CN107591495B - Added metal plate and display device - Google Patents
Added metal plate and display device Download PDFInfo
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- CN107591495B CN107591495B CN201710711312.7A CN201710711312A CN107591495B CN 107591495 B CN107591495 B CN 107591495B CN 201710711312 A CN201710711312 A CN 201710711312A CN 107591495 B CN107591495 B CN 107591495B
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Abstract
The embodiment of the invention discloses a kind of display device and added metal plate, which is used for glassivation powder, and added metal plate is also used to receive the energy of laser, melten glass powder, and added metal plate includes at least double layer of metal lamination；Every layer of metal laminated metal wire or net surface structure for snakelike cabling at least in double layer of metal lamination, adjacent two layers are metal laminated at least in double layer of metal lamination is separated by inter-level dielectric；Medium holes are arranged in the crosspoint position that adjacent two layers are metal laminated on inter-level dielectric, and adjacent two layers are metal laminated to be electrically connected via medium holes.Implement the embodiment of the present invention, it is possible to reduce the charge accumulated on added metal plate, to reduce Electro-static Driven Comb.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of added metal plate and display devices.
Background technique
Currently, AMOLED (Active-matrix organic light emitting diode) display device is answered extensively
For in various product.When carrying out the encapsulation of AMOLED display panel, clinkering (frit) technique can be used, needing to be encapsulated in
Added metal plate can be set between two substrates together, for the energy of reflection laser, melt frit material secondary and consolidate
Change.To increase the adhesive force to frit material, aperture can be set on added metal plate.
However, the added metal plate for adhering to frit material is the gold of the large area of monolithic in AMOLED display panel
Belong to plate, since area is huge, easily cause charge accumulated, generate Electro-static Driven Comb (Electro-Static Discharge,
ESD), thus electronic device on damaged substrate.
Summary of the invention
Based on this, to solve charge accumulated caused by added metal plate suqare is huge in the prior art, spy proposes one kind
Added metal plate, it is possible to reduce the charge accumulated on added metal plate, to reduce Electro-static Driven Comb.
A kind of added metal plate, the added metal plate are used for glassivation powder, and the added metal plate is also used to receive
The energy of laser, melts the glass powder, and the added metal plate includes at least double layer of metal lamination；At least double layer of metal
Every layer of metal laminated metal wire or net surface structure for snakelike cabling in lamination, phase in at least double layer of metal lamination
Adjacent double layer of metal lamination is separated by inter-level dielectric；The metal laminated intersection point of the adjacent two layers on the inter-level dielectric
Medium holes are installed, the adjacent two layers are metal laminated to be electrically connected via the medium holes.
In addition, to solve charge accumulated caused by added metal plate suqare is huge in the prior art, spy proposes a kind of aobvious
Showing device, the display device include above-mentioned added metal plate, it is possible to reduce the charge accumulated on added metal plate, to reduce
Electro-static Driven Comb.
Implement the embodiment of the present invention, will have the following beneficial effects:
Setting added metal plate is multiple layer metal lamination, and it is snakelike cabling metal wire or wire side that every layer metal laminated
Structure, then every layer of metal laminated area reduces compared to bulk metal, due to every layer it is metal laminated with it is adjacent metal laminated
Between separated by inter-level dielectric, it is metal laminated to have certain capacitor between inter-level dielectric so that the electricity assembled on single-layer metal
Lotus is reduced compared to bulk metal, so as to reduce Electro-static Driven Comb, improves the safety of electronic device.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Wherein:
Fig. 1 is a kind of structural schematic diagram of added metal plate provided in an embodiment of the present invention；
Fig. 2 is a kind of longitudal section structural schematic diagram of added metal plate provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another added metal plate provided in an embodiment of the present invention；
Fig. 4 is the longitudal section structural schematic diagram of another added metal plate provided in an embodiment of the present invention；
Fig. 5 is the longitudal section structural schematic diagram of another added metal plate provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of another added metal plate provided in an embodiment of the present invention；
Fig. 7 is the structural schematic diagram of another added metal plate provided in an embodiment of the present invention；
Fig. 8 is also a kind of structural schematic diagram of added metal plate provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Added metal plate is used for glassivation powder (frit seal), and frit seal is coated on the position of metal plate aperture,
And pass through the energy of metal plate reflection laser, make frit seal second melting and solidifies.For the energy for absorbing enough laser,
The size of added metal plate need to be greater than preset threshold.However the metal plate of large area easily causes charge accumulated, generates
ESD, thus the electronic device on damaged substrate.
