CN107630188A - A kind of film-coating mechanism and its application method for being used to improve metal level plating film uniformity - Google Patents
A kind of film-coating mechanism and its application method for being used to improve metal level plating film uniformity Download PDFInfo
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- CN107630188A CN107630188A CN201711047109.0A CN201711047109A CN107630188A CN 107630188 A CN107630188 A CN 107630188A CN 201711047109 A CN201711047109 A CN 201711047109A CN 107630188 A CN107630188 A CN 107630188A
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Abstract
The present invention discloses a kind of film-coating mechanism for being used to improve metal level plating film uniformity, including mechanism, and cavity is provided with mechanism, two L-type connecting shafts and revision board are provided with cavity, L-type connecting shaft one end is connected through actuator base with cylinder, and the other end is connected with revision board, and the lower section of revision board is provided with crucible；Mechanism is provided with planet carrier by rotating shaft, and planet carrier is connected with plating pot；Plating pot enters line slip in plating pot swing-around trajectory；Four lifting shafts are connected with plating pot swing-around trajectory, the side wall of mechanism installs the fixed mount for fixed plating pot swing-around trajectory.The present invention stops gaseous metal source to plating pot center excessive vaporization by revision board, and plate pot orbit altitude using axial adjustment is lifted, the inner ring and outer ring for ensureing plating pot receive the gaseous energy coincidence of source metal, and then make it that the plating film uniformity of silicon chip surface is good, compactness is strong, reduce the roughness on surface, reduce silicon chip to do over again number, while improve the performance of silicon chip, it is cost-effective.
Description
Technical field
The invention belongs to silicon chip process technology field, is related to a kind of coating machine for being used to improve metal level plating film uniformity
Structure and its application method.
Background technology
5 inch chips evaporate in electron beam evaporation platform in recent years, the metal level lack of homogeneity of the plated film come out, and plate pot
The metal layer thickness of upper silicon chip differs hundreds of angstroms, and it is uneven coating film thickness to be present, causes rough surface, increases doing over again time for silicon chip
Number, while considerably increase silicon chip manufacturing cost.
The equipment on evaporation coating does not have the breakthrough uniformity to evaporation coating to be changed at present, in order in silicon chip
During surface coating, improve metal level uniformity, now design it is a kind of be used for improve metal level plating film uniformity film-coating mechanism and its
Application method.
The content of the invention
It is an object of the invention to provide a kind of film-coating mechanism and its user for being used to improve metal level plating film uniformity
Method, silicon chip surface plated film lack of homogeneity when solving existing silicon chip surface plated film be present, do over again often and manufacturing cost is high
The problem of.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of film-coating mechanism for being used to improve metal level plating film uniformity, including mechanism are provided with cavity in mechanism, in cavity
Provided with two L-type connecting shafts and revision board, L-type connecting shaft one end is connected through actuator base with cylinder, and the other end connects with revision board
Connect, the lower section of revision board is provided with crucible；
Mechanism is provided with planet carrier by rotating shaft, and planet carrier is connected with plating pot；The plating pot enters in plating pot swing-around trajectory
Line slip；
Four lifting shafts are connected with plating pot swing-around trajectory；
The lower section of plating pot swing-around trajectory is provided with drying lamp；
The side wall of mechanism installs the fixed mount for fixed plating pot swing-around trajectory.
Further, the revision board is located between crucible and plating pot.
Further, the cavity is provided with chamber door, and chamber door side is provided with two knocker bodies, and chamber door passes through knocker body and machine
Structure connects；Chamber door opposite side is provided with door handle, and door handle is engaged with the door handle fixing card in mechanism.
Further, observation window and lower observation window are respectively equipped with the chamber door from top to bottom.
Further, the plating pot can be rotated around planet carrier.
A kind of application method for being used to improve the film-coating mechanism of metal level plating film uniformity, comprises the following steps：
S1, the leaf revision board of two panels is installed in the L-type connecting shaft of inside cavity；
S2, install the height that four screwed lifting shafts change plating pot swing-around trajectory, and then change additional at the top of cavity
Plate pot height in orbit；
S3, chamber door is opened by plating pot installation planet carrier；
S4, add source metal in crucible；
S5, close chamber door；
When S6, high vacuum are extracted into 6.0e-4pa, drying lamp is opened, planet carrier rotation, drives plating pot in plating pot swing-around trajectory
Interior motion；
S7, to high vacuum be extracted into 4.0e-4pa when, open 10KV high pressures, in crucible source metal evaporate；
After S8,20min plated film time terminate, evaporation power supply is closed；
S9, treat that cavity inner temperature drops to 100 DEG C of unlatching charge valves, after vacuum indoor pressure and atmospheric pressure balance, beat
Open vacuum chamber and take out silicon chip；
S10, the metal layer thickness with film thickness gauge test silicon wafer surface.
