sp conductings, middle electrode block and bottom electrode block is connected to GND, and ultrasound feedback signal is converted into electricity by piezoelectric layer 22
The signal gathering unit 2731 being connected with Top electrode 211 is transferred to after signal, in the deformation, middle electrode block 231 can be single
The electrode of block, i.e. lower electrode layer are a flood.
Preferably, Top electrode block 211 is identical with the middle size of electrode block 231, and the area of bottom electrode block 241,242 is middle electrode block
The 30%-45% of 231 areas.More preferably 38%-42%.
Compared with prior art, the present embodiment not only has in first embodiment possessed by composite fingerprint identification module
Advantage, meanwhile, because composite fingerprint identification module adds lower electrode layer 24 in the present embodiment, lower electrode layer 24 can be lifted
The signal stabilization of middle electrode layer 23, so as to improve the precision of fingerprint recognition.
Third embodiment of the invention provides a kind of fingerprint recognition module with position detecting, and it includes as described above compound
Formula fingerprint recognition module, the composite fingerprint identification module further comprise signal processing module, the signal processing module
Including a fingerprint recognition processing module and position signalling processing module, the fingerprint recognition processing module is to signal acquisition module
The signal transmitted is handled to obtain fingerprint recognition image, and the position signalling processing module passes to signal acquisition module
The defeated signal to come is handled to obtain finger manipulation position.
Fourth embodiment of the invention provides a kind of electronic equipment, and the electronic equipment includes composite fingerprint as described above
Identify module.The electronic equipment can be mobile phone, notebook, tablet PC, printer, duplicator, scanner, biography
True device, global positioning system (GPS) receiver/navigator, camera, digital media player, personal digital assistant (PDA),
Field camera, game console, watch, clock, calculator, televimonitor, flat-panel monitor, electronic reading device
(for example, electronic reader), mobile health care device, computer monitor, automotive displays (are shown comprising mileometer and speedometer
Device etc.), driving cabin control and/or display, camera view display (for example, display of the rear view camera in vehicle), electricity
Sub- photo, board, bulletin or label, projecting apparatus, building structure, refrigerator, stereophonic sound system, cassette recorder or player,
DVD player, CD Player, VCR, radio device, pocket memory chip, washing machine, dryer, washing machine/drying
Machine, parking meter etc..
Some switch conductions specified mentioned in the present invention mean that other are switched off.
Compared with prior art, composite fingerprint identification module includes ultrasonic type fingerprint can either being used to know in the present invention
Other principle carries out fingerprint recognition, and and can carries out fingerprint recognition using capacitance type fingerprint recognition principle, in this way, substantially increasing fingerprint
The environmental suitability of identification.Further, the application is arbitrarily switched by switch module to two kinds of recognition modes, simple side
Just.
Fingerprint recognition module with position detecting can also carry out position detecting while fingerprint recognition is realized so that band
Under conditions of feature-rich, integrated level improves the fingerprint recognition module of position detecting.
Electronic equipment using composite fingerprint identification module has the advantages of fingerprint recognition is accurate.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all originals in the present invention
Any modification made within then, equivalent substitution and improvement etc. all should be included within protection scope of the present invention.
Claims (10)
1. a kind of composite fingerprint identifies module, it is characterised in that：Including composite fingerprint identification module and switch module, institute
State composite fingerprint identification module to be electrically connected with the switch module, composite fingerprint identification module has the first recognition mode
With the second recognition mode, under the first recognition mode, composite fingerprint identification module is carried out with ultrasonic type fingerprint recognition principle
Fingerprint recognition, under the second recognition mode, composite fingerprint identification module carries out fingerprint recognition with capacitance type fingerprint recognition principle；
The switch module control composite fingerprint identification module switches between the first recognition mode and the second recognition mode.
2. composite fingerprint as claimed in claim 1 identifies module, it is characterised in that：The composite fingerprint identification module bag
Upper electrode layer, piezoelectric layer and lower electrode layer are included, upper electrode layer and lower electrode layer are separately positioned on two relative tables of piezoelectric layer
On face, upper electrode layer includes the Top electrode block of array arrangement, and lower electrode layer includes the bottom electrode block of array arrangement, Top electrode block with
Bottom electrode block, which corresponds, to be set, and switch module includes multiple switch unit, and each Top electrode block and bottom electrode block connect respectively
One switch element.