To solve charge accumulated caused by added metal plate suqare is huge in the prior art, spy proposes a kind of added metal
Plate 10, it is possible to reduce the charge accumulated on added metal plate, to reduce Electro-static Driven Comb.
Specifically, Fig. 1 is a kind of knot of added metal plate 10 provided in an embodiment of the present invention also referring to Fig. 1 and Fig. 2
Structure schematic diagram.Fig. 2 is a kind of longitudal section structural schematic diagram of added metal plate provided in an embodiment of the present invention.The added metal plate
10 are used for glassivation powder, and the added metal plate 10 is also used to receive the energy of laser, melts the glass powder, such as Fig. 1 and
Shown in Fig. 2, which includes first metal laminated 101 and second metal laminated 102, this first metal laminated 101
It is separated with second metal laminated 102 by inter-level dielectric (Inter Layer Dielectric, ILD) 103, and inter-level dielectric
In the place setting inter-level dielectric hole that first metal laminated 101 and second metal laminated 102 are intersected in the stacking direction on 103
(ILD hole) 1031, first metal laminated 101 and second metal laminated 102 can pass through 1031 electricity of ILD hole of setting
Connection.
Wherein, the first metal laminated 101 and second metal laminated 102 metal wire that can be snakelike cabling.
In the added metal plate described in Fig. 1, setting added metal plate is multiple layer metal lamination, and every layer metal laminated
For snakelike cabling metal wire or net surface structure, then the metallic area on every layer of metal laminated unit area is compared to bulk gold
Belong to and reducing, due to every layer it is metal laminated and adjacent it is metal laminated between separated by inter-level dielectric, metal laminated and inter-level dielectric
Between have certain capacitor so that the charge assembled on single-layer metal compared to bulk metal reduce, so as to reduce electrostatic
Release, improves the safety of electronic device.
In the embodiment of the present invention, first metal laminated 101 and second metal laminated 102 can be film crystalline substance in pixel unit
In the gate metal of body pipe, the pixel unit in the source/drain metal of thin film transistor (TFT) and the anode metal of luminescent device
One kind.First metal laminated 101 and second metal laminated 102 can be the metal of different metal material.Wherein, pixel unit
The gate metal of middle thin film transistor (TFT) for example can be Gate1 metal or Gate2 metal, and film is brilliant in pixel unit
The source/drain metal of body pipe is S/D metal, and the anode metal of luminescent device is Anode metal.It chooses in these
Metal as metal laminated 101 and 102, can made in the production for directly leading out these metals and carrying out added metal plate
Simplification of flowsheet in technique, save the cost.In addition, first metal laminated 101 and second metal laminated 102 can choose
Two kinds of different metals in Gate1 metal, Gate2 metal, S/D metal and Anode metal.First is metal laminated
One in 101 and second metal laminated 102 can choose S/D metal, another can choose Gate1 metal, Gate2
One of metal.In the present embodiment, first metal laminated 101 and second metal laminated 102 is also possible to any other gold
Belong to, this embodiment is not limited.
In the embodiment of the present invention, as depicted in figs. 1 and 2, first metal laminated 101 and second metal laminated 102 be can be
The metal wire of snakelike cabling, the metal laminated snakelike direction of routing of adjacent two layers can be in default angle, as depicted in figs. 1 and 2,
The angle can be 90 degree, be also possible to other angles.Can be first metal laminated 101 is in the direction y cabling and in the x-direction
The metal wire of the snakelike cabling of inflection, second metal laminated 102 is in the direction x cabling and to the snakelike cabling of the direction y inflection
Metal wire, i.e., first metal laminated 101 and second metal laminated 102 direction of routing are vertical.
Referring to Fig. 3, as shown in figure 3, Fig. 3 is the structural representation of another added metal plate provided in an embodiment of the present invention
Figure, as shown in figure 3, the direction of the metal laminated snakelike cabling of adjacent two layers can be in any angle in the embodiment of the present invention,
Can also be identical with direction of routing, the embodiment of the present invention is not construed as limiting.