Further, the baking temperature of the drying lamp is 150 DEG C, baking time 10min.
Beneficial effects of the present invention：
The present invention stops gaseous metal source to plating pot center excessive vaporization by revision board, and utilizes and lift axial adjustment
Pot orbit altitude is plated, ensures that the inner ring of plating pot and outer ring receive the gaseous energy coincidence of source metal, and then cause silicon chip surface
Plate that film uniformity is good, compactness is strong, reduce the roughness on surface, reduce silicon chip and do over again number, while improve the performance of silicon chip,
It is cost-effective.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, used required for being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1, which is that the present invention is a kind of, to be used to improve the film-coating mechanism schematic diagram that metal level plates film uniformity；
Fig. 2, which is that the present invention is a kind of, to be used to improve the film-coating mechanism schematic diagram that metal level plates film uniformity；
Fig. 3 is the front view at mechanism cavity gate in the present invention；
In accompanying drawing, the list of parts representated by each label is as follows：
1- mechanisms, 2-L type connecting shafts, 3- revision boards, 4- crucibles, 5- cylinders, 6- planet carriers, 7- plating pots, 8- lifting shafts, 9-
Plate pot swing-around trajectory, 10- fixed mounts, 11- drying lamps, 12- knocker bodies, 13- chamber doors, the upper observation windows of 14-, observation window under 15-,
16- door handle fixing cards, 17- door handles.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained all other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Refer to shown in Fig. 1-2, it is of the invention for a kind of film-coating mechanism for being used to improve metal level plating film uniformity, including machine
Structure 1, mechanism 1 is interior to be provided with cavity, is provided with two L-type connecting shafts 2 and revision board 3 in cavity, the bottom of mechanism 1 is run through in the one end of L-type connecting shaft 2
Portion is connected with cylinder 5, and the other end is connected with revision board 3, and the lower section of revision board 3 is provided with crucible 4, wherein, revision board 3 is blade
Shape, the excessive evaporation in gaseous metal source can be stopped.
The top of mechanism 1 is provided with planet carrier 6 by rotating shaft, and planet carrier 6 is connected with plating pot 7, and plating pot 7 can be around planet carrier
6 are rotated；The plating pot 7 enters line slip in plating pot swing-around trajectory 9；
Four lifting shafts 8 are connected with plating pot swing-around trajectory 9, lifting shaft 8 is used for the height for adjusting plating pot swing-around trajectory 9,
The angle of plating pot is set to reduce down to parallel；Fixed mount 10 is installed in the sidewalls vertical of mechanism 1, fixed mount 10 is used for further solid
Fixed plating pot swing-around trajectory 9, ensure the stability of plating pot swing-around trajectory 9.
The lower section of plating pot swing-around trajectory 9 is provided with drying lamp 11.
As shown in figure 3, cavity is provided with chamber door 13, the side of chamber door 13 is provided with two knocker bodies 12, and chamber door 13 passes through knocker
Body 12 is connected with mechanism 1, ensures the stability that chamber door 13 is closed；The opposite side of chamber door 13 is provided with door handle 17, door handle 17 with
Door handle fixing card 16 in mechanism 1 is engaged；Observation window 14 and lower observation window 15 are respectively equipped with chamber door 13 from top to bottom,
It is easy to staff to be observed.
The film-coating mechanism under high vacuum cavity environment, got in source metal and steamed by the electron beam sent using electron gun
When sending out source metal, gaseous metal atom is given out, by revision board and four lifting axis mechanisms, adjustment is deposited on plating pot
The how many amount of gaseous metal atom, to control the film thickness on whole plating pot.
The application method of the mechanism, comprises the following steps：
S1, the leaf revision board of two panels is installed in the L-type connecting shaft of inside cavity；
S2, install the height that four screwed lifting shafts change plating pot swing-around trajectory, and then change additional at the top of cavity
Plate pot height in orbit；
S3, chamber door is opened by plating pot installation planet carrier；
S4, add source metal in crucible；
S5, close chamber door；
When S6, high vacuum are extracted into 6.0e-4pa, drying lamp is opened, planet carrier rotation, ensures baking temperature for 150 DEG C, perseverance
The warm time is 10min；
S7, to high vacuum be extracted into 4.0e-4pa when, open 10KV high pressures, in crucible source metal evaporate；
After S8,20min plated film time terminate, evaporation power supply is closed；
S9, treat that cavity inner temperature drops to 100 DEG C of unlatching charge valves, after vacuum indoor pressure and atmospheric pressure balance, beat
Open vacuum chamber and take out silicon chip；
S10, the metal layer thickness with film thickness gauge test silicon wafer surface.