3. composite fingerprint as claimed in claim 2 identifies module, it is characterised in that：Composite fingerprint identification module is further
Including the signal acquisition module being at least acquired to capacitive feedback signal, signal acquisition module includes multiple signal acquisition lists
Member, signal gathering unit are connected one to one by switching with Top electrode block.
4. composite fingerprint as claimed in claim 2 identifies module, it is characterised in that：The switch element is opened including at least one
Close, Top electrode block and bottom electrode block may be connected to GND, VDD and Vx, wherein Vx by the switching of described at least one switch<VDD.
5. composite fingerprint as claimed in claim 3 identifies module, it is characterised in that：Under the first recognition mode, combined type
Fingerprint recognition module includes initial shift：Top electrode block and bottom electrode block meet GND to realize that electric charge is reset, the second work rank
Section：Bottom electrode block meets GND, and Top electrode block alternately connects two voltage signals with pressure difference and excites piezoelectric layer to produce ultrasonic wave transmitting
Signal；3rd working stage：Top electrode block connects the voltage signal of a fixation, and bottom electrode block connects signal gathering unit, and ultrasonic wave is anti-
Penetrate signal and encounter finger back reflection and return to produce ultrasound feedback signal, ultrasound feedback signal is converted into electric signal by piezoelectric layer
The signal gathering unit being connected with bottom electrode block is transferred to afterwards.
6. composite fingerprint as claimed in claim 3 identifies module, it is characterised in that：Under the second recognition mode, combined type
Fingerprint recognition module includes initial shift：Top electrode block and bottom electrode block meet GND to realize that electric charge is reset, the second work rank
Section：Top electrode block and bottom electrode block meet VDD, the parasitic capacitance charging between Top electrode block and finger；3rd working stage：Upper electricity
Pole block connects signal gathering unit and Vx, and bottom electrode block meets Vx, and signal gathering unit gathers the discharge signal of the parasitic capacitance.
7. composite fingerprint as claimed in claim 1 identifies module, it is characterised in that：The composite fingerprint identification module bag
Upper electrode layer and piezoelectric layer and lower electrode layer are included, upper electrode layer and lower electrode layer are separately positioned on two relative tables of piezoelectric layer
On face, upper electrode includes the Top electrode block of array arrangement, and lower electrode layer includes bottom electrode block, and the bottom electrode block is single correspondence
Electrode block, switch module are corresponded in the Top electrode block of the array arrangement or the multiple and Top electrode block of the array arrangement
Including multiple switch unit, composite fingerprint identification module further comprises entering ultrasound feedback signal and capacitive feedback signal
The signal acquisition module of row collection, bottom electrode block may be connected to GND, VDD and Vx by switch element, and each Top electrode block passes through
Even switch element may be connected to GND, VDD, Vx and signal acquisition module.
8. the composite fingerprint identification module as described in claim 2 or 7, it is characterised in that：The piezoelectric layer polarizes to be in situ
Film.
9. the composite fingerprint identification module as described in claim 2 or 7, it is characterised in that：The composite fingerprint identifies mould
Group further comprises signal processing module, and the signal processing module is handled the signal that signal acquisition module transmits
To obtain fingerprint recognition image.