Referring to Fig. 4, Fig. 4 is the longitudal section structural representation of another added metal plate 10 provided in an embodiment of the present invention
Figure.The added metal plate 10 may include two layers or more metal laminated, as shown in figure 4, the added metal plate 10 may include
First metal laminated 101, second metal laminated 102 and third metal laminated 104, wherein two layers of arbitrary neighborhood it is metal laminated it
Between separated by ILD 103, i.e., separated between first metal laminated 101 and second metal laminated 102 by ILD 103, second
Separated between metal laminated 102 and third metal laminated 104 by ILD 103, and on ILD 103 metal laminated in stacking side
Place setting the ILD hole 1031, such as ILD between first metal laminated 101 and second metal laminated 102 intersected upwards
The 103 position setting ILD hole 1031 intersected on ILD 103, such as second metal laminated 102 and third metal laminated 104
Between ILD 103 intersect on ILD 103 position setting ILD hole 1031.In the embodiment of the present invention, ILD hole
1031 quantity is not construed as limiting.
It wherein, is reduction process flow, first metal laminated 101, second metal laminated 102 and third metal laminated 104
Gate1 metal can be chosen, three kinds of different metals in Gate2 metal, S/D metal and Anode metal.The present invention
In embodiment, first metal laminated 101, second metal laminated 102 and third is metal laminated is also possible to any other metal,
The embodiment of the present invention is not construed as limiting.
Wherein, first metal laminated 101, second metal laminated 102 and third metal laminated 104 can be snakelike cabling
The structure of metal wire, every layer of snakelike cabling can be found in Fig. 1.First metal laminated 101, second metal laminated 102 and third metal
It the direction of the snakelike cabling of lamination 104 can be different.It can also the metal laminated double layer of metal lamination direction of routing phase of phase alternating floor
Together, for example, it may be first metal laminated 101 is in the direction y cabling and the metal wire of the snakelike cabling of inflection in the x-direction
Two metal laminated 102 be the metal wire of the snakelike cabling in the direction x cabling and to the inflection of the direction y, i.e., the first metal laminated 101 He
Second metal laminated 102 direction of routing is vertical.Third metal laminated 104 can be and the first metal laminated 101 direction of routing
The metal wire of identical snakelike cabling, i.e., in the direction y cabling and the metal wire of the snakelike cabling of inflection in the x-direction.The present invention is real
It applies in example, the direction of the metal laminated snakelike cabling of adjacent two layers can be in any angle, and the embodiment of the present invention is not construed as limiting.
In the embodiment of the present invention, every layer of metal laminated area can be related to the metal laminated number of plies, for example, can
To be that metal laminated quantity is more, the metal laminated area of each layer can be smaller, then the cabling spacing of snakelike cabling is bigger
Or the spacing of adjacent metal block can be bigger in the metal block array of reticular structure.
In the embodiment of the present invention, the metal due to that can be used to do added metal plate in existing metal is Gate1
Metal, Gate2 metal, S/D metal and Anode metal, and in added metal plate every layer it is metal laminated can equal not phases
Together, then the number of plies that can be at most setting added metal plate 10 is four layers, and four layers are respectively Gate1 metal, Gate2
Metal, S/D metal and Anode metal, the sequence of unlimited deposit category laminated material.Every layer of gold that can be snakelike cabling
Belong to line, is also possible to metal block array.
Referring to Fig. 5, Fig. 5 is the longitudal section structural representation of another added metal plate 10 provided in an embodiment of the present invention
Figure.As shown in figure 5, added metal plate 10 includes first metal laminated 101, second metal laminated 102, third metal laminated 104
With the 4th metal laminated 105, wherein separated between two layers of arbitrary neighborhood metal laminated by ILD 103, i.e. the first metal is folded
Separated between layer 101 and second metal laminated 102 by ILD 103, second metal laminated 102 and third metal laminated 104 it
Between separated by ILD 103, separated between third metal laminated 104 and the 4th metal laminated 105 by ILD 103, and ILD
ILD hole 1031, such as first metal laminated 101 are set in the adjacent metal laminated position intersected on ILD 103 on 103
And the position setting ILD hole 1031 that the ILD 103 between second metal laminated 102 intersects on ILD 103, the second metal
ILD hole 1031 is arranged in the position that ILD 103 between lamination 102 and third metal laminated 104 intersects on ILD 103,
ILD hole 1031 is arranged in the position that the two intersects on ILD 103 in third metal laminated 104 and the 4th metal laminated 105.
In the embodiment of the present invention, the quantity of ILD hole 1031 is not construed as limiting.Wherein, every layer of metal laminated structure may refer to Fig. 4
The longitudal section structural schematic diagram of described added metal plate 10, which is not described herein again.