The angle of revision board and plating pot can reduce returning for silicon chip according to the thickness evenness deviation adjusting of metal level at any time
Work and the hidden danger of quality brought of being done over again to silicon chip.
Stop that gaseous metal source to plating pot center excessive vaporization, is adjusted using four lifting shafts using blade-shaped revision board
Whole plating pot orbit altitude, reduce the angle of inclination of plating pot so that parallel, the inner ring and outer ring for ensureing plating pot receive source metal gas
The energy coincidence of state, and then make it that the metal layer thickness on per a piece of silicon chip is the same.
It the wherein measurement of metal layer thickness, can be monitored by the film thickness gauge of routine, and be joined according to the measurement of film thickness gauge
Number, to adjust revision board and lifting shaft.
The present invention stops gaseous metal source to plating pot center excessive vaporization by revision board, and utilizes and lift axial adjustment
The height of pot swing-around trajectory is plated, ensures that the inner ring of plating pot and outer ring receive the gaseous energy coincidence of source metal, and then cause silicon chip
The plating film uniformity on surface is good, compactness is strong, reduces the roughness on surface, reduces silicon chip and does over again number, while improves silicon chip
Performance, it is cost-effective.
Above content is only to design example and explanation of the invention, affiliated those skilled in the art
Various modifications or supplement are made to described specific embodiment or is substituted using similar mode, without departing from invention
Design or surmount scope defined in the claims, protection scope of the present invention all should be belonged to.
Claims (7)
- A kind of 1. film-coating mechanism for being used to improve metal level plating film uniformity, it is characterised in that：It is interior including mechanism (1), mechanism (1) Provided with cavity, two L-type connecting shafts (2) and revision board (3) are provided with cavity, mechanism (1) bottom is run through in L-type connecting shaft (2) one end It is connected with cylinder (5), the other end is connected with revision board (3), and the lower section of revision board (3) is provided with crucible (4)；Mechanism (1) is provided with planet carrier (6) by rotating shaft, and planet carrier (6) is connected with plating pot (7)；The plating pot (7) is in plating pot rotation Enter line slip in transition road (9)；Four lifting shafts (8) are connected with plating pot swing-around trajectory (9)；The lower section of plating pot swing-around trajectory (9) is provided with drying lamp (11)；The side wall of mechanism (1) installs the fixed mount (10) for fixed plating pot swing-around trajectory (9).
- A kind of 2. film-coating mechanism for being used to improve metal level plating film uniformity according to claim 1, it is characterised in that：Institute Revision board (3) is stated to be located between crucible (4) and plating pot (7).
- A kind of 3. film-coating mechanism for being used to improve metal level plating film uniformity according to claim 1, it is characterised in that：Institute State cavity and be provided with chamber door (13), chamber door (13) side is provided with two knocker bodies (12), chamber door (13) by knocker body (12) with Mechanism (1) connects；Chamber door (13) opposite side is provided with door handle (17), door handle (17) and the door handle fixing card in mechanism (1) (16) it is engaged.
- A kind of 4. film-coating mechanism for being used to improve metal level plating film uniformity according to claim 3, it is characterised in that：Institute State and be respectively equipped with observation window (14) and lower observation window (15) in chamber door (13) from top to bottom.
- A kind of 5. film-coating mechanism for being used to improve metal level plating film uniformity according to claim 1, it is characterised in that：Institute Stating plating pot (7) can be rotated around planet carrier (6).
- 6. a kind of application method for being used to improve the film-coating mechanism of metal level plating film uniformity, it is characterised in that including following step Suddenly：S1, the leaf revision board of two panels is installed in the L-type connecting shaft of inside cavity；S2, install the height that four screwed lifting shafts change plating pot swing-around trajectory, and then change plating pot additional at the top of cavity Height in orbit；S3, chamber door is opened by plating pot installation planet carrier；S4, add source metal in crucible；S5, close chamber door；When S6, high vacuum are extracted into 6.0e-4pa, drying lamp is opened, planet carrier rotation, drives plating pot to be transported in plating pot swing-around trajectory It is dynamic；S7, to high vacuum be extracted into 4.0e-4pa when, open 10KV high pressures, in crucible source metal evaporate；After S8,20mi n plated film time terminate, evaporation power supply is closed；S9, treat that cavity inner temperature drops to 100 DEG C of unlatching charge valves, after vacuum indoor pressure and atmospheric pressure balance, open true Empty room takes out silicon chip；S10, the metal layer thickness with film thickness gauge test silicon wafer surface.