10. a kind of electronic equipment, it is characterised in that the electronic equipment includes compound as described in claim any one of 1-7
Formula fingerprint recognition module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710696779.9A CN107657212A (en) | 2017-08-15 | 2017-08-15 | Composite fingerprint identifies module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710696779.9A CN107657212A (en) | 2017-08-15 | 2017-08-15 | Composite fingerprint identifies module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107657212A true CN107657212A (en) | 2018-02-02 |
Family
ID=61127717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710696779.9A Pending CN107657212A (en) | 2017-08-15 | 2017-08-15 | Composite fingerprint identifies module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107657212A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021093384A1 (en) * | 2019-11-12 | 2021-05-20 | 神盾股份有限公司 | Fingerprint recognition device and fingerprint recognition method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204926126U (en) * | 2015-09-16 | 2015-12-30 | 京东方科技集团股份有限公司 | Fingerprint identification module and display device |
| CN106990861A (en) * | 2016-01-20 | 2017-07-28 | 丽智科技股份有限公司 | Intelligent sensing touch device |
| CN107004756A (en) * | 2014-10-14 | 2017-08-01 | 康宁股份有限公司 | Piezoelectricity membrane structure and sensor and use its display module |
-
2017
- 2017-08-15 CN CN201710696779.9A patent/CN107657212A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107004756A (en) * | 2014-10-14 | 2017-08-01 | 康宁股份有限公司 | Piezoelectricity membrane structure and sensor and use its display module |
| CN204926126U (en) * | 2015-09-16 | 2015-12-30 | 京东方科技集团股份有限公司 | Fingerprint identification module and display device |
| CN106990861A (en) * | 2016-01-20 | 2017-07-28 | 丽智科技股份有限公司 | Intelligent sensing touch device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021093384A1 (en) * | 2019-11-12 | 2021-05-20 | 神盾股份有限公司 | Fingerprint recognition device and fingerprint recognition method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107346195B (en) | Touch display panel and touch display device | |
| CN207097007U (en) | Composite fingerprint identifies module and electronic equipment | |
| US9600704B2 (en) | Electronic imager using an impedance sensor grid array and method of making | |
| CN102893248B (en) | Use electronic imager and the manufacture method of impedance transducer grid array | |
| CN108883435A (en) | The drive scheme read for ultrasonic transducer pixel | |
| CN109407862A (en) | Biometric sensing | |
| CN107609484A (en) | Fingerprint recognition module and electronic equipment with position detecting | |
| CN113343800B (en) | Fingerprint touch identification module, fingerprint touch identification method and electronic equipment | |
| CN109815918A (en) | Fingerprint recognition mould group and preparation method thereof and driving method, display device | |
| CN103955679A (en) | Color film substrate, array substrate and display device | |
| CN102193692B (en) | Surface capacitive touch panel and display device, electronic device as well as driving method thereof | |
| CN107451573A (en) | Composite fingerprint identification module, composite fingerprint recognition means and electronic equipment | |
| CN102192760A (en) | Position pointer, variable capacitor and inputting apparatus | |
| CN105164621A (en) | Touch input device and display device | |
| CN106383607B (en) | Touch display system with pressure sensing | |
| CN107977602A (en) | Ultrasonic fingerprint identification module, module, device and electronic equipment | |
| CN107798300A (en) | Ultrasonic fingerprint identification module, device and electronic equipment | |
| CN107958199A (en) | Detect module, display device and electronic equipment | |
| CN207517029U (en) | Composite fingerprint identifies module and electronic equipment | |
| CN107451572A (en) | Ultrasonic fingerprint identifies module and electronic equipment | |
| US10445549B2 (en) | Fingerprint identification device and electronic device using same | |
| CN107037931A (en) | Touching display screen and display device | |
| CN106557741A (en) | Fingerprint identification device, its manufacture method, display device | |
| CN107832665A (en) | Display module and electronic equipment | |
| CN107832671A (en) | Display device and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190528 Address after: 610000 Shunsheng Road, Zhengxing Street, Tianfu New District, Chengdu City, Sichuan Province Applicant after: Chengdu also a partnership of science and Technology (limited partnership) Address before: 611731 No. 2103, Building No. 798, Tianfu First Street, Chengdu High-tech Zone, Chengdu, Sichuan Province Applicant before: Wu Lu |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200630 Address after: No.88, Yingbin Avenue, Shouan Town, Pujiang County, Chengdu City, Sichuan Province Applicant after: Chengdu Dachao Technology Co.,Ltd. Address before: 610000 Sichuan city of Chengdu province Tianfu Zheng Xing Shun Shing Street No. 172 Applicant before: CHENGDU YIDAO TECHNOLOGY PARTNERSHIP (L.P.) |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180202 |