Wherein, every layer of metal laminated material can also choose any metal material, and the embodiment of the present invention is not construed as limiting.
Referring to Fig. 6, Fig. 6 is the structural schematic diagram of another added metal plate 10 provided in an embodiment of the present invention.This is molten
Connect it is metal laminated in metal plate 10 be also possible to be made of the metal layer of reticular structure, i.e. metal block array, as shown in fig. 6, should
Added metal plate 10 is made of first metal laminated 101 and second metal laminated 102, and second metal laminated 102 is metal block battle array
Column.It is similar with added metal plate 10 described in Fig. 1, pass through ILD between first metal laminated 101 and second metal laminated 102
103 separate, and ILD hole is arranged in the position of first metal laminated 101 and second metal laminated 102 intersection on ILD 103
1031, first metal laminated 101 and second metal laminated 102 is electrically connected via ILD hole 1031.On ILD 103, ILD
The quantity of hole 1031 does not limit.
Wherein, first metal laminated 101 and second metal laminated 102 Gate1 metal, Gate2 metal can be chosen,
Different metal in S/D metal and Anode metal, second it is metal laminated 102 composition metal block array in metal block
Two of them or two or more metals can also be chosen, for example, first metal laminated 101 can choose S/D metal, second
Metal block in metal laminated 102 can choose the alternate metal block of Gate1 metal and Gate2 metal composition, that is, appoint
The metal material that the adjacent metal block of one metal block uses is different from any metal block.First metal laminated 101 and second gold medal
Arbitrary metal can also be chosen by belonging to lamination 102, for example, Gate1 metal, Gate2 metal, S/D metal and Anode
Metal other than metal, the embodiment of the present invention are not construed as limiting.
Alternatively, it is also possible to be snakelike cabling the first metal layer 101 in a z-direction, it is folded in the second metal of net surface structure
Below layer 102, and the direction of snakelike cabling is also possible to the metal of the snakelike cabling in the direction x cabling and to the inflection of the direction y
Line.First metal laminated 101 is also possible to above-mentioned metal net surface structure, and in the embodiment of the present invention, the direction of snakelike cabling can
It according to demand can be any direction, for example, it can be the directions of snakelike cabling to be and the direction x and the direction y to be not construed as limiting
It is in a certain angle.
Wherein, the cabling spacing of the snakelike cabling of the first metal layer 101 can be identical, be also possible to it is different, second
The spacing of metal block in the x-direction can be identical in metal laminated 102 metal block array, can not also be identical, metal block array
The spacing of middle metal block in the y-direction can be identical, can not also be identical, and the embodiment of the present invention is not construed as limiting.
Wherein, the number of plies of the added metal plate 10 can be more than two layers, and overlapped way can refer to Fig. 4 or Fig. 5, adjacent
The structure of double layer of metal lamination can be different, for example, in the z-direction, first it is metal laminated can be metal block array,
Two it is metal laminated can be from the first metal laminated different structure, can be snakelike cabling.Third is metal laminated to be can be
From the second metal laminated different structure, metal block array structure can be.In addition, the structure between adjacent metal lamination
It can be identical, for example, it is metal block array structure that adjacent two layers are metal laminated, the embodiment of the present invention is not construed as limiting.
Referring to Fig. 7, Fig. 7 is the structural schematic diagram of another added metal plate 10 provided in an embodiment of the present invention.In Fig. 6
Shown in added metal plate 10 structure on the basis of, as shown in fig. 7, the first metal layer 101 can be snakelike cabling, this is snakelike
Cabling can be the snakelike cabling mode successively radiated outward by center.It is also possible to other snakelike cabling modes or snake
Other kinds of structure other than shape cabling, the embodiment of the present invention are not construed as limiting, and need to guarantee unit area on single-layer metal lamination
On metallic area be less than the metallic area on bulk metal plate on unit area, then the charge of metal laminated upper accumulation is less than big
The quantity of electric charge accumulated on block metal plate, the quantity of electric charge reduces on single-layer metal plate, is equivalent to and disperses at least two for a large amount of charge
Layer it is metal laminated on, so as to reduce ESD risk.
Referring to Fig. 8, Fig. 8 is also a kind of structural schematic diagram of added metal plate 10 provided in an embodiment of the present invention.In Fig. 7
On the basis of described added metal plate 10, the shape of metal block is in this hair in second metal laminated 102 metal block array
It is not construed as limiting in bright embodiment.As shown in figure 8, second metal laminated 102 can be designed as circle according to demand, it is also possible to ellipse
Circle, diamond shape, rectangle etc., the embodiment of the present invention is not construed as limiting.