- 7. a kind of application method for being used to improve the film-coating mechanism of metal level plating film uniformity according to claim 6, its It is characterised by：The baking temperature of the drying lamp is 150 DEG C, and baking time is 10mi n.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047109.0A CN107630188A (en) | 2017-10-31 | 2017-10-31 | A kind of film-coating mechanism and its application method for being used to improve metal level plating film uniformity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047109.0A CN107630188A (en) | 2017-10-31 | 2017-10-31 | A kind of film-coating mechanism and its application method for being used to improve metal level plating film uniformity |
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| CN107630188A true CN107630188A (en) | 2018-01-26 |
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| CN201711047109.0A Pending CN107630188A (en) | 2017-10-31 | 2017-10-31 | A kind of film-coating mechanism and its application method for being used to improve metal level plating film uniformity |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489638A (en) * | 2001-02-08 | 2004-04-14 | ס�ѵ�����ҵ��ʽ���� | Film formation method and film forming device |
| CN102086505A (en) * | 2009-12-03 | 2011-06-08 | 鸿富锦精密工业（深圳）有限公司 | Correction mask for coating film |
| CN102312223A (en) * | 2010-06-30 | 2012-01-11 | 鸿富锦精密工业（深圳）有限公司 | Coating corrector plate and coating device comprising same |
| CN202347082U (en) * | 2011-10-28 | 2012-07-25 | 苏州灵菱照明镀膜科技有限公司 | Vacuum coater |
| CN102732844A (en) * | 2012-07-12 | 2012-10-17 | 中国科学院光电技术研究所 | Design method of coating uniformity correction baffle plate of spherical optical element on planetary rotating fixture of vacuum coating machine |
| CN103088299A (en) * | 2011-11-04 | 2013-05-08 | 鸿富锦精密工业（深圳）有限公司 | Film coating correction plate and assembly method thereof |
| CN103088298A (en) * | 2011-10-31 | 2013-05-08 | 鸿富锦精密工业（深圳）有限公司 | Coating correction plate and coating device |
| CN104294234A (en) * | 2014-09-23 | 2015-01-21 | 东莞市华星镀膜科技有限公司 | Planet-like coating jig capable of rotating and revoluting and use method of planet-like coating jig |
| CN205529023U (en) * | 2016-02-17 | 2016-08-31 | 苏州灵菱照明镀膜科技有限公司 | Structure is revised to thick distribution of coating machine membrane |
| CN207347651U (en) * | 2017-10-31 | 2018-05-11 | 安徽富芯微电子有限公司 | A kind of film-coating mechanism for being used to improve metal layer plating film uniformity |
-
2017
- 2017-10-31 CN CN201711047109.0A patent/CN107630188A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489638A (en) * | 2001-02-08 | 2004-04-14 | ס�ѵ�����ҵ��ʽ���� | Film formation method and film forming device |
| CN102086505A (en) * | 2009-12-03 | 2011-06-08 | 鸿富锦精密工业（深圳）有限公司 | Correction mask for coating film |
| CN102312223A (en) * | 2010-06-30 | 2012-01-11 | 鸿富锦精密工业（深圳）有限公司 | Coating corrector plate and coating device comprising same |
| CN202347082U (en) * | 2011-10-28 | 2012-07-25 | 苏州灵菱照明镀膜科技有限公司 | Vacuum coater |
| CN103088298A (en) * | 2011-10-31 | 2013-05-08 | 鸿富锦精密工业（深圳）有限公司 | Coating correction plate and coating device |
| CN103088299A (en) * | 2011-11-04 | 2013-05-08 | 鸿富锦精密工业（深圳）有限公司 | Film coating correction plate and assembly method thereof |
| CN102732844A (en) * | 2012-07-12 | 2012-10-17 | 中国科学院光电技术研究所 | Design method of coating uniformity correction baffle plate of spherical optical element on planetary rotating fixture of vacuum coating machine |
| CN104294234A (en) * | 2014-09-23 | 2015-01-21 | 东莞市华星镀膜科技有限公司 | Planet-like coating jig capable of rotating and revoluting and use method of planet-like coating jig |
| CN205529023U (en) * | 2016-02-17 | 2016-08-31 | 苏州灵菱照明镀膜科技有限公司 | Structure is revised to thick distribution of coating machine membrane |
| CN207347651U (en) * | 2017-10-31 | 2018-05-11 | 安徽富芯微电子有限公司 | A kind of film-coating mechanism for being used to improve metal layer plating film uniformity |
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Address after: 230000 Hefei 503 high tech park, Anhui Applicant after: Wick Microelectronics Co., Ltd. Address before: 230000 room 521, innovation building, 860 Wangjiang West Road, Hefei high tech Zone, Anhui Applicant before: Anhui core Microelectronics Co., Ltd. |
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Application publication date: 20180126 |