In the embodiment of the present invention, metal laminated structure is also possible to other structures, such as single-layer metal lamination can be
The structure etc. that network, a plurality of metal wire rearrange, the embodiment of the present invention is not construed as limiting.
In addition, the embodiment of the present invention also provides a kind of display device, the display device includes any one of Fig. 1 to Fig. 8 institute
The weld plate of description.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, therefore equivalent changes made in accordance with the claims of the present invention, is still within the scope of the present invention.
Claims (10)
1. a kind of added metal plate, the added metal plate is used for glassivation powder, and the added metal plate is also used to receive sharp
The energy of light melts the glass powder, which is characterized in that the added metal plate includes at least double layer of metal lamination；It is described extremely
Every layer of metal laminated metal wire or net surface structure for snakelike cabling in few double layer of metal lamination, at least two layers of gold medal
Adjacent two layers are metal laminated in category lamination is separated by inter-level dielectric；The adjacent two layers are metal laminated on the inter-level dielectric
Crosspoint position be arranged medium holes, the adjacent two layers it is metal laminated via the medium holes be electrically connected.
2. added metal plate according to claim 1, which is characterized in that the metal wire of the snakelike cabling is along default side
To snakelike cabling, or from center to the snakelike cabling of external radiation, the net surface structure is metal block array.
3. added metal plate according to claim 1, which is characterized in that described in the adjacent two layers it is metal laminated for it is snakelike walk
When line metal wire, metal laminated snakelike direction of routing described in the adjacent two layers is in default angle.
4. added metal plate according to claim 3, which is characterized in that metal laminated snakelike described in the adjacent two layers
Direction of routing is vertical.
5. added metal plate according to claim 2, which is characterized in that the metal block array is by least two metal groups
At.
6. added metal plate according to claim 1, which is characterized in that every layer of metal in at least double layer of metal lamination
Lamination be the gate metal of thin film transistor (TFT) in pixel unit, in the pixel unit thin film transistor (TFT) source/drain metal
One of with the anode metal of luminescent device.
7. added metal plate according to claim 6, which is characterized in that any two layers in at least double layer of metal lamination
The metal laminated metal material it is different.
8. added metal plate according to claim 1, which is characterized in that every layer of metal in at least double layer of metal lamination
The area of lamination is related to the number of plies of at least double layer of metal lamination.
9. added metal plate according to any one of claims 1 to 8, which is characterized in that between the cabling of the snakelike cabling
Away from equal, the net surface structure is metal block array, and the spacing between metal block described in the metal block array is equal.
10. a kind of display device, which is characterized in that the display device includes welding as described in any one of claim 1 to 9
Metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710711312.7A CN107591495B (en) | 2017-08-18 | 2017-08-18 | Added metal plate and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710711312.7A CN107591495B (en) | 2017-08-18 | 2017-08-18 | Added metal plate and display device |
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| Publication Number | Publication Date |
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| CN107591495A CN107591495A (en) | 2018-01-16 |
| CN107591495B true CN107591495B (en) | 2019-06-25 |
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| CN201710711312.7A Active CN107591495B (en) | 2017-08-18 | 2017-08-18 | Added metal plate and display device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102893700A (en) * | 2010-10-01 | 2013-01-23 | 日本电气硝子株式会社 | Electric device package |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
| CN105679771A (en) * | 2016-01-29 | 2016-06-15 | 厦门天马微电子有限公司 | Array substrate and manufacturing method thereof and display panel comprising array substrate |
| CN106876606A (en) * | 2017-03-16 | 2017-06-20 | 京东方科技集团股份有限公司 | Display panel and display device |
-
2017
- 2017-08-18 CN CN201710711312.7A patent/CN107591495B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102893700A (en) * | 2010-10-01 | 2013-01-23 | 日本电气硝子株式会社 | Electric device package |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
| CN105679771A (en) * | 2016-01-29 | 2016-06-15 | 厦门天马微电子有限公司 | Array substrate and manufacturing method thereof and display panel comprising array substrate |
| CN106876606A (en) * | 2017-03-16 | 2017-06-20 | 京东方科技集团股份有限公司 | Display panel and display device |
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| CN107591495A (en) | 2018-01-16 |